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1. 发明专利

JP2004218055A Method of depositing conductive gold film substituted for electroless gold plating film using conductive gold paste 有权
标题翻译：使用导电性金浆取代用于电镀金镀膜的导电性金膜的沉积方法
公开(公告)号：JP2004218055A
公开(公告)日：2004-08-05
申请号：JP2003010144
申请日：2003-01-17
申请人： Harima Chem Inc , Ulvac Corporate Center:Kk , ハリマ化成株式会社 , 株式会社アルバック・コーポレートセンター
发明人： HATA NORIAKI , SHIOI NAOTO , UEDA MASAYUKI , MATSUBA YORISHIGE , ODA MASAAKI
IPC分类号： B22F1/02 , B22F3/10 , C23C24/08
摘要： PROBLEM TO BE SOLVED: To provide a method of easily depositing a conductive thin gold film which can be substituted for an electroless gold plating film utilized for various uses in an electronic industrial field and equivalent to that by an electroless flash gold plating method with high film thickness controllability and reproducibility.
SOLUTION: The surface of each gold hyperfine particle with a mean particle diameter of ≤100 nm is provided with a covering layer of an amine compound or the like capable of forming a coordinate bond with a gold element, and it is dispersed into an organic solvent. Using conductive gold paste with an organic acid anhydride, the derivative thereof or the like exhibiting reactivity with the amine compound or the like in the covering layer added, a coating film is deposited, and heat treatment is performed at ≤300°C, so that a thin gold film in which gold hyperfine particles are densely sintered is produced.
COPYRIGHT: (C)2004,JPO&NCIPI
摘要翻译：要解决的问题：提供一种容易沉积导电薄金膜的方法，所述导电薄金膜可以替代用于电子工业领域中各种用途的无电镀金膜，并且等同于通过无电刷闪镀金方法具有高膜厚可控性和重现性。
解决方案：平均粒径≤100nm的每个金超细颗粒的表面设置有能够与金元素形成配位键的胺化合物等的覆盖层，并且分散在有机溶剂。使用导电性金膏与有机酸酐，其衍生物等在被覆层中与胺化合物等显示反应性的方法，沉积涂膜，在≤300℃下进行热处理，产生金超细颗粒致密烧结的薄金膜。版权所有（C）2004，JPO＆NCIPI

2. 发明专利

JP2009299086A Method of forming thick film layer of metal nano particle sintered body 有权
标题翻译：形成金属纳米颗粒烧结体的薄膜层的方法
公开(公告)号：JP2009299086A
公开(公告)日：2009-12-24
申请号：JP2008151678
申请日：2008-06-10
申请人： Harima Chem Inc , ハリマ化成株式会社
发明人： UEDA MASAYUKI , SAITO HIROSHI , TERADA NOBUHITO , MATSUBA YORISHIGE
IPC分类号： C23C18/06 , B22F1/02 , B22F9/00 , B82B3/00 , H01B13/00 , H05K1/09 , H05K3/22 , H05K3/38
摘要： PROBLEM TO BE SOLVED: To provide a method of forming a thick film layer of a metal nano particle sintered body having the excellent adhesiveness to a base layer and the high conductivity on a substrate by applying a method of heating the metal nano particle dispersion liquid coating film from the substrate surface side by using a hot plate like substrate heating means. SOLUTION: The substrate with a coating film being plotted on its surface is arranged on a hot plate like substrate heating means which is heated at the temperature T plate , and heated from a substrate back side in contact with the substrate heating means. The temperature : T bottom (t) on the substrate surface side of the coating film is set to be in a range of 150-250°C, and set to the temperature selected to be lower than the boiling point T b-solvent of the dispersive solvent contained in the coating film. The surface temperature : T top (t) of the coating film is maintained in a range of the temperature difference ΔT(t)=äT bottom (t)-T top (t)}≥10°C, the coating film is heated to cause the low-temperature sintering of metal nano particles contained therein. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种通过应用加热金属纳米颗粒的方法形成具有优异的基底粘附性和基底上的高导电性的金属纳米颗粒烧结体的厚膜层的方法通过使用热板如基板加热装置从基板表面侧分散液体涂膜。＆lt; P＆gt;解决方案：将具有涂膜的基板在其表面上绘制在热板上，如在基板加热装置上加热，在温度T 板加热，并从基板背面加热与基板加热装置接触。将涂膜的基材表面侧的温度T 底部（t）设定在150〜250℃的范围内，将其设定为低于沸点涂布膜中所含的分散溶剂的T b-溶剂。涂膜的表面温度T 顶部（t）保持在温差ΔT（t）=äT底部（t）-T top （t）}≥10℃，加热涂膜，使其内含有金属纳米粒子的低温烧结。版权所有（C）2010，JPO＆INPIT

