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1. 发明专利

JP2004218055A Method of depositing conductive gold film substituted for electroless gold plating film using conductive gold paste 有权
标题翻译：使用导电性金浆取代用于电镀金镀膜的导电性金膜的沉积方法
公开(公告)号：JP2004218055A
公开(公告)日：2004-08-05
申请号：JP2003010144
申请日：2003-01-17
申请人： Harima Chem Inc , Ulvac Corporate Center:Kk , ハリマ化成株式会社 , 株式会社アルバック・コーポレートセンター
发明人： HATA NORIAKI , SHIOI NAOTO , UEDA MASAYUKI , MATSUBA YORISHIGE , ODA MASAAKI
IPC分类号： B22F1/02 , B22F3/10 , C23C24/08
摘要： PROBLEM TO BE SOLVED: To provide a method of easily depositing a conductive thin gold film which can be substituted for an electroless gold plating film utilized for various uses in an electronic industrial field and equivalent to that by an electroless flash gold plating method with high film thickness controllability and reproducibility.
SOLUTION: The surface of each gold hyperfine particle with a mean particle diameter of ≤100 nm is provided with a covering layer of an amine compound or the like capable of forming a coordinate bond with a gold element, and it is dispersed into an organic solvent. Using conductive gold paste with an organic acid anhydride, the derivative thereof or the like exhibiting reactivity with the amine compound or the like in the covering layer added, a coating film is deposited, and heat treatment is performed at ≤300°C, so that a thin gold film in which gold hyperfine particles are densely sintered is produced.
COPYRIGHT: (C)2004,JPO&NCIPI
摘要翻译：要解决的问题：提供一种容易沉积导电薄金膜的方法，所述导电薄金膜可以替代用于电子工业领域中各种用途的无电镀金膜，并且等同于通过无电刷闪镀金方法具有高膜厚可控性和重现性。
解决方案：平均粒径≤100nm的每个金超细颗粒的表面设置有能够与金元素形成配位键的胺化合物等的覆盖层，并且分散在有机溶剂。使用导电性金膏与有机酸酐，其衍生物等在被覆层中与胺化合物等显示反应性的方法，沉积涂膜，在≤300℃下进行热处理，产生金超细颗粒致密烧结的薄金膜。版权所有（C）2004，JPO＆NCIPI

2. 发明专利

JP2005093814A Method for forming multilayer wiring pattern 有权
标题翻译：形成多层布线图案的方法
公开(公告)号：JP2005093814A
公开(公告)日：2005-04-07
申请号：JP2003326572
申请日：2003-09-18
申请人： Harima Chem Inc , ハリマ化成株式会社
发明人： SAITO HIROSHI , UEDA MASAYUKI , HATA NORIAKI , MATSUBA YORISHIGE
IPC分类号： H05K3/28 , H05K3/10 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide a method for forming a novel multilayer wiring structure wherein alignment of the lowest wiring layer with upper wiring layers is maintained with high precision, intricacy of layer connecting conductive route formation is greatly reduced, and wiring suitable for pattern miniaturization is feasible, and to provide a circuit board having multiple wiring layers utilizing this method. SOLUTION: A conductive paste applied layer is formed for lower layer wiring on an insulating substrate by using the inkjet method for drawing. Concerning the parts whereon an upper wiring pattern is placed, an insulating paste applied layer is formed for interlayer insulation except at parts where conduction is to be established between the upper and lower layers. Further, a conductive paste applied layer for upper wiring is laminated, and is treated by heat. A conductive layer is made out of each conductive paste applied layer and an insulating layer is made out of each insulating paste applied layer, which results in a multilayer wiring structure wherein upper and lower layers are insulated from each other at parts where the insulating film exists and connection/conduction is established between them at parts where the insulating film is omitted. COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：为了提供一种形成新颖的多层布线结构的方法，其中最高布线层与上布线层的对准以高精度保持，层间连接导电路径形成的复杂度大大降低，布线适合为了图案小型化是可行的，并且提供一种使用该方法的具有多个布线层的电路板。解决方案：通过使用喷墨方法在绝缘基板上形成用于下层布线的导电糊涂层。关于放置上部布线图案的部分，形成用于层间绝缘的绝缘膏施加层，除了要在上层和下层之间建立传导的部分之外。此外，层叠用于上部布线的导电性糊剂涂布层，并进行热处理。由每个导电糊涂层施加导电层，并且由每个绝缘膏施加层制成绝缘层，这导致多层布线结构，其中上层和下层在存在绝缘膜的部分处彼此绝缘并且在省略绝缘膜的部分之间建立它们之间的连接/导通。版权所有（C）2005，JPO＆NCIPI

