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1. 发明专利

JP2008261893A Inspection apparatus 有权
标题翻译：检查装置
公开(公告)号：JP2008261893A
公开(公告)日：2008-10-30
申请号：JP2008205955
申请日：2008-08-08
申请人： Hitachi High-Technologies Corp , Hitachi Ltd , 株式会社日立ハイテクノロジーズ , 株式会社日立製作所
发明人： ISHIMARU ICHIRO , NOGUCHI MINORU , MORIYAMA ICHIRO , TANABE YOSHIKAZU , HACHIKAKE YASUO , KENBO YUKIO , WATANABE KENJI , TSUCHIYAMA YOJI
IPC分类号： G01N21/956
摘要： PROBLEM TO BE SOLVED: To provide a surface inspection apparatus which enables an inspection discriminating between scratches, which are generated on a surface and have various shapes, and foreign substances sticking to the surface when a polishing or grinding like CMP etc. is performed on an object to be processed (for example, an insulation film on a semiconductor substrate) in semiconductor manufacture or magnetic head manufacture, and to provide its method. SOLUTION: The inspection apparatus is characterized by the followings. Epi illumination and oblique illumination with almost the same luminous flux are applied on the scratches and foreign substances generated on the polished or grinded surface of the insulation film. Discrimination between shallow scratches and the foreign substances is performed by detecting variations in the intensities of scattered light arising from the shallow scratches and foreign substances during the epi illumination and oblique illumination, further, discrimination between linear scratches and the foreign substances is performed by detecting the directivity of the scattered light during the epi illumination. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种表面检查装置，其能够进行检查，以区分在表面上产生并具有各种形状的划痕和当像CMP等的研磨或研磨时粘附到表面的异物在半导体制造或磁头制造中对被处理物体（例如，半导体衬底上的绝缘膜）进行，并提供其方法。
解决方案：检查装置的特征如下。 Epi照明和具有几乎相同光通量的倾斜照明被施加在在绝缘膜的抛光或研磨表面上产生的划痕和异物上。通过检测在epi照明和倾斜照明期间由浅刮痕和异物产生的散射光的强度的变化来进行浅痕迹和异物之间的区别，此外，通过检测线性划痕和异物来区分线性划痕在epi照明期间散射光的方向性。版权所有（C）2009，JPO＆INPIT

2. 发明专利

JP2005300553A Defect inspection device and method 有权
标题翻译：缺陷检查装置和方法
公开(公告)号：JP2005300553A
公开(公告)日：2005-10-27
申请号：JP2005172304
申请日：2005-06-13
申请人： Hitachi High-Technologies Corp , Hitachi Ltd , 株式会社日立ハイテクノロジーズ , 株式会社日立製作所
发明人： NOGUCHI MINORU , OSHIMA YOSHIMASA , NISHIYAMA HIDETOSHI , MATSUMOTO SHUNICHI , KENBO YUKIO , MATSUNAGA RYOJI , SAKAI SHIGETOSHI , NINOMIYA TAKANORI , WATANABE TETSUYA , NAKAMURA HISATO , JINGU TAKAHIRO , MORISHIGE YOSHIO , CHIKAMATSU SHUICHI
IPC分类号： G01N21/956 , H01L21/66
摘要： PROBLEM TO BE SOLVED: To provide a defect inspection device and method, capable of improving detection sensitivity and throughput by realizing, at the detecting of defects, such as a foreign matter generated in a manufacturing process for forming a pattern on a substrate to produce an object, a linear high-efficiency lighting from a direction on which no diffracted light from the pattern is incident in order to reduce the diffracted light, and setting a threshold according to the dispersion of signals by patterns. SOLUTION: Scattered light, from the pattern that causes dispersion of signals, is reduced by a high-efficiency lighting optical system, lighting from a direction reducing the scattered light from the pattern, and the detection threshold is reduced by a means which sets the threshold, based on the dispersion of signals calculated each area within a chip, whereby improvement in the detection sensitivity and improvement in throughput are realized. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种缺陷检查装置和方法，其能够通过在检测诸如在用于在基板上形成图案的制造工艺中产生的异物等缺陷的检测来提高检测灵敏度和生产率为了产生物体，从不存在来自图案的衍射光入射的方向的线性高效照明，以便减少衍射光，并根据图案的信号色散设置阈值。解决方案：通过高效率照明光学系统减少来自引起信号色散的图案的散射光，从减少来自图案的散射光的方向进行照明，并且通过以下方式减少检测阈值：基于芯片内每个区域计算的信号的色散设置阈值，从而实现检测灵敏度的提高和吞吐量的提高。版权所有（C）2006，JPO＆NCIPI

