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1. 发明专利

JP2012044071A Electronic component mounting device and electronic component mounting method 有权
标题翻译：电子元件安装设备和电子元件安装方法
公开(公告)号：JP2012044071A
公开(公告)日：2012-03-01
申请号：JP2010185610
申请日：2010-08-20
申请人： Fujitsu Ltd , Shinko Electric Ind Co Ltd , 富士通株式会社 , 新光電気工業株式会社
发明人： YAMAGAMI TAKATOYO , KIRA HIDEHIKO , KUBOTA TAKASHI , OI ATSUSHI , IIDA KIYOAKI , KURIHARA TAKASHI
IPC分类号： H01L21/60 , H05K13/04
CPC分类号： H01L24/83 , H01L24/75 , H01L2224/32145 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2224/73265 , H01L2224/75 , H01L2224/75743 , H01L2224/81001 , H01L2224/83001 , H01L2224/83101 , H01L2224/83192 , H01L2224/838 , H01L2924/01006 , H01L2924/01033 , H01L2924/3025 , H01L2924/00014 , H01L2924/00 , H01L2924/3512
摘要： PROBLEM TO BE SOLVED: To prevent occurrence of creases on the upper surface of an underfill material.SOLUTION: A bonding tool 10 sucks a chip 41 while interposing an anti-adhesive tape 30 therebetween. The bonding tool 10 has an electronic component suction hole 11 through which the chip 41 is sucked, and a groove 13 provided on the periphery of the electronic component suction hole 11 in order to suck the anti-adhesive tape 30. When the chip 41 is pressed against an underfill material 70 and heated, and the mounting surface of an upper stage chip is formed by making the underfill material 70 protrude from the chip 41, thermally expanded portion of the anti-adhesive tape 30 enters the groove 13 and thereby creases do not occur on the upper surface of the underfill material.
摘要翻译：要解决的问题：为了防止在底部填充材料的上表面上产生折痕。解决方案：接合工具10吸附芯片41，同时在其间插入防粘带30。接合工具10具有吸引芯片41的电子部件吸入孔11和设置在电子部件吸入孔11的周围的槽13，以吸引防粘带30.当芯片41为压在底部填充材料70上并被加热，并且通过使底部填充材料70从芯片41突出而形成上层芯片的安装表面，防粘带30的热膨胀部分进入凹槽13，从而产生折痕不会发生在底部填充材料的上表面上。版权所有（C）2012，JPO＆INPIT

2. 发明专利

JP2013080844A Board module manufacturing method, board module and board module assembly 审中-公开
标题翻译：板模块制造方法，板模块和板模块总成
公开(公告)号：JP2013080844A
公开(公告)日：2013-05-02
申请号：JP2011220403
申请日：2011-10-04
申请人： Fujitsu Ltd , 富士通株式会社
发明人： YAMAGAMI TAKATOYO , KUBOTA TAKASHI , ISHIKAWA KUNIKO , KITAJIMA MASAYUKI
IPC分类号： H05K3/34 , B22F1/00 , B22F1/02 , B23K1/00 , B23K35/26 , B23K101/42 , C22C12/00 , C22C13/00 , H01L21/60
CPC分类号： H05K3/00 , B23K1/0016 , B23K31/02 , H01L21/4846 , H01L23/49811 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/81 , H01L2224/11003 , H01L2224/11332 , H01L2224/11848 , H01L2224/11901 , H01L2224/13211 , H01L2224/13347 , H01L2224/13439 , H01L2224/13499 , H01L2224/16225 , H01L2224/16238 , H01L2224/16503 , H01L2224/32225 , H01L2224/73204 , H01L2224/81191 , H01L2224/81385 , H01L2224/81447 , H01L2224/8181 , H01L2224/83104 , H01L2924/01327 , H01L2924/15311 , H05K3/3436 , H05K7/06 , H05K2201/10674 , H05K2203/043 , H05K2203/047 , H05K2203/159 , Y02P70/613 , H01L2924/00 , H01L2924/01029 , H01L2924/0105 , H01L2924/00012 , H01L2924/00014 , H01L2924/01083 , H01L2924/01047
摘要： PROBLEM TO BE SOLVED: To provide a board module manufacturing method which can prevent solder flash on the side of an electrode on which a solder ball is preliminarily mounted.SOLUTION: A manufacturing method of a board module 1 comprises the steps of: adhering a solder paste 6 containing copper particles 61 having a larger specific gravity and a higher melting point than those of a solder ball to a surface of the solder ball 4 containing at least a tin component and mounted on a first electrode 21 provided on a surface of an electronic component 2; turning up the surface of the electronic component on which the first electrode is provided; melting the solder ball by heating to precipitate the copper particles adhered to the surface of the solder ball in the solder ball; and forming a first intermetallic compound layer 41 having a melting point higher than the melting point of the solder ball at a boundary of the first electrode on which the solder ball is mounted by the precipitated copper particles and the tin component of the solder ball.
摘要翻译：要解决的问题：提供一种能够防止预先安装有焊锡球的电极侧的焊料闪光的电路板模块制造方法。解决方案：板模块1的制造方法包括以下步骤：将包含比重比和焊料球更高的熔点的铜颗粒61的焊膏6粘附到焊球的表面 4，其至少包含锡组分并且安装在设置在电子部件2的表面上的第一电极21上; 卷起设置有第一电极的电子部件的表面; 通过加热熔化焊球，以沉淀附着在焊球中的焊球表面的铜颗粒; 并且通过沉淀的铜颗粒和锡球的锡组分在形成焊锡球的第一电极的边界处形成熔点高于焊料球的熔点的第一金属间化合物层41。版权所有（C）2013，JPO＆INPIT

