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1. 发明专利

JP2002083787A METHOD AND APPARATUS FOR POLISHING WAFER 审中-公开
公开(公告)号：JP2002083787A
公开(公告)日：2002-03-22
申请号：JP2001204658
申请日：2001-07-05
申请人： EBARA CORP , TOSHIBA CORP
发明人： KIMURA NORIO , ISHII YU , HIYAMA HIROKUNI , OKUMURA KATSUYA , YANO HIROYUKI
IPC分类号： B24B49/10 , B24B37/005 , B24B37/013 , B24B37/10 , B24B49/12 , H01L21/304 , B24B37/00 , B24B37/04
摘要： PROBLEM TO BE SOLVED: To provide a method and an apparatus for polishing wafer, with which plural steps of polishing are executed using one polish table, when polishing plural kinds of films of a semiconductor wafer, the apparatus can be configured compact, further, the thickness of the film can be measured easily during polishing, and improvement in the throughput of wafer polishing can be expected. SOLUTION: This apparatus is provided with a polish table 10-1, having a polishing plane 10-1a and a top ring 10-2 for holding the wafer and in the wafer-polishing method for pressing the wafer to be polished (semiconductor wafer W), held by the top ring on the polishing plane 10-1a of the polish table 10-1 and polishing the wafer to be polished by relatively moving the wafer to be polished and the polishing plane, the wafer to be polished held by the top ring 10-2 is polished, while being overhung from the polishing plane of the polish table 10-1 for a prescribe quantity.

2. 发明专利

JP2011009600A Substrate processing method and substrate processing apparatus 审中-公开
标题翻译：基板加工方法和基板加工装置
公开(公告)号：JP2011009600A
公开(公告)日：2011-01-13
申请号：JP2009153290
申请日：2009-06-29
申请人： Ebara Corp , 株式会社荏原製作所
发明人： TAIMA YASUSHI , SUZUKI TSUKURU , O CHIKAAKI , YAMAUCHI KAZUO , KODERA AKIRA , SAITO TAKAYUKI , HIYAMA HIROKUNI
IPC分类号： H01L21/304
摘要： PROBLEM TO BE SOLVED: To suppress formation of a watermark on the surface of a substrate having been dried by reducing the used amount of isopropyl alcohol (IPA) or th like as much as possible, and minimizing production of droplets and mist.SOLUTION: A substrate processing method that dries the surface of the substrate W which is at least partially hydrophobic includes: arranging a proximate plate 16 at a position near the surface of the substrate W opposite in parallel with the surface of the substrate W; forming a continuous coating liquid film 28 which comes into contact with the surface of the substrate W and the proximate plate 16 between the surface of the substrate W and the proximate plate 16; and removing the coating liquid film 28, positioned in a region on the surface of the substrate W which is not covered with the proximate plate 16 any more, from the surface of the substrate W by changing the position of the coating liquid film 28 relative to the surface of the substrate W by relatively moving the substrate W and the proximate plate 16 in parallel and in one direction.
摘要翻译：要解决的问题：通过尽可能地减少异丙醇（IPA）或类似物的使用量来抑制已经干燥的基底的表面上的水印的形成，并且最小化液滴和雾的产生。解决方案：A 使至少部分疏水的衬底W的表面干燥的衬底处理方法包括：在邻近衬底W的表面平行于衬底W的表面附近的位置处布置邻近板16; 形成与衬底W的表面和衬底W的表面与邻近板16之间的接近板16接触的连续涂覆液膜28; 并且通过改变涂布液膜28相对于基板W的位置，从基板W的表面移除位于基板W的表面上未被邻近板16的表面的区域中的涂布液膜28 基板W的表面通过相对移动基板W和邻近板16而平行且沿一个方向。

