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1. 发明专利

JP2008261893A Inspection apparatus 有权
标题翻译：检查装置
公开(公告)号：JP2008261893A
公开(公告)日：2008-10-30
申请号：JP2008205955
申请日：2008-08-08
申请人： Hitachi High-Technologies Corp , Hitachi Ltd , 株式会社日立ハイテクノロジーズ , 株式会社日立製作所
发明人： ISHIMARU ICHIRO , NOGUCHI MINORU , MORIYAMA ICHIRO , TANABE YOSHIKAZU , HACHIKAKE YASUO , KENBO YUKIO , WATANABE KENJI , TSUCHIYAMA YOJI
IPC分类号： G01N21/956
摘要： PROBLEM TO BE SOLVED: To provide a surface inspection apparatus which enables an inspection discriminating between scratches, which are generated on a surface and have various shapes, and foreign substances sticking to the surface when a polishing or grinding like CMP etc. is performed on an object to be processed (for example, an insulation film on a semiconductor substrate) in semiconductor manufacture or magnetic head manufacture, and to provide its method. SOLUTION: The inspection apparatus is characterized by the followings. Epi illumination and oblique illumination with almost the same luminous flux are applied on the scratches and foreign substances generated on the polished or grinded surface of the insulation film. Discrimination between shallow scratches and the foreign substances is performed by detecting variations in the intensities of scattered light arising from the shallow scratches and foreign substances during the epi illumination and oblique illumination, further, discrimination between linear scratches and the foreign substances is performed by detecting the directivity of the scattered light during the epi illumination. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种表面检查装置，其能够进行检查，以区分在表面上产生并具有各种形状的划痕和当像CMP等的研磨或研磨时粘附到表面的异物在半导体制造或磁头制造中对被处理物体（例如，半导体衬底上的绝缘膜）进行，并提供其方法。
解决方案：检查装置的特征如下。 Epi照明和具有几乎相同光通量的倾斜照明被施加在在绝缘膜的抛光或研磨表面上产生的划痕和异物上。通过检测在epi照明和倾斜照明期间由浅刮痕和异物产生的散射光的强度的变化来进行浅痕迹和异物之间的区别，此外，通过检测线性划痕和异物来区分线性划痕在epi照明期间散射光的方向性。版权所有（C）2009，JPO＆INPIT

2. 发明专利

JP2005300553A Defect inspection device and method 有权
标题翻译：缺陷检查装置和方法
公开(公告)号：JP2005300553A
公开(公告)日：2005-10-27
申请号：JP2005172304
申请日：2005-06-13
申请人： Hitachi High-Technologies Corp , Hitachi Ltd , 株式会社日立ハイテクノロジーズ , 株式会社日立製作所
发明人： NOGUCHI MINORU , OSHIMA YOSHIMASA , NISHIYAMA HIDETOSHI , MATSUMOTO SHUNICHI , KENBO YUKIO , MATSUNAGA RYOJI , SAKAI SHIGETOSHI , NINOMIYA TAKANORI , WATANABE TETSUYA , NAKAMURA HISATO , JINGU TAKAHIRO , MORISHIGE YOSHIO , CHIKAMATSU SHUICHI
IPC分类号： G01N21/956 , H01L21/66
摘要： PROBLEM TO BE SOLVED: To provide a defect inspection device and method, capable of improving detection sensitivity and throughput by realizing, at the detecting of defects, such as a foreign matter generated in a manufacturing process for forming a pattern on a substrate to produce an object, a linear high-efficiency lighting from a direction on which no diffracted light from the pattern is incident in order to reduce the diffracted light, and setting a threshold according to the dispersion of signals by patterns. SOLUTION: Scattered light, from the pattern that causes dispersion of signals, is reduced by a high-efficiency lighting optical system, lighting from a direction reducing the scattered light from the pattern, and the detection threshold is reduced by a means which sets the threshold, based on the dispersion of signals calculated each area within a chip, whereby improvement in the detection sensitivity and improvement in throughput are realized. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种缺陷检查装置和方法，其能够通过在检测诸如在用于在基板上形成图案的制造工艺中产生的异物等缺陷的检测来提高检测灵敏度和生产率为了产生物体，从不存在来自图案的衍射光入射的方向的线性高效照明，以便减少衍射光，并根据图案的信号色散设置阈值。解决方案：通过高效率照明光学系统减少来自引起信号色散的图案的散射光，从减少来自图案的散射光的方向进行照明，并且通过以下方式减少检测阈值：基于芯片内每个区域计算的信号的色散设置阈值，从而实现检测灵敏度的提高和吞吐量的提高。版权所有（C）2006，JPO＆NCIPI

