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1. 发明专利

JP2006083377A Electrically conductive adhesive and method for producing article utilizing the electrically conductive adhesive 有权
标题翻译：电导电粘合剂及使用电导电胶粘剂生产物品的方法
公开(公告)号：JP2006083377A
公开(公告)日：2006-03-30
申请号：JP2005237302
申请日：2005-08-18
申请人： Harima Chem Inc , Toshiba Corp , ハリマ化成株式会社 , 株式会社東芝
发明人： OSAKO TAKEHISA , SHIOI NAOTO , ITO DAISUKE , GOTO HIDEYUKI , MATSUBA YORISHIGE , TATEYAMA KAZUKI , UKITA YASUNARI , SEGAWA MASAO , KIKUCHI TAKUO
IPC分类号： C09J201/00 , C09C1/62 , C09C3/08 , C09J5/00 , C09J9/02 , C09J11/00 , C09J163/00 , H01B1/00 , H01B1/22 , H01L21/52
CPC分类号： H01L24/73 , H01L2224/29 , H01L2224/2919 , H01L2224/29298 , H01L2224/32245 , H01L2224/45 , H01L2224/45015 , H01L2224/45144 , H01L2224/48247 , H01L2224/73265 , H01L2224/83192 , H01L2224/8384 , H01L2224/92247 , H01L2924/00013 , H01L2924/01005 , H01L2924/01029 , H01L2924/0103 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/0665 , H01L2924/10253 , H01L2924/181 , H01L2924/00 , H01L2924/00014 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/2929 , H01L2924/00012 , H01L2924/20752
摘要： PROBLEM TO BE SOLVED: To provide an electrically conductive adhesive capable of solvent dilution for giving good coating workability, capable of preventing a gas from forming, when a binder resin is heated and cured after mounting of parts, and capable of forming an electrically conductive joint excellent in both of thermal conductivity and electrical conductivity. SOLUTION: This electrically conductive adhesive contains an electrically conductive medium, a thermosetting resin as a binder resin component, and a solvent for adjusting a liquid viscosity as essential components, wherein 100 pts.wt. of a silver powder having an average particle diameter of a micrometer size is, for example, used as a main component, together with 1-10 pts.wt. of silver fine particles having an average particle diameter of a nanometer size, in the electrically conductive medium, and further 5-15 pts.wt. of the thermosetting resin and 10 pts.wt. or less of the solvent are together used in the adhesive. The adhesive having a mixing ratio of the components thus selected avoids formation of gas components, when the thermosetting resin is heated/cured, and therefore prevents formation of voids, and further realizes preparation of the electrically conductive joint excellent in the thermal conductivity and the electrical conductivity at the same time. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：为了提供能够进行溶剂稀释以提供良好的涂布可加工性的导电粘合剂，能够防止气体形成，当粘合剂树脂在部件安装之后被加热和固化，并且能够形成导电接头在导热性和导电性方面均优异。解决方案：该导电粘合剂包含导电介质，作为粘合剂树脂组分的热固性树脂和用于调节作为必需组分的液体粘度的溶剂，其中100重量份平均粒径为微米尺寸的银粉末，例如以1-10重量份为主成分。的导电介质中平均粒径为纳米尺寸的银微粒，再加入5-15重量份的热固性树脂和10重量份或更少的溶剂一起用于粘合剂中。具有这样选择的组分的混合比例的粘合剂避免形成气体组分，当热固性树脂被加热/固化时，因此防止形成空隙，并且进一步实现导热性和导电性优异的导电接头的制备电导率同时。版权所有（C）2006，JPO＆NCIPI