3. 发明专利

JP2009295914A Polishing pad, electrolytic compound polishing device, and electrolytic compound polishing method 审中-公开
标题翻译：抛光垫，电解复合抛光装置和电解复合抛光方法
公开(公告)号：JP2009295914A
公开(公告)日：2009-12-17
申请号：JP2008150539
申请日：2008-06-09
申请人： Ebara Corp , 株式会社荏原製作所
发明人： FUKUDA AKIRA , O CHIKAAKI , SUZUKI TSUKURU , KODERA AKIRA , TAIMA YASUSHI , HIYAMA HIROKUNI
IPC分类号： H01L21/304 , B24B37/00 , B24B37/22 , B24B37/26
摘要： PROBLEM TO BE SOLVED: To provide a polishing pad with which variation of processing speed becomes smaller than permitted variation ratio if rotation speed of the polishing pad is set within a range of 25-150 rpm which is the normally used rotation speed, to provide an electrolytic compound polishing device, and to provide an electrolytic compound polishing method. SOLUTION: The polishing pad 101 has a through-hole to be installed on the opposite electrode of the electrolytic compound polishing device used for electrolytic compound polishing of a metal film on the substrate surface, and is characterized in that a hole diameter D of the through-hole 101a is within a range of 0.1-5 mm, a thickness h is within a range of 0.5-5 mm, and square of the hole diameter/thickness (D 2 /h) is within a range of 0.002-50 mm. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：为了提供一种抛光垫，如果研磨垫的旋转速度设定在通常使用的旋转速度的25-150rpm的范围内，则处理速度的变化变得小于允许的变化率，提供一种电解复合抛光装置，并提供一种电解化合物研磨方法。解决方案：抛光垫101具有安装在用于基板表面上的金属膜的电解复合抛光的电解化合物研磨装置的相对电极上的通孔，其特征在于，孔径D 通孔101a的厚度在0.1-5mm的范围内，厚度h在0.5-5mm的范围内，孔直径/厚度的平方（D 2 / h）在0.002-50mm的范围内。版权所有（C）2010，JPO＆INPIT

4. 发明专利

JP2007263018A Micropump and rotor 审中-公开
标题翻译：麦克风和转子
公开(公告)号：JP2007263018A
公开(公告)日：2007-10-11
申请号：JP2006090361
申请日：2006-03-29
申请人： Ebara Corp , 株式会社荏原製作所
发明人： HIRATA KAZUYA , ICHIKI KATSUNORI , MOCHIZUKI NOBUHIRO , NOMI MOTOHIKO , HIYAMA HIROKUNI
IPC分类号： F04B43/12
摘要： PROBLEM TO BE SOLVED: To provide a micropump for feeding fluid of minute flow rate continuously without pulsation, constantly and stably. SOLUTION: The micropump 1 is provided with: an elastic tube 10 in which fluid is circulated; a tube support 20 supporting the elastic tube 10; a rotor 30 having a spiral projection part 32 formed thereon; and a motor 40 rotating the rotor 30. The rotor 30 is arranged along the elastic tube 10 supported by a tube supporter 20 and presses the elastic tube 30 at a plurality of pressing points along a longitudinal direction of the elastic tube 10. A motor 40 moves the plurality of pressing points along a longitudinal direction of the elastic tube 10. Intervals of pressing points adjoining along the longitudinal direction are changed along the longitudinal direction in at least a partial section of the longitudinal direction. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种连续稳定地连续输送微量流量的微型泵，无脉动。解决方案：微型泵1设置有：流体循环的弹性管10; 支撑弹性管10的管支撑件20; 具有形成在其上的螺旋突起部32的转子30; 以及旋转转子30的电动机40.转子30沿着由支撑体20支撑的弹性管10配置，并沿着弹性管10的长度方向的多个按压点按压弹性管30.电动机40 沿着弹性管10的长度方向移动多个按压点。沿着纵向方向相邻的按压点的间隔在纵向方向的至少一部分部分沿长度方向变化。版权所有（C）2008，JPO＆INPIT

