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1. 发明专利

JP2006179955A Polishing apparatus 有权
标题翻译：抛光装置
公开(公告)号：JP2006179955A
公开(公告)日：2006-07-06
申请号：JP2006076902
申请日：2006-03-20
申请人： Ebara Corp , 株式会社荏原製作所
发明人： TOGAWA TETSUJI , TAKADA NOBUYUKI
IPC分类号： H01L21/304 , B24B37/04
摘要： PROBLEM TO BE SOLVED: To provide a polishing apparatus, which can be used for a dry-in and dry-out type polishing apparatus and can increase throughput per unit time and unit installation area for polishing workpieces such as semiconductor wafers. SOLUTION: The polishing apparatus includes a polishing table TT1 having a polishing surface; a polishing processing unit having at least two top rings TR1-1, TR1-2; pushers P1-1, P1-2 for receiving and releasing the top rings TR1-1, TR1-2 and the polishing workpieces; a conveying robot RB3 provided with a hand for grasping a dry-polishing workpiece and a hand for grasping a wet polishing workpiece, for conveying the polishing workpieces; cleaning apparatuses CL1-1, CL1-2 for cleaning the polished workpieces; and a station 20 arranged between the cleaning apparatuses and the pushers, for including a dry station which receives and releases the dry-polishing workpiece and a wet station which receives and releases the wet-polishing workpiece. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种可用于干式和干式抛光装置的抛光装置，并且可以增加用于抛光诸如半导体晶片的工件的单位时间的生产量和单位安装面积。解决方案：抛光装置包括具有抛光表面的抛光台TT1; 抛光处理单元，具有至少两个顶环TR1-1，TR1-2; 用于接收和释放顶环TR1-1，TR1-2和抛光工件的推动器P1-1，P1-2; 设置有用于抓握干抛光工件的手的输送机器人RB3和用于抓握湿抛光工件的手，用于输送抛光工件; 用于清洁抛光工件的清洁设备CL1-1，CL1-2; 以及布置在清洁设备和推动器之间的站20，用于包括接收和释放干抛光工件的干燥站以及接收和释放湿抛光工件的湿站。版权所有（C）2006，JPO＆NCIPI

2. 发明专利

JP2001062712A POLISHING DEVICE 失效
公开(公告)号：JP2001062712A
公开(公告)日：2001-03-13
申请号：JP23676599
申请日：1999-08-24
申请人： EBARA CORP
发明人： TAKADA NOBUYUKI , TOGAWA TETSUJI
IPC分类号： B24B37/07 , B24B53/007 , H01L21/304 , B24B37/04
摘要： PROBLEM TO BE SOLVED: To provide a polishing device preventing a scroll motion of a polishing table from being impeded so as to be formed into a small size and compactness as the device. SOLUTION: This polishing device provided with a polishing table 22 having a polishing surface 34a and an engaging end part 58a formed in a rotating drive shaft 58 in a position eccentric from its axial center O1 so as to make a scroll motion of the polishing table 22 by engaging a connection part 31 formed in the polishing table 22 with the engaging end part 58a, has a balance weight 76 acting in the direction negating centrifugal force loaded in the drive shaft 58 by the polishing table 22 and support mechanism 80, 82 rotatably supporting the balance weight 76 coaxially with the drive shaft 58.

3. 发明专利

JP2000343407A DRESSING DEVICE 失效
公开(公告)号：JP2000343407A
公开(公告)日：2000-12-12
申请号：JP16159599
申请日：1999-06-08
申请人： EBARA CORP
发明人： TOGAWA TETSUJI , YAMAGUCHI KUNIAKI , TAKADA NOBUYUKI , WAKABAYASHI SATOSHI
IPC分类号： B24B53/017 , B24B53/12 , H01L21/304 , B24B37/00
摘要： PROBLEM TO BE SOLVED: To stably regenerate a polishing surface over a long period of time by composing a dressing face of a grinding wheel. SOLUTION: Dressing of abrasive cloth is performed during the board replacement of a top ring, that is, a dresser 48 is positioned in a dressing position above a polishing surface 30a, and the dresser 48 is lowered while being rotated, and pressed toward the polishing surface 30a of a polishing table 22 to regenerate the polishing surface 30a. A washing fluid is jetted toward the polishing surface 30a from a residual abrasive grain wash nozzle 32 having a plurality of nozzle holes in the radial direction of the polishing table 22, to eliminate abrasive grains produced from a grinding wheel to become an unstable factor in a polishing process, from the polishing surface 30a. Demineralized water is normally used as the washing fluid and injected at high pressure in some cases. The polishing surface 30a can thereby be regenerated stably over a long period of time.