2. 发明专利

JP2004119686A Method of forming fine wiring pattern 有权
公开(公告)号：JP2004119686A
公开(公告)日：2004-04-15
申请号：JP2002280965
申请日：2002-09-26
申请人： Harima Chem Inc , ハリマ化成株式会社
发明人： HATA NORIAKI , UEDA MASAYUKI , SHIOI NAOTO , MATSUBA YORISHIGE
IPC分类号： H05K3/12 , H05K3/10 , H05K3/20
摘要： PROBLEM TO BE SOLVED: To provide a method by which an extremely fine sintered copper-based wiring pattern can be formed by reducing nano-sized copper oxide particles in the pattern into nano-sized copper particles at a relatively low temperature after the pattern is drawn, by using a dispersed liquid of nano-sized copper oxide particles and baking the copper particles.
SOLUTION: The dispersed liquid containing the nano-sized copper oxide particles having a mean particle diameter of 1-100 nm is applied to a substrate. Thereafter, the reduction of the nano-sized copper oxide particles and the formation of a sintered layer of the obtained copper particles are performed in the same step, by reducing the copper oxide particles through a reducing reaction using an active reactive species excited with plasma derived from a reducing gas, by heating the copper oxide particles contained in the applied layer to a temperature of ≤300°C in a plasma atmosphere produced under the presence of the reducing gas. Consequently, the utilizable range of the used substrate material is expanded largely, because the heat resistance required for the material is significantly relaxed.
COPYRIGHT: (C)2004,JPO

3. 发明专利

JP2009123607A Low resistivity conductive paste 有权
标题翻译：低电阻导电胶
公开(公告)号：JP2009123607A
公开(公告)日：2009-06-04
申请号：JP2007298165
申请日：2007-11-16
申请人： Harima Chem Inc , ハリマ化成株式会社
发明人： OSAKO TAKEHISA , SHIOI NAOTO
IPC分类号： H01B1/22 , C09D5/00 , C09D7/12 , C09D133/00 , C09D161/06 , C09D161/12 , C09D201/00 , H01B1/00
摘要： PROBLEM TO BE SOLVED: To provide a conductive paste utilizing silver particles as a conductive filler, which can be hardened at a curing temperature of 200°C or less, and in which a binder resin itself shows flexibility of a certain level or more, and at the same time, the apparent volume specific resistivity of the conductive paste cured layer obtained can be reduced to at least 10 μΩcm (20°C) or less.
SOLUTION: This is the conductive paste in which a conductive filler component is uniformly mixed in a liquid binder resin composition, and its composition is selected in a range of the liquid binder composition in which a binder resin component having a thermosetting resin component as a main component 0.5-6 parts by mass, an organic compound having acidic group 0.5-6 parts by mass, and a polar solvent 2-15 parts by mass are contained as an indispensable constituent against the conductive filler component having silver particles of average particle size 1 μm-8 μm as a main component 100 parts by mass.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种使用银颗粒作为导电填料的导电糊料，其可以在200℃或更低的固化温度下硬化，并且其中粘合剂树脂本身显示出一定水平的柔韧性或更多地，同时所获得的导电糊固化层的表观体积电阻率可以降低至至少10μΩcm（20℃）或更低。解决方案：这是导电填料组分在液体粘合剂树脂组合物中均匀混合的导电浆料，其组成是在具有热固性树脂组分的粘合剂树脂组分的液体粘合剂组合物的范围内选择的作为0.5-6质量份的主要成分，含有0.5-6质量份的酸性基团的有机化合物和2-15质量份的极性溶剂作为对具有平均粒径的银颗粒的导电填料组分的不可缺少的成分粒径1μm〜8μm为主成分100质量份。版权所有（C）2009，JPO＆INPIT

4. 发明专利

JP2005225980A Electrically conductive adhesive 有权
标题翻译：电导电胶
公开(公告)号：JP2005225980A
公开(公告)日：2005-08-25
申请号：JP2004036213
申请日：2004-02-13
申请人： Denso Corp , Harima Chem Inc , ハリマ化成株式会社 , 株式会社デンソー
发明人： TERADA NOBUHITO , SHIOI NAOTO , TOTOKAWA SHINJI , NINOMIYA YASUTOKU
IPC分类号： C09J163/00 , C08L63/00 , C09J9/02 , C09J11/04 , C09J11/06 , H01B1/00 , H01B1/22 , H05K3/32
CPC分类号： C09J163/00 , C08G59/42 , C08L63/00 , C09J9/02 , H01B1/22 , H05K3/321 , H05K2201/0239
摘要： PROBLEM TO BE SOLVED: To obtain an electrically conductive adhesive usable as an alternative for solder jointing as a means for electrically conductive joint formation in the surface mounting of electronic parts for vehicle loading and in making electronic parts themselves.
SOLUTION: The electrically conductive adhesive is obtained by dispersing silver powder or the like as electrically conductive medium in a binder resin component consisting of an one-part epoxy-based thermosetting resin essentially comprising an epoxy resin component based on a polycyclic aromatic skeleton-bearing epoxy compound and a cyclic acid anhydride as the curing agent component and also incorporated with a coupling agent as an adhesivity-imparting agent.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：为了获得作为用于车辆装载的电子部件的表面安装和制造电子部件本身的用于焊接接合的替代物的导电粘合剂作为用于导电接头形成的装置。解决方案：导电粘合剂通过将银粉等作为导电介质分散在由基于多环芳族骨架的基本上包含环氧树脂组分的单组分环氧基热固性树脂组成的粘合剂树脂组分中的环氧化合物和环状酸酐作为固化剂组分，并且还与作为粘合剂赋予剂的偶联剂结合。版权所有（C）2005，JPO＆NCIPI