3. 发明专利

JP2014211440A 表面検査装置およびその方法有权
标题翻译：用于表面检查的装置和方法
公开(公告)号：JP2014211440A
公开(公告)日：2014-11-13
申请号：JP2014113696
申请日：2014-06-02
申请人：株式会社日立製作所 , Hitachi Ltd , 株式会社日立ハイテクノロジーズ , Hitachi High-Technologies Corp
发明人： ISHIMARU ICHIRO , NOGUCHI MINORU , MORIYAMA ICHIRO , TANABE YOSHIKAZU , HACHIKAKE YASUO , KENBO YUKIO , WATANABE KENJI , TSUCHIYAMA HIROSHI
IPC分类号： G01N21/88 , G01B11/02 , G01B11/30 , G01N21/84 , G01N21/956 , H01L21/027
CPC分类号： G01B11/02 , G01B11/30 , G01N21/84 , G01N21/88 , G01N21/95 , H01L21/30
摘要：【課題】半導体製造や磁気ヘッド製造において、被加工対象物(例えば、半導体基板上の絶縁膜)に対してCMPなどの研磨または研削加工を施した際、その表面に生じる様々な形状を有するスクラッチと付着する異物とを弁別して検査することができるようにした表面検査装置およびその方法を提供することにある。【解決手段】本発明は、研磨または研削された絶縁膜の表面に発生したスクラッチや異物に対してほぼ同じ光束で落射照明と斜方照明とを行い、該落射照明時と斜方照明時との間において浅いスクラッチと異物とから発生する散乱光強度の変化を検出することによって浅いスクラッチと異物とを弁別し、さらに、前記落射照明時における散乱光の指向性を検出することによって線状スクラッチと異物とを弁別することを特徴とする表面検査方法およびその装置である。【選択図】図1
摘要翻译：要解决的问题：提供一种表面检查装置和表面检查方法，该表面检查装置和表面检查方法可以鉴别出附着在外部材料上的处理物体（例如，半导体基板上的绝缘体膜）的表面上出现的各种形状的划痕在半导体制造和磁头制造中对被处理物进行抛光或研磨处理（例如CMP）进行检查。本发明的表面检查方法对划痕和外来物进行表面照明和倾斜照明在具有大致相等的光通量的抛光或接地绝缘体膜的表面上发生的材料，并且检测由外部光照时间和倾斜照明时间之间的浅划痕和异物产生的散射光的强度变化，从而区分来自异物的浅划痕。该方法通过检测外照射时间中的散射光的方向性来进一步鉴别异物的线性划痕。还提供了该方法的设备。