4. 发明专利

JP2000071166A POLISHING DEVICE AND METHOD 失效
公开(公告)号：JP2000071166A
公开(公告)日：2000-03-07
申请号：JP16990899
申请日：1999-06-16
申请人： EBARA CORP , TOSHIBA CORP
发明人： TOGAWA TETSUJI , TAKADA NOBUYUKI , KATSUOKA SEIJI , SHIGETA KENICHI
IPC分类号： B24B37/04 , B24B53/017 , H01L21/304 , B24B37/00
摘要： PROBLEM TO BE SOLVED: To provide a polishing device and a polishing method that prevent cracks in objects of polishing at overhanging and make no trace of scrapes on the polished surface of objects of polishing. SOLUTION: After a semiconductor wafer is polished with its entire surface put into contact with a polishing surface 5 within a turntable 20, a top ring moving/elevating mechanism 8 separates the semiconductor wafer from the polishing surface 5 by moving a top ring 3 horizontally to set the semiconductor wafer at least partly outside the polishing surface 5 before lifting the top ring 3. A dresser 10 is placed into contact with the polishing surface 5 to dress it to the outer circumference such that the internal polishing region and this outer circumference of the polishing surface 5 have no steps therebetween or become flush with each other.

5. 发明专利

JP2000040648A SEMICONDUCTOR MANUFACTURING EQUIPMENT 失效
公开(公告)号：JP2000040648A
公开(公告)日：2000-02-08
申请号：JP22110098
申请日：1998-07-21
申请人： EBARA CORP
发明人： TOGAWA TETSUJI , TAKADA NOBUYUKI
IPC分类号： H01L21/02 , B24B37/34 , B24B41/00 , H01L21/00 , H01L21/306
摘要： PROBLEM TO BE SOLVED: To provide semiconductor manufacturing equipment capable of treatment in a clean atmosphere, without needing installation in a clean room and exposing a semiconductor wafer to external circumstances. SOLUTION: This manufacturing equipment is provided with a housing H forming a closed space divided from external circumstances K, a means for keeping the space clean, a polishing part 1 and a cleaning part 10 which are installed in the space and treat a semiconductor wafer W, and a means which increases the pressure in the space higher than that of the external circumstances K.

6. 发明专利

JPH11188620A POLISHING DEVICE 失效
公开(公告)号：JPH11188620A
公开(公告)日：1999-07-13
申请号：JP29876098
申请日：1998-10-20
申请人： EBARA CORP
发明人： TOGAWA TETSUJI , TAKADA NOBUYUKI
IPC分类号： B24B37/04 , H01L21/304
摘要： PROBLEM TO BE SOLVED: To provide a polishing device which can eliminate a conveying error, by improving the delivering accuracy of a polishing object between a delivering device and a top ring or a robot hand. SOLUTION: A top ring 4 to hold a semiconductor wafer; a turntable 2 having a grinding surface to grind the surface of the wafer held to the top ring 4; and a pusher 10 set at the position to deliver the semiconductor wafer to the top ring 4; are provided, and the pusher 10 is provided with a stage 11 having the supporting surface to load the semiconductor wafer; an air cylinder 15 to move the stage 11 up and down; and a guide member 12 positioning at the outer peripheral side of the stage 11, and having a reverse conical form of guide surface 12c to carry out the centering of the semiconductor wafer.

7. 发明专利

JP2008188767A Substrate holding apparatus 审中-公开
标题翻译：基板保持装置
公开(公告)号：JP2008188767A
公开(公告)日：2008-08-21
申请号：JP2008085984
申请日：2008-03-28
申请人： Ebara Corp , 株式会社荏原製作所
发明人： TOGAWA TETSUJI , NOMICHI IKUTARO , NAMIKI KEISUKE , YASUDA HOZUMI , KOJIMA SHIYUNICHIROU , SAKURAI KUNIHIKO , TAKADA NOBUYUKI , NABEYA OSAMU , FUKUSHIMA MAKOTO , TAKAYANAGI HIDEKI
IPC分类号： B24B37/04 , B24B37/30 , B24B37/32 , H01L21/304
摘要： PROBLEM TO BE SOLVED: To wash away, for example, a polishing liquid intruding into a gap formed between an outer peripheral surface of an elastic pad and a retainer ring to prevent deposits of the polishing liquid from being stuck in the gap. SOLUTION: The substrate holding apparatus 1 for holding a substrate W to be polished and pressing the substrate W against a polishing surface 101 comprises: a top ring body 2 for holding the substrate W; the retainer ring 3 fixed to or integrated in a lower end of a periphery of the top ring body 2; and an elastic pad 4 brought in contact with the substrate W; and support member 6 disposed in a space formed inside the retainer ring 3. The top ring body 2 is provided with a cleaning liquid passage 51 to supply a cleaning liquid into the gap G formed between the outer peripheral surface of the elastic pad 4 and the retainer ring 3, in which a through-hole 3a is provided in the retainer ring 3 to remove the cleaning liquid outward. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：例如，冲洗入到形成在弹性垫的外周表面和保持环之间的间隙中的抛光液体，以防止抛光液的沉积物粘附在间隙中。解决方案：用于保持要抛光的基板W并将基板W压靠在抛光表面101上的基板保持装置1包括：用于保持基板W的顶环体2; 固定环3固定到或整合在顶环主体2的周边的下端; 以及与基板W接触的弹性垫4; 以及设置在形成在保持环3内部的空间中的支撑构件6.顶环体2设置有清洁液通道51，以将清洁液体供应到形成在弹性垫4的外周表面之间的间隙G和保持环3，其中在保持环3中设置有通孔3a以将清洁液向外移除。版权所有（C）2008，JPO＆INPIT

