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1. 发明专利

JP2005225980A Electrically conductive adhesive 有权
标题翻译：电导电胶
公开(公告)号：JP2005225980A
公开(公告)日：2005-08-25
申请号：JP2004036213
申请日：2004-02-13
申请人： Denso Corp , Harima Chem Inc , ハリマ化成株式会社 , 株式会社デンソー
发明人： TERADA NOBUHITO , SHIOI NAOTO , TOTOKAWA SHINJI , NINOMIYA YASUTOKU
IPC分类号： C09J163/00 , C08L63/00 , C09J9/02 , C09J11/04 , C09J11/06 , H01B1/00 , H01B1/22 , H05K3/32
CPC分类号： C09J163/00 , C08G59/42 , C08L63/00 , C09J9/02 , H01B1/22 , H05K3/321 , H05K2201/0239
摘要： PROBLEM TO BE SOLVED: To obtain an electrically conductive adhesive usable as an alternative for solder jointing as a means for electrically conductive joint formation in the surface mounting of electronic parts for vehicle loading and in making electronic parts themselves.
SOLUTION: The electrically conductive adhesive is obtained by dispersing silver powder or the like as electrically conductive medium in a binder resin component consisting of an one-part epoxy-based thermosetting resin essentially comprising an epoxy resin component based on a polycyclic aromatic skeleton-bearing epoxy compound and a cyclic acid anhydride as the curing agent component and also incorporated with a coupling agent as an adhesivity-imparting agent.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：为了获得作为用于车辆装载的电子部件的表面安装和制造电子部件本身的用于焊接接合的替代物的导电粘合剂作为用于导电接头形成的装置。解决方案：导电粘合剂通过将银粉等作为导电介质分散在由基于多环芳族骨架的基本上包含环氧树脂组分的单组分环氧基热固性树脂组成的粘合剂树脂组分中的环氧化合物和环状酸酐作为固化剂组分，并且还与作为粘合剂赋予剂的偶联剂结合。版权所有（C）2005，JPO＆NCIPI

2. 发明专利

JP2008091523A Semiconductor device, and method of manufacturing semiconductor device 审中-公开
标题翻译：半导体器件及制造半导体器件的方法
公开(公告)号：JP2008091523A
公开(公告)日：2008-04-17
申请号：JP2006269097
申请日：2006-09-29
申请人： Denso Corp , 株式会社デンソー
发明人： TANAKA MASAAKI , SAITO TAKASHIGE , NINOMIYA YASUTOKU
IPC分类号： H01L25/065 , G01P15/08 , H01L25/07 , H01L25/18
CPC分类号： H01L2224/16 , H01L2924/1305 , H01L2924/13091 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor device capable of easily inspecting outer appearance, and to provide its manufacturing method. SOLUTION: The semiconductor device includes: a semiconductor sensor device in which an acceleration sensor element 100 is mounted by flip-flop on a processing circuit element 200 via a bump 40a for a sensor; and a wiring board 300 for electrically connecting the semiconductor sensor device to an external device. The semiconductor sensor device is mounted by flip-flop on the wiring board 300 via a bump 40b for a circuit. The wiring board 300 has a flat surface 340 where a substantially flat surface is obtained at least between a part, where the bump 40b for the circuit is connected, and the end part of the wiring board 300. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种能够容易地检查外观的半导体器件，并提供其制造方法。解决方案：半导体器件包括：半导体传感器装置，其中通过触发器通过用于传感器的凸块40a在处理电路元件200上安装加速度传感器元件100; 以及用于将半导体传感器装置电连接到外部装置的布线板300。半导体传感器装置通过用于电路的凸块40b的触发器安装在布线板300上。布线板300具有平坦表面340，其中至少在连接有电路的凸起40b的部分与布线板300的端部之间获得基本平坦的表面。（C） 2008年，日本特许厅和INPIT

