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1. 发明专利

JP2011062812A Polishing apparatus and polishing method 有权
标题翻译：抛光装置和抛光方法
公开(公告)号：JP2011062812A
公开(公告)日：2011-03-31
申请号：JP2010254656
申请日：2010-11-15
申请人： Ebara Corp , 株式会社荏原製作所
发明人： YASUDA HOZUMI , TOGAWA TETSUJI , NABEYA OSAMU , SAITO KENICHIRO , FUKUSHIMA MAKOTO , INOUE TOMOMI
IPC分类号： B24B37/04 , B24B37/32 , B24B49/10 , H01L21/304
摘要： PROBLEM TO BE SOLVED: To provide a polishing apparatus which prevents a substrate as an object to be polished, from coming off, and provides stable polishing. SOLUTION: The polishing apparatus has: a polishing pad 101 having a polishing surface; a top ring body 2 that holds a substrate W and presses the substrate W against the polishing surface to polish the substrate; and a retainer ring 3 that holds an outer peripheral part of the substrate W and presses the polishing surface. The polishing apparatus is further equipped with: a sensor 506 that detects the height of the retainer ring 3 in at least two positions; and a computing unit 508 that computes the inclination of the retainer ring 3 from the height detected by the sensor 506. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供一种防止作为被抛光物体的基板脱落的抛光装置，并提供稳定的抛光。抛光装置具有：具有研磨面的研磨垫101，保持基板W并将基板W压靠在抛光表面上以抛光基板的顶环体2; 以及固定环3，其保持基板W的外周部并按压研磨面。抛光装置还配备有：传感器506，其在至少两个位置检测保持环3的高度; 以及计算单元508，其根据由传感器506检测到的高度来计算保持环3的倾斜度。（C）2011年，JPO和INPIT

2. 发明专利

JP2008066755A Polishing device 有权
标题翻译：抛光装置
公开(公告)号：JP2008066755A
公开(公告)日：2008-03-21
申请号：JP2007304919
申请日：2007-11-26
申请人： Ebara Corp , 株式会社荏原製作所
发明人： SAKURAI KUNIHIKO , TOGAWA TETSUJI , TAKADA NOBUYUKI , WAKABAYASHI SATOSHI , SAITO KENICHIRO , SEKIMOTO MASAHIKO , HAYAMA TAKUJI , KOGA DAISUKE
IPC分类号： H01L21/304 , B24B37/04
摘要： PROBLEM TO BE SOLVED: To provide a polishing device which can be applied to a dry-in/dry-out type polishing device and respond to cleaning of semiconductor wafers accompanying miniaturization, having three or more cleaning steps in a cleaning process without spoiling processing capacity per unit time and per unit footprint. SOLUTION: The device comprises polishing tables 34, 35, 36, and 37 with polishing surfaces, top rings 32 and 33 which hold an object to be polished to press it to the polishing surfaces, transporting mechanisms 27, 27A, and 27B equipped with a plurality of bases on which the object is placed and is movable horizontally, pressures 30 and 30' which deliver the object between the bases and the top rings 32 and 33, and inversion device 28 and 28' which can deliver the object between the bases and invert the object. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种可应用于干式/干式抛光装置并且对小型化的半导体晶片的清洁作出反应的抛光装置，其具有在清洁过程中具有三个或更多个清洁步骤而没有每单位时间和每单位占地面积的破坏处理能力。解决方案：该装置包括具有抛光表面的抛光台34,35,36和37，顶表面32和33，其保持要抛光的物体将其推压到抛光表面，输送机构27,27A和27B 配备有多个基座，物体被放置在其上并且可水平移动，将物体在基座与顶环32和33之间输送的压力30和30'以及可以在物体之间传送物体的反转装置28和28' 基础和反转对象。版权所有（C）2008，JPO＆INPIT