4. 发明专利

JP2006330007A Defect inspection device and its method 有权
标题翻译：缺陷检查装置及其方法
公开(公告)号：JP2006330007A
公开(公告)日：2006-12-07
申请号：JP2006238838
申请日：2006-09-04
申请人： Hitachi High-Technologies Corp , Hitachi Ltd , 株式会社日立ハイテクノロジーズ , 株式会社日立製作所
发明人： NOGUCHI MINORU , OSHIMA YOSHIMASA , NISHIYAMA HIDETOSHI , MATSUMOTO SHUNICHI , KENBO YUKIO , MATSUNAGA RYOJI , SAKAI SHIGETOSHI , NINOMIYA TAKANORI , WATANABE TETSUYA , NAKAMURA HISATO , JINGU TAKAHIRO , MORISHIGE YOSHIO , CHIKAMATSU SHUICHI
IPC分类号： G01N21/956 , H01L21/66
摘要： PROBLEM TO BE SOLVED: To provide a defect inspection device and its method capable of improving detection sensitivity and throughput by setting a threshold value corresponding to the dispersion of signal depending on a pattern by realizing highly effective illumination on a straight line from a direction where no diffracted light enters at the time of detecting the defect such as foreign matter etc., generated in the manufacturing process of an object while forming a pattern on the substrate. SOLUTION: By a highly effective illumination system illuminating from the direction of reducing the diffraction light from the pattern, the dispersed light from the pattern being the cause of the dispersion of the signal is reduced. Further, the threshold value is reduced by a threshold setting means from the calculated dispersion of signal for every region in the chip. Consequently, the detection threshold value is reduced and the detection sensitivity is improved and the improvement of the throughput is realized. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：解决问题：提供一种缺陷检查装置及其方法，该缺陷检查装置及其方法能够通过根据图案设置与信号的色散相对应的阈值，从而通过在直线上实现高效照明来提高检测灵敏度和吞吐量在检测在物体的制造过程中产生的缺陷（例如异物等）的同时在衍射光线入射的方向，同时在基板上形成图案。解决方案：通过从减少来自图案的衍射光的方向照明的高效照明系统，来自图案的分散光是信号分散的原因。此外，根据芯片中每个区域的计算的信号色散，阈值设置装置减小阈值。因此，检测阈值降低，检测灵敏度提高，吞吐量提高。版权所有（C）2007，JPO＆INPIT

5. 发明专利

JP2006201179A Surface inspection device and its method 有权
标题翻译：表面检测装置及其方法
公开(公告)号：JP2006201179A
公开(公告)日：2006-08-03
申请号：JP2006028261
申请日：2006-02-06
申请人： Hitachi High-Technologies Corp , Hitachi Ltd , 株式会社日立ハイテクノロジーズ , 株式会社日立製作所
发明人： ISHIMARU ICHIRO , NOGUCHI MINORU , MORIYAMA ICHIRO , TANABE YOSHIKAZU , HACHIKAKE YASUO , KENBO YUKIO , WATANABE KENJI , TSUCHIYAMA YOJI
IPC分类号： G01N21/956 , G01B11/30 , H01L21/66
摘要： PROBLEM TO BE SOLVED: To provide a surface inspection device and its method where a scratch, having various shapes occurring on the surface of a processed object (for example, an insulating film on a semiconductor substrate) and an adhering foreign substance are discriminated and inspected, when the processed object is polished or ground through CMP or the like, in the manufacturing of semiconductors or of magnetic heads. SOLUTION: In the surface inspection method and its device, epi-illumination and oblique illumination are applied to the scratch and the foreign substance occurring on the surface of the polished or ground insulating film with substantially the same luminous flux, a shallow scratch and foreign substance are discriminated by detecting variation of the intensity of the scattered light generated from the shallow scratch and foreign substance between the epi-illumination and oblique illumination, and a linear scratch and foreign substance are discriminated, by detecting the directivity of the scattered light in the epi-illumination. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：解决问题：提供一种表面检查装置及其方法，其中在加工对象（例如半导体基板上的绝缘膜）的表面上出现各种形状的刮痕和附着的异物为通过CMP等对被处理物进行抛光或研磨时，在半导体或磁头的制造中进行鉴别和检查。解决方案：在表面检查方法及其装置中，外露照明和倾斜照明被施加到具有基本上相同的光通量的抛光或接地绝缘膜的表面上产生的划痕和异物，浅划痕通过检测从外部照明和倾斜照明之间的浅划痕和异物产生的散射光的强度的变化来区分外来物质，并且通过检测散射光的方向性来区分线性划痕和异物在epi照明。版权所有（C）2006，JPO＆NCIPI