5. 发明专利

JP2004218055A Method of depositing conductive gold film substituted for electroless gold plating film using conductive gold paste 有权
标题翻译：使用导电性金浆取代用于电镀金镀膜的导电性金膜的沉积方法
公开(公告)号：JP2004218055A
公开(公告)日：2004-08-05
申请号：JP2003010144
申请日：2003-01-17
申请人： Harima Chem Inc , Ulvac Corporate Center:Kk , ハリマ化成株式会社 , 株式会社アルバック・コーポレートセンター
发明人： HATA NORIAKI , SHIOI NAOTO , UEDA MASAYUKI , MATSUBA YORISHIGE , ODA MASAAKI
IPC分类号： B22F1/02 , B22F3/10 , C23C24/08
摘要： PROBLEM TO BE SOLVED: To provide a method of easily depositing a conductive thin gold film which can be substituted for an electroless gold plating film utilized for various uses in an electronic industrial field and equivalent to that by an electroless flash gold plating method with high film thickness controllability and reproducibility.
SOLUTION: The surface of each gold hyperfine particle with a mean particle diameter of ≤100 nm is provided with a covering layer of an amine compound or the like capable of forming a coordinate bond with a gold element, and it is dispersed into an organic solvent. Using conductive gold paste with an organic acid anhydride, the derivative thereof or the like exhibiting reactivity with the amine compound or the like in the covering layer added, a coating film is deposited, and heat treatment is performed at ≤300°C, so that a thin gold film in which gold hyperfine particles are densely sintered is produced.
COPYRIGHT: (C)2004,JPO&NCIPI
摘要翻译：要解决的问题：提供一种容易沉积导电薄金膜的方法，所述导电薄金膜可以替代用于电子工业领域中各种用途的无电镀金膜，并且等同于通过无电刷闪镀金方法具有高膜厚可控性和重现性。
解决方案：平均粒径≤100nm的每个金超细颗粒的表面设置有能够与金元素形成配位键的胺化合物等的覆盖层，并且分散在有机溶剂。使用导电性金膏与有机酸酐，其衍生物等在被覆层中与胺化合物等显示反应性的方法，沉积涂膜，在≤300℃下进行热处理，产生金超细颗粒致密烧结的薄金膜。版权所有（C）2004，JPO＆NCIPI

6. 发明专利

JP2004119790A Method of forming fine wiring pattern using dispersed nano-sized particles in supercritical fluid 有权
公开(公告)号：JP2004119790A
公开(公告)日：2004-04-15
申请号：JP2002282790
申请日：2002-09-27
申请人： Harima Chem Inc , ハリマ化成株式会社
发明人： HATA NORIAKI , UEDA MASAYUKI , SHIOI NAOTO , MATSUBA YORISHIGE
IPC分类号： B22F9/00 , B22F7/04 , H01B13/00 , H05K3/10 , H05K3/12
摘要： PROBLEM TO BE SOLVED: To provide a method of forming an ultrafine sintered wiring pattern by baking nano-sized metal particles contained in a drawn ultrafine pattern at a relatively low temperature after drawing the pattern, by using a dispersion prepared by dispersing the nano-sized metal particles in a dispersion medium that can be removed easily by evaporating.
SOLUTION: In a step of drawing the ultrafine wiring pattern, an applied layer is formed on a substrate by jetting dispersed nano-sized metal particles in the dispersion medium composed of a supercritical fluid under a pressurized and heated condition from a nozzle. Consequently, the dispersion medium composed of the supercritical fluid can be removed by evaporating, because the medium quickly changes to a gaseou state under the atmospheric pressure.
COPYRIGHT: (C)2004,JPO

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