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1. 发明专利

JP2006083377A Electrically conductive adhesive and method for producing article utilizing the electrically conductive adhesive 有权
标题翻译：电导电粘合剂及使用电导电胶粘剂生产物品的方法
公开(公告)号：JP2006083377A
公开(公告)日：2006-03-30
申请号：JP2005237302
申请日：2005-08-18
申请人： Harima Chem Inc , Toshiba Corp , ハリマ化成株式会社 , 株式会社東芝
发明人： OSAKO TAKEHISA , SHIOI NAOTO , ITO DAISUKE , GOTO HIDEYUKI , MATSUBA YORISHIGE , TATEYAMA KAZUKI , UKITA YASUNARI , SEGAWA MASAO , KIKUCHI TAKUO
IPC分类号： C09J201/00 , C09C1/62 , C09C3/08 , C09J5/00 , C09J9/02 , C09J11/00 , C09J163/00 , H01B1/00 , H01B1/22 , H01L21/52
CPC分类号： H01L24/73 , H01L2224/29 , H01L2224/2919 , H01L2224/29298 , H01L2224/32245 , H01L2224/45 , H01L2224/45015 , H01L2224/45144 , H01L2224/48247 , H01L2224/73265 , H01L2224/83192 , H01L2224/8384 , H01L2224/92247 , H01L2924/00013 , H01L2924/01005 , H01L2924/01029 , H01L2924/0103 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/0665 , H01L2924/10253 , H01L2924/181 , H01L2924/00 , H01L2924/00014 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/2929 , H01L2924/00012 , H01L2924/20752
摘要： PROBLEM TO BE SOLVED: To provide an electrically conductive adhesive capable of solvent dilution for giving good coating workability, capable of preventing a gas from forming, when a binder resin is heated and cured after mounting of parts, and capable of forming an electrically conductive joint excellent in both of thermal conductivity and electrical conductivity. SOLUTION: This electrically conductive adhesive contains an electrically conductive medium, a thermosetting resin as a binder resin component, and a solvent for adjusting a liquid viscosity as essential components, wherein 100 pts.wt. of a silver powder having an average particle diameter of a micrometer size is, for example, used as a main component, together with 1-10 pts.wt. of silver fine particles having an average particle diameter of a nanometer size, in the electrically conductive medium, and further 5-15 pts.wt. of the thermosetting resin and 10 pts.wt. or less of the solvent are together used in the adhesive. The adhesive having a mixing ratio of the components thus selected avoids formation of gas components, when the thermosetting resin is heated/cured, and therefore prevents formation of voids, and further realizes preparation of the electrically conductive joint excellent in the thermal conductivity and the electrical conductivity at the same time. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：为了提供能够进行溶剂稀释以提供良好的涂布可加工性的导电粘合剂，能够防止气体形成，当粘合剂树脂在部件安装之后被加热和固化，并且能够形成导电接头在导热性和导电性方面均优异。解决方案：该导电粘合剂包含导电介质，作为粘合剂树脂组分的热固性树脂和用于调节作为必需组分的液体粘度的溶剂，其中100重量份平均粒径为微米尺寸的银粉末，例如以1-10重量份为主成分。的导电介质中平均粒径为纳米尺寸的银微粒，再加入5-15重量份的热固性树脂和10重量份或更少的溶剂一起用于粘合剂中。具有这样选择的组分的混合比例的粘合剂避免形成气体组分，当热固性树脂被加热/固化时，因此防止形成空隙，并且进一步实现导热性和导电性优异的导电接头的制备电导率同时。版权所有（C）2006，JPO＆NCIPI