3. 发明专利

JP2007268654A Substrate holder, polisher and polishing method 有权
标题翻译：基板支架，抛光和抛光方法
公开(公告)号：JP2007268654A
公开(公告)日：2007-10-18
申请号：JP2006097296
申请日：2006-03-31
申请人： Ebara Corp , 株式会社荏原製作所
发明人： YASUDA HOZUMI , TOGAWA TETSUJI , NABEYA OSAMU , SAITO KENICHIRO , FUKUSHIMA MAKOTO , INOUE TOMOMI
IPC分类号： B24B37/005 , B24B37/04 , B24B37/30 , B24B49/10 , H01L21/304
CPC分类号： B24B37/32
摘要： PROBLEM TO BE SOLVED: To provide a substrate holder, preventing a substrate as a polishing object from being dislocated and achieving stable polishing. SOLUTION: A top ring 1 includes: a top ring body 2 for holding a wafer and pressing the wafer to a polishing pad 101; and a retainer ring 3 provided on the outer peripheral part of the top ring body 2 to press the polishing pad 101. The retainer ring 3 includes: a piston 406 made of magnetic body; and a ring member 408 having a magnet 420 on the surface thereof abutting on the piston 406. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种防止作为抛光对象的基板脱落并实现稳定的抛光的基板保持器。解决方案：顶环1包括：用于保持晶片并将晶片按压到抛光垫101的顶环主体2; 以及设置在顶环主体2的外周部分上以按压抛光垫101的保持环3。保持环3包括：由磁体制成的活塞406; 以及环形构件408，其在其表面上具有与活塞406相邻的磁体420.版权所有（C）2008，JPO＆INPIT

4. 发明专利

JP2008207320A Polishing apparatus 有权
标题翻译：抛光装置
公开(公告)号：JP2008207320A
公开(公告)日：2008-09-11
申请号：JP2008018658
申请日：2008-01-30
申请人： Ebara Corp , 株式会社荏原製作所
发明人： SAITO KENICHIRO , NABEYA OSAMU , NAGATA KIMIHIDE , TOGAWA TETSUJI
IPC分类号： B24B37/07 , B24B37/10 , B24B49/10 , B24B53/02
CPC分类号： B24B53/017 , B24B49/14 , B24B49/18
摘要： PROBLEM TO BE SOLVED: To provide a polishing apparatus which omits as much as possible a movement for grounding a top ring on a polishing surface for detecting the height of the top ring before starting polishing and maintains the top ring at a preset polishing position during polishing even when a top ring shaft for holding the top ring is elongated by a temperature rise. SOLUTION: The polishing apparatus includes the polishing surface 22a, the top ring 20 for holding and pressing a substrate W against the polishing surface 22a, the top ring shaft 18 for lifting and lowering the top ring 20, an elongation detecting device 70 for detecting an elongation of the top ring shaft 18, and a controller 47 for setting a vertical position of the top ring 20 during polishing and lowering the top ring 20 to the preset polishing position which is the set vertical position. The controller 47 corrects the preset polishing position, based on the elongation of the top ring shaft 18 which has been detected by the elongation detecting device 70. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种抛光装置，尽可能省略在开始研磨之前将顶环接地的运动，用于在开始抛光之前检测顶环的高度，并将顶环保持在预设抛光即使当用于保持顶环的顶环轴由于温度升高而被拉长时，在抛光期间的位置。解决方案：抛光装置包括抛光表面22a，用于将衬底W保持并压靠在抛光表面22a上的顶环20，用于升高和降低顶环20的顶环轴18，伸长检测装置70 用于检测顶环轴18的伸长率;以及控制器47，用于在将顶环20抛光和降低到作为设定的垂直位置的预设抛光位置时设定顶环20的垂直位置。控制器47基于由伸长检测装置70检测到的顶环轴18的伸长率来校正预设的抛光位置。（C）2008，JPO＆INPIT

5. 发明专利

JP2001135604A POLISHING APPARATUS 失效
公开(公告)号：JP2001135604A
公开(公告)日：2001-05-18
申请号：JP2000250392
申请日：2000-08-21
申请人： EBARA CORP
发明人： SAKURAI KUNIHIKO , TOGAWA TETSUJI , TAKADA NOBUYUKI , WAKABAYASHI SATOSHI , SAITO KENICHIRO , SEKIMOTO MASAHIKO , HAYAMA TAKUJI , KOGA DAISUKE
IPC分类号： B24B37/04 , H01L21/304 , H01L21/677 , H01L21/68
摘要： PROBLEM TO BE SOLVED: To provide a polishing apparatus applicable to dry-in/dry-out system without reducing processing capability per hour and per unit of footprint, having cleaning steps or more in a cleaning process, and capable of developing clean processing of semiconductor wafer in accordance with miniaturization. SOLUTION: The polishing apparatus is provided with polishing tables 34, 35, 36, 37 with polishing surface, top rings 32, 33 for retaining a polishing object and pressing the object onto the polishing surface, three or more cleaning devices 5, 6, 22, 23 for cleaning the object after polishing process, and transfer mechanisms 20, 21 for transferring the object after polishing between three or more cleaning device 5, 6, 22, 23. The transfer mechanisms 20, 21 are changeable in the transfer route between three or more cleaning devices 5, 6, 22, 23.

