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1. 发明专利

JP2004218055A Method of depositing conductive gold film substituted for electroless gold plating film using conductive gold paste 有权
标题翻译：使用导电性金浆取代用于电镀金镀膜的导电性金膜的沉积方法
公开(公告)号：JP2004218055A
公开(公告)日：2004-08-05
申请号：JP2003010144
申请日：2003-01-17
申请人： Harima Chem Inc , Ulvac Corporate Center:Kk , ハリマ化成株式会社 , 株式会社アルバック・コーポレートセンター
发明人： HATA NORIAKI , SHIOI NAOTO , UEDA MASAYUKI , MATSUBA YORISHIGE , ODA MASAAKI
IPC分类号： B22F1/02 , B22F3/10 , C23C24/08
摘要： PROBLEM TO BE SOLVED: To provide a method of easily depositing a conductive thin gold film which can be substituted for an electroless gold plating film utilized for various uses in an electronic industrial field and equivalent to that by an electroless flash gold plating method with high film thickness controllability and reproducibility.
SOLUTION: The surface of each gold hyperfine particle with a mean particle diameter of ≤100 nm is provided with a covering layer of an amine compound or the like capable of forming a coordinate bond with a gold element, and it is dispersed into an organic solvent. Using conductive gold paste with an organic acid anhydride, the derivative thereof or the like exhibiting reactivity with the amine compound or the like in the covering layer added, a coating film is deposited, and heat treatment is performed at ≤300°C, so that a thin gold film in which gold hyperfine particles are densely sintered is produced.
COPYRIGHT: (C)2004,JPO&NCIPI
摘要翻译：要解决的问题：提供一种容易沉积导电薄金膜的方法，所述导电薄金膜可以替代用于电子工业领域中各种用途的无电镀金膜，并且等同于通过无电刷闪镀金方法具有高膜厚可控性和重现性。
解决方案：平均粒径≤100nm的每个金超细颗粒的表面设置有能够与金元素形成配位键的胺化合物等的覆盖层，并且分散在有机溶剂。使用导电性金膏与有机酸酐，其衍生物等在被覆层中与胺化合物等显示反应性的方法，沉积涂膜，在≤300℃下进行热处理，产生金超细颗粒致密烧结的薄金膜。版权所有（C）2004，JPO＆NCIPI

2. 发明专利

JP2005093814A Method for forming multilayer wiring pattern 有权
标题翻译：形成多层布线图案的方法
公开(公告)号：JP2005093814A
公开(公告)日：2005-04-07
申请号：JP2003326572
申请日：2003-09-18
申请人： Harima Chem Inc , ハリマ化成株式会社
发明人： SAITO HIROSHI , UEDA MASAYUKI , HATA NORIAKI , MATSUBA YORISHIGE
IPC分类号： H05K3/28 , H05K3/10 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide a method for forming a novel multilayer wiring structure wherein alignment of the lowest wiring layer with upper wiring layers is maintained with high precision, intricacy of layer connecting conductive route formation is greatly reduced, and wiring suitable for pattern miniaturization is feasible, and to provide a circuit board having multiple wiring layers utilizing this method. SOLUTION: A conductive paste applied layer is formed for lower layer wiring on an insulating substrate by using the inkjet method for drawing. Concerning the parts whereon an upper wiring pattern is placed, an insulating paste applied layer is formed for interlayer insulation except at parts where conduction is to be established between the upper and lower layers. Further, a conductive paste applied layer for upper wiring is laminated, and is treated by heat. A conductive layer is made out of each conductive paste applied layer and an insulating layer is made out of each insulating paste applied layer, which results in a multilayer wiring structure wherein upper and lower layers are insulated from each other at parts where the insulating film exists and connection/conduction is established between them at parts where the insulating film is omitted. COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：为了提供一种形成新颖的多层布线结构的方法，其中最高布线层与上布线层的对准以高精度保持，层间连接导电路径形成的复杂度大大降低，布线适合为了图案小型化是可行的，并且提供一种使用该方法的具有多个布线层的电路板。解决方案：通过使用喷墨方法在绝缘基板上形成用于下层布线的导电糊涂层。关于放置上部布线图案的部分，形成用于层间绝缘的绝缘膏施加层，除了要在上层和下层之间建立传导的部分之外。此外，层叠用于上部布线的导电性糊剂涂布层，并进行热处理。由每个导电糊涂层施加导电层，并且由每个绝缘膏施加层制成绝缘层，这导致多层布线结构，其中上层和下层在存在绝缘膜的部分处彼此绝缘并且在省略绝缘膜的部分之间建立它们之间的连接/导通。版权所有（C）2005，JPO＆NCIPI