2. 发明专利

JP2006022394A Method for producing metallic copper fine particle 有权
标题翻译：生产金属铜微粒的方法
公开(公告)号：JP2006022394A
公开(公告)日：2006-01-26
申请号：JP2004203542
申请日：2004-07-09
申请人： Harima Chem Inc , ハリマ化成株式会社
发明人： HOSOYA KAZUO , UEDA MASAYUKI , ITO DAISUKE , IZUMITANI AKITO , MATSUBA YORISHIGE
IPC分类号： B22F9/24
摘要： PROBLEM TO BE SOLVED: To provide a method for preparing metallic copper fine particles having a nano-sized particle diameter, by using copper oxide as a raw material through a reduction reaction in a liquid phase.
SOLUTION: This method for producing the metallic copper fine particles comprises: previously preparing a pH-controlled dispersion liquid of copper oxide by adding a dispersing agent and a pH-adjusting solution to a dispersion liquid of powdery copper oxide; mixing the dispersion liquid of copper oxide with a solution of a reducing agent to form a liquid mixture having a pH of 10 at lowest, and preferably 10.5 or higher; stirring, heating and refluxing the liquid mixture while passing an inert gas therein, and thereby precipitating the metallic copper fine particles with an average particle diameter of 10 to 200 nm formed of copper atoms produced through a reduction reaction, in the liquid mixture.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：待解决的问题：提供一种通过在液相中通过还原反应以氧化铜为原料制备具有纳米尺寸粒径的金属铜微粒的方法。该解决方案：该金属铜微粒的制造方法包括：通过向粉末状氧化铜的分散液中添加分散剂和pH调节溶液，预先制备pH值控制的氧化铜分散液; 将氧化铜的分散液与还原剂的溶液混合，形成pH最低为10的液体混合物，优选为10.5以上; 在液体混合物中通过惰性气体搅拌，加热和回流，从而沉淀由还原反应生成的铜原子形成的平均粒径为10〜200nm的金属铜微粒。版权所有（C）2006，JPO＆NCIPI

3. 发明专利

JP2005109467A Substrate and method of manufacturing the same 有权
标题翻译：基板及其制造方法
公开(公告)号：JP2005109467A
公开(公告)日：2005-04-21
申请号：JP2004264046
申请日：2004-09-10
申请人： Harima Chem Inc , National Institute Of Advanced Industrial & Technology , ハリマ化成株式会社 , 独立行政法人産業技術総合研究所
发明人： MURATA KAZUHIRO , YOKOYAMA HIROSHI , ITO DAISUKE , IZUMITANI AKITO , HATA NORIAKI , MATSUBA YORISHIGE
IPC分类号： H05K3/40 , H01L21/48 , H01L21/60 , H05K3/12 , H05K3/46
CPC分类号： B05D1/007 , B32B3/266 , B32B15/08 , H01L21/4867 , H01L2924/0002 , H05K3/125 , H05K3/245 , H05K3/4061 , H05K3/4647 , H05K2201/0367 , H05K2203/013 , H05K2203/105 , H05K2203/1131 , H05K2203/1476 , Y10T428/24322 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a substrate in which a fine metal column is formed by injecting and depositing metal particles dispersion onto the substrate using a fine ink-jet printing method capable of fine drawing, a manufacturing method thereof, a substrate structured to have a high aspect ratio, and a manufacturing method simply producing the substrate at high speed. SOLUTION: In the substrate manufacturing method, metal particles are deposited on a certain position of a substrate in a column state by using a fine ink-jet method and then sintered, thus a metal column is formed. COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供一种基板，其中通过使用能够精细拉制的精细喷墨打印方法将金属颗粒分散体注入并沉积到基板上来形成细金属柱，其制造方法，基板被构造成具有高纵横比，以及简单地高速生产基板的制造方法。解决方案：在基板制造方法中，通过使用细小的喷墨法将金属颗粒在柱状态下沉积在基板的某个位置上，然后烧结，从而形成金属柱。版权所有（C）2005，JPO＆NCIPI

