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1. 发明专利

JP2005264339A Electrolytic treatment method and apparatus therefor 审中-公开
标题翻译：电解处理方法及其设备
公开(公告)号：JP2005264339A
公开(公告)日：2005-09-29
申请号：JP2005161668
申请日：2005-06-01
申请人： Ebara Corp , Toshiba Corp , 株式会社東芝 , 株式会社荏原製作所
发明人： MATSUDA TETSURO , KANEKO HISAFUMI , MISHIMA KOJI , MAKINO NATSUKI , KUNISAWA JUNJI , INOUE HIROAKI , KIMURA NORIO , ODAGAKI MITSUKO , TSUJIMURA MANABU
IPC分类号： C25D7/12 , C25D17/00 , C25D17/10 , C25D17/12 , C25F7/00
摘要： PROBLEM TO BE SOLVED: To uniformly electrolyze over a substrate without varying thickness or materials of a conductive layer or an electrolytic solution such as a plating liquid.
SOLUTION: The apparatus is equipped with: a substrate mount 30 where a substrate W to be treated is horizontally mounted with the top surface facing upward; a lip seal 34 to be in contact with the surface peripheral edge of the objective substrate W mounted on the substrate mount 30 and to seal the peripheral edge; a contact point 36 disposed outside the lip seal 34 and in contact with the peripheral edge of the objective substrate W mounted on the substrate mount 30 so as to introduce the potential of either a cathode or an anode into the substrate W; the other electrode 38 disposed above the objective substrate W mounted on the substrate mount 30; and a high resistance structure 40 disposed between the objective substrate W mounted on the substrate mount 30 and the other electrode 38. Electrolytic treatment is carried out by filling the space between the objective substrate W mounted on the substrate mount 30 and the other electrode 38 with an electrolytic solution 10.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：在不改变导电层或诸如电镀液的电解液的厚度或材料的基板上均匀地电解。解决方案：该装置配备有：基板安装件30，其中要处理的基板W水平安装，顶表面面向上; 唇形密封件34，其与安装在基板安装件30上的物镜基板W的表面周缘接触并密封周边边缘; 接触点36，其设置在唇形密封件34的外侧并与安装在基板安装件30上的物镜基板W的周缘接触，以将阴极或阳极的电位引入基板W; 设置在安装在基板安装件30上的物镜基板W上方的另一电极38; 以及设置在安装在基板安装件30上的目标基板W与另一个电极38之间的高电阻结构40.电解处理通过将安装在基板安装件30上的目标基板W与另一个电极38之间的空间填充，电解液10.版权所有（C）2005，JPO＆NCIPI

2. 发明专利

JP2003220556A POLISHING APPARATUS AND METHOD 审中-公开
公开(公告)号：JP2003220556A
公开(公告)日：2003-08-05
申请号：JP2003016795
申请日：2003-01-24
申请人： TOSHIBA CORP , EBARA CORP
发明人： OKUMURA KATSUYA , AOKI RIICHIRO , YAJIMA HIROMI , KODERA MASAKO , MISHIMA SHIRO , SHIGETA ATSUSHI , HIROSE MASAYOSHI , KIMURA NORIO , ISHIKAWA SEIJI
IPC分类号： B24B37/04 , B65G49/07 , H01L21/304 , H01L21/677 , H01L21/68
摘要： PROBLEM TO BE SOLVED: To provide a polishing apparatus, which polishes an object to be polished, and cleans and drys it, then transfers out the object that is clean and dry. SOLUTION: The polishing apparatus comprises a robot 10 for transferring the object S in the apparatus; a loading section 11, in which the object S to be polished is placed and which is arranged within reach of the gripping arm of the robot 10; a polishing section 13 in which the object S transferred thereto from the load section 11 is polished; a cleaning section 15 in which the polished object S is cleaned and dried; and an unloading section 12 in which the object S, clean and dry after having been polished, is placed and which is arranged within reach of the gripping arm of the robot 10. The robot 10 can pick the object S to be polished out of the loading section 11 and transfer the object S, which is polished, cleaned, and dried, to the unloading section 12. COPYRIGHT: (C)2003,JPO