3. 发明专利

JP2009088340A Method of manufacturing metal nanoparticle sintered compact 有权
标题翻译：金属纳米复合材料的制备方法
公开(公告)号：JP2009088340A
公开(公告)日：2009-04-23
申请号：JP2007257594
申请日：2007-10-01
申请人： Harima Chem Inc , ハリマ化成株式会社
发明人： ABE SHINTARO , TERADA NOBUHITO , MATSUBA YORISHIGE
IPC分类号： H05K3/12 , B22F1/00 , H01B13/00 , H05K1/09 , H05K3/10
摘要： PROBLEM TO BE SOLVED: To provide a method of manufacturing a metal nanoparticle sintered compact capable of reducing the scattering of a conductivity of the whole sintered compact layer to be formed and at the same time keeping the conductivity of the whole sintered compact layer obtained in a range of 1×10 -5 Ω cm or below with a high reproducibility, when the metal nanoparticle sintered compact is produced by a low temperature sintering of metal nanoparticles. SOLUTION: After applying a dispersion liquid in which metal nanoparticles with an average particle diameter of 1-100 nm, the surface of which is coated with alkylamine, are dispersed in an organic solvent having a boiling point of 100°C or higher, the metal nanoparticle sintered compact is formed by efficiently removing alkylamine covering the surface of the metal nanoparticles by heating at a temperature of 100°C-200°C under pressurized atmosphere of 1.5 atm-10 atm. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：解决的问题：提供一种能够减少要形成的整个烧结体层的电导率的散射的金属纳米颗粒烧结体的制造方法，同时保持整个烧结体层的导电性通过金属纳米粒子的低温烧结制造金属纳米粒子烧结体时，以1×10 -5 Ωcm以下的范围以高的再现性获得。解决方案：在其表面用烷基胺涂覆其中平均粒径为1-100nm的金属纳米颗粒涂布在沸点为100℃或更高的有机溶剂中的分散液之后，金属纳米颗粒烧结体通过在1.5atm-10大气压的加压气氛下在100℃-200℃的温度下加热而有效地除去覆盖金属纳米颗粒表面的烷基胺而形成。版权所有（C）2009，JPO＆INPIT

4. 发明专利

JP2007083288A Forming method of conductive joint 有权
标题翻译：导电接头的形成方法
公开(公告)号：JP2007083288A
公开(公告)日：2007-04-05
申请号：JP2005276060
申请日：2005-09-22
申请人： Harima Chem Inc , ハリマ化成株式会社
发明人： HATA NORIAKI , MATSUBA YORISHIGE
IPC分类号： B23K20/00 , H05K3/32 , H05K3/36
摘要： PROBLEM TO BE SOLVED: To provide a forming method of conductive joint by applying a technique of forge welding for bonding a metal surface of a metal layer to a conductive bonding layer, when conductive-bonding the surfaces of two metal layers via a conductive bonding layer composed of metallic nanoparticles. SOLUTION: A dispersion liquid of metallic nanoparticles having a molecular layer of a coating agent on the surface thereof is coated on the metal surface of one of metal layers. Then, an organic solvent contained in the coated layer is vaparized to obtain a dry coated layer. The conductive bonding layer is formed by removal of the molecular layer of the coating agent and interactive fusion of metallic nanoparticles through heat treatment at 150°C and under in an atmosphere of high-frequency plasma. A metallic bonding is formed between the surface of the conductive bonding layer and the surface of the metal composing the other metal layer, by applying a heat treatment at 100°C-200°C while forcibly pressing the metal surface of the other metal layer on the surface of the conductive bonding layer. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：为了通过将金属层的金属表面接合到导电接合层的锻造焊接技术来提供导电接合体的形成方法，当通过以下方式将两个金属层的表面进行导电接合时导电结合层由金属纳米粒子组成。解决方案：在其表面上具有涂层剂分子层的金属纳米颗粒的分散液涂覆在金属层之一的金属表面上。然后，将包含在涂层中的有机溶剂挥发，得到干涂层。通过在高频等离子体的气氛中，在150℃以下的热处理下除去涂层剂的分子层和金属纳米粒子的相互融合，形成导电性接合层。在导电接合层的表面和构成另一金属层的金属的表面之间通过在100℃-200℃下进行热处理，同时强制地将另一金属层的金属表面压在一起而形成金属接合导电接合层的表面。版权所有（C）2007，JPO＆INPIT