6. 发明专利

JP2013174599A Device and method for surface inspection 有权
标题翻译：用于表面检查的装置和方法
公开(公告)号：JP2013174599A
公开(公告)日：2013-09-05
申请号：JP2013076050
申请日：2013-04-01
申请人： Hitachi Ltd , 株式会社日立製作所 , Hitachi High-Technologies Corp , 株式会社日立ハイテクノロジーズ
发明人： ISHIMARU ICHIRO , NOGUCHI MINORU , MORIYAMA ICHIRO , TANABE YOSHIKAZU , HACHIKAKE YASUO , KENBO YUKIO , WATANABE KENJI , TSUCHIYAMA HIROSHI
IPC分类号： G01N21/956 , G01N21/88 , G03F7/20 , H01L21/027
摘要： PROBLEM TO BE SOLVED: To provide a surface inspection device and a surface inspection method, which can discriminate scratches in various shapes occurring on a surface of a processed object (for example, an insulator film on a semiconductor substrate) from foreign materials attached to the processed object, and perform inspection when the processed object is subjected to polishing or grinding processing such as CMP, in semiconductor manufacturing and magnetic head manufacturing.SOLUTION: The surface inspection method of the present invention performs epi-illumination and oblique illumination on scratches and foreign materials occurring on a surface of a polished or ground insulator film with substantially equal light flux, and detects a change in intensity of scattered light generated from shallow scratches and the foreign materials between the epi-illumination time and the oblique illumination time to thereby discriminate the shallow scratches from the foreign materials. The method further discriminates linear scratches from the foreign materials by detecting the directivity of the scattered light in the epi-illumination time. The device for the method is also provided.
摘要翻译：要解决的问题：提供一种表面检查装置和表面检查方法，该表面检查装置和表面检查方法可以鉴别出附着在外部材料上的处理物体（例如，半导体基板上的绝缘体膜）的表面上出现的各种形状的划痕在半导体制造和磁头制造中对被处理物进行抛光或研磨处理（例如CMP）进行检查。本发明的表面检查方法对划痕和外来物进行表面照明和倾斜照明在具有大致相等的光通量的抛光或接地绝缘体膜的表面上发生的材料，并且检测由外部光照时间和倾斜照射时间之间的浅划痕和异物产生的散射光的强度变化，从而区分来自异物的浅划痕。该方法通过检测外照射时间中的散射光的方向性来进一步鉴别异物的线性划痕。还提供了该方法的设备。

7. 发明专利

JP2009192541A Defect inspection device 有权
标题翻译：缺陷检查装置
公开(公告)号：JP2009192541A
公开(公告)日：2009-08-27
申请号：JP2009125763
申请日：2009-05-25
申请人： Hitachi High-Technologies Corp , Hitachi Ltd , 株式会社日立ハイテクノロジーズ , 株式会社日立製作所
发明人： ISHIMARU ICHIRO , NOGUCHI MINORU , MORIYAMA ICHIRO , TANABE YOSHIKAZU , HACHIKAKE YASUO , KENBO YUKIO , WATANABE KENJI , TSUCHIYAMA HIROSHI
IPC分类号： G01N21/956 , H01L21/66
摘要： PROBLEM TO BE SOLVED: To provide a surface inspection apparatus for discriminably inspecting a scratch having various shapes occurring on the surface and an adhering foreign substance, when polishing or grinding such as CMP (Chemical Mechanical Polishing) is applied to a workpiece (for example, an insulation film on a semiconductor substrate), in manufacturing a semiconductor or a magnetic head. SOLUTION: In this surface inspection method and apparatus, epi-illumination and slanting illumination are applied to the scratch and the foreign substance occurring on the surface of the polished or ground insulation film with substantially the same light flux, a shallow scratch and a foreign substance are discriminated by detecting variation of the scattered light intensity generated from the shallow scratch and foreign substance between the epi-illumination time and slanting illumination time. Further, a linear scratch and a foreign substance are discriminated by detecting the directivity of the scattered light during the epi-illumination. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：为了提供一种表面检查装置，用于区分地检查在表面上发生的各种形状的刮痕和粘附的异物，当将CMP（化学机械抛光）的抛光或研磨施加到工件上时例如半导体衬底上的绝缘膜），制造半导体或磁头时。解决方案：在这种表面检查方法和装置中，对抛光或接地绝缘膜的表面上产生的划痕和异物施加外照射和倾斜照明，具有基本上相同的光通量，浅划痕和通过检测在外部照射时间和倾斜照明时间之间从浅划痕和异物产生的散射光强度的变化来区分异物。此外，通过在外照明期间检测散射光的方向性来区分线性划痕和异物。版权所有（C）2009，JPO＆INPIT