3. 发明专利

JP2004119686A Method of forming fine wiring pattern 有权
公开(公告)号：JP2004119686A
公开(公告)日：2004-04-15
申请号：JP2002280965
申请日：2002-09-26
申请人： Harima Chem Inc , ハリマ化成株式会社
发明人： HATA NORIAKI , UEDA MASAYUKI , SHIOI NAOTO , MATSUBA YORISHIGE
IPC分类号： H05K3/12 , H05K3/10 , H05K3/20
摘要： PROBLEM TO BE SOLVED: To provide a method by which an extremely fine sintered copper-based wiring pattern can be formed by reducing nano-sized copper oxide particles in the pattern into nano-sized copper particles at a relatively low temperature after the pattern is drawn, by using a dispersed liquid of nano-sized copper oxide particles and baking the copper particles.
SOLUTION: The dispersed liquid containing the nano-sized copper oxide particles having a mean particle diameter of 1-100 nm is applied to a substrate. Thereafter, the reduction of the nano-sized copper oxide particles and the formation of a sintered layer of the obtained copper particles are performed in the same step, by reducing the copper oxide particles through a reducing reaction using an active reactive species excited with plasma derived from a reducing gas, by heating the copper oxide particles contained in the applied layer to a temperature of ≤300°C in a plasma atmosphere produced under the presence of the reducing gas. Consequently, the utilizable range of the used substrate material is expanded largely, because the heat resistance required for the material is significantly relaxed.
COPYRIGHT: (C)2004,JPO

4. 发明专利

JP2007083288A Forming method of conductive joint 有权
标题翻译：导电接头的形成方法
公开(公告)号：JP2007083288A
公开(公告)日：2007-04-05
申请号：JP2005276060
申请日：2005-09-22
申请人： Harima Chem Inc , ハリマ化成株式会社
发明人： HATA NORIAKI , MATSUBA YORISHIGE
IPC分类号： B23K20/00 , H05K3/32 , H05K3/36
摘要： PROBLEM TO BE SOLVED: To provide a forming method of conductive joint by applying a technique of forge welding for bonding a metal surface of a metal layer to a conductive bonding layer, when conductive-bonding the surfaces of two metal layers via a conductive bonding layer composed of metallic nanoparticles. SOLUTION: A dispersion liquid of metallic nanoparticles having a molecular layer of a coating agent on the surface thereof is coated on the metal surface of one of metal layers. Then, an organic solvent contained in the coated layer is vaparized to obtain a dry coated layer. The conductive bonding layer is formed by removal of the molecular layer of the coating agent and interactive fusion of metallic nanoparticles through heat treatment at 150°C and under in an atmosphere of high-frequency plasma. A metallic bonding is formed between the surface of the conductive bonding layer and the surface of the metal composing the other metal layer, by applying a heat treatment at 100°C-200°C while forcibly pressing the metal surface of the other metal layer on the surface of the conductive bonding layer. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：为了通过将金属层的金属表面接合到导电接合层的锻造焊接技术来提供导电接合体的形成方法，当通过以下方式将两个金属层的表面进行导电接合时导电结合层由金属纳米粒子组成。解决方案：在其表面上具有涂层剂分子层的金属纳米颗粒的分散液涂覆在金属层之一的金属表面上。然后，将包含在涂层中的有机溶剂挥发，得到干涂层。通过在高频等离子体的气氛中，在150℃以下的热处理下除去涂层剂的分子层和金属纳米粒子的相互融合，形成导电性接合层。在导电接合层的表面和构成另一金属层的金属的表面之间通过在100℃-200℃下进行热处理，同时强制地将另一金属层的金属表面压在一起而形成金属接合导电接合层的表面。版权所有（C）2007，JPO＆INPIT

