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1. 发明专利

JP2006066891A Substrate processing method and substrate processing apparatus 审中-公开
标题翻译：基板加工方法和基板加工装置
公开(公告)号：JP2006066891A
公开(公告)日：2006-03-09
申请号：JP2005200309
申请日：2005-07-08
申请人： Ebara Corp , Toshiba Corp , 株式会社東芝 , 株式会社荏原製作所
发明人： SHIGETA ATSUSHI , TOYODA GEN , YANO HIROYUKI , OISHI KUNIO , ITO KENYA , NAKANISHI MASAYUKI , YAMAGUCHI KENJI
IPC分类号： H01L21/304 , B24B9/00 , B24B37/013 , B24B37/04
摘要： PROBLEM TO BE SOLVED: To allow the peripheral portion of a semiconductor substrate to be polished by an appropriate amount without causing a lack of polishing or excessive polishing. SOLUTION: A substrate processing method is used to polish the peripheral portion of a semiconductor substrate 13. The substrate processing method comprises: a process of bringing the polishing surface of a polishing mechanism 20 into contact with the principal surface of the peripheral portion of the substrate 13, and pressing the polishing surface against the principal surface; a process of polishing the principal surface by rotating the substrate 13 with a motor 12, and detecting the polishing end point of the principal surface by monitoring the polished state of the principal surface; a process of stopping polishing of the principal surface when the polishing end point is detected, and determining the polishing time for a surface other than the principal surface, which is to be polished subsequently, on the basis of the polishing time for the principal surface which is determined when polishing is finished; and a process of polishing the surface for the determined polishing time. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：为了允许半导体衬底的周边部分被适当地抛光，而不会导致抛光不足或过度抛光。解决方案：使用基板处理方法来抛光半导体基板13的周边部分。基板处理方法包括：使抛光机构20的抛光表面与周边部分的主表面接触的过程并且将抛光表面压靠在主表面上; 通过用马达12旋转基板13来研磨主表面的过程，并且通过监测主表面的抛光状态来检测主表面的抛光终点; 在检测到研磨终点时停止主表面的研磨的处理，以及随后要研磨的主面以外的表面的研磨时间，基于主面的研磨时间抛光结束后确定; 以及抛光表面以确定抛光时间的过程。版权所有（C）2006，JPO＆NCIPI

2. 发明专利

JP2004055927A Apparatus and method for processing substrate 有权
公开(公告)号：JP2004055927A
公开(公告)日：2004-02-19
申请号：JP2002213078
申请日：2002-07-22
申请人： Ebara Corp , 株式会社荏原製作所
发明人： SAITO TAKAYUKI , SUZUKI TSUKURU , YAMADA KAORU , ITO KENYA , KAMEZAWA MASAYUKI , YAMAGUCHI KENJI
IPC分类号： H01L21/306 , H01L21/304
摘要： PROBLEM TO BE SOLVED: To provide an apparatus and a method for processing a substrate which can supply a treating liquid to the substrate, without scattering the liquid, can thereby maintain a clean atmosphere in a chamber and can reduce the amount of the liquid used.
SOLUTION: The apparatus for processing a substrate includes a rotating holding unit 11 for making the substrate W rotate, while holding the substrate W substantially horizontally, and a treatment liquid supply unit 15 provided at a peripheral edge of the rotating substrate W for supplying the liquid to the substrate W so that the liquid stands still to the substrate W.
COPYRIGHT: (C)2004,JPO