3. 发明专利

JP2004119686A Method of forming fine wiring pattern 有权
公开(公告)号：JP2004119686A
公开(公告)日：2004-04-15
申请号：JP2002280965
申请日：2002-09-26
申请人： Harima Chem Inc , ハリマ化成株式会社
发明人： HATA NORIAKI , UEDA MASAYUKI , SHIOI NAOTO , MATSUBA YORISHIGE
IPC分类号： H05K3/12 , H05K3/10 , H05K3/20
摘要： PROBLEM TO BE SOLVED: To provide a method by which an extremely fine sintered copper-based wiring pattern can be formed by reducing nano-sized copper oxide particles in the pattern into nano-sized copper particles at a relatively low temperature after the pattern is drawn, by using a dispersed liquid of nano-sized copper oxide particles and baking the copper particles.
SOLUTION: The dispersed liquid containing the nano-sized copper oxide particles having a mean particle diameter of 1-100 nm is applied to a substrate. Thereafter, the reduction of the nano-sized copper oxide particles and the formation of a sintered layer of the obtained copper particles are performed in the same step, by reducing the copper oxide particles through a reducing reaction using an active reactive species excited with plasma derived from a reducing gas, by heating the copper oxide particles contained in the applied layer to a temperature of ≤300°C in a plasma atmosphere produced under the presence of the reducing gas. Consequently, the utilizable range of the used substrate material is expanded largely, because the heat resistance required for the material is significantly relaxed.
COPYRIGHT: (C)2004,JPO

4. 发明专利

JP2003311944A Fine patterning method 有权
标题翻译：精细绘图方法
公开(公告)号：JP2003311944A
公开(公告)日：2003-11-06
申请号：JP2002121036
申请日：2002-04-23
申请人： Dainippon Printing Co Ltd , Harima Chem Inc , ハリマ化成株式会社 , 大日本印刷株式会社
发明人： FUJITA HIROYUKI , DAITO RYOICHI , MATSUBA YORISHIGE , UEDA MASAYUKI
IPC分类号： B41J2/01
摘要： PROBLEM TO BE SOLVED: To provide a fine patterning method in which a fine pattern can be formed with high accuracy by writing the pattern directly with ink. SOLUTION: Ink containing, at least, ultrafine particles having a mean particle size in the range of 1-100 nm, a dispersant covering the surface of the ultrafine particles, an organic binder, and a supplementary substance for removing the dispersant thermally from the surface of the ultrafine particles and having a viscosity in the range of 1-10000 cp is ejected from microholes of a silicon substrate onto a pattern forming body by means of an electric field being formed between a main electrode and a counter electrode and a low pressure at the time of supply thus writing the pattern directly with ink. Subsequently, the ink is heated to form a desired fine pattern. COPYRIGHT: (C)2004,JPO
摘要翻译：要解决的问题：为了提供一种精细图案化方法，其中通过将图案直接写入墨水可以高精度地形成精细图案。解决方案：至少含有平均粒度在1-100nm范围内的超细颗粒，覆盖超细颗粒表面的分散剂，有机粘合剂和用于除去分散剂的辅助物质的油墨从具有1-10000cp范围的粘度的超细颗粒表面通过在主电极和对电极之间形成的电场从硅衬底的微孔喷射到图案形成体上，供应时的低压，直接用墨水书写图案。随后，将油墨加热以形成所需的精细图案。版权所有（C）2004，JPO