5. 发明专利

JP2005093741A Solid electrolytic capacitor and manufacturing method thereof 有权
标题翻译：固体电解电容器及其制造方法
公开(公告)号：JP2005093741A
公开(公告)日：2005-04-07
申请号：JP2003325468
申请日：2003-09-18
申请人： Harima Chem Inc , Nippon Chemicon Corp , Ulvac Japan Ltd , Vacuum Metallurgical Co Ltd , ハリマ化成株式会社 , 日本ケミコン株式会社 , 株式会社アルバック , 真空冶金株式会社
发明人： ENDO KAZUYOSHI , OSAKO TAKEHISA , GOTO HIDEYUKI , MATSUBA YORISHIGE , ODA MASAAKI
IPC分类号： H01G9/028 , H01G9/00 , H01G9/04 , H01G9/14
摘要： PROBLEM TO BE SOLVED: To provide a method for manufacturing a solid electrolytic capacitor which enables further reduction of ESR.
SOLUTION: A solid electrolytic layer consisting of a conductive polymer is formed on a capacitor element of a sintered body formed by sintering valve metal powder and having an anode oxide film on the surface thereof. Silver paste formed by mixing silver powder particles with mean particle diameter of 0.2-20 μm, silver nano-particles with mean particle diameter of 1-100 nm, and a predetermined binder is applied on the conductive polymer layer, and is sintered in the temperature range of 150-350°C to form a conductive layer.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供一种能够进一步减少ESR的固体电解电容器的制造方法。解决方案：在通过烧结阀金属粉末并在其表面上具有阳极氧化膜形成的烧结体的电容器元件上形成由导电聚合物组成的固体电解质层。通过将平均粒径为0.2〜20μm的银粉末，平均粒径为1-100nm的银纳米颗粒和预定的粘合剂混合而形成的银浆料涂覆在导电聚合物层上，并在温度范围为150-350℃，形成导电层。版权所有（C）2005，JPO＆NCIPI

6. 发明专利

JP2004148198A Ultrafine ink-jet printing nozzle and its production method 有权
公开(公告)号：JP2004148198A
公开(公告)日：2004-05-27
申请号：JP2002316176
申请日：2002-10-30
申请人： Harima Chem Inc , ハリマ化成株式会社
发明人： MATSUI SHINJI , HATA NORIAKI , MATSUBA YORISHIGE
IPC分类号： B41J2/135 , B05C5/00
摘要： PROBLEM TO BE SOLVED: To provide a fine nozzle which is applicable to a fine drawing method by ink-jet printing using a nanoparticle paste and a method for producing the nozzle.
SOLUTION: The bore diameter of the nozzle has an inner wall surface structure to be gradually decreased from the pipe inside diameter of the base part to the aperture diameter of the tip of the nozzle and an outer surface structure showing a cuspidal-outer shape which has the same central axis as the inner wall surface. The aperture diameter of the nozzle tip, corresponding to the average particle size of the nanoparticles contained in the nanoparticle paste, after being selected to be 10-10,000 nm, by using a focused ion beam method, manufactures the ultrafine ink-jet printing nozzle which is integrally constituted of a gas-phase accumulation material which is accumulated/processed in the above shape.
COPYRIGHT: (C)2004,JPO

