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1. 发明专利

JP2004249452A Base board holding mechanism, base board polishing device and base board polishing method 有权
公开(公告)号：JP2004249452A
公开(公告)日：2004-09-09
申请号：JP2003188775
申请日：2003-06-30
申请人： Ebara Corp , Toshiba Corp , 株式会社東芝 , 株式会社荏原製作所
发明人： TOGAWA TETSUJI , WATANABE TOSHIO , YANO HIROYUKI , TOYODA GEN , IWADE KENJI , TATEYAMA YOSHIKUNI
IPC分类号： B24B37/04 , B24B37/30 , B24B37/32 , B24B41/06 , B24B49/14 , B24B55/02 , H01L21/304
CPC分类号： B24B37/015 , B24B41/061 , B24B55/02
摘要： PROBLEM TO BE SOLVED: To provide a base board holding mechanism, a base board polishing device, and a base board polishing method having the function for reducing a heating quantity when polishing a polishing object base board, effectively cooling a base board holding part of the base board holding mechanism, and effectively preventing a polishing liquid and polishing chips from sticking to and drying in an outer peripheral part. SOLUTION: This base board holding mechanism (a top ring 1) has an installing flange 2, a support member 6, and a retainer ring 3, and presses the polishing object base board W to a polishing surface by holding the polishing object base board W on an under surface of the support member 6 surrounded by the retainer ring 3, and is characterized by cooling the installing flange 2, the support member 6 and the retainer ring 3 by making temperature-controlled gas flow to a passage 26 by arranging the passage 26 for contacting with at least the retainer ring 3 in the installing flange 2, and is characterized in that the retainer ring 3 is provided with a plurality of through-holes 3a communicating with the passage 26, and jetting the gas flowing to the passage 26 on the polishing surface of a polishing table. COPYRIGHT: (C)2004,JPO&NCIPI

2. 发明专利

JP2001345298A APPARATUS AND METHOD FOR POLISHING 失效
公开(公告)号：JP2001345298A
公开(公告)日：2001-12-14
申请号：JP2000163082
申请日：2000-05-31
申请人： EBARA CORP , TOSHIBA CORP
发明人： KIMURA NORIO , ISHII YU , SHIRAKASHI MICHIHIKO , KUNISAWA JUNJI , YANO HIROYUKI , OKUMURA KATSUYA
IPC分类号： B24B37/04 , B24B37/30 , B24B37/32 , H01L21/304
摘要： PROBLEM TO BE SOLVED: To provide a polishing apparatus in which polishing work at the outer circumferential part of an object to be polished, e.g. a substrate on which a film is formed, is carried out through a series of operations associated with the essential polishing work and the outer circumferential part can be polished efficiently. SOLUTION: The polishing apparatus comprises a turntable 26 having a polishing face, and a top ring 28 moving freely up and down and in the horizontal direction while holding an object W to be polished and pressing the plane of the object being polished toward the turntable 26 wherein a mechanism for polishing the outer circumferential part of the object is disposed on the side of the turntable 26.