3. 发明专利

JP2014152359A Molten metal coating apparatus 有权
标题翻译：金属涂层装置
公开(公告)号：JP2014152359A
公开(公告)日：2014-08-25
申请号：JP2013022543
申请日：2013-02-07
申请人： Denso Corp , 株式会社デンソー
发明人： NINOMIYA YASUTOKU , TERA AKINOSUKE
IPC分类号： C23C4/14 , B05B7/20 , B21B1/22 , B21B3/00
摘要： PROBLEM TO BE SOLVED: To provide a molten metal coating apparatus that sprays metal material particles on a coating object in a molten state while preventing the metal material particles from being solidified.SOLUTION: There is provided a molten metal coating apparatus which includes: a tank (5) for melting a metal material; and a nozzle (10) for jetting the molten metal molten in the tank (5). The nozzle (10) comprises: a jet nozzle part (21) which jets a gas flow (24); an atomization noddle part (22) which atomizes the molten metal in a molten state with the gas flow (24) jetted from the jet nozzle part (21); and a screen gas nozzle part (23) which generates a screen gas flow (25) for spraying atomized fine particles of the molten metal on a base material (1) while keeping the fine particles in the molten state by enclosing the fine particles with the screen gas flow (25) of high temperature.
摘要翻译：要解决的问题：提供一种熔融金属涂覆装置，其在熔融状态下在金属材料颗粒上喷涂金属材料颗粒，同时防止金属材料颗粒凝固。溶液：提供一种熔融金属涂覆装置，其包括：罐（5）用于熔化金属材料; 以及用于喷射熔融在罐（5）中的熔融金属的喷嘴（10）。喷嘴（10）包括：喷射喷嘴部分（21），其喷射气流（24）; 雾化节点部分（22），其利用从喷嘴部分（21）喷射的气流（24）以熔融状态雾化熔融金属; 以及屏幕气体喷嘴部分（23），其产生用于在基材（1）上喷射熔融金属的雾化微粒的筛气体流（25），同时通过将微粒包裹在熔融状态屏风气（25）高温。

4. 发明专利

JP2008021902A Semiconductor device, and its manufacturing method 有权
标题翻译：半导体器件及其制造方法
公开(公告)号：JP2008021902A
公开(公告)日：2008-01-31
申请号：JP2006193866
申请日：2006-07-14
申请人： Denso Corp , 株式会社デンソー
发明人： NINOMIYA YASUTOKU , TOTOKAWA SHINJI , NIDAN AKIRA , SAKAI MINEICHI
IPC分类号： H01L21/60
CPC分类号： H01L2224/0401 , H01L2224/06102 , H01L2224/16225
摘要： PROBLEM TO BE SOLVED: To electrically bond a semiconductor chip over regions where heights in whole surfaces are different even if there are any height variations in the whole surfaces of a package, in a semiconductor device constituted by electrically bonding both electrodes of the semiconductor chip and a ceramic package in the state where sides having each electrode of the semiconductor chip and the ceramic package are made to be faced.
SOLUTION: Between a chip electrode 12 and a package electrode 22, there intervenes conductive adhesive 30 as a conductive bonding member which can be deformed at the time of loading a semiconductor chip 10 on a package 20. While the both electrodes 12, 22 are electrically connected by this conductive adhesive 30, heights variations T existing in whole surfaces 21 of the package 20 are absorbed by deforming the conductive adhesive 30.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：即使在包装的整个表面上存在任何高度变化的情况下，在半导体芯片的整个表面的高度不同的区域上电连接半导体芯片，在通过电连接两个电极半导体芯片和具有半导体芯片和陶瓷封装的每个电极的侧面的状态的陶瓷封装。解决方案：在芯片电极12和封装电极22之间，插入作为导电接合部件的导电粘合剂30，在将半导体芯片10装载在封装20上时可以变形。尽管两个电极12， 22通过该导电粘合剂30电连接，存在于包装20的整个表面21中的高度变化T被导电粘合剂30变形所吸收。（C）2008，JPO＆INPIT