3. 发明专利

JP2006303112A Semiconductor wafer peripheral edge polisher and method therefor 有权
标题翻译：半导体波形外围边缘抛物面及其方法
公开(公告)号：JP2006303112A
公开(公告)日：2006-11-02
申请号：JP2005121464
申请日：2005-04-19
申请人： Ebara Corp , Nihon Micro Coating Co Ltd , 日本ミクロコーティング株式会社 , 株式会社荏原製作所
发明人： TAKAHASHI YOSHIMIZU , ITO KENYA , SHIRAKASHI MICHIHIKO , INOUE KAZUYUKI , YAMAGUCHI KENJI , SEKI MASAYA , SATO SATORU , WATANABE ATSUSHI , KATO KENJI , TAMURA ATSUSHI , ASAKAWA SOICHI
IPC分类号： H01L21/304 , B24B9/00 , B24B21/00 , B24B49/12 , B24B55/08
CPC分类号： B24B9/065 , B24B21/16
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor wafer peripheral edge polisher and method therefor, which efficiently polishes the notch and the bevel of a semiconductor wafer in a single apparatus. SOLUTION: The apparatus 10 is composed of a wafer stage unit 20, having a wafer stage 23 for holding a semiconductor wafer W, stage-moving means 30, 32 for moving the wafer stage unit 20 in a direction parallel to the surface of the wafer stage 23, a notch polisher 40 for polishing the notch of the semiconductor wafer W held on the wafer stage 23, and a bevel polisher 50 for polishing the bevel of the semiconductor wafer W held on the wafer stage 23. It further has a wafer-chucking means 80 for taking up the semiconductor wafer W held on the wafer stage 23, from the wafer stage 23, after mounting the semiconductor wafer W that has been carried in the inside of a housing 11 on the wafer stage 23. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种半导体晶片周边抛光机及其方法，其在单个设备中有效地抛光半导体晶片的凹口和斜面。解决方案：设备10由具有用于保持半导体晶片W的晶片台23的晶片台单元20组成，用于在平行于表面的方向上移动晶片台单元20的平台移动装置30,32 晶片载物台23上的凹槽抛光机40，用于抛光保持在晶片台23上的半导体晶片W的凹口的凹口抛光机40以及用于抛光保持在晶片台23上的半导体晶片W的斜面的斜面抛光机50。在将载置在壳体11的内部的半导体晶片W安装在晶片台23上之后，从晶片台23取出保持在晶片台23上的半导体晶片W的晶片夹紧装置80。 P>版权所有（C）2007，JPO＆INPIT

4. 发明专利

JP2004055839A Apparatus and method for processing substrate 有权
公开(公告)号：JP2004055839A
公开(公告)日：2004-02-19
申请号：JP2002211524
申请日：2002-07-19
申请人： Ebara Corp , 株式会社荏原製作所
发明人： SAITO TAKAYUKI , SUZUKI TSUKURU , YAMADA KAORU , ITO KENYA , KAMEZAWA MASAYUKI , YAMAGUCHI KENJI
IPC分类号： H01L21/306 , H01L21/304
摘要： PROBLEM TO BE SOLVED: To provide an apparatus and a method for processing a substrate which can supply a cleaning liquid only to a required region of the substrate, without scattering the liquid, can thereby maintain clean atmosphere in a chamber and can reduce the amount of the cleaning liquid used.
SOLUTION: The apparatus for processing the substrate includes rotation holding mechanisms 21a, 21b, 21c and 21d, each for substantially horizontally holding and rotating the substrate; and a cleaning liquid supply mechanism 23 for supplying the cleaning liquid L toward a region B to be cleaned of the substrate at a flow rate of at least 0.1 m/s or higher, by opening a cleaning liquid discharge port directed toward the radiating direction directed from an inside of the substrate toward the peripheral edge at an elevation angle of 45° or smaller, from the surface of the substrate to at least one of a front surface and a rear surface of the substrate.
COPYRIGHT: (C)2004,JPO