6. 发明专利

JP2008279596A Retainer ring 有权
标题翻译：保持环
公开(公告)号：JP2008279596A
公开(公告)日：2008-11-20
申请号：JP2008187568
申请日：2008-07-18
申请人： Ebara Corp , 株式会社荏原製作所
发明人： YASUDA HOZUMI , TOGAWA TETSUJI , NABEYA OSAMU , SAITO KENICHIRO , FUKUSHIMA MAKOTO , INOUE TOMOMI
IPC分类号： B24B37/32 , H01L21/304
摘要： PROBLEM TO BE SOLVED: To provide a retainer ring providing the consistent grinding by preventing a substrate as a workpiece to be ground from being detached. SOLUTION: The retainer ring comprises a ring member 408, pressing parts 400, 402, 404, 406, 410 which press the ring member 408 downward when grinding a workpiece W to be ground and bring it into contact with a grinding surface of a grinding pad, and a magnet 420 for fixing the ring member to the pressing parts by the magnetic force. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种保持环，其通过防止作为工件的基板被剥离而提供一致的研磨。解决方案：保持环包括环形构件408，当研磨待研磨的工件W并使其与研磨表面接触时，将环构件408向下挤压的按压部件400,402,404,406,410 研磨垫和用于通过磁力将环构件固定到按压部件的磁体420。版权所有（C）2009，JPO＆INPIT

7. 发明专利

JP2006035328A Polishing device, substrate handling device, and substrate jump-out detecting method 有权
标题翻译：抛光装置，基板处理装置和基板切断检测方法
公开(公告)号：JP2006035328A
公开(公告)日：2006-02-09
申请号：JP2004214598
申请日：2004-07-22
申请人： Ebara Corp , 株式会社荏原製作所
发明人： SAITO KENICHIRO , TANIZAWA AKIHIRO , SASAKI MASANORI , MITSUYA TAKASHI
IPC分类号： B24B37/04 , B24B49/12 , H01L21/304
CPC分类号： B24B37/0053 , B24B49/12
摘要： PROBLEM TO BE SOLVED: To provide a polishing device capable of detecting jump-out of a wafer from a top ring without causing photo-corrosion of the wafer.
SOLUTION: The polishing device provided with the top ring 21 holding and rotating the wafer W, and a polishing table 10 provided with a polishing pad 11, polishes the wafer W by bringing the wafer W into sliding contact with the polishing pad 11. The polishing device is provided with a wafer jump-out detecting means comprising an LED lighting system 26 for irradiating the upper face of the polishing pad 11 with light, a controller 32 for controlling the LED lighting system 26, and a CCD camera 27 for acquiring the upper face image of the polishing pad 11, and an image processor 31 for processing information outputted from the CCD camera 27. Light irradiation is started immediately before or at the moment of determining that the wafer has abutted on the polishing pad 11.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种能够从顶环检测晶片跳出而不引起晶片的光腐蚀的抛光装置。解决方案：设置有保持和旋转晶片W的顶环21的抛光装置和设置有抛光垫11的抛光台10，通过使晶片W与抛光垫11滑动接触来抛光晶片W 抛光装置设置有晶片跳出检测装置，包括用于用光照射抛光垫11的上表面的LED照明系统26，用于控制LED照明系统26的控制器32和用于获取抛光垫11的上脸图像，以及用于处理从CCD相机27输出的信息的图像处理器31.在确定晶片已经抵靠在抛光垫11上之前或之前开始照射光。 P>版权所有（C）2006，JPO＆NCIPI

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