5. 发明专利

JP2007333407A Sensor apparatus 有权
标题翻译：传感器装置
公开(公告)号：JP2007333407A
公开(公告)日：2007-12-27
申请号：JP2006162192
申请日：2006-06-12
申请人： Denso Corp , 株式会社デンソー
发明人： NINOMIYA YASUTOKU , ABE RYUICHIRO
IPC分类号： G01P15/08 , G01P15/125 , H01L29/84
CPC分类号： G01P15/125 , G01P1/023 , G01P15/0802 , G01P2015/0814
摘要： PROBLEM TO BE SOLVED: To possibly inhibit a sensor element from being warped due to a change in a temperature, and inhibit the detection accuracy from being deteriorated in an acceleration sensor comprising the sensor element having a displacement section displaced in the detection direction and bonded on a substrate through a resin member for the element.
SOLUTION: The resin member 40 for the element does not exist below the displacement section 31 in the sensor element 30 and a region extending from the displacement section 31 in parallel in the detection direction Y, and is disposed below both ends 30b facing each other in the sensor element 30 in the direction X orthogonal to the detection direction Y. The both ends 30b are bonded to the substrates 10, 20 through the resin member 40 for the element.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：为了可能地抑制传感器元件由于温度的变化而翘曲，并且抑制检测精度降低的加速度传感器包括具有在检测方向上移位的位移部分的传感器元件并通过该元件的树脂构件粘合在基板上。解决方案：用于元件的树脂构件40不存在于传感器元件30中的位移部31的下方以及从位移部31沿检测方向Y平行延伸的区域的下方，传感器元件30在与检测方向Y正交的方向X上彼此相对。两端30b通过用于元件的树脂构件40与基板10,20接合。版权所有（C）2008，JPO＆INPIT

6. 发明专利

JP2009298951A Electroconductive adhesive and connection method of components using the same 有权
标题翻译：使用它的组分的电磁粘合和连接方法
公开(公告)号：JP2009298951A
公开(公告)日：2009-12-24
申请号：JP2008156253
申请日：2008-06-16
申请人： Denso Corp , Namics Corp , ナミックス株式会社 , 株式会社デンソー
发明人： IMAI HIROKAZU , NINOMIYA YASUTOKU , OTANI YUJI , KOMAGATA MICHINORI , MIZUMURA SHINJI
IPC分类号： C09J9/02 , C09J5/06 , C09J11/04 , C09J201/00 , H01B1/22 , H05K3/32
摘要： PROBLEM TO BE SOLVED: To suitably reduce a metal oxide film formed on surfaces of both metal components to sufficiently secure the contact conduction of both the components and electroconductive fillers in an electroconductive adhesive which contains the electroconductive fillers in a resin, and connects both the components.
SOLUTION: The resin 31 in the electroconductive adhesive 30 includes a reducing agent 33 to reduce the metal oxide film formed on the surfaces of a component electrode 11 of an electronic component 10 and a substrate electrode 21 of a circuit substrate 20. The reducing agent 33 has a lower melting point than the curing temperature of the resin 31, and includes a substance having at least one hydroxy group, for example, aminophenethyl alcohol.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：为了适当地减少在两个金属组分的表面上形成的金属氧化物膜，以充分确保在树脂中含有导电填料的导电粘合剂中的两种组分和导电填料的接触传导，并连接这两个组件。解决方案：导电粘合剂30中的树脂31包括还原剂33，以还原形成在电子部件10的部件电极11和电路基板20的基板电极21的表面上的金属氧化物膜。还原剂33具有比树脂31的固化温度低的熔点，并且包括具有至少一个羟基的物质，例如氨基苯乙醇。版权所有（C）2010，JPO＆INPIT