5. 发明专利

JP2012231191A Polishing device and polishing method 有权
标题翻译：抛光装置和抛光方法
公开(公告)号：JP2012231191A
公开(公告)日：2012-11-22
申请号：JP2012189768
申请日：2012-08-30
申请人： Ebara Corp , 株式会社荏原製作所
发明人： TAKAHASHI YOSHIMIZU , SEKI MASAYA , KUSA HIROAKI , YAMAGUCHI KENJI , NAKANISHI MASAYUKI
IPC分类号： H01L21/304 , B24B9/00 , B24B21/00 , B24B37/00 , B24B37/04
CPC分类号： B24B21/002 , B24B9/065 , B24B37/042 , B24B37/30
摘要： PROBLEM TO BE SOLVED: To provide a polishing device capable of reducing an entire polishing time, and easily exchanging a polishing tape.SOLUTION: This polishing device for polishing a notch part of a substrate W comprises: a rotation holding mechanism 3 for holding the substrate W parallel and rotating it; plural polishing head modules 70A, 70B, 70C, 70D polishing the substrate W using the polishing tape; and a movement mechanism for moving the plural polishing head modules independently. Each of the plural polishing head modules has a polishing head 30 for sliding the polishing tape in contact with the notch part of the substrate W, and tape supply and recovery mechanisms 2A, 2B, 2C, 2D for supplying the polishing tape to the polishing head and recovering it.
摘要翻译：要解决的问题：提供能够减少整个抛光时间并且容易更换研磨带的抛光装置。解决方案：用于抛光基板W的切口部分的抛光装置包括：用于平行地保持基板W并使其旋转的旋转保持机构3; 多个研磨头模块70A，70B，70C，70D使用研磨带对基板W进行研磨; 以及用于独立地移动多个抛光头模块的移动机构。多个研磨头模块中的每一个具有用于使研磨带与基板W的切口部分接触的研磨头30，以及用于将抛光带供给到抛光头的胶带供给和回收机构2A，2B，2C，2D 并恢复它。版权所有（C）2013，JPO＆INPIT

6. 发明专利

JP2009154285A Polishing device and method 有权
标题翻译：抛光装置和方法
公开(公告)号：JP2009154285A
公开(公告)日：2009-07-16
申请号：JP2008292193
申请日：2008-11-14
申请人： Ebara Corp , 株式会社荏原製作所
发明人： TAKAHASHI YOSHIMIZU , SEKI MASAYA , KUSA HIROAKI , YAMAGUCHI KENJI , NAKANISHI MASAYUKI
IPC分类号： B24B9/00 , B24B21/00 , B24B37/00 , B24B37/04 , H01L21/304
CPC分类号： B24B21/002 , B24B9/065 , B24B21/004 , B24B21/008 , B24B21/20 , B24B27/0076 , B24B37/042 , B24B37/30 , B24B41/068 , B24B49/00 , Y10T428/24777
摘要： PROBLEM TO BE SOLVED: To provide a polishing device allowing shortening of the whole polishing time and easy replacement of a polishing tape. SOLUTION: This polishing device includes a rotary holding mechanism 3 for horizontally holding a substrate W and rotating the substrate W, a plurality of polishing head assemblies 1A, 1B, 1C and 1D, a plurality of tape supplying and recovering mechanisms 2A, 2B, 2C and 2D, and a plurality of moving mechanisms for moving the plurality of polishing head assemblies 1A, 1B, 1C and 1D in radial directions of the substrate W. Each of the polishing head assemblies 1A, 1B, 1C and 1D has a polishing head 30 for making a polishing tape abut on a peripheral edge part of the substrate W and a tilt mechanism for rotating a polishing head with a shaft parallel to a tangential line of the substrate W as a center. The polishing head has a tape feed mechanism for holding the polishing tape and delivering the polishing tape at prescribed speed. The tape supplying and recovering mechanisms 2A, 2B, 2C and 2D are arranged outwardly of the plurality of polishing head assemblies 1A, 1B, 1C and 1D in the radial directions of the substrate, and the positions are fixed. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供能够缩短整个抛光时间并且容易更换抛光带的抛光装置。解决方案：该抛光装置包括用于水平地保持基板W并旋转基板W的旋转保持机构3，多个抛光头组件1A，1B，1C和1D，多个胶带供应和恢复机构2A， 2B，2C和2D以及用于在基板W的径向方向上移动多个抛光头组件1A，1B，1C和1D的多个移动机构。每个抛光头组件1A，1B，1C和1D具有用于制造抛光带的抛光头30与基板W的周缘部分邻接;以及倾斜机构，用于以平行于基板W的切线为中心的轴旋转抛光头。抛光头具有用于保持研磨带并以规定速度输送研磨带的带进给机构。磁带供给和恢复机构2A，2B，2C和2D沿着基板的径向布置在多个抛光头组件1A，1B，1C和1D的外侧，并且位置是固定的。版权所有（C）2009，JPO＆INPIT