3. 发明专利

JP2013247295A Conductive joint material, electronic component, and electronic apparatus 审中-公开
标题翻译：导电材料，电子元件和电子设备
公开(公告)号：JP2013247295A
公开(公告)日：2013-12-09
申请号：JP2012121202
申请日：2012-05-28
申请人： Fujitsu Ltd , 富士通株式会社
发明人： KITAJIMA MASAYUKI , YAMAGAMI TAKATOYO , KUBOTA TAKASHI , ISHIKAWA KUNIKO
IPC分类号： H05K3/34 , B22F1/00 , B22F1/02 , B22F9/08 , B23K1/00 , B23K35/22 , B23K101/42 , C22C12/00 , C22C13/00
CPC分类号： H01L21/64 , B23K35/0244 , B23K35/025 , H01L23/3121 , H01L24/03 , H01L24/05 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/743 , H01L24/83 , H01L24/94 , H01L25/0655 , H01L25/16 , H01L25/50 , H01L2224/0382 , H01L2224/03825 , H01L2224/03828 , H01L2224/03829 , H01L2224/04026 , H01L2224/05611 , H01L2224/27003 , H01L2224/27312 , H01L2224/27318 , H01L2224/2732 , H01L2224/2744 , H01L2224/2747 , H01L2224/29211 , H01L2224/2929 , H01L2224/29311 , H01L2224/29395 , H01L2224/29411 , H01L2224/32105 , H01L2224/32227 , H01L2224/83075 , H01L2224/83192 , H01L2224/83411 , H01L2224/83424 , H01L2224/83438 , H01L2224/83444 , H01L2224/83447 , H01L2224/83455 , H01L2224/83464 , H01L2224/83466 , H01L2224/83815 , H01L2224/94 , H01L2924/1203 , H01L2924/12042 , H01L2924/1301 , H01L2924/1304 , H01L2924/14 , H01L2924/15788 , H01L2924/19041 , H01L2924/19043 , H01L2924/19105 , H01L2924/3512 , H01L2924/3841 , H05K3/3484 , H05K2201/0272 , H05K2201/10636 , H05K2203/047 , Y02P70/611 , Y10T428/12014 , Y10T428/12222 , H01L2924/01083 , H01L2924/01047 , H01L2924/01028 , H01L2924/0103 , H01L2924/01046 , H01L2924/01049 , H01L2924/01029 , H01L2924/00014 , H01L2924/014 , H01L2224/83 , H01L2224/83439 , H01L2924/01014 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a conductive joint material capable of preventing cubical expansion and initiation stress which are caused by the conductive joint material re-melted by secondary reflow heating, and to provide an electronic component using the conductive joint material and an electronic apparatus on which the electronic component is mounted.SOLUTION: A conductive joint material includes: a first metal composed of the first metal and including holes which absorb the melted first metal when the first metal is heated at a temperature higher than a melting point of the first metal; and a solder component composed of a second metal having a melting point lower than the melting point of the first metal. An electronic component includes: a module substrate having electrode pads; a component mounted on the module substrate and having multiple electrodes; a sealing resin covering the component; and multiple terminals connecting the wiring in the module substrate with the wiring board at the exterior. The multiple electrodes are connected with the electrode pads by the conductive joint material.
摘要翻译：要解决的问题：提供能够防止由二次回流加热再次熔化的导电接头材料引起的立方膨胀和起始应力的导电接头材料，并且提供使用导电接合材料的电子部件和电子设备电子部件安装在其上。解决方案：导电接头材料包括：由第一金属组成的第一金属，并且当第一金属在高于第一金属的熔点的温度下被加热时，包括吸收熔融的第一金属的孔金属; 以及由熔点低于第一金属的熔点的第二金属构成的焊料成分。电子部件包括：具有电极焊盘的模块基板; 安装在模块基板上并具有多个电极的部件; 覆盖该部件的密封树脂; 以及多个端子将模块基板中的布线与外部的布线板连接。多个电极通过导电接头材料与电极焊盘连接。