4. 发明专利

JP2004059778A Liquid epoxy resin composition for encapsulation filler 审中-公开
公开(公告)号：JP2004059778A
公开(公告)日：2004-02-26
申请号：JP2002221264
申请日：2002-07-30
申请人： Harima Chem Inc , ハリマ化成株式会社
发明人： ITO DAISUKE , TERADA NOBUHITO
IPC分类号： C08L63/00 , C08G59/48 , C08K3/00 , C08K5/00 , H01L21/56
摘要： PROBLEM TO BE SOLVED: To provide a liquid epoxy resin composition for an encapsulation filler which has a function equivalent to flux treatment which removes an oxide film formed on a bump electrode, etc., using a lead-free tin-alloy solder and has desirable resin characteristics as an underfill (encapsulation filler). SOLUTION: The liquid epoxy resin composition used in an encapsulation filling step in flip chip packaging essentially comprises (A) a liquid, thermosetting epoxy resin, (B) an acid anhydride as a hardener and (C) a dispersible hardening accelerator. From 5×10 -2 to 5×10 -1 mol 9-15C dicarboxylic acid, serving as (D) a flux activity-enhancing component having a proton-donating ability, is added to the composition per 1 mol acid anhydride. COPYRIGHT: (C)2004,JPO

5. 发明专利

JP2003082064A Liquid epoxy resin composition for sealing filler 有权
标题翻译：用于密封填料的液体环氧树脂组合物
公开(公告)号：JP2003082064A
公开(公告)日：2003-03-19
申请号：JP2001362370
申请日：2001-11-28
申请人： Harima Chem Inc , ハリマ化成株式会社
发明人： ITO DAISUKE , TERADA NOBUHITO , GOTO HIDEYUKI
IPC分类号： C08G59/42 , H01L21/60 , H01L23/29 , H01L23/31
摘要： PROBLEM TO BE SOLVED: To provide a liquid epoxy resin composition for a sealing filler imparted with a function comparable to the function attained by a flux treatment to remove the oxide film such as a bump electrode using a lead-free tin alloy solder and exhibiting desired resin properties also as an underfill (sealing filler). SOLUTION: The liquid epoxy resin composition for the sealing and filling stage in a flip chip mounting process is produced by using (A) a liquid thermosetting epoxy resin and (B) a curing agent composed of an acid anhydride as essential components and adding (C) a 9-15C dicarboxylic acid as a flux activity promoting component having proton donative property in an amount of 5×10 to 5×10 mol based on 1 mol of the acid anhydride.
摘要翻译：要解决的问题：提供一种用于密封填料的液体环氧树脂组合物，其具有与通过焊剂处理获得的功能相当的功能，以使用无铅锡合金焊料去除氧化膜，例如凸块电极，并显示期望的树脂性能也作为底层填料（密封填料）。解决方案：通过使用（A）液态热固性环氧树脂和（B）由酸酐组成的固化剂作为必要成分并添加（C（C）），制造用于倒装芯片安装工艺中的密封和填充阶段的液体环氧树脂组合物）9-15C二羧酸作为助催化活性促进成分，具有质子供体性，相对于1摩尔酸酐为5×10 -2至5×10 -1摩尔。

6. 发明专利

JP2005020261A Facsimile communication equipment, facsimile communication method and facsimile communication program 审中-公开
标题翻译： FACSIMILE通信设备，FACSIMILE通信方法和FACSIMILE通信程序
公开(公告)号：JP2005020261A
公开(公告)日：2005-01-20
申请号：JP2003181001
申请日：2003-06-25
申请人： Toshiba Corp , Toshiba Tec Corp , 東芝テック株式会社 , 株式会社東芝
发明人： ITO DAISUKE
IPC分类号： H04N1/00 , H04N1/32 , H04N1/44
摘要： PROBLEM TO BE SOLVED: To improve confidentiality of facsimile communication.
SOLUTION: Facsimile communication equipment performs facsimile communication via a network for existing facsimile communication as an end terminal of a transmission source or a destination or as a repeating terminal repeating communication between the end terminals to be the transmission source or the destination. The equipment is provided with an attribute information supply part acquiring terminal attribute information or work attribute information obtained by processing terminal attribute information, supplying the terminal attribute information or work attribute information to itself, and storing it in a self-storage resource when itself is the end terminal, and supplying it to the end terminal and storing it in a storage resource of the end terminal when itself is the repeating terminal, a mode selection part, and an attribute information output limiting part limiting output of terminal attribute information or work attribute information which the attribute information supply part supplies when the mode selection part selects a confidential mode and which is stored on the storage resource.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提高传真通信的保密性。解决方案：传真通信设备通过网络进行传真通信，作为传输源或目的地的终端，或作为重复终端重复终端之间作为传输源或目的地的通信的传真通信。设备具有获取终端属性信息或通过处理终端属性信息获得的工作属性信息的属性信息提供部件，向其自身提供终端属性信息或工作属性信息，并将其自身存储在自身存储资源中并且将其提供给终端，并且当其本身是重复终端时将其存储在终端的存储资源中，模式选择部分和限制终端属性信息或工作属性信息的输出的属性信息输出限制部分当模式选择部分选择机密模式并且存储在存储资源上时，属性信息提供部分提供的属性信息提供部分。版权所有（C）2005，JPO＆NCIPI