5. 发明专利

JP2003060114A Semiconductor device and solid-state image pickup device 审中-公开
标题翻译：半导体器件和固态图像拾取器件
公开(公告)号：JP2003060114A
公开(公告)日：2003-02-28
申请号：JP2001248335
申请日：2001-08-17
申请人： Harima Chem Inc , Sony Corp , ソニー株式会社 , ハリマ化成株式会社
发明人： SASANO KEIJI , YAMADA TOMOKO , GOTO HIDEYUKI , UEDA MASAYUKI , MATSUBA YORISHIGE
IPC分类号： H01L27/14 , H01L21/56 , H01L21/60 , H01L23/12
CPC分类号： H01L2224/16
摘要： PROBLEM TO BE SOLVED: To improve reliability of the electrical connection of a bump and a pattern of a semiconductor element or a solid-state image pickup device and a substrate with respect to mechanical shocks or thermal shocks.
SOLUTION: The bump 8 of the solid-state image pickup device 3 and an inner lead part 4, consisting of the conductive paste 2 of a transparent substrate 1, are positioned and pressure-contacted. Then transparent resin 10 is applied between the image pickup device 3 and the substrate 1, to fix the image pickup device 3 and the substrate 1 by hardening of this resin 10. By using material of a low Young's modulus {200 to 1,000 N/mm
2 (20 to 100 kgf/mm
2 )} for the conductive paste 2, an effect of absorbing stress in the periphery of the bump occurring on the mechanical shock and the thermal shock generated, when jointing the image pickup device 3 and the substrate 1 and the reliability of the electrical connection state of the bump, and the pattern is improved markedly.
COPYRIGHT: (C)2003,JPO
摘要翻译：要解决的问题：相对于机械冲击或热冲击，提高凸块的电连接和半导体元件或固态图像拾取装置和基板的图案的可靠性。解决方案：由透明基板1的导电浆料2组成的固态图像拾取装置3的凸起8和内部引线部分4被定位和压力接触。然后将透明树脂10施加在图像拾取装置3和基板1之间，以通过该树脂10的硬化来固定图像拾取装置3和基板1。通过使用低杨氏模量200至1,000N / 2>（20〜100kgf / mm 2）}，在连接图像摄取装置3和图像拾取装置3时，产生在机械冲击发生的凸起的周围的应力和产生的热冲击的效果衬底1和凸起的电连接状态的可靠性，并且图案显着改善。

6. 发明专利

JP2009299086A Method of forming thick film layer of metal nano particle sintered body 有权
标题翻译：形成金属纳米颗粒烧结体的薄膜层的方法
公开(公告)号：JP2009299086A
公开(公告)日：2009-12-24
申请号：JP2008151678
申请日：2008-06-10
申请人： Harima Chem Inc , ハリマ化成株式会社
发明人： UEDA MASAYUKI , SAITO HIROSHI , TERADA NOBUHITO , MATSUBA YORISHIGE
IPC分类号： C23C18/06 , B22F1/02 , B22F9/00 , B82B3/00 , H01B13/00 , H05K1/09 , H05K3/22 , H05K3/38
摘要： PROBLEM TO BE SOLVED: To provide a method of forming a thick film layer of a metal nano particle sintered body having the excellent adhesiveness to a base layer and the high conductivity on a substrate by applying a method of heating the metal nano particle dispersion liquid coating film from the substrate surface side by using a hot plate like substrate heating means. SOLUTION: The substrate with a coating film being plotted on its surface is arranged on a hot plate like substrate heating means which is heated at the temperature T plate , and heated from a substrate back side in contact with the substrate heating means. The temperature : T bottom (t) on the substrate surface side of the coating film is set to be in a range of 150-250°C, and set to the temperature selected to be lower than the boiling point T b-solvent of the dispersive solvent contained in the coating film. The surface temperature : T top (t) of the coating film is maintained in a range of the temperature difference ΔT(t)=äT bottom (t)-T top (t)}≥10°C, the coating film is heated to cause the low-temperature sintering of metal nano particles contained therein. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种通过应用加热金属纳米颗粒的方法形成具有优异的基底粘附性和基底上的高导电性的金属纳米颗粒烧结体的厚膜层的方法通过使用热板如基板加热装置从基板表面侧分散液体涂膜。＆lt; P＆gt;解决方案：将具有涂膜的基板在其表面上绘制在热板上，如在基板加热装置上加热，在温度T 板加热，并从基板背面加热与基板加热装置接触。将涂膜的基材表面侧的温度T 底部（t）设定在150〜250℃的范围内，将其设定为低于沸点涂布膜中所含的分散溶剂的T b-溶剂。涂膜的表面温度T 顶部（t）保持在温差ΔT（t）=äT底部（t）-T top （t）}≥10℃，加热涂膜，使其内含有金属纳米粒子的低温烧结。版权所有（C）2010，JPO＆INPIT