5. 发明专利

JP2007134745A Polishing device and method therefor 有权
标题翻译：抛光装置及其方法
公开(公告)号：JP2007134745A
公开(公告)日：2007-05-31
申请号：JP2007035070
申请日：2007-02-15
申请人： Ebara Corp , 株式会社荏原製作所
发明人： HIYAMA HIROKUNI , WADA TAKETAKA
IPC分类号： H01L21/304 , B24B37/013
摘要： PROBLEM TO BE SOLVED: To provide a polishing device and a method therefor capable of detecting the film thickness of a polished surface in a real time without moving the top ring outer than a turn table, while keeping a semiconductor wafer mounted on the top ring. SOLUTION: The polishing method that is provided with the table 1 that rotates and the top ring 3 that rotates, interposes the polished object between the table 1 and the ring 3, while the polished object is pressed by the ring 3 to polish the polished surface of the polished object, wherein changes over time in film thickness at measurement points of a plurality of the polished objects of different radius positions are measured to control a polished profile of the polished object during polishing by detecting the film thicknesses while a film thickness detection means provided on the table 1 is being moved on the polished surface. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：为了提供一种抛光装置及其方法，其能够实时地检测抛光表面的膜厚度而不将顶环移动到转台以外，同时保持安装在转台上的半导体晶片顶环解决方案：提供有旋转的工作台1和旋转的顶环3的抛光方法将抛光对象夹在工作台1和环3之间，同时抛光对象被环3按压以抛光抛光对象的抛光表面，其中测量在不同半径位置的多个抛光物体的测量点处的膜厚度随时间的变化，以在抛光期间通过检测膜厚度来控制抛光对象的抛光轮廓，同时膜设置在工作台1上的厚度检测装置在抛光表面上移动。版权所有（C）2007，JPO＆INPIT

6. 发明专利

JP2006272276A Pressure generation mechanism 审中-公开
标题翻译：压力发生机制
公开(公告)号：JP2006272276A
公开(公告)日：2006-10-12
申请号：JP2005099397
申请日：2005-03-30
申请人： Ebara Corp , 株式会社荏原製作所
发明人： HONGO AKIHISA , OSAWA SUSUMU , HIYAMA HIROKUNI , MOCHIZUKI NOBUHIRO , SHINODA MASAO
IPC分类号： B01J19/00
摘要： PROBLEM TO BE SOLVED: To provide a pressure generation mechanism capable of durably transporting liquid without pulsating a pressure of the liquid and, moreover, capable of applying a high pressure to the liquid.
SOLUTION: The pressure generation mechanism is provided with: a plurality of pressure vessels 8a, 8b in which the liquid is stored; a liquid introducing part 15 which introduces the liquid to the plurality of pressure vessels 8a, 8b; a compressed gas supply part 16 which successively discharges the liquid introduced to the plurality of pressure vessels 8a, 8b by supplying the compressed gas to the plurality of pressure vessels 8a, 8b; and a controller 7 which controls the timing on which the compressed gas is supplied to the plurality of pressure vessels 8a, 8b so that the pressure of the liquid discharged from the plurality of pressure vessels 8a, 8b is made to be constant at all times.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种能够在不脉动地施加液体的压力的情况下耐久地输送液体的压力产生机构，并且还能够对液体施加高压。解决方案：压力产生机构设置有：存储液体的多个压力容器8a，8b; 将液体引入多个压力容器8a，8b的液体导入部15; 压缩气体供给部16，其通过将压缩气体供给到多个压力容器8a，8b，连续排出导入到多个压力容器8a，8b的液体; 以及控制器7，其控制向多个压力容器8a，8b供应压缩气体的时刻，使得从多个压力容器8a，8b排出的液体的压力始终保持恒定。版权所有（C）2007，JPO＆INPIT

7. 发明专利

JP2004281230A Beam source and beam treatment device 审中-公开
公开(公告)号：JP2004281230A
公开(公告)日：2004-10-07
申请号：JP2003071071
申请日：2003-03-14
申请人： Ebara Corp , Univ Tohoku , 東北大学長 , 株式会社荏原製作所
发明人： FUKUDA AKIRA , SHIBATA AKIO , HIYAMA HIROKUNI , ICHIKI KATSUNORI , YAMAUCHI KAZUO , SAGAWA SEIJI
IPC分类号： H05H1/46 , H01J27/16 , H01J37/08 , H01J37/305 , H01J37/32 , H01L21/02 , H01L21/205 , H01L21/3065
CPC分类号： H01J37/321 , H01J37/32357
摘要： PROBLEM TO BE SOLVED: To provide a beam source and a beam treatment device capable of irradiating various beams like positive ion, negative ion, neutral particles or the like in a large diameter uniformly on a treated object and realizing charge-free and damage-free properties. SOLUTION: In the beam source provided with an antenna generating plasma inside a plasma generating chamber, a first electrode arranged inside the plasma chamber, a second electrode arranged in opposition to the first electrode inside the plasma generating chamber and a voltage impression part drawing out particles from the plasma generated by the antenna by impressing voltage between the first electrode and the second electrode, both the antenna and the second electrode are placed in opposition to the first electrode. COPYRIGHT: (C)2005,JPO&NCIPI