4. 发明专利

JP2013119089A Conductive bonding material, electronic component, and electronic device 审中-公开
标题翻译：导电粘接材料，电子元件和电子器件
公开(公告)号：JP2013119089A
公开(公告)日：2013-06-17
申请号：JP2011266729
申请日：2011-12-06
申请人： Fujitsu Ltd , 富士通株式会社
发明人： KITAJIMA MASAYUKI , YAMAGAMI TAKATOYO , KUBOTA TAKASHI , ISHIKAWA KUNIKO
IPC分类号： B23K35/14 , B22F1/00 , B22F1/02 , C22C9/00 , C22C12/00 , C22C13/00 , C22C28/00 , H05K3/32
CPC分类号： H01B1/22 , H01L2924/0002 , H05K1/09 , H05K3/3484 , H05K2201/0272 , H05K2203/047 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a conductive bonding material surely mountable by primary reflow heating and prevented from re-melting in secondary reflow heating, an electronic component using the conductive bonding material, and an electronic device with the electronic component mounted thereon.SOLUTION: The conductive bonding material contains copper particles coated with either gallium or a gallium alloy, and either tin particles or tin alloy particles. It is prefarably that the gallium alloy is one of Ga-Ni alloy, a Ga-Cu alloy, a Ga-Sn alloy and a Ga-Au alloy, the volume average particle diameter of copper particles is 0.5 μm or more and 30 μm or less, the average thickness of a coating film containing either the gallium or the gallium alloy is 0.5 μm or more and 10 μm or less, and the like.
摘要翻译：要解决的问题：为了提供可通过初级回流加热可靠地安装的导电接合材料，并且防止二次回流加热中的再熔化，使用导电接合材料的电子部件以及安装有电子部件的电子器件。
解决方案：导电接合材料包含用镓或镓合金涂覆的铜颗粒，以及锡颗粒或锡合金颗粒。优选的是，镓合金是Ga-Ni合金，Ga-Cu合金，Ga-Sn合金和Ga-Au合金之一，铜粒子的体积平均粒径为0.5μm以上且30μm以下含镓或镓合金的涂膜的平均厚度为0.5μm以上且10μm以下。版权所有（C）2013，JPO＆INPIT