3. 发明专利

JP2002310932A METHOD AND SYSTEM OF MONITORING SEMICONDUCTOR DEVICE TREATMENT DEVICE 审中-公开
公开(公告)号：JP2002310932A
公开(公告)日：2002-10-23
申请号：JP2002026239
申请日：2002-02-04
申请人： HITACHI LTD
发明人： MORIOKA HIROSHI , NOGUCHI MINORU , OSHIMA YOSHIMASA , KENBO YUKIO
IPC分类号： G01N21/956 , H01L21/66
摘要： PROBLEM TO BE SOLVED: To provide a foreign-body inspection apparatus by which defects in large quantities can be prevented and by which a yield is maintained in the mass-production line of a semiconductor production process. SOLUTION: The method and the system are achieved in such a way that, in the mass production line of the semiconductor production process, the foreign-body inspection apparatus is miniaturized and that the foreign-body inspection apparatus is placed on a conveyance system between the input port and the output port of a treatment device in a semiconductor production line or between treatment devices. The apparatus which detects a foreign body on a repetitive pattern part on a wafer by a refractive index change-type lens array, a spatial filter and a pattern-information removal circuit is provided, and the foreign body on the wafer being conveyed can be inspected. In the mass production line of the semiconductor production process, the foreign body is monitored by a simple monitoring device, the weight of the production line is reduced, and the production cost of the production line can be reduced. Since the monitoring device can perform a real-time sampling operation, it is possible to prevent the defects in large quantities which are fatal to the yield, and an effect to ensure the yield stably is obtained.

4. 发明专利

JP2002100660A DEFECT DETECTING METHOD, DEFECT OBSERVING METHOD AND DEFECT DETECTING APPARATUS 失效
公开(公告)号：JP2002100660A
公开(公告)日：2002-04-05
申请号：JP2001103290
申请日：2001-04-02
申请人： HITACHI LTD
发明人： SHIBATA YUKIHIRO , MAEDA SHUNJI , KENBO YUKIO
IPC分类号： G01B11/30 , G01N21/95 , G01N21/956 , G01N23/205 , H01L21/66
摘要： PROBLEM TO BE SOLVED: To provide a highly sensitive inspection technology that can prevent detection of misinformation. SOLUTION: This defect detecting method has a means to detect an image of a whole chip, and, an inspection region of this image is divided into a plurality of regions based on sensitivity to fatal defects so that inspection sensitivity can be set up in each region. Or by recording a characteristic amount to judge a defect in an inspection result, for example a shading difference, misinformation can be removed in a post handling after the inspection. Moreover, by configuring a sharing system of inspecting conditions and others necessary in common among a group of inspection apparatuses, it becomes possible to reduce the time finding out an inspecting condition and monitor stability and reliability.

5. 发明专利

JP2001274048A METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND PROCESSING DEVICE 失效
公开(公告)号：JP2001274048A
公开(公告)日：2001-10-05
申请号：JP2000088506
申请日：2000-03-24
申请人： HITACHI LTD
发明人： KATSUMURA YOSHITERU , ABE TOSHIHIKO , NAKABAYASHI SHINICHI , KANAI FUMIYUKI , KENBO YUKIO
IPC分类号： H01L21/02
摘要： PROBLEM TO BE SOLVED: To solve a problem in which a wafer is warped as a whole due to the distortion of films when the films are repeatedly formed on the wafer in a semiconductor manufacturing process, and the warpage of a wafer causes a critical problem with an increase in diameter of the wafer and wiring density. SOLUTION: The deformation of a semiconductor wafer is measured through a polarization method or a shape measuring method in which a laser displacement gauge is used, and the state of distortion of the wafer is calculated on the basis of measured shape of the wafer. A processing pattern is provided on the rear of the wafer at a proper position corresponding to the state of distortion, by which the rear of the wafer is turned to an isotropic state, and the wafer is corrected on shape. A processing method is carried out by the use of an ion beam, a flow of high-pressure liquid or the like which is capable of cutting a fine groove, or a high-speed particle irradiating method, a laser beam irradiating method or the like which modifies the state of a surface is used, by which the above processing pattern is provided corresponding to a state of distortion.

6. 发明专利

JP2000105203A DEFECT INSPECTING DEVICE AND METHOD 失效
公开(公告)号：JP2000105203A
公开(公告)日：2000-04-11
申请号：JP20607899
申请日：1999-07-21
申请人： HITACHI LTD , HITACHI ELECTR ENG
发明人： NOGUCHI MINORU , OSHIMA YOSHIMASA , NISHIYAMA HIDETOSHI , MATSUMOTO SHUNICHI , KENBO YUKIO , MATSUNAGA RYOJI , SAKAI SHIGETOSHI , NINOMIYA TAKANORI , WATANABE TETSUYA , NAKAMURA HISATO , JINGU TAKAHIRO , MORISHIGE YOSHIO , CHIKAMATSU SHUICHI
IPC分类号： G01B11/30 , G01N21/956 , H01L21/66
摘要： PROBLEM TO BE SOLVED: To quickly and precisely inspect a defect such as a very small contaminant by calculating dispersion based on signals in a portion with the same circuit patterns formed or in its vicinity, and by extracting a signal indicating the defect such as the very small contaminant out of detected signals based on a threshold set on the basis of a result calculated hereinbefore. SOLUTION: An illumination optical system 100 having a laser beam 101, lenses 102-104, a beam splitter and the like has a precdribed inclination with respect to a main straight line group of a circuit pattern, and an inspected objective substrate 1 is irradiated subtantially orthogonally to a traveling direction of a substrate mounting table 304 for mounting the objective substrate 1. An inspecting optical system 200 detects reflected scattered light provided by a defect such as a contaminant existing on the substrate 1, using image sensors 205, 206 through lenses 201, 203 and a beam aplitter 204, to feed signals to a processing circuit 400. A threshold as a determination reference is set in a defect determining process in the circuit 400 based on a dispersion of the resulting signals, and the signal indicating the defect such as the contaminant is extracted, based on the set threshold.