8. 发明专利

JP2002042041A DESIGN METHOD OF ADSORBENT 失效
公开(公告)号：JP2002042041A
公开(公告)日：2002-02-08
申请号：JP2000231659
申请日：2000-07-31
申请人： EBARA CORP
发明人： O CHIKAAKI , KA AKIHIRO , HIYAMA HIROKUNI , SUZUKI YOKO
IPC分类号： B01J20/20 , G06F19/00
摘要： PROBLEM TO BE SOLVED: To provide a method of designing an adsorbent having excellent adsorption performance to a specific contaminant by obtaining the adsorption characteristic of an organic molecule in a adsorbent micro pores of the adsorbent via a molecular dynamics analysis method in order to manufacture a high- performance adsorbent filter aiming at removing of a gaseous organic contaminant in a clean room or in a substrate transfer container with an environment purifying function. SOLUTION: The method of analyzing the adsorption characteristic of a specific adsorbate to an adsorbent on a molecular dynamics basis includes processes of (1) preparing an analytic model of an organic molecule of the target adsorbate, (2) a micro pore model of the adsorbent, (3) simulating the adsorption process of the organic molecule adsorbate to the adsorbent via a molecular dynamics analysis method, (4) visually expressing the behavior of the adsorbent in the adsorbent pore, and (5) obtaining the adsorption energy of the adsorption system to estimate the adsorption performance of the adsorbent to the selected specific adsorbate.

9. 发明专利

JP2001018161A POLISHING DEVICE 失效
公开(公告)号：JP2001018161A
公开(公告)日：2001-01-23
申请号：JP19329999
申请日：1999-07-07
申请人： EBARA CORP
发明人： HIYAMA HIROKUNI , WADA TAKETAKA , HIROKAWA KAZUTO , MATSUO NAONORI , TOGAWA TETSUJI
IPC分类号： B24B37/005 , B24B37/34 , B24B53/007 , B24B53/017 , B24D7/14 , B24D13/14 , H01L21/304 , B24B37/00
摘要： PROBLEM TO BE SOLVED: To attain improvement of through put per floor area, by providing a plurality of base board hold members pressing relating to a polishing table and dressing a polishing work surface by pressing its prescribed position. SOLUTION: A polishing part performs polishing action so as to generate a phase different by each about 1/3 in three top rings 16. In a polishing process, a polishing work surface 10 of a polishing table 12 is applied with dressing in a steady manner by a dresser 28. A regenerative effect of this polishing work surface 10 is completely maintained in a first polishing position P1 and reduced in a second/third polishing position P2, P3 by polishing work in the upstream thereof. Accordingly, in the case of polishing simultaneously a plurality of polishing workpieces W, by properly using the polishing position corresponding to a residual amount of a dressing effect of the polishing work surface 10 in accordance with a condition, more effective polishing can be performed.

10. 发明专利

JP2000094307A POLISHING DEVICE 失效
公开(公告)号：JP2000094307A
公开(公告)日：2000-04-04
申请号：JP26516098
申请日：1998-09-18
申请人： EBARA CORP
发明人： HIYAMA HIROKUNI , WADA TAKETAKA , HIROKAWA KAZUTO , MATSUO NAONORI , TOGAWA TETSUJI , WAKABAYASHI SATOSHI
IPC分类号： B24B37/12 , B24D7/16 , B24D9/08 , B24B37/04
摘要： PROBLEM TO BE SOLVED: To provide a method by which a grinding wheel is easily and certainly installed in and removed from a surface plate, and a polishing device on which the grinding wheel is fixed using this method. SOLUTION: In a polishing device for polishing a surface to be polished flat an glassily by slidably pressing the surface to be polished of an object 4 of polishing against the polishing surface of a grinding wheel 15 fixed on a surface plate 5, the grinding wheel 15 is stuck on a grinding wheel tool 17, and the outer peripheral part of the grinding wheel tool 17 is fixed to the surface plate 5 using a clamping mechanism 18.

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