7. 发明专利

JP2014214709A 蒸気弁装置有权
标题翻译：蒸汽阀装置
公开(公告)号：JP2014214709A
公开(公告)日：2014-11-17
申请号：JP2013094359
申请日：2013-04-26
申请人：株式会社東芝 , Toshiba Corp
发明人： ITO DAISUKE , TAMAOKI TOMOHARU , SHINDO KURA
IPC分类号： F01D17/10
CPC分类号： F01D25/24 , F01D17/00 , F01D17/145
摘要：【課題】蒸気弁装置の弁開時圧力損失を低減できるようにすること。【解決手段】蒸気弁装置21の蒸気加減弁2は、中間流路部30に接続された入口部43と、鉛直方向に開口した出口部44とを備え、入口部43と出口部44との間に流路71を形成してその流路内に弁座45が配置されたケーシング41と、このケーシング内で上下方向に移動可能で、弁座45との間で離脱係合することによって流路71を開閉する弁体42と、弁体42に結合されるとともにケーシング41の出口部44と反対側を貫通して上下方向に摺動し、流路71を開くときに出口部44と反対側に移動させられる弁棒47とを有し、中間流路部30が、主蒸気止め弁1の出口部34から流出した主蒸気の流れを鉛直方向から向きを変えて入口部43に流出するように円弧の形状を成す円管流路であり、出口部44は上方に向いて開口しており、弁棒47はケーシング41の下部を下方に貫通している。【選択図】図1
摘要翻译：要解决的问题：减少在阀杆装置中打开阀时的压力损失。解决方案：蒸汽阀装置21的蒸汽控制阀2包括：壳体41，其具有连接到中间流动通道部分的入口部分43 30和沿垂直方向开口的出口部分44，其中在入口部分43和出口部分44之间形成有流动通道71，并且在该流动通道中设置有阀座45; 阀体42，其能够在壳体内上下移动，并与阀座45脱离接合，用于打开和关闭流路71; 并且与阀体42连接的阀杆47在与出口部44相反的一侧穿过壳体41，向上和向下滑动，并且当打开流动时移动到与出口部44相对的一侧中间流路部30是具有圆弧形状的圆形管流路，使得从主蒸汽截止阀1的出口部34流出的主干杆的流动沿垂直方向变化，流向入口部分43.出口部分44向上打开，阀杆47向下穿过壳体41的下部。