5. 发明专利

JP2004148198A Ultrafine ink-jet printing nozzle and its production method 有权
公开(公告)号：JP2004148198A
公开(公告)日：2004-05-27
申请号：JP2002316176
申请日：2002-10-30
申请人： Harima Chem Inc , ハリマ化成株式会社
发明人： MATSUI SHINJI , HATA NORIAKI , MATSUBA YORISHIGE
IPC分类号： B41J2/135 , B05C5/00
摘要： PROBLEM TO BE SOLVED: To provide a fine nozzle which is applicable to a fine drawing method by ink-jet printing using a nanoparticle paste and a method for producing the nozzle.
SOLUTION: The bore diameter of the nozzle has an inner wall surface structure to be gradually decreased from the pipe inside diameter of the base part to the aperture diameter of the tip of the nozzle and an outer surface structure showing a cuspidal-outer shape which has the same central axis as the inner wall surface. The aperture diameter of the nozzle tip, corresponding to the average particle size of the nanoparticles contained in the nanoparticle paste, after being selected to be 10-10,000 nm, by using a focused ion beam method, manufactures the ultrafine ink-jet printing nozzle which is integrally constituted of a gas-phase accumulation material which is accumulated/processed in the above shape.
COPYRIGHT: (C)2004,JPO

6. 发明专利

JP2005293937A Method of forming metal thin-film layer on conductive ito film or on glass substrate surface as base substrate of ito film, and metal thin-film layer on conductive ito film or on glass substrate surface as base substrate of the ito film 有权
标题翻译：在导电ITO膜上形成金属薄膜层的方法或作为ITO膜的基底表面的玻璃基底表面上形成金属薄膜层的方法，以及导电ITO膜上的金属薄膜层或作为ITO膜的基板的玻璃基板表面的方法
公开(公告)号：JP2005293937A
公开(公告)日：2005-10-20
申请号：JP2004104791
申请日：2004-03-31
申请人： Harima Chem Inc , Ulvac Japan Ltd , ハリマ化成株式会社 , 株式会社アルバック
发明人： UEDA MASAYUKI , KOYAMA MASAHIDE , HATA NORIAKI , MATSUBA YORISHIGE , IWASHIGE HIROSHI , ODA MASAAKI
IPC分类号： G02F1/1343 , C03C17/34 , H01B5/14 , H01B13/00
摘要： PROBLEM TO BE SOLVED: To provide a method, capable of forming a fine metal thin film pattern excellent in adherence properties on the surface of a conductive ITO film and a glass substrate of a base substrate, with high drawing precision, high workability, and high reproducibility. SOLUTION: The thin film layer of transition metal is formed by applying a solvent formed by dissolving transition metal compound, containing organic anion and cation of transition metal in organic solvent on the ITO film and on the surface of the glass substrate of a base substrate, and applying heat treatment thereto. The fine metal thin-film pattern with superior adherence properties is formed on the surface of the transition metal thin film layer, by applying a liquid, in which metal fine particles with average size of 1 to 100 nm are dispersed at a prescribed thickness, and by forming a layer in which fine metal particles are sintered mutually, by heating and sintering the above. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：解决问题的方案：提供一种能够在导电性ITO膜和基材的玻璃基板的表面上形成粘合性优异的金属薄膜图案，拉拔精度高，加工性高的方法，重现性高。解决方案：过渡金属的薄膜层通过将通过将含有有机阴离子的过渡金属化合物和过渡金属的阳离子溶解在有机溶剂中而形成的溶剂形成在ITO膜上和玻璃基板的表面上并对其进行热处理。在过渡金属薄膜层的表面上，通过涂布以规定厚度分散平均粒径为1〜100nm的金属微粒子的液体，形成具有优异粘附特性的金属薄膜图案，通过加热和烧结上述方法形成相互烧结金属微粒的层。版权所有（C）2006，JPO＆NCIPI