7. 发明专利

JP2006200924A Method of manufacturing pressure sensor 有权
标题翻译：制造压力传感器的方法
公开(公告)号：JP2006200924A
公开(公告)日：2006-08-03
申请号：JP2005010341
申请日：2005-01-18
申请人： Denso Corp , 株式会社デンソー
发明人： TOMISAKA MANABU , WATANABE YOSHIFUMI , TANAKA HIROAKI , NINOMIYA YASUTOKU
IPC分类号： G01L9/00 , H01L29/84
CPC分类号： H01L2224/48463 , H01L2924/01013 , H01L2924/01079 , H01L2924/00014
摘要： PROBLEM TO BE SOLVED: To provide a method of manufacturing a pressure sensor capable of preventing a corrosive medium from intruding to the side of a pad from the interface between an Au film and an Al film and the pad from being corroded by heightening an adhesive force of the Au film and the Al film.
SOLUTION: The treatment of changing an adhesive force of the Al film 23 to be a substrate of the Au film 24 and a protective film 25 is executed. It is thereby possible to heighten an adhesive force of the Al film 23, the protective film 25, and the Au film 24. It is therefore possible to prevent a corrosive medium from intruding to the side of the pad through the interface between the Au film 24 and the protective film 25 and prevent the pad from being corroded.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种制造压力传感器的方法，该压力传感器能够防止腐蚀介质从Au膜和Al膜之间的界面侵入到焊盘的侧面，并且焊盘被加深而被腐蚀 Au膜和Al膜的粘合力。解决方案：执行改变作为Au膜24和保护膜25的基板的Al膜23的粘合力的处理。从而可以提高Al膜23，保护膜25和Au膜24的粘合力。因此，可以防止腐蚀性介质通过Au膜之间的界面侵入焊盘的侧面 24和保护膜25，并防止垫被腐蚀。版权所有（C）2006，JPO＆NCIPI

8. 发明专利

JP2011017078A Method for forming thermal splay coating 审中-公开
标题翻译：形成热喷涂涂层的方法
公开(公告)号：JP2011017078A
公开(公告)日：2011-01-27
申请号：JP2010088833
申请日：2010-04-07
申请人： Denso Corp , 株式会社デンソー
发明人： ITO TOSHIKI , YOSHIMURA KOZO , TERA AKINOSUKE , TOTOKAWA SHINJI , NINOMIYA YASUTOKU
IPC分类号： C23C4/04
CPC分类号： C23C4/134 , C23C4/11 , H01L24/73 , H01L2224/32245 , H01L2224/33181 , H01L2224/48091 , H01L2224/48247 , H01L2224/73215 , H01L2224/73265 , H01L2924/181 , H01L2924/00012 , H01L2924/00014
摘要： PROBLEM TO BE SOLVED: To provide a method for forming a thermal splay coating by which, when raw material powder is thermally sprayed on an objective face for film formation, the film formation is performed in such a manner that, in a liquid phase part contributing to the sticking of the raw material powder to the objective face for film formation, the ratio is reduced and is left, and the ratio of a solid phase part is increased, thus high thermal conductivity is secured.SOLUTION: When raw material powder P is classified, and is thermally sprayed on the objective face for film formation, by alternately thermal-spraying large-sized powder Pb as a solid phase and perfectly melted small-sized powder Ps upon its arrival at the objective face for film formation, thermal spraying timing is controlled in such a manner that the large-sized powder Pb arrives at the objective face for film formation before the small-sized grain powder Ps is solidified. The ceramic film 10 to be deposited is solidified as a solid phase part 10Sp (about 50 to 90%, desirably 70 to 80%) and a liquid phase part 10Lp (about 10 to 50%, desirably 20 to 30%) with the small-sized powder Ps in a liquid phase state (melted state) as a binder.
摘要翻译：要解决的问题：提供一种形成热喷涂涂层的方法，当将原料粉末热喷涂在用于成膜的物镜面上时，以这样的方式进行成膜：在液相部分贡献为了使原料粉末粘附到成膜用的物镜面上，其比例降低，固相部分的比例增加，导致高导热性。解决方案：当原料粉末P为分类，并通过交替地将大尺寸粉末Pb作为固相热喷涂，并在其到达物镜面以成膜，热喷涂时间时完全熔化小尺寸粉末Ps，将其热喷涂在用于成膜的物镜面上以这样的方式控制，使得大尺寸粉末Pb在小颗粒粉末Ps固化之前到达用于成膜的物镜面。将要沉积的陶瓷膜10作为固相部分10Sp（约50至90％，期望为70至80％）和液相部分10Lp（约10至50％，优选为20至30％）固化，其中小作为粘合剂的液相状态（熔融状态）的粉末状Ps。