8. 发明专利

JP2014031744A Steam valve device and method for assembling steam valve device 审中-公开
标题翻译：蒸汽阀装置和组装蒸汽阀装置的方法
公开(公告)号：JP2014031744A
公开(公告)日：2014-02-20
申请号：JP2012172005
申请日：2012-08-02
申请人： Toshiba Corp , 株式会社東芝
发明人： ITO DAISUKE
IPC分类号： F01D25/00 , F16K1/00 , F16K27/00 , F16K27/02
摘要： PROBLEM TO BE SOLVED: To provide a steam valve device which balances heat resistance and pressure resistance performance and workability of manufacture and maintenance, and to provide a method for assembling the steam valve device.SOLUTION: The steam valve device includes an outer casing, an inner casing, a sleeve material, an opening part, and an opening part opening/closing mechanism. The outer casing has an introduction part which introduces steam. The inner casing is accommodated in the outer casing and has a penetration part in the position corresponding to the introduction part of the outer casing. The sleeve material is inserted so as to communicate with the introduction part of the outer casing and the penetration part of the inner casing. The opening is provided on an axis line of the introduction part of both the outer casing and the inner casing. The opening is used for linearly attaching and detaching the sleeve material in the direction of the penetration part or the introduction part. The opening part opening/closing mechanism closes the opening part and can open the opening part when attaching and detaching the sleeve material.
摘要翻译：要解决的问题：提供一种平衡耐热性和耐压性能以及制造和维护的可加工性的蒸汽阀装置，并提供一种组装蒸汽阀装置的方法。解决方案：蒸汽阀装置包括外壳，内壳，套筒材料，开口部和开口部开闭机构。外壳具有引入蒸汽的引入部。内壳容纳在外壳中，并且在与外壳的导入部对应的位置具有贯通部。套筒材料被插入以与外壳的引入部分和内壳的穿透部分连通。开口设置在外壳和内壳两者的导入部的轴线上。该开口用于沿着穿透部或导入部的方向直线地安装和分离套筒材料。打开部分开/关机构关闭开口部分，并且当安装和拆卸套筒材料时可以打开开口部分。

9. 发明专利

JPH06267734A SUPERCONDUCTIVE COIL EQUIPMENT 失效
公开(公告)号：JPH06267734A
公开(公告)日：1994-09-22
申请号：JP5183993
申请日：1993-03-12
申请人： TOSHIBA CORP , TOYO BOSEKI
发明人： YONEDA ERIKO , ITO DAISUKE , KASHIMA TOSHIHIRO , INUI HIDETOMO , OKADA TOICHI , NISHIJIMA SHIGEHIRO
IPC分类号： H01F6/06 , H01F5/08
摘要： PURPOSE:To provide a superconductive coil equipment which can prevent loosensess in binding between a bobbin and a superconductive coil body when the coil is energized at extremely low temperature and which can reduce the generation of quench. CONSTITUTION:A superconductive coil equipment provided with a superconductive coil body 23 formed by winding a superconductor 22 around a bobbin 21, wherein the bobbing 21 is made of fiber reinforced plastics in which a roving of polyethylene fibers submitted to reinforcing process is oriented within a range + or -40 deg.-+ or -80 deg. regarding an axis line of the superconductive coil body 23.

10. 发明专利

JPH04207924A SUPERCONDUCTIVE CURRENT LIMITER 失效
公开(公告)号：JPH04207924A
公开(公告)日：1992-07-29
申请号：JP33036590
申请日：1990-11-30
申请人： TOKYO ELECTRIC POWER CO , TOSHIBA CORP
发明人： HARA CHIKUSHI , OKANIWA KIYOSHI , EI KAZUYUKI , ITO DAISUKE , SUGIYAMA YOSHIYUKI , OKUMURA HIROYUKI
IPC分类号： H02H9/02
摘要： PURPOSE:To enable continuous current limitation by connecting a trigger element, which consists of a superconductor having a specified critical current value, and a superconductive coil, which has an optional critical current value and inductance, in parallel, and applying a magnetic field to the trigger element by this superconductive coil. CONSTITUTION:By the quenching of this trigger element 1, voltage occurs across the trigger element 1, and a current iLC, which has a delay phase of 90 deg. to this voltage, flows to a current limiting coil 3. By this current limiting coil iLC, magnetic fields in accord with the number of patterns occur within the current limiting coil 3, so the resistivity rho of the trigger element 1 rises to the maximum value instantaneously regardless to the element temperature. That is, since the resistance value of the trigger element 1 increases suddenly, the greater part of accident currents commutate to the side of the current limiting coil 3, and then the trigger circuit is interrupted by a switch 2.

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