7. 发明专利

JP2004273205A Conductive nanoparticle paste 有权
公开(公告)号：JP2004273205A
公开(公告)日：2004-09-30
申请号：JP2003060094
申请日：2003-03-06
申请人： Harima Chem Inc , ハリマ化成株式会社
发明人： HATA NORIAKI , UEDA MASAYUKI , MATSUBA YORISHIGE
IPC分类号： H05K1/09 , H01B1/00 , H01B1/22 , H01B13/00 , H01L21/288 , H05K3/10 , H05K3/12
摘要： PROBLEM TO BE SOLVED: To provide low temperature sintering type conductive metal nanoparticle paste for high density circuit printing forming a smooth surface when applied to a substrate and baked, and forming a low resistance and fine circuit. SOLUTION: The conductive metal nanoparticle paste is prepared by forming a surface covering layer comprising an amine compound or the like covering the surface on metal nanoparticles having an average particle size of 100 nm, and uniformly dispersing in a dispersing medium containing one or more high boiling point organic solvents capable of eluting and releasing covered molecules such as the amine compound by heating. By using the conductive metal nanoparticle paste, when a fine pattern is drown and heated at low temperature, a dense sinter of metal nanoparticles can be obtained, and a conductor layer with high metal contents and high conductive characteristics can be formed. COPYRIGHT: (C)2004,JPO&NCIPI

8. 发明专利

JP2004119790A Method of forming fine wiring pattern using dispersed nano-sized particles in supercritical fluid 有权
公开(公告)号：JP2004119790A
公开(公告)日：2004-04-15
申请号：JP2002282790
申请日：2002-09-27
申请人： Harima Chem Inc , ハリマ化成株式会社
发明人： HATA NORIAKI , UEDA MASAYUKI , SHIOI NAOTO , MATSUBA YORISHIGE
IPC分类号： B22F9/00 , B22F7/04 , H01B13/00 , H05K3/10 , H05K3/12
摘要： PROBLEM TO BE SOLVED: To provide a method of forming an ultrafine sintered wiring pattern by baking nano-sized metal particles contained in a drawn ultrafine pattern at a relatively low temperature after drawing the pattern, by using a dispersion prepared by dispersing the nano-sized metal particles in a dispersion medium that can be removed easily by evaporating.
SOLUTION: In a step of drawing the ultrafine wiring pattern, an applied layer is formed on a substrate by jetting dispersed nano-sized metal particles in the dispersion medium composed of a supercritical fluid under a pressurized and heated condition from a nozzle. Consequently, the dispersion medium composed of the supercritical fluid can be removed by evaporating, because the medium quickly changes to a gaseou state under the atmospheric pressure.
COPYRIGHT: (C)2004,JPO