3. 发明专利

JP2006066891A Substrate processing method and substrate processing apparatus 审中-公开
标题翻译：基板加工方法和基板加工装置
公开(公告)号：JP2006066891A
公开(公告)日：2006-03-09
申请号：JP2005200309
申请日：2005-07-08
申请人： Ebara Corp , Toshiba Corp , 株式会社東芝 , 株式会社荏原製作所
发明人： SHIGETA ATSUSHI , TOYODA GEN , YANO HIROYUKI , OISHI KUNIO , ITO KENYA , NAKANISHI MASAYUKI , YAMAGUCHI KENJI
IPC分类号： H01L21/304 , B24B9/00 , B24B37/013 , B24B37/04
摘要： PROBLEM TO BE SOLVED: To allow the peripheral portion of a semiconductor substrate to be polished by an appropriate amount without causing a lack of polishing or excessive polishing. SOLUTION: A substrate processing method is used to polish the peripheral portion of a semiconductor substrate 13. The substrate processing method comprises: a process of bringing the polishing surface of a polishing mechanism 20 into contact with the principal surface of the peripheral portion of the substrate 13, and pressing the polishing surface against the principal surface; a process of polishing the principal surface by rotating the substrate 13 with a motor 12, and detecting the polishing end point of the principal surface by monitoring the polished state of the principal surface; a process of stopping polishing of the principal surface when the polishing end point is detected, and determining the polishing time for a surface other than the principal surface, which is to be polished subsequently, on the basis of the polishing time for the principal surface which is determined when polishing is finished; and a process of polishing the surface for the determined polishing time. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：为了允许半导体衬底的周边部分被适当地抛光，而不会导致抛光不足或过度抛光。解决方案：使用基板处理方法来抛光半导体基板13的周边部分。基板处理方法包括：使抛光机构20的抛光表面与周边部分的主表面接触的过程并且将抛光表面压靠在主表面上; 通过用马达12旋转基板13来研磨主表面的过程，并且通过监测主表面的抛光状态来检测主表面的抛光终点; 在检测到研磨终点时停止主表面的研磨的处理，以及随后要研磨的主面以外的表面的研磨时间，基于主面的研磨时间抛光结束后确定; 以及抛光表面以确定抛光时间的过程。版权所有（C）2006，JPO＆NCIPI

4. 发明专利

JPH1086057A POLISHING DEVICE AND ITS CONDITIONER 失效
公开(公告)号：JPH1086057A
公开(公告)日：1998-04-07
申请号：JP14190497
申请日：1997-05-30
申请人： TOSHIBA CORP , EBARA CORP
发明人： YANO HIROYUKI , OKUMURA KATSUYA , KIMURA NORIO , SHIMIZU NOBU
IPC分类号： B24B53/007 , B24B53/017 , B24B53/12 , H01L21/304 , B24B37/00
摘要： PROBLEM TO BE SOLVED: To prevent dents from being formed in a polishing pad by arranging an elastic member between a conditioning member attached to a support body and the support body. SOLUTION: A pad conditioner 102 incorporates respective conditioning members 24, the bottom face 20 of a conditioning member support body 16, and elastic members 60 sandwiched between them, respectively. The respective conditioning members 24 and the elastic members 60 are arranged, for example, along the circumference of the bottom face 20 of the conditioning member support, body 16. The respective elastic members 60 minimizes unstable movement of the pad conditioner device and minimizes dents produced on the polishing pad. Especially, the elastic members 60 function as a damper to stabilize the movement of the pad conditioner and consequently wafers can be polished uniformly.

5. 发明专利

JPH071328A POLISHING DEVICE AND METHOD 失效
公开(公告)号：JPH071328A
公开(公告)日：1995-01-06
申请号：JP32126093
申请日：1993-11-26
申请人： TOSHIBA CORP , EBARA CORP
发明人： OKUMURA KATSUYA , WATANABE TORU , AOKI RIICHIRO , YANO HIROYUKI , KODERA MASAKO , SHIGETA ATSUSHI , ISHII YU , KIMURA NORIO , HIROSE MASAYOSHI , IKEDA YUKIO
IPC分类号： B24B37/04 , B24B37/07 , B24B37/10 , B24B37/30 , H01L21/304
摘要： PURPOSE:To accurately flatten the surface of a workpiece to be polished without producing unusual points in the polished workpiece without severe cleaning of the lower surface of a top ring and without intervening a soft member such as mat between the lower surface of the top ring and the workpiece to be polished. CONSTITUTION:A polishing device is provided with a turn table driving device to rotate a turn table 20, a top ring driving device to rotate a top ring 3, and a lock ring 5 to lock the workpiece to be polished, which is arranged in the lower face of the top ring 3. The top ring's lower face being in contact with the workpiece is formed smooth, and the bore of the lock ring 5 is formed larger than the outer diameter of the workpiece to be polished so that the outer peripheral surface of the workpiece comes in contact with the inner peripheral surface of the lock ring 5 due to the rotation of the turn table 20, and the lock ring 5 gives torque to the workpiece due to the rotation of the top ring 3, resulting in the sun-and-planet motion of the workpiece.