7. 发明专利

JP2005293937A Method of forming metal thin-film layer on conductive ito film or on glass substrate surface as base substrate of ito film, and metal thin-film layer on conductive ito film or on glass substrate surface as base substrate of the ito film 有权
标题翻译：在导电ITO膜上形成金属薄膜层的方法或作为ITO膜的基底表面的玻璃基底表面上形成金属薄膜层的方法，以及导电ITO膜上的金属薄膜层或作为ITO膜的基板的玻璃基板表面的方法
公开(公告)号：JP2005293937A
公开(公告)日：2005-10-20
申请号：JP2004104791
申请日：2004-03-31
申请人： Harima Chem Inc , Ulvac Japan Ltd , ハリマ化成株式会社 , 株式会社アルバック
发明人： UEDA MASAYUKI , KOYAMA MASAHIDE , HATA NORIAKI , MATSUBA YORISHIGE , IWASHIGE HIROSHI , ODA MASAAKI
IPC分类号： G02F1/1343 , C03C17/34 , H01B5/14 , H01B13/00
摘要： PROBLEM TO BE SOLVED: To provide a method, capable of forming a fine metal thin film pattern excellent in adherence properties on the surface of a conductive ITO film and a glass substrate of a base substrate, with high drawing precision, high workability, and high reproducibility. SOLUTION: The thin film layer of transition metal is formed by applying a solvent formed by dissolving transition metal compound, containing organic anion and cation of transition metal in organic solvent on the ITO film and on the surface of the glass substrate of a base substrate, and applying heat treatment thereto. The fine metal thin-film pattern with superior adherence properties is formed on the surface of the transition metal thin film layer, by applying a liquid, in which metal fine particles with average size of 1 to 100 nm are dispersed at a prescribed thickness, and by forming a layer in which fine metal particles are sintered mutually, by heating and sintering the above. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：解决问题的方案：提供一种能够在导电性ITO膜和基材的玻璃基板的表面上形成粘合性优异的金属薄膜图案，拉拔精度高，加工性高的方法，重现性高。解决方案：过渡金属的薄膜层通过将通过将含有有机阴离子的过渡金属化合物和过渡金属的阳离子溶解在有机溶剂中而形成的溶剂形成在ITO膜上和玻璃基板的表面上并对其进行热处理。在过渡金属薄膜层的表面上，通过涂布以规定厚度分散平均粒径为1〜100nm的金属微粒子的液体，形成具有优异粘附特性的金属薄膜图案，通过加热和烧结上述方法形成相互烧结金属微粒的层。版权所有（C）2006，JPO＆NCIPI

8. 发明专利

JP2004273205A Conductive nanoparticle paste 有权
公开(公告)号：JP2004273205A
公开(公告)日：2004-09-30
申请号：JP2003060094
申请日：2003-03-06
申请人： Harima Chem Inc , ハリマ化成株式会社
发明人： HATA NORIAKI , UEDA MASAYUKI , MATSUBA YORISHIGE
IPC分类号： H05K1/09 , H01B1/00 , H01B1/22 , H01B13/00 , H01L21/288 , H05K3/10 , H05K3/12
摘要： PROBLEM TO BE SOLVED: To provide low temperature sintering type conductive metal nanoparticle paste for high density circuit printing forming a smooth surface when applied to a substrate and baked, and forming a low resistance and fine circuit. SOLUTION: The conductive metal nanoparticle paste is prepared by forming a surface covering layer comprising an amine compound or the like covering the surface on metal nanoparticles having an average particle size of 100 nm, and uniformly dispersing in a dispersing medium containing one or more high boiling point organic solvents capable of eluting and releasing covered molecules such as the amine compound by heating. By using the conductive metal nanoparticle paste, when a fine pattern is drown and heated at low temperature, a dense sinter of metal nanoparticles can be obtained, and a conductor layer with high metal contents and high conductive characteristics can be formed. COPYRIGHT: (C)2004,JPO&NCIPI