9. 发明专利

JP2006054212A Substrate, electronic component assembly and method of manufacturing electronic component assembly 有权
标题翻译：基板，电子元器件组件及制造电子元器件组件的方法
公开(公告)号：JP2006054212A
公开(公告)日：2006-02-23
申请号：JP2004232546
申请日：2004-08-09
申请人： Harima Chem Inc , Matsushita Electric Ind Co Ltd , ハリマ化成株式会社 , 松下電器産業株式会社
发明人： HAJI HIROSHI , ARITA KIYOSHI , ISHIKAWA TAKATOSHI , UEDA MASAYUKI , HATA NORIAKI , MATSUBA YORISHIGE
IPC分类号： H01L21/60
CPC分类号： H01L24/83 , H01L2224/83205 , H01L2224/83207 , H01L2224/8384
摘要： PROBLEM TO BE SOLVED: To provide a substrate where a transparent electrode formed on the substrate and an electrode of an electronic component can easily, inexpensively and electrically be bonded with low connection resistance and to provide an electronic component assembly thereof and a method of manufacturing the electronic component assembly. SOLUTION: In the method of manufacturing a display panel assembly, driver IC is mounted on a display panel where the transparent electrode formed of an ITO film is formed. Metal nano particle paste containing a metal nano particle whose average particle diameter is 30 nm or below and dispersant is printed on a surface of the transparent electrode. Metal nano paste is cured by heating and a metal nano particle film where the metal nano particle is sintered on the surface of the transparent electrode is formed. A bump of driver IC is metal-bonded to the metal nano particle film by ultrasonic bonding. Thus, the transparent electrode and the bump can easily, inexpensively and electrically be bonded with low connection resistance. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：为了提供一种基板，其中形成在基板上的透明电极和电子部件的电极可以容易地，低成本地并且电连接而具有低连接电阻并且提供其电子部件组件和方法制造电子部件组件。解决方案：在制造显示面板组件的方法中，驱动器IC安装在由ITO膜形成的透明电极形成的显示面板上。将含有平均粒径为30nm以下的金属纳米粒子和分散剂印刷在透明电极的表面上的金属纳米粒子糊料。通过加热固化金属纳米糊料，形成在透明电极的表面上烧结金属纳米粒子的金属纳米粒子膜。驱动器IC的凸块通过超声波接合与金属纳米颗粒膜金属结合。因此，透明电极和凸块可以以低连接电阻容易地，廉价地和电接合。版权所有（C）2006，JPO＆NCIPI

10. 发明专利

JP2006026602A Method for forming thin film conductor layer of metallic particulate sintered compact type, and methods for forming metallic wiring and metallic thin film by applying the method 有权
标题翻译：形成金属颗粒烧结薄型薄膜导体层的方法，以及通过应用方法形成金属接线和金属薄膜的方法
公开(公告)号：JP2006026602A
公开(公告)日：2006-02-02
申请号：JP2004212899
申请日：2004-07-21
申请人： Harima Chem Inc , Toyo Ink Mfg Co Ltd , ハリマ化成株式会社 , 東洋インキ製造株式会社
发明人： TATENO HIROYUKI , OIZUMI KEI , TAKAYAMA MICHIO , ITO TAKASHI , HATA NORIAKI , UEDA MASAYUKI , MATSUBA YORISHIGE
IPC分类号： B05D5/12 , B05D3/06 , B05D7/24 , B22F3/105 , B22F7/04 , H01B13/00 , H05K3/00
摘要： PROBLEM TO BE SOLVED: To provide a method for manufacturing a metallic particulate sintered compact exhibiting a good electric conductivity by setting a heat treatment temperature to be used within a range not exceeding at least 200°C at the time of forming a metallic particulate sintered compact layer while a metallic particulate coating layer applied on a substrate is subjected to low-temperature thermal sintering. SOLUTION: After the coating molecules on a surface are removed from the metallic particulates having a surface coating molecule layer included in a coating layer, the metallic particulates are subjected to low-temperature thermal sintering, and at this time, the metallic particulates are irradiated with energy rays from the surface of the coating layer, and thereafter, the metallic particulates are subjected to a heat treatment at a low temperature (below 15°C), and thereby the removal of the coating molecules of the surface is accelerated and the sintering itself of the metallic particulates is rapidly progressed by such low-temperature heating and the metallic particulate sintered compact exhibiting the good electric conductivity is formed. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：待解决的问题：提供一种通过将热处理温度设定在不超过200℃以下的金属颗粒状烧结体的制造方法，该热处理温度在形成金属将颗粒状烧结体层施加于基板上的金属微粒被覆层进行低温热烧结。解决方案：将表面上的涂层分子从包含在涂层中的表面涂层分子层的金属颗粒中除去后，对金属颗粒进行低温热烧结，此时金属微粒用来自涂层表面的能量射线照射，然后在低温（低于15℃）下对金属微粒进行热处理，由此去除表面的涂层分子，并且通过这样的低温加热使金属微粒的烧结本身快速进行，形成具有良好导电性的金属微粒烧结体。版权所有（C）2006，JPO＆NCIPI

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