7. 发明专利

JP2009267300A Method for manufacturing multilayer wiring board 有权
标题翻译：制造多层接线板的方法
公开(公告)号：JP2009267300A
公开(公告)日：2009-11-12
申请号：JP2008118444
申请日：2008-04-30
申请人： Harima Chem Inc , ハリマ化成株式会社
发明人： ABE SHINTARO , TERADA NOBUHITO , MATSUBA YORISHIGE
IPC分类号： H05K3/40 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide a method for manufacturing a multilayer wiring board, using a copper nanoparticle sintered body conductive layer, in place of a conventionally used electroless copper plating layer. SOLUTION: For example, when electroless copper plating is carried out, an attachment layer of Pd metal based catalyst formed by attaching Sn-Pd based catalyst usable as a catalyst to a copper layer, carrying out activation thereto is utilized as a metal nuclear particle attaching layer. The copper nanoparticle sintered body conductive layer is formed by sintering copper nanoparticles at low temperature which are regenerated, by reducing the copper nanoparticles, having a surface oxidized film layer as metal nuclear particles. Formation of an upper wiring layer on an insulating resin layer and interlayer conduction via a via hole, between the lower wiring layer and upper wiring layer, are attained by using the copper nanoparticle sintered body conductive layer. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种使用铜纳米颗粒烧结体导电层制造多层布线板的方法，代替常规使用的无电镀铜层。解决方案：例如，当进行无电镀铜时，使用通过将可用作催化剂的可用作催化剂的Sn-Pd基催化剂附着到铜层上形成的Pd金属基催化剂的附着层作为金属，作为金属核粒子附着层。铜纳米颗粒烧结体导电层是通过将具有表面氧化膜层作为金属核粒子的铜纳米颗粒还原而在再生的低温烧结铜纳米粒子而形成的。通过使用铜纳米颗粒烧结体导电层，可以在下部布线层和上部布线层之间通过通孔形成绝缘树脂层上的上部布线层和层间导电。版权所有（C）2010，JPO＆INPIT

8. 发明专利

JP2008146999A Forming method of fine shape conductor of copper-based particulate sintering compact 有权
标题翻译：基于铜的颗粒烧结精细成形导体的形成方法
公开(公告)号：JP2008146999A
公开(公告)日：2008-06-26
申请号：JP2006332320
申请日：2006-12-08
申请人： Harima Chem Inc , ハリマ化成株式会社
发明人： ABE SHINTARO , TERADA NOBUHITO , MATSUBA YORISHIGE
IPC分类号： H01B13/00 , B22F3/10 , C22C9/00 , H05K3/10
摘要： PROBLEM TO BE SOLVED: To provide a forming method of a fine shape conductor of a copper-based particulate sintering compact exhibiting a superior conductivity, which is formed by utilizing a dispersion liquid of the copper particulates having a surface oxide film layer, wherein after fine pattern drawing, the copper particulates or copper oxide particulates contained in the coated films are reduction treated under a comparatively low temperature, and the copper particulates formed are calcinated. SOLUTION: After the dispersion liquid containing the copper particulates or copper oxide particulates having surface oxide film layer of the average particle diameter of 1 to 100 nm is coated on the substrate, with a metal or a metal salt having a catalytic activity against hydrogenation reaction, under existence of hydrocarbon having hydrogen donating property in an atmosphere containing hydrogen is heated in a temperature of 150°C or more and 300°C or less, and by a reduction reaction utilizing hydrogen molecule as a reducer, reduction of oxide film is applied, and a process in which the mutually sintered compact layer is formed from the copper particulates thus obtained is carried out in a series of heat treatment process. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：为了提供通过利用具有表面氧化膜层的铜微粒的分散液形成的具有优异导电性的铜基微粒烧结体的细形状导体的形成方法，其中，在精细图案拉伸之后，涂覆膜中所含的铜微粒或氧化铜微粒在比较低的温度下进行还原处理，并且所形成的铜微粒被煅烧。溶液：将含有平均粒径为1〜100nm的表面氧化膜层的铜微粒或氧化铜微粒的分散液涂布在基材上，用金属或具有催化活性的金属盐在含有氢的气氛中存在具有赋氢性的烃的氢化反应在150℃以上且300℃以下的温度下加热，通过使用氢分子作为还原剂的还原反应，还原氧化膜并且由这样获得的铜微粒形成相互烧结的致密层的工序是在一系列的热处理工序中进行的。版权所有（C）2008，JPO＆INPIT