6. 发明专利

JPH09267257A WAFER GRINDING DEVICE 失效
公开(公告)号：JPH09267257A
公开(公告)日：1997-10-14
申请号：JP142997
申请日：1997-01-08
申请人： TOSHIBA CORP , EBARA CORP
发明人： YANO HIROYUKI , OKUMURA KATSUYA , KIMURA NORIO , YAHIRO TOMOYUKI , YASUDA HOZUMI
IPC分类号： B24B37/30 , B24B37/04
摘要： PROBLEM TO BE SOLVED: To make the whole surface of a wafer so as to be uniformly grindable. SOLUTION: In this wafer grinding device, a guide ring 30 is connected to the lower peripheral part of a wafer supporter 20 and, in turn, a ringlike plate 45 is set up in an inner part of this guide ring 30. In addition, a wafer 10 is held in an inner part of this ringlike plate 45 which expands a substantial diameter of this wafer 10, concentrating any weighting from an abrasive pad to a peripheral edge of this ringlike plate 45, and thereby any possible concentration of this weighting to a grinding surface of the wafer 10 is eliminated in this way.

7. 发明专利

JP2002083787A METHOD AND APPARATUS FOR POLISHING WAFER 审中-公开
公开(公告)号：JP2002083787A
公开(公告)日：2002-03-22
申请号：JP2001204658
申请日：2001-07-05
申请人： EBARA CORP , TOSHIBA CORP
发明人： KIMURA NORIO , ISHII YU , HIYAMA HIROKUNI , OKUMURA KATSUYA , YANO HIROYUKI
IPC分类号： B24B49/10 , B24B37/005 , B24B37/013 , B24B37/10 , B24B49/12 , H01L21/304 , B24B37/00 , B24B37/04
摘要： PROBLEM TO BE SOLVED: To provide a method and an apparatus for polishing wafer, with which plural steps of polishing are executed using one polish table, when polishing plural kinds of films of a semiconductor wafer, the apparatus can be configured compact, further, the thickness of the film can be measured easily during polishing, and improvement in the throughput of wafer polishing can be expected. SOLUTION: This apparatus is provided with a polish table 10-1, having a polishing plane 10-1a and a top ring 10-2 for holding the wafer and in the wafer-polishing method for pressing the wafer to be polished (semiconductor wafer W), held by the top ring on the polishing plane 10-1a of the polish table 10-1 and polishing the wafer to be polished by relatively moving the wafer to be polished and the polishing plane, the wafer to be polished held by the top ring 10-2 is polished, while being overhung from the polishing plane of the polish table 10-1 for a prescribe quantity.

8. 发明专利

JP2001225261A POLISHING DEVICE 失效
公开(公告)号：JP2001225261A
公开(公告)日：2001-08-21
申请号：JP2000038739
申请日：2000-02-16
申请人： EBARA CORP , TOSHIBA CORP
发明人： KIMURA NORIO , OKUMURA KATSUYA , YANO HIROYUKI
IPC分类号： B24B37/013 , B24B37/10 , B24B49/04 , B24B49/12 , H01L21/304 , B24B37/04
摘要： PROBLEM TO BE SOLVED: To provide a polishing device capable of detecting the film thickness of an insulating film and a metal film, during polishing, formed on the polished surface of a semiconductor substrate, as real-time continuous measured values without excessively projecting the surface of the semiconductor substrate from a turntable. SOLUTION: This polishing device is provided with a top ring 3 for holding the substrate, and the turntable 1 having a polishing surface, and polishes the surface formed with a semiconductor device on the substrate, in sliding contact with the polishing surface. An optical measuring apparatus 10 for measuring the thickness of the film formed on the polished surface of the substrate is provided close below the outer peripheral part of the turntable 1, and the outer peripheral part of the turntable 1 is provided with at least one cutout part 1a. With the rotation of the turntable 1, light projected from the measuring apparatus 10 passes through the cutout 1a to enter the polished surface of the substrate, and reflected light from the polished surface passes through the cutout 1a to enter the measuring apparatus 10.