7. 发明专利

JP2008082967A Vibration diagnostic system for rotary machine 有权
标题翻译：旋转机振动诊断系统
公开(公告)号：JP2008082967A
公开(公告)日：2008-04-10
申请号：JP2006265560
申请日：2006-09-28
申请人： Toshiba Corp , 株式会社東芝
发明人： YAMAGUCHI KENJI , KOSAKA HIDENORI
IPC分类号： G01M99/00 , G01H17/00
摘要： PROBLEM TO BE SOLVED: To provide a vibration diagnostic system for a rotary machine capable of supplying automatically a signal alternative for a one-rotation reference signal of the rotary machine, even when the one-rotation reference signal of the rotary machine is lacked. SOLUTION: This vibration diagnostic system is provided with a vibration detector 3 for detecting vibration accompanying an operation of the rotary machine such as a turbine power generator 1 to transmit a vibration signal expressing it, a phase angle reference signal generator 4 for detecting one rotation of the rotary machine to generate the one-rotation reference signal expressing it, a waveform shaping circuit 5 for waveform-shaping the vibration signal from the vibration detector 3 into a prescribed signal to form the one-rotation signal, a rotation reference signal selection circuit 6 for conducting switching to the one-rotation signal transmitted from the waveform shaping circuit 5 when the one-rotation reference signal disappears, and a vibration monitoring/diagnostic device 7 for monitoring and diagnosing the abnormality of vibration of the rotary machine, based on an output from the vibration detector 3 and the one-rotation reference signal or the one-rotation signal selected by the rotation reference signal selection circuit 6. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：为了提供一种能够自动提供旋转机器的一转参考信号的替代信号的旋转机械的振动诊断系统，即使旋转机器的单次旋转参考信号是缺乏。解决方案：该振动诊断系统设置有用于检测伴随着诸如涡轮发电机1的旋转机器的操作的振动的振动检测器3，以传送表示它的振动信号，用于检测的相位角参考信号发生器4 旋转机的一圈旋转以产生表示它的单旋转参考信号，波形整形电路5，用于将来自振动检测器3的振动信号波形整形为规定信号以形成一个旋转信号;旋转参考信号选择电路6，用于在单次旋转参考信号消失时切换到从波形整形电路5发送的一个旋转信号;以及振动监视/诊断装置7，用于监视和诊断旋转机器的振动异常在振动检测器3的输出和单次旋转参考信号或单次旋转信号选择中由旋转参考信号选择电路6编辑。版权所有（C）2008，JPO＆INPIT

8. 发明专利

JP2007334464A Data generation apparatus, data storage apparatus, its program and method 审中-公开
标题翻译：数据生成装置，数据存储装置，其程序和方法
公开(公告)号：JP2007334464A
公开(公告)日：2007-12-27
申请号：JP2006163015
申请日：2006-06-13
申请人： Toshiba Corp , Toshiba Solutions Corp , 東芝ソリューション株式会社 , 株式会社東芝
发明人： TATSUMIYA SHIGEYOSHI , YAMAGUCHI KENJI , YAMAMOTO MASASHI
IPC分类号： G06F5/00
摘要： PROBLEM TO BE SOLVED: To provide technologies which can flexibly support data format changes for data that is required with an inherent data format. SOLUTION: A data generation apparatus generates data which holds a plurality of data with a specified data holding structure based on the plurality of data stored in a specified data table. The data generation apparatus has a data acquisition part for data generation 101 which acquires a plurality of data stored in the specified data table, a correlation information acquisition part 102 which acquires correlation information that specifies correlations between a data storage location in the specified data table and a data holding location in the data holding structure for each of the plurality of data acquired by the data acquisition part for data generation 101, and a data generation part 103 which sets each of the plurality of data acquired by the data acquisition part for data generation 101 at a data holding location corresponding to a data storage location that is an acquisition source of the data based on the correlation information acquired by the correlation information acquisition part 102 and generates data. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供可以灵活支持固有数据格式所需数据的数据格式更改的技术。解决方案：数据生成装置基于存储在指定数据表中的多个数据生成保存具有指定数据保持结构的多个数据的数据。数据生成装置具有用于获取存储在指定数据表中的多个数据的数据生成部101，相关信息获取部102，其获取指定指定数据表中的数据存储位置与指定数据表的相关性的相关信息，数据保存结构中的数据保持结构，用于由用于数据生成的数据获取部分101获取的多个数据中的每一个;以及数据生成部分103，其设置由数据获取部分获取的用于数据生成的多个数据 101在与基于由相关信息获取部102获取的相关信息相对应的作为数据的获取源的数据存储位置的数据保持位置处生成数据。版权所有（C）2008，JPO＆INPIT