8. 发明专利

JP2004138620A Pattern inspection method 审中-公开
标题翻译：模式检验方法
公开(公告)号：JP2004138620A
公开(公告)日：2004-05-13
申请号：JP2003373888
申请日：2003-11-04
申请人： Hitachi Ltd , 株式会社日立製作所
发明人： NOGUCHI MINORU , KENBO YUKIO , OSHIDA YOSHITADA , SHIBA MASATAKA , YOSHITAKE YASUHIRO , MURAYAMA MAKOTO
IPC分类号： G01B11/30 , G01B11/24 , G01N21/956 , H01L21/027
摘要： PROBLEM TO BE SOLVED: To provide an aligner and its method for using a monochrome mask to image a pattern on the mask onto a substrate with the resolution level achieved by optics or more. SOLUTION: The aligner comprises a light source means emitting a laser, a scanning means scanning the laser emitted from the light source means, an irradiation means irradiating the laser scanned by the scanning means onto the above mask, an imaging optics means imaging the light from the mask with laser irradiated by the irradiation means on a wafer, and a table means on which the above wafer is mounted. It uses a galvano mirror to scan the laser emitted from light source, irradiates the scanned laser onto the mask, and then images the light from the above laser-irradiated mask on the wafer through the imaging optics, exposing the wafer. COPYRIGHT: (C)2004,JPO
摘要翻译：要解决的问题：提供一种对准器及其使用单色掩模的方法，以通过光学器件或更高级别实现的分辨率水平将掩模上的图案成像到基板上。解决方案：对准器包括发射激光的光源装置，扫描从光源装置发射的激光的扫描装置，将由扫描装置扫描的激光照射到上述掩模上的照射装置，成像光学装置成像通过照射装置在晶片上照射激光的掩模的光，以及安装上述晶片的台装置。它使用电流镜来扫描从光源发射的激光，将扫描的激光照射到掩模上，然后通过成像光学元件将来自上述激光照射的掩模的光成像在晶片上，暴露晶片。版权所有（C）2004，JPO