9. 发明专利

JP2009049308A Mounting structure of electronic component 审中-公开
标题翻译：电子元件的安装结构
公开(公告)号：JP2009049308A
公开(公告)日：2009-03-05
申请号：JP2007216147
申请日：2007-08-22
申请人： Denso Corp , 株式会社デンソー
发明人： IMAI HIROKAZU , NINOMIYA YASUTOKU
IPC分类号： H05K3/32 , H01L21/52
摘要： PROBLEM TO BE SOLVED: To secure excellent conductivity of a mounting structure of an electronic component constituted by mounting the electronic component having an electrode surface made of Sn-based metal on a substrate and connecting an electrode of the substrate and an electrode of the electronic component to each other through a conductive adhesive.
SOLUTION: On an interface between a surface of the electrode 21 of the electronic component 20 and the conductive adhesive 30, the conductive adhesive 30 has a conductive filler 32 exposed on a resin 31 to come into contact with the electrode 21 of the electronic component 20 and when the area rate of the conductive filler 32 exposed per unit area on the interface is defined as a filler exposure rate, the filler exposure rate is ≥4%.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：为了确保通过将具有由Sn基金属制成的电极表面的电子部件安装在基板上并将基板的电极和电极的电极连接而构成的电子部件的安装结构的优异的导电性电子部件通过导电粘合剂彼此相连。解决方案：在电子部件20的电极21的表面和导电粘合剂30之间的界面上，导电粘合剂30具有暴露在树脂31上的导电填料32，以与电极21的电极21接触电子部件20，并且当界面上每单位面积露出的导电填料32的面积率被定义为填料曝光率时，填料曝光率≥4％。版权所有（C）2009，JPO＆INPIT

10. 发明专利

JP2008053296A Part mounting method 有权
标题翻译：部分安装方法
公开(公告)号：JP2008053296A
公开(公告)日：2008-03-06
申请号：JP2006225495
申请日：2006-08-22
申请人： Denso Corp , 株式会社デンソー
发明人： NINOMIYA YASUTOKU , SAITO TAKASHIGE
IPC分类号： H01L21/60
CPC分类号： H01L2224/16225
摘要： PROBLEM TO BE SOLVED: To provide a part mounting method wherein a semiconductor chip and a package are joined together through two or more joining members, by making the one surface of the semiconductor chip and the junction surface of the package confront each other with degree of planarity inferior to that of the surface of the semiconductor chip, capable of adequately and collectively disposing the joining members even when the height variation of the junction surface of the package is large.
SOLUTION: A sheet member 31, a first mold 50 with two or more openings 51, and a second mold 60 with two or more projections 61 which penetrate through the openings 51 when the second mold 60 is attached to the first mold 50, are prepared. The sheet member 31 is put on the first mold 50, and the second mold 60 is attached to the first mold 50 to enable the projections 61 to penetrate through the opening 51. The projections 61 break through the sheet member 31 at the openings 51; and the parts 30, which are taken off from the sheet member 31 by the tips of the projections 61, are pressed and pasted as joining members 30 on the junction surface 21 of the package 20.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：为了提供一种部件安装方法，其中半导体芯片和封装通过两个或更多个接合部件接合在一起，通过使半导体芯片的一个表面和封装的接合面彼此面对即使在封装的接合面的高度变化大的情况下，平面度比半导体芯片表面的平坦度更小，能够充分地并且共同地配置接合部件。解决方案：当第二模具60附接到第一模具50时，片材部件31，具有两个或更多个开口51的第一模具50和具有两个或更多个突起61的第二模具60穿过开口51 ，准备好了。片材31放在第一模具50上，第二模具60附接到第一模具50，以使突起61能够穿过开口51.突起61在开口51处穿过片状部件31; 并且通过突起部61的前端从片状部件31取出的部件30在包装体20的接合面21上作为接合部件30被压入和粘贴。（C）2008， JPO＆INPIT

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