9. 发明专利

JP2004119790A Method of forming fine wiring pattern using dispersed nano-sized particles in supercritical fluid 有权
公开(公告)号：JP2004119790A
公开(公告)日：2004-04-15
申请号：JP2002282790
申请日：2002-09-27
申请人： Harima Chem Inc , ハリマ化成株式会社
发明人： HATA NORIAKI , UEDA MASAYUKI , SHIOI NAOTO , MATSUBA YORISHIGE
IPC分类号： B22F9/00 , B22F7/04 , H01B13/00 , H05K3/10 , H05K3/12
摘要： PROBLEM TO BE SOLVED: To provide a method of forming an ultrafine sintered wiring pattern by baking nano-sized metal particles contained in a drawn ultrafine pattern at a relatively low temperature after drawing the pattern, by using a dispersion prepared by dispersing the nano-sized metal particles in a dispersion medium that can be removed easily by evaporating.
SOLUTION: In a step of drawing the ultrafine wiring pattern, an applied layer is formed on a substrate by jetting dispersed nano-sized metal particles in the dispersion medium composed of a supercritical fluid under a pressurized and heated condition from a nozzle. Consequently, the dispersion medium composed of the supercritical fluid can be removed by evaporating, because the medium quickly changes to a gaseou state under the atmospheric pressure.
COPYRIGHT: (C)2004,JPO

10. 发明专利

JP2012028243A Conductive copper paste 有权
标题翻译：导电铜浆
公开(公告)号：JP2012028243A
公开(公告)日：2012-02-09
申请号：JP2010167917
申请日：2010-07-27
申请人： Harima Chem Inc , ハリマ化成株式会社
发明人： ABE SHINTARO , UEDA MASAYUKI , HOSOYA KAZUO , HAMADA TAKESHI , MATSUBA YORISHIGE
IPC分类号： H01B1/22 , H01B1/00 , H05K1/09 , H05K3/12
摘要： PROBLEM TO BE SOLVED: To provide a conductive copper paste having a novel structure, which need not use a thermosetting resin component nor glass frit for keeping the adhesion with a base layer and an electrical contact with the base layer, and which is suitable for manufacture of a thick conductor layer.SOLUTION: The conductive copper paste is prepared by evenly mixing copper powder, fine copper powder, and a copper salt of aliphatic monocarboxylic acid dissolved in (dialkyl amino)alkylamine together with aliphatic polyhydric alcohol as a dispersion solvent, or prepared by evenly mixing copper powder, fine copper powder, and copper nano particles dispersed in (dialkyl amino)alkylamine together with aliphatic polyhydric alcohol as a dispersion solvent. Use of the conductive copper paste allows the manufacture of a sintered compact layer exhibiting a good electrical conductivity.
摘要翻译：要解决的问题：为了提供一种具有新颖结构的导电铜浆，不需要使用热固性树脂组分和玻璃料来保持与基底层的粘附和与基底层的电接触，并且其是适用于制造厚导体层。解决方案：通过将铜粉末，细铜粉末和溶解在（二烷基氨基）烷基胺中的脂肪族单羧酸的铜盐与作为分散溶剂的脂肪族多元醇一起均匀地混合，或者均匀地制备，将分散在（二烷基氨基）烷基胺中的铜粉末，细铜粉末和铜纳米颗粒与脂族多元醇一起作为分散溶剂混合。导电铜浆的使用允许制造表现出良好导电性的烧结致密层。版权所有（C）2012，JPO＆INPIT

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