3. 发明专利

JPH1086057A POLISHING DEVICE AND ITS CONDITIONER 失效
公开(公告)号：JPH1086057A
公开(公告)日：1998-04-07
申请号：JP14190497
申请日：1997-05-30
申请人： TOSHIBA CORP , EBARA CORP
发明人： YANO HIROYUKI , OKUMURA KATSUYA , KIMURA NORIO , SHIMIZU NOBU
IPC分类号： B24B53/007 , B24B53/017 , B24B53/12 , H01L21/304 , B24B37/00
摘要： PROBLEM TO BE SOLVED: To prevent dents from being formed in a polishing pad by arranging an elastic member between a conditioning member attached to a support body and the support body. SOLUTION: A pad conditioner 102 incorporates respective conditioning members 24, the bottom face 20 of a conditioning member support body 16, and elastic members 60 sandwiched between them, respectively. The respective conditioning members 24 and the elastic members 60 are arranged, for example, along the circumference of the bottom face 20 of the conditioning member support, body 16. The respective elastic members 60 minimizes unstable movement of the pad conditioner device and minimizes dents produced on the polishing pad. Especially, the elastic members 60 function as a damper to stabilize the movement of the pad conditioner and consequently wafers can be polished uniformly.

4. 发明专利

JPH071328A POLISHING DEVICE AND METHOD 失效
公开(公告)号：JPH071328A
公开(公告)日：1995-01-06
申请号：JP32126093
申请日：1993-11-26
申请人： TOSHIBA CORP , EBARA CORP
发明人： OKUMURA KATSUYA , WATANABE TORU , AOKI RIICHIRO , YANO HIROYUKI , KODERA MASAKO , SHIGETA ATSUSHI , ISHII YU , KIMURA NORIO , HIROSE MASAYOSHI , IKEDA YUKIO
IPC分类号： B24B37/04 , B24B37/07 , B24B37/10 , B24B37/30 , H01L21/304
摘要： PURPOSE:To accurately flatten the surface of a workpiece to be polished without producing unusual points in the polished workpiece without severe cleaning of the lower surface of a top ring and without intervening a soft member such as mat between the lower surface of the top ring and the workpiece to be polished. CONSTITUTION:A polishing device is provided with a turn table driving device to rotate a turn table 20, a top ring driving device to rotate a top ring 3, and a lock ring 5 to lock the workpiece to be polished, which is arranged in the lower face of the top ring 3. The top ring's lower face being in contact with the workpiece is formed smooth, and the bore of the lock ring 5 is formed larger than the outer diameter of the workpiece to be polished so that the outer peripheral surface of the workpiece comes in contact with the inner peripheral surface of the lock ring 5 due to the rotation of the turn table 20, and the lock ring 5 gives torque to the workpiece due to the rotation of the top ring 3, resulting in the sun-and-planet motion of the workpiece.

5. 发明专利

JP2001287142A SUBSTRATE EDGE POLISHING DEVICE 失效
公开(公告)号：JP2001287142A
公开(公告)日：2001-10-16
申请号：JP2000102669
申请日：2000-04-04
申请人： EBARA CORP , TOSHIBA CORP
发明人： KIMURA NORIO , SHIRAKASHI MICHIHIKO , OKUMURA KATSUYA
IPC分类号： B24B57/02 , B24B9/00 , H01L21/304
摘要： PROBLEM TO BE SOLVED: To provide a substrate edge polishing device capable of efficiently polishing the edge of a substrate and allowing compactification of the device. SOLUTION: This substrate edge polishing device comprises a vertically movable substrate holding part 14 for holding the substrate W with the edge of the substrate W exposed, and a rotatable polishing part 16 having a ring-like polishing surface 20 at a position facing to the edge of the substrate W held by the substrate holding part 14.