5. 发明专利

JP2011077308A Method for mounting semiconductor device 审中-公开
标题翻译：安装半导体器件的方法
公开(公告)号：JP2011077308A
公开(公告)日：2011-04-14
申请号：JP2009227400
申请日：2009-09-30
申请人： Fujitsu Ltd , 富士通株式会社
发明人： YAMAGAMI TAKATOYO , KUBOTA TAKASHI , KIRA HIDEHIKO , MATSUMURA TAKAYOSHI
IPC分类号： H01L21/60
CPC分类号： H01L24/11 , H01L24/12 , H01L24/16 , H01L24/81 , H01L2224/1134 , H01L2224/13144 , H01L2224/13147 , H01L2224/75251 , H01L2224/75252 , H01L2224/81193 , H01L2224/81203 , H01L2224/81801 , H01L2924/00013 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/01327 , H01L2924/014 , H01L2224/45111 , H01L2224/13099
摘要： PROBLEM TO BE SOLVED: To provide a method for mounting a semiconductor device, wherein a melting point of connection part between a semiconductor chip and a substrate is increased after the semiconductor device is mounted.
SOLUTION: In the method for mounting the semiconductor device, a semiconductor chip 11 is mounted on the substrate 15 by flip chip bonding. The method includes: a step of bringing an Au bump of the semiconductor chip 11 into contact with an Sn-Bi solder 18; and a step of heating the Sn-Bi solder 18 at a temperature which is not lower than the melting point and is not higher than 180°C for 30 minutes or more.
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供一种用于安装半导体器件的方法，其中在半导体器件安装之后，半导体芯片和衬底之间的连接部分的熔点增加。解决方案：在安装半导体器件的方法中，半导体芯片11通过倒装芯片接合安装在基板15上。该方法包括：使半导体芯片11的Au凸块与Sn-Bi焊料18接触的步骤; 以及在不低于熔点并且不高于180℃的温度下加热Sn-Bi焊料18 30分钟以上的步骤。版权所有（C）2011，JPO＆INPIT

6. 发明专利

JP2013210575A Optical waveguide device, and method for manufacturing optical waveguide device 有权
标题翻译：光波导装置和制造光波导装置的方法
公开(公告)号：JP2013210575A
公开(公告)日：2013-10-10
申请号：JP2012082178
申请日：2012-03-30
申请人： Fujitsu Ltd , 富士通株式会社
发明人： YAMAGAMI TAKATOYO , KUBOTA TAKASHI , ISHIKAWA KUNIKO , KIRA HIDEHIKO
IPC分类号： G02B6/42 , G02B6/122 , G02B6/13
CPC分类号： B29D11/00721 , B29D11/00663 , G02B6/122 , G02B6/125 , G02B6/4214 , G02B2006/12104
摘要： PROBLEM TO BE SOLVED: To simply form a mirror surface for optical coupling between an optical waveguide and an optical component with high accuracy in an optical waveguide device and a method for manufacturing the optical waveguide device.SOLUTION: In a method for manufacturing an optical waveguide device, a mirror surface for optical coupling between an optical waveguide member (12a) and an optical component 11 is formed in an under-fill material 15 by inserting an inclined surface 102a which inclines to the surface of a base material 12 in which the optical waveguide member (12a) is disposed of a mold 102 having the inclined surface 102a into a through hole 12-1 to which the optical waveguide member (12a) is exposed, formed in the base material 12 from one surface side of the base material 12, arranging the optical component 11 on an opening of a through hole 12-1 on the other surface side of the base material 12, and injecting the under-fill material 15 between the optical component 11 and the other surface and the through hole 12-1 to be hardened.
摘要翻译：要解决的问题：在光波导器件中简单地形成用于光波导和光学部件之间的光耦合的高精度的镜面，以及制造光波导器件的方法。在光学波导构件（12a）和光学部件11之间用于光学耦合的镜面通过插入倾斜表面102a而形成在底部填充材料15中，倾斜表面102a倾斜到基底材料12的表面，其中光学将波导构件（12a）从具有倾斜面102a的模具102设置在从基材12的一个表面侧形成在基材12中的光波导构件（12a）露出的通孔12-1中将光学部件11配置在基材12的另一面侧的通孔12-1的开口部上，将欠补充材料15注入光学部件 11，另一表面和通孔12-1被硬化。