9. 发明专利

JP2003077969A Dust particle detection method, its device and semiconductor device manufacturing method 审中-公开
标题翻译：颗粒检测方法，其设备和半导体器件制造方法
公开(公告)号：JP2003077969A
公开(公告)日：2003-03-14
申请号：JP2002158563
申请日：2002-05-31
申请人： Hitachi Ltd , 株式会社日立製作所
发明人： NOGUCHI MINORU , KENBO YUKIO
IPC分类号： G01N21/956 , H01L21/66
摘要： PROBLEM TO BE SOLVED: To solve the problem that minute dust particles exist during semiconductor manufacturing because LSI is made minute and contamination due to heavy metal elements or the like existing in a wafer or on the surface of the wafer can not be detected.
SOLUTION: An atmosphere setting and holding system detected while suppressing Rayleigh scattering in which scattering light from the dust particles or the contamination is unnecessary in a specific atmosphere in a scattering light detection system is provided with a contamination detector for detecting scattering light detection from the dust particles existing on a substrate or contamination, and the contamination detector is provided with a substrate heating system for further previously heating the substrate prior to contamination detection. The above constituted contamination detector is installed in a doorway of each substrate of a vacuum processing device for semiconductor manufacturing.
COPYRIGHT: (C)2003,JPO
摘要翻译：要解决的问题为了解决半导体制造中存在微小尘埃颗粒的问题，因为LSI微小，并且不能检测到存在于晶片或晶片表面上的重金属元素等的污染。解决方案：在散射光检测系统中，在特定气氛中抑制瑞利散射而在灰尘粒子或污染物中散射光不需要时检测到气氛设定保持系统，设置有用于检测来自灰尘的散射光检测的污染检测器存在于基板上的颗粒或污染物，并且污染检测器设置有用于在污染检测之前进一步预先加热基板的基板加热系统。上述构成的污染检测器安装在用于半导体制造的真空处理装置的每个基板的门口中。

10. 发明专利

JP2003042928A Scanning probe microscope 有权
标题翻译：扫描探针显微镜
公开(公告)号：JP2003042928A
公开(公告)日：2003-02-13
申请号：JP2001234742
申请日：2001-08-02
申请人： Hitachi Kenki Fine Tech Co Ltd , Hitachi Ltd , 日立建機ファインテック株式会社 , 株式会社日立製作所
发明人： MURAYAMA TAKESHI , NAKADA TOSHIHIKO , NOMOTO MINEO , OSHIDA YOSHITADA , KENBO YUKIO , MORIMOTO TAKASHI , YAMAMOTO HIROSHI
IPC分类号： G01B11/00 , G01B11/30 , G01B21/30 , G01Q10/04 , G01Q20/02 , G01Q60/24 , G01N13/10 , G01N13/16
摘要： PROBLEM TO BE SOLVED: To reduce the probability of incidence of a diffracted light into a photoreceiving face of a photodetector, when one portion of a laser beam emitted toward a backface of a cantilever leakes to irradiate a sample surface, and when diffracted light is generated thereby in the sample surface, to reduce the errors in measurement.
SOLUTION: A microscope is provided with the cantilever 21 having a probe 20, a Z fine-motion mechanism for bringing displacement between the probe and a sample, an XY scanning mechanism for providing relative displacement for the probe along the sample surface, an optical detection means for detecting a displacement level generated in the cantilever, and a controller 31 for controlling the Z fine-motion mechanism based on a detection signal from the optical detecting means and a reference value, and for controlling the XY scanning mechanism, while keeping the space between the probe and the sample, for scanning on the sample surface. A plane, formed by a laser beam reflecting point B in the cantilever, a laser beam emitting point A in a laser beam source and a laser beam-incident point C in the photodetector is arranged to be inclined, with respect to a standard face of the sample surface.
COPYRIGHT: (C)2003,JPO
摘要翻译：要解决的问题：为了降低衍射光入射到光电检测器的光接收面的可能性，当朝向悬臂的背面发射的激光束的一部分泄漏以照射样品表面时，以及当产生衍射光时从而在样品表面，以减少测量误差。解决方案：显微镜设有悬臂21，悬臂21具有探针20，Z精细运动机构，用于使探针与样品之间发生位移; XY扫描机构，用于沿着样品表面提供探针的相对位移;光学检测用于检测在悬臂中产生的位移水平的装置，以及控制器31，用于基于来自光学检测装置的检测信号和参考值来控制Z微动机构，并且用于控制XY扫描机构，同时保持空间探头和样品之间，用于扫描样品表面。由激光束反射点B在悬臂中形成的平面，激光束源中的激光束发射点A和光电检测器中的激光束入射点C相对于标准面倾斜样品表面。

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