9. 发明专利

JP2008016153A Recording/reproducing device 审中-公开
标题翻译：记录/再现设备
公开(公告)号：JP2008016153A
公开(公告)日：2008-01-24
申请号：JP2006188166
申请日：2006-07-07
申请人： Toshiba Corp , 株式会社東芝
发明人： YAMAGUCHI KENJI
IPC分类号： G11B20/10
摘要： PROBLEM TO BE SOLVED: To provide a recording/reproducing device capable of automatically overwriting into the same disk many times.
SOLUTION: This device is provided with a mode information recording means for recording mode information indicating an optical disk exclusive for information overwrite recording into a re-recordable optical disk, and a control means for performing control so as to record information up to the information recording capacity of the optical disk when mode information has been recorded in the optical disk, and to overwrite in the optical disk when more information is recorded in the optical disk.
COPYRIGHT: (C)2008,JPO&INPIT

10. 发明专利

JP2006220533A Apparatus and method for processing vibrational input of rotating machine, and vibration diagnosis device 审中-公开
标题翻译：旋转机械振动输入加工装置及振动诊断装置
公开(公告)号：JP2006220533A
公开(公告)日：2006-08-24
申请号：JP2005034063
申请日：2005-02-10
申请人： Toshiba Corp , 株式会社東芝
发明人： AIZAWA YASUSHI , KOSAKA HIDENORI , YAMAGUCHI KENJI
IPC分类号： G01H17/00 , G01M99/00
摘要： PROBLEM TO BE SOLVED: To match the level of a plurality of different detection signals detected with a detector of a diagnosis device of a rotating machine to a specific level and process it as digital data.
SOLUTION: The diagnosis device has a detection part 21 provided with a plurality of different detectors 25a and 25b detecting the vibration of the rotating machine as an analog signal, a detection processor 22 provided with a level conversion board 33a for receiving analog signals from the detectors 25a and 25b, switching the gain and converting the analog signals to each specific level, an ADC board 36a for converting the analog signals whose level is converted by the level conversion board 33a to a digital signal and a CPU board 40 for processing the digital signal, and a diagnosis part 23 provided with a host computer 41 and an display 42 for calculating the digital signal processed by the detection processor 22 and diagnosing the vibration.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：将由旋转机器的诊断装置的检测器检测到的多个不同检测信号的电平与特定电平进行匹配，并将其处理为数字数据。解决方案：诊断装置具有检测部件21，该检测部件21设置有检测作为模拟信号的旋转机器的振动的多个不同的检测器25a和25b;检测处理器22，具有用于接收模拟信号的电平转换板33a 从检测器25a和25b切换增益并将模拟信号转换为每个特定电平; ADC板36a，用于将由电平转换板33a转换的电平的模拟信号转换成数字信号;以及用于处理的CPU板40 数字信号以及设置有主计算机41的诊断部23和用于计算由检测处理器22处理的数字信号并诊断振动的显示器42。版权所有（C）2006，JPO＆NCIPI

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