9. 发明专利

JPH06155286A SLIP-OFF PREVENTING RING FOR POLISHING DEVICE 失效
公开(公告)号：JPH06155286A
公开(公告)日：1994-06-03
申请号：JP34116192
申请日：1992-11-27
申请人： TOSHIBA CORP , EBARA CORP
发明人： OKUMURA KATSUYA , WATANABE TORU , AOKI RIICHIRO , YANO HIROYUKI , KODERA MASAKO , SHIGETA ATSUSHI , ISHII YU , KIMURA NORIO , HIROSE MASAYOSHI , TSUJIMURA MANABU
IPC分类号： B24B37/04 , B24B37/30 , B24B37/32 , H01L21/304
摘要： PURPOSE:To provide the slip-off preventing ring of a polishing device having the large edge dangling preventing effect when a polishing objective article is polished. CONSTITUTION:A slip-off preventing ring for a polishing device is equipped with a turntable 20 for the revolution with each independent number of revolution and a top body 3, and is equipped with a means for applying a certain pressure to the turntable 20 through the sliding movement of the top ring body 3, and allows a polishing objective article to be interposed between the turntable 20 and the top ring body 3, and polishes and flattens the surface of the polishing objective article, and forms the surface to a mirror surface. The slip-off preventing ring for a polishing device is installed on the outer periphery at the lower edge of the top ring body 3 of the polishing device and prevents the slip-off of the polishing objective article 6 from the lower edge surface of the top ring, and a slip-off preventing ring 5 is formed to a taper having the thin upper part and the thick lower part of the sectional surface.

10. 发明专利

JP2009123782A Method for manufacturing semiconductor device 审中-公开
标题翻译：制造半导体器件的方法
公开(公告)号：JP2009123782A
公开(公告)日：2009-06-04
申请号：JP2007293581
申请日：2007-11-12
申请人： Toshiba Corp , 株式会社東芝
发明人： MATSUI YUKITERU , KINOSHITA MASAKO , MITSUYOSHI YASURO , TATEYAMA YOSHIKUNI , NISHIOKA TAKESHI , YANO HIROYUKI
IPC分类号： H01L21/3205 , H01L21/304
CPC分类号： H01L21/76808 , C09G1/02 , H01L21/31058 , H01L21/31144 , H01L21/312 , H01L21/76811 , H01L21/76835
摘要： PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor device capable of forming a dual damascene at a high production yield by decreasing a defect and flatening an organic film.
SOLUTION: The method for manufacturing the semiconductor device includes the steps of: forming a film on an insulating film provided on a semiconductor substrate and having a concave part by applying a solution including a solvent and an organic component; obtaining an organic film precursor by baking the film at a first temperature without organic component bridging; leaving the organic film precursor in the concave part by polishing with the use of a slurry including a resin particle; obtaining a first organic film 19 burried in the concave part by removing the solvent by baking the organic film precursor at a second temperature higher than the first temperature after polishing; obtaining a lower layer film by forming a second organic film 20 on the insulating film with the first organic film burried by the applying method; sequentially forming an intermediate layer 22 and a resist film 23 on the lower layer film; and pattern-exposing the resist film.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：解决的问题：提供一种通过减少缺陷和使有机膜平坦化来制造能够以高生产率形成双镶嵌的半导体器件的方法。解决方案：制造半导体器件的方法包括以下步骤：通过施加包括溶剂和有机组分的溶液，在设置在半导体衬底上并具有凹部的绝缘膜上形成膜; 通过在没有有机组分桥接的第一温度下烘烤所述膜来获得有机膜前体; 通过使用包含树脂颗粒的浆料进行抛光，将有机膜前体留在凹部中; 通过在高于抛光后的第一温度的第二温度下烘烤有机膜前体来除去溶剂，从而获得在凹部中嵌入的第一有机膜19; 通过在绝缘膜上形成第二有机膜20，通过涂布方法固化第一有机膜来获得下层膜; 在下层膜上依次形成中间层22和抗蚀剂膜23; 并且对抗蚀剂膜进行图案曝光。版权所有（C）2009，JPO＆INPIT

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