6. 发明专利

JP2000317824A POLISHING DEVICE EQUIPPED WITH ATTITUDE CONTROL DEVICE FOR TURNTABLE SYSTEM 失效
公开(公告)号：JP2000317824A
公开(公告)日：2000-11-21
申请号：JP2000066070
申请日：2000-03-10
申请人： EBARA CORP , TOSHIBA CORP
发明人： SATO KAZUKI , KIMURA NORIO , OKUMURA KATSUYA
IPC分类号： B24B37/005 , B24B37/04 , B24B37/10 , B24B37/12 , B24B37/30 , H01L21/304 , B24B37/00
摘要： PROBLEM TO BE SOLVED: To equalize the contact (polishing) pressure to be given from the polishing surface over the whole area of the substrate which is held by a top ring and is pressed down on the polishing surface of a turntable for polishing. SOLUTION: A support unit 43 for supporting a turntable 1 possible to move in a tilted position and a posture control means 45 to control the posture of the turntable 1 are provided. The posture control means 45 can control the tilt angle of the turntable 1 by electromagnetic force. The posture control device by electromagnetic force is provided with an electromagnetic device 45 fixed on the stationary frame of a polishing device and an armature 14 fixed on the turntable 1 and moved by the magnetic force of an electromagnetic device.

7. 发明专利

JP2010038853A Method and device for inspecting substrate surface 有权
标题翻译：用于检查基板表面的方法和装置
公开(公告)号：JP2010038853A
公开(公告)日：2010-02-18
申请号：JP2008205097
申请日：2008-08-08
申请人： Ebara Corp , Toshiba Corp , 株式会社東芝 , 株式会社荏原製作所
发明人： NAITO YOSHIHIKO , KIMURA NORIO , TERAO KENJI , HATAKEYAMA MASAKI , ITO MASAMITSU
IPC分类号： G01N23/225 , G03F1/84 , G03F1/86
CPC分类号： G01N23/203 , G01N2223/652
摘要： PROBLEM TO BE SOLVED: To provide a method and device for inspecting a substrate surface for easily and accurately detecting a defect existing on the substrate surface using cell inspection. SOLUTION: This method for inspecting the substrate surface for detecting the defect 32 on the substrate 10 containing a plurality of materials on the surface includes an electron beam irradiating process of irradiating the surface of the substrate with the electron beam to which a landing energy is set so that the contrast of at least two kinds of materials of the plurality of materials is within a predetermined range, a process of detecting an electron generated from the substrate and acquiring a surface image of the substrate while a pattern made of the two kinds of materials is eliminated or thinned, and a process of detecting, as the defect 32, an image of a target having a contrast distinguishable from the background image in the obtained surface image. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种用于检查基板表面的方法和装置，以便容易且准确地检测使用电池检查存在于基板表面上的缺陷。解决方案：用于检测在表面上含有多种材料的基板10上的缺陷32的检测用基板表面的方法包括电子束照射工序，用电子束照射基板的表面，能量被设定为使得多种材料中的至少两种材料的对比度在预定范围内，检测从衬底产生的电子并获取衬底的表面图像的过程，同时由两个材料形成的图案将各种材料消除或变薄，以及作为缺陷32检测在所获得的表面图像中具有与背景图像可辨别的对比度的对象的图像的处理。版权所有（C）2010，JPO＆INPIT

8. 发明专利

JP2007308807A Electrolytic treating device and electric field state control method 审中-公开
标题翻译：电解处理装置和电场状态控制方法
公开(公告)号：JP2007308807A
公开(公告)日：2007-11-29
申请号：JP2007213896
申请日：2007-08-20
申请人： Ebara Corp , Toshiba Corp , 株式会社東芝 , 株式会社荏原製作所
发明人： MAKINO NATSUKI , MISHIMA KOJI , KUNISAWA JUNJI , INOUE HIROAKI , KIMURA NORIO , ODAGAKI MITSUKO , TSUJIMURA MANABU , MATSUDA TETSURO , KANEKO HISAFUMI , MORITA TOSHIYUKI , OKUMURA KATSUYA
IPC分类号： C25D17/10 , C25D7/12 , H01L21/288
摘要： PROBLEM TO BE SOLVED: To provide an electrolytic treating device which makes it possible to obtain the in-plane distribution of a desired plating film thickness by positively controlling the electric field state of the surface of a substrate to be treated and an electric field state control method for the same.
SOLUTION: A plating liquid 10 is filled between an anode 38 and the substrate W to be treated and a high-resistance structure 4 having the electrical conductivity lower than the electrical conductivity of the plating liquid 10 is installed between the anode 38 and the substrate W. The electric field on the surface of the substrate W is controlled by adjusting the thickness of the high resistant structure 4 or the shape of the high resistant structure 4 on a plane surface.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：解决的问题：提供一种电解处理装置，其可以通过积极地控制待处理的基板的表面的电场状态和电流来获得期望的镀膜厚度的面内分布场状态控制方法相同。解决方案：在阳极38和待处理的基板W之间填充电镀液10，将具有比电镀液10的导电性低的导电率的高电阻结构4安装在阳极38和通过在平面上调整高阻结构体4的厚度或耐高压结构体4的形状来控制基板W的表面上的电场。版权所有（C）2008，JPO＆INPIT