7. 发明专利

JP2013081966A Conductive bonding material, conductor bonding method, and semiconductor device production method 审中-公开
标题翻译：导电粘合材料，导体接合方法和半导体器件生产方法
公开(公告)号：JP2013081966A
公开(公告)日：2013-05-09
申请号：JP2011221817
申请日：2011-10-06
申请人： Fujitsu Ltd , 富士通株式会社
发明人： KUBOTA TAKASHI , KITAJIMA MASAYUKI , YAMAGAMI TAKATOYO , ISHIKAWA KUNIKO
IPC分类号： B23K35/14 , B23K1/00 , B23K35/26 , B23K35/28 , B23K35/30 , B23K35/363 , B23K101/42 , C22C12/00 , C22C13/00 , C22C21/00 , H05K3/34
CPC分类号： B23K35/262 , B23K1/0016 , B23K35/0244 , B23K35/025 , B23K35/24 , B23K35/286 , B23K35/3006 , B23K35/302 , B23K35/36 , B23K35/3613 , B23K2201/40 , C22C12/00 , C22C13/00 , C22C13/02 , H01B1/22 , H01L24/18 , H01L2924/01322 , H01L2924/12042 , H01L2924/1301 , H01L2924/15788 , H01L2924/19105 , H05K1/0269 , H05K3/3463 , H05K2201/0272 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a conductive bonding material that can form a metal coating that is preferable in lustrous property after being melted by heat and allows an automatic appearance inspection apparatus to be applicable, and to provide a conductor bonding method using the conductive bonding material, and a semiconductor device production method.SOLUTION: The conductive bonding material includes: a first metal particle; a second metal particle having an average particle diameter larger than an average particle diameter of the first metal particle; and a third metal particle having an average particle diameter larger than the average particle diameter of the first metal particle, a relative density larger than a relative density of the first metal particle, and a melting point higher than a melting point of the second metal particle.
摘要翻译：解决的问题：提供一种导电接合材料，其可以在通过热熔化之后形成优良的光泽性的金属涂层，并且允许自动外观检查装置可应用，并提供使用导电接合材料和半导体器件制造方法。导电接合材料包括：第一金属颗粒; 平均粒径大于第一金属颗粒的平均粒径的第二金属颗粒; 和平均粒径大于第一金属粒子的平均粒径的第三金属粒子，比第一金属粒子的相对密度大的相对密度，高于第二金属粒子的熔点的熔点。版权所有（C）2013，JPO＆INPIT

8. 发明专利

JP2012216678A Electronic component, electronic apparatus, and solder paste 审中-公开
标题翻译：电子元件，电子设备和焊膏
公开(公告)号：JP2012216678A
公开(公告)日：2012-11-08
申请号：JP2011080836
申请日：2011-03-31
申请人： Fujitsu Ltd , 富士通株式会社
发明人： KITAJIMA MASAYUKI , YAMAGAMI TAKATOYO , KUBOTA TAKASHI , ISHIKAWA KUNIKO
IPC分类号： H01L23/29 , B23K1/00 , B23K35/22 , B23K35/26 , B23K35/363 , B23K101/40 , B23K101/42 , C22C13/00 , H01L21/60 , H01L23/31 , H05K3/28 , H05K3/34
CPC分类号： H05K3/3442 , B23K1/0016 , B23K1/206 , B23K35/0244 , B23K35/025 , B23K35/0255 , B23K35/262 , B23K35/302 , B23K35/3613 , B23K2201/42 , C22C13/00 , H01L2924/0002 , H05K3/284 , H05K3/3484 , H05K2201/0323 , H05K2201/10977 , H05K2203/1476 , Y02P70/613 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a solder paste which prevents the occurence of short circuits between electrodes due to melted solder when an electronic component is connected to a printed wiring board or the like through soldering, to provide the electronic component and an electronic apparatus using the electronic component.SOLUTION: An electronic component has: a wiring board having an electrode pad; a component mounted on the wiring board and having multiple electrodes; a sealing resin covering the component; and multiple terminals connecting wiring in the wiring board with an external substrate. The multiple electrodes are connected with the electrode pad through solder. A first resin layer having a first Young's modulus and a second resin layer having a second Young's modulus that is larger than the first Young's modulus are formed from the solder side in this order between the solder and the sealing resin.
摘要翻译：要解决的问题：提供一种当通过焊接将电子部件连接到印刷线路板等时，由于焊料熔化而防止在电极之间发生短路的焊膏，以提供电子部件和使用该电子部件的电子设备。解决方案：电子部件具有：具有电极焊盘的布线板; 安装在所述布线板上并具有多个电极的部件; 覆盖该部件的密封树脂; 以及多个端子，其将布线板中的布线与外部基板连接。多个电极通过焊料与电极焊盘连接。在焊料和密封树脂之间依次形成具有第一杨氏模量的第一树脂层和具有大于第一杨氏模量的第二杨氏模量的第二树脂层。版权所有（C）2013，JPO＆INPIT