8. 发明专利

JP2008066755A Polishing device 有权
标题翻译：抛光装置
公开(公告)号：JP2008066755A
公开(公告)日：2008-03-21
申请号：JP2007304919
申请日：2007-11-26
申请人： Ebara Corp , 株式会社荏原製作所
发明人： SAKURAI KUNIHIKO , TOGAWA TETSUJI , TAKADA NOBUYUKI , WAKABAYASHI SATOSHI , SAITO KENICHIRO , SEKIMOTO MASAHIKO , HAYAMA TAKUJI , KOGA DAISUKE
IPC分类号： H01L21/304 , B24B37/04
摘要： PROBLEM TO BE SOLVED: To provide a polishing device which can be applied to a dry-in/dry-out type polishing device and respond to cleaning of semiconductor wafers accompanying miniaturization, having three or more cleaning steps in a cleaning process without spoiling processing capacity per unit time and per unit footprint. SOLUTION: The device comprises polishing tables 34, 35, 36, and 37 with polishing surfaces, top rings 32 and 33 which hold an object to be polished to press it to the polishing surfaces, transporting mechanisms 27, 27A, and 27B equipped with a plurality of bases on which the object is placed and is movable horizontally, pressures 30 and 30' which deliver the object between the bases and the top rings 32 and 33, and inversion device 28 and 28' which can deliver the object between the bases and invert the object. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种可应用于干式/干式抛光装置并且对小型化的半导体晶片的清洁作出反应的抛光装置，其具有在清洁过程中具有三个或更多个清洁步骤而没有每单位时间和每单位占地面积的破坏处理能力。解决方案：该装置包括具有抛光表面的抛光台34,35,36和37，顶表面32和33，其保持要抛光的物体将其推压到抛光表面，输送机构27,27A和27B 配备有多个基座，物体被放置在其上并且可水平移动，将物体在基座与顶环32和33之间输送的压力30和30'以及可以在物体之间传送物体的反转装置28和28' 基础和反转对象。版权所有（C）2008，JPO＆INPIT

9. 发明专利

JP2001009713A POLISHING DEVICE 失效
公开(公告)号：JP2001009713A
公开(公告)日：2001-01-16
申请号：JP18535799
申请日：1999-06-30
申请人： EBARA CORP
发明人： TOGAWA TETSUJI , TAKADA NOBUYUKI
IPC分类号： B24B37/04 , H01L21/304
摘要： PROBLEM TO BE SOLVED: To establish the applicability of polishing devices to a dry-in/dry-out system and improve their throughput per unit time and unit installation area over polishing workpieces such as semiconductor wafers. SOLUTION: A polishing unit includes a polishing table TT1 with an abrasive surface, and at least two top rings TR1-1 and TR1-2 for pressing semiconductor wafers they hold against the abrasive surface. Each of the two or more top rings TR1-1 and TR1-2 is supported on a swivel shaft and movable on the polishing table TT1 between a polishing position wherein it subjects the semiconductor wafer to polishing and a delivery position wherein it receives and releases the semiconductor wafer. All those top rings TR1-1 and TR1-2 can be positioned in their polishing positions simultaneously and alternately as well.

10. 发明专利

JP2000033551A TOP RING CONTROL DEVICE 失效
公开(公告)号：JP2000033551A
公开(公告)日：2000-02-02
申请号：JP20513798
申请日：1998-07-21
申请人： EBARA CORP
发明人： TOGAWA TETSUJI , TAKADA NOBUYUKI
IPC分类号： B24B37/005 , B24B49/16 , B24D15/02 , B24B37/00
摘要： PROBLEM TO BE SOLVED: To provide a top ring control device capable of detecting an abnormality when an object to be polished is polished by a top ring speedily and securely and corresponding to it properly. SOLUTION: This top ring control device is provided with an air cylinder 52 pressing a top ring 11 against a turn table, a load cell 75 detecting a pressing pressure of the top ring 11 against the turn table, and a control means 80 which controls a pressing pressure of the top ring 11 against the turn table by the air cylinder 52 so that the detected pressure value becomes a predetermined specified pressure value, judges that an abnormality occurs when a condition in which the detected pressure value exceeds the predetermined specified value continues for more than predetermined time, and stops the operation for polishing an object to be polished by the top ring 11.

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