7. 发明专利

JP2000088563A METHOD AND APPARATUS FOR VISUAL INSPECTION 失效
公开(公告)号：JP2000088563A
公开(公告)日：2000-03-31
申请号：JP25393498
申请日：1998-09-08
申请人： HITACHI LTD
发明人： OKA KENJI , MAEDA SHUNJI , NOGUCHI MINORU , KENBO YUKIO
IPC分类号： H01J37/22 , G01B21/30 , G01N13/10 , G01N21/88 , G01N21/93 , G01N21/94 , G01N21/95 , G01N21/956 , G03F1/84 , G06T1/00 , G06T7/00 , H01L21/66 , G03F1/08
摘要： PROBLEM TO BE SOLVED: To obtain a method and an apparatus in which an inspection can be performed with good efficiency by a constitution wherein an image is detected at a low magnification (a low resolution) for an inspection processing operation and, at the same time, the image can be detected also at a high magnification required for a defect sorting operation. SOLUTION: Detection light which is received by a detector 7A is converted into a digital image signal by an A/D converter 8 so as to be input to a defect detection part 23. In the detection part 23, input data from the converter 8 is compared with data for comparison with it, and the existence of a defect is judged. That is to say, in the detection part 23, data which is generated by a design-data-pattern generation circuit on the basis of design data is compared with the input data from the converter 8, or data which is fetched in a previous scanning region so as to be stored in an image storage circuit is compared with the input data from the converter 8, and the defect is judged. Defect image information and coordinate information which are retained are displayed on a CRT 32 by a computer 32 for defect-information editing. By using their display, an operator can sort the defect.

8. 发明专利

JPH10233374A METHOD AND SYSTEM FOR MANUFACTURING SEMICONDUCTOR DEVICES 失效
公开(公告)号：JPH10233374A
公开(公告)日：1998-09-02
申请号：JP3448997
申请日：1997-02-19
申请人： HITACHI LTD
发明人： NOGUCHI MINORU , HIROSE TAKESHI , KENBO YUKIO , NINOMIYA TAKANORI , SERIZAWA MASAYOSHI , TAKAHARA YOICHI , KIMURA TAKESHI , MITANI SHINICHIRO , TANABE YOSHIKAZU
IPC分类号： B24B37/013 , B24B37/07 , H01L21/304 , H01L21/3105 , H01L21/3205 , H01L21/321 , H01L21/66 , H01L21/768 , B24B37/04
摘要： PROBLEM TO BE SOLVED: To enable manufacturing of semiconductor devices (semiconductor elements) with high throughput and high yield, while realizing chemical and mechanical polishing with high throughput and high accuracy. SOLUTION: In this method, change-over from chemical and mechanical high-speed polishing to low-speed polishing can be controlled according to the thickness of a measured film to be further polished. The method includes a polishing step of chemically and mechanically polishing a film formed on a substrate to flatten the film, and an inspection step of detecting a presence of a scratch or foreign matter different from surface roughness on the polished surface flattened by the polishing step. The presence of the scratch or foreign matters on the polished surface inspected by the inspection step is fed back to the polishing step to control its polishing conditions and reduce a scratch or foreign matter on the polished surface.

9. 发明专利

JPH0587009B2 失效
公开(公告)号：JPH0587009B2
公开(公告)日：1993-12-15
申请号：JP2125686
申请日：1986-02-04
申请人： HITACHI LTD
发明人： KENBO YUKIO , FUNATSU RYUICHI , KUNI TOMOHIRO , YONEYAMA YOSHIHIRO
IPC分类号： G01B11/00 , G01M11/00 , G03F7/20 , G03F9/00 , H01L21/027 , H01L21/30

10. 发明专利

JPH0481850B2 失效
公开(公告)号：JPH0481850B2
公开(公告)日：1992-12-25
申请号：JP22395684
申请日：1984-10-26
申请人： HITACHI LTD
发明人： TANIGUCHI MOTOYA , FUNATSU RYUICHI , KENBO YUKIO , IKEDA MINORU , INAGAKI AKIRA
IPC分类号： H01L21/027 , G03F7/20 , H01L21/30 , H01L21/67 , H01L21/683

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