9. 发明专利

JP2005064286A Design support system 有权
标题翻译：设计支持系统
公开(公告)号：JP2005064286A
公开(公告)日：2005-03-10
申请号：JP2003293385
申请日：2003-08-14
申请人： Fujitsu Ltd , 富士通株式会社
发明人： OKADA TORU , FUJII MASANAO , YAMAGAMI TAKATOYO , MISHIMA KAZUHISA , OTSUKA TOSHIAKI
IPC分类号： G06F17/50 , G05B19/418 , G06F19/00 , G06Q50/00 , G06Q50/04 , H01L21/02 , G06F17/60
CPC分类号： G05B19/41885 , G05B2219/31334 , G05B2219/31343 , G05B2219/35029 , G05B2219/35179 , G06Q10/06 , G06Q50/04 , Y02P90/185 , Y02P90/26 , Y02P90/265 , Y02P90/30
摘要： PROBLEM TO BE SOLVED: To shorten the designing/manufacturing time of a manufacturing line and to reduce manufacturing costs by efficiently inspecting, determining and constructing the manufacturing line provided with a plurality of processes. SOLUTION: The design support system is constituted of a manufacturing line information preparation part 9 for acquiring information concerned with element sorts previously stored in an element sort database 503, on the basis of element sorts selected as optional element sorts constituting the manufacturing line by selection parts 3, 4, and preparing information concerned with the manufacturing line and an output part 2 for outputting the information concerned with the manufacturing line which is prepared by the manufacturing line information preparation part 9. COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：通过有效地检查，确定和构建具有多个工艺的生产线，缩短生产线的设计/制造时间并降低制造成本。解决方案：设计支持系统由生产线信息准备部分9构成，生产线信息准备部分9基于选择为构成生产线的可选元素种类的元素种类来获取与先前存储在元素分类数据库503中的元素种类有关的信息通过选择部件3,4，以及准备与生产线有关的信息，以及输出部分2，用于输出与生产线信息准备部分9制备的生产线有关的信息。版权所有（C）2005 ，JPO＆NCIPI

10. 发明专利

JP2014191251A Joining device and joining method 有权
标题翻译：加工设备和接合方法
公开(公告)号：JP2014191251A
公开(公告)日：2014-10-06
申请号：JP2013067995
申请日：2013-03-28
申请人： Fujitsu Ltd , 富士通株式会社
发明人： YAMAGAMI TAKATOYO , KUBOTA TAKASHI , KIRA HIDEHIKO
IPC分类号： G02B6/42 , B29C65/52 , G02B6/122 , H01L31/0232 , H01S5/022
CPC分类号： B32B37/12 , G02B6/4204 , G02B6/4214 , G02B6/4221 , G02B6/4239
摘要： PROBLEM TO BE SOLVED: To provide a joining device and a joining method, capable of accurately joining components with each other in a short time by using a photo-curing adhesive.SOLUTION: The joining device includes a light source 36, a stage 31, a component holding part 34 made of a light transmissive material, a control part 40, and driving parts 32 and 35 controlled by the control part 40, to drive the stage 31 and the component holding part 34. The component holding part 34 includes an incident surface on which light outputted from the light source 36 is made incident, a first reflecting surface being a surface opposite to the incident surface and reflecting the light made incident from the incident surface, a second reflecting surface reflecting the light reflected by the first reflecting surface, and an emission surface from which the light reflected by the second reflecting surface is emitted. The joining device joins a first component 17 and a second component 15 by the photo-curing adhesive, in such a state that the second component 15 is held on the emission surface side of the component holding part 34.
摘要翻译：要解决的问题：提供一种接合装置和接合方法，其能够通过使用光固化粘合剂在短时间内精确地接合部件。解决方案：接合装置包括光源36，台31，由透光材料制成的部件保持部分34，控制部分40和由控制部分40控制的驱动部分32和35，以驱动平台31和部件保持部分34.部件保持部分34包括事件从光源36输出的光入射的表面，与入射面相反的面，反射从入射面入射的光的第一反射面，反射由第一反射面反射的光的第二反射面以及发射由第二反射面反射的光的发射面。接合装置以第二部件15保持在部件保持部34的出射面侧的状态通过光固化型粘合剂与第一部件17和第二部件15接合。

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