9. 发明专利

JP2008146991A Forming method for copper particulate sintered body type micro profile conductive body and forming method for copper micro profile wiring and copper thin film using same method 有权
标题翻译：铜复合型烧结体型微型轮廓导体的形成方法及铜微型轮廓线形成方法及铜薄膜的制作方法
公开(公告)号：JP2008146991A
公开(公告)日：2008-06-26
申请号：JP2006332126
申请日：2006-12-08
申请人： Harima Chem Inc , ハリマ化成株式会社
发明人： TERADA NOBUHITO , ABE SHINTARO , MATSUBA YORISHIGE
IPC分类号： H01B13/00 , B22F9/20 , H05K1/09
摘要： PROBLEM TO BE SOLVED: To provide a method for forming a copper particulate sintered body type micro profile conductive body showing excellent conductivity by applying a reduction treatment to the copper particulates or oxidized copper particulates provided with a surface oxidized film layer in a pattern under comparatively low temperature after a detailed pattern is drawn by using dispersion liquid of copper particulates provided with surface oxidized film layers and then sintering the formed copper particulates. SOLUTION: The process is carried out in a series of heat treatment processes such that the particulates in a coating layer are, for example, heated to temperature which is 200°C or more and 300°C or less under a pressurizing condition of 1.5 atmospheric pressure or more in an environment containing hydrogen molecules after the dispersion liquid containing copper particulates with the surface oxidized film layer or oxidized copper particulates with an average particle diameter of 1 to 100 nm is coated on a substrate, and are subjected to a reduction reaction of the oxidized film using hydrogen molecules as a reducing agent, to form the sintered body layer between the copper particulates obtained. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：解决的问题：提供一种形成铜微粒烧结体型微型导电体的方法，其通过对设置有图案的表面氧化膜层的铜微粒或氧化铜微粒进行还原处理而显示出优异的导电性在通过使用具有表面氧化膜层的铜微粒的分散液抽出详细图案然后烧结形成的铜微粒之后，在相对低的温度下进行。解决方案：该方法在一系列热处理工艺中进行，使得涂层中的微粒例如在加压条件下被加热至200℃以上且300℃以下的温度在含有具有表面氧化膜层的铜微粒或平均粒径为1〜100nm的氧化的铜微粒的分散液中的含有氢分子的环境中，在1.5大气压以上的环境下，涂布在基板上，使用氢分子作为还原剂的氧化膜的还原反应，形成所获得的铜微粒之间的烧结体层。版权所有（C）2008，JPO＆INPIT

10. 发明专利

JP2006260951A Conductive copper paste 审中-公开
标题翻译：导电铜浆
公开(公告)号：JP2006260951A
公开(公告)日：2006-09-28
申请号：JP2005077021
申请日：2005-03-17
申请人： Harima Chem Inc , Osaka Univ , ハリマ化成株式会社 , 国立大学法人大阪大学
发明人： TAKEMOTO TADASHI , NISHIKAWA HIROSHI , TERADA NOBUHITO , MATSUBA YORISHIGE
IPC分类号： H01B1/22 , H01B1/00
摘要： PROBLEM TO BE SOLVED: To provide a conductive copper paste capable of, as a main part of a conductive filler, manufacturing a conductive adhesive layer showing excellent conductivity by using copper particles, with the formed conductive adhesive layer capable of keeping excellent conductivity for a long period.
SOLUTION: Low melting-point alloy particles are used as well by less amount than copper particles. A thermo-curable phenol resin of a binder resin is added with flux agent, a trace amount of flux activity suppressing agent, and chelating agent. A conductive copper paste is thus configured. So, before curing of the binder resin, a low melting-point alloy having a low melting-point dissolves, to fill the gap among copper particles, forming metal bonding. Then, when the temperature rises for thermo-curing of resin, the flux activity suppressing agent reacts with the flux active component to lose activity of the flux, providing a conductive copper paste for manufacturing a conductive adhesive layer excellent in conductivity and anti-oxidation characteristics.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：为了提供一种导电铜浆，其能够作为导电填料的主要部分，通过使用铜颗粒制造显示出优异的导电性的导电粘合剂层，所形成的导电粘合剂层能够保持优异的导电性很长一段时间。
解决方案：低熔点合金颗粒的使用量也少于铜颗粒。加入粘合剂树脂的热固性酚醛树脂，添加助熔剂，微量助焊剂活性抑制剂和螯合剂。因此构成导电铜浆。因此，在粘合剂树脂固化之前，具有低熔点的低熔点合金溶解，以填充铜颗粒之间的间隙，形成金属粘合。然后，当树脂的热固化温度升高时，助焊剂活性抑制剂与助焊剂活性成分反应，失去助焊剂的活性，提供导电性铜膏，用于制造导电性和抗氧化特性优异的导电性粘合剂层。版权所有（C）2006，JPO＆NCIPI

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