9. 发明专利

JP2006339665A Apparatus for manufacturing semiconductor substrate 审中-公开
标题翻译：制造半导体基板的装置
公开(公告)号：JP2006339665A
公开(公告)日：2006-12-14
申请号：JP2006169432
申请日：2006-06-19
申请人： Ebara Corp , Toshiba Corp , 株式会社東芝 , 株式会社荏原製作所
发明人： KIMURA NORIO , MISHIMA KOJI , KUNISAWA JUNJI , MAKINO NATSUKI , TSUJIMURA MANABU , MATSUDA TETSURO , KANEKO HISAFUMI , OKUMURA KATSUYA
IPC分类号： H01L21/288 , C25D7/12 , C25D19/00 , H01L21/304 , H01L21/677
摘要： PROBLEM TO BE SOLVED: To provide an apparatus for manufacturing a semiconductor substrate suitable for a small-scaled manufacturing line, which can produce various products in small amounts, cope with a large change of the number of products, produce products having a short product life, and is capable of changing the function flexibly or updating the apparatus. SOLUTION: The apparatus for manufacturing the semiconductor substrate is equipped with a loader/unloader 120, a plurality of treatment units such as a plating film-forming film unit 113, and a transfer mechanism (robots 131-134) which transfers the semiconductor substrate between the units. The mounting portion of each unit has a guide. Each unit can be loaded to the apparatus for manufacturing the semiconductor substrate, or removed from the apparatus for manufacturing the semiconductor substrate, and exchanged for other units, by moving along the guide. The apparatus for manufacturing the semiconductor substrate is comprised by freely combining the units needed in the semiconductor manufacturing processes. And the units performing distinct treatments in the apparatus for manufacturing the semiconductor substrate can be exchanged each other. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：为了提供适合于能够少量生产各种产品的适合于小规模生产线的半导体基板的设备，可以应对产品数量的大量变化，生产具有产品寿命短，并且能够灵活地改变功能或更新设备。解决方案：用于制造半导体衬底的装置装备有装载器/卸载器120，多个处理单元如镀膜形成膜单元113和转移机构（机器人131-134）半导体衬底之间的单元。每个单元的安装部分都有一个导轨。每个单元可以被加载到用于制造半导体衬底的装置中，或者从用于制造半导体衬底的装置中移除，并且通过沿导向件移动而被交换到其它单元。用于制造半导体衬底的装置包括通过自由组合半导体制造工艺中所需的单元。并且在用于制造半导体衬底的装置中执行不同处理的单元可以彼此交换。版权所有（C）2007，JPO＆INPIT

10. 发明专利

JP2004312036A Device and method of polishing 有权
标题翻译：装置和抛光方法
公开(公告)号：JP2004312036A
公开(公告)日：2004-11-04
申请号：JP2004177568
申请日：2004-06-15
申请人： Ebara Corp , Toshiba Corp , 株式会社東芝 , 株式会社荏原製作所
发明人： OKUMURA KATSUYA , AOKI RIICHIRO , YAJIMA HIROMI , KODERA MASAKO , MISHIMA SHIRO , SHIGETA ATSUSHI , HIROSE MASAYOSHI , KIMURA NORIO , ISHIKAWA SEIJI
IPC分类号： B24B37/04 , H01L21/304
摘要： PROBLEM TO BE SOLVED: To provide a device and a method of polishing capable of carrying out a clean and dried object after the object for polishing is polished, cleaned and dried. SOLUTION: There are provided a polishing device which carries out the clean and dried object S for polishing, after the object S for polishing is carried in and cleaned, wherein the polishing sections 13, 14 which polish the object S, a cleaning section 15 which cleans and dries the object S for polishing after polished and a thickness gauge which measures the thickness of the object S for polishing. COPYRIGHT: (C)2005,JPO&NCIPI

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