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    • 3. 发明专利
    • Method and system for suspension alignment
    • 悬挂对准方法与系统
    • JP2011255694A
    • 2011-12-22
    • JP2010129203
    • 2010-06-04
    • Toyota Motor Corpトヨタ自動車株式会社
    • SHIOMI TAKASHISHIMIZU KOJI
    • B62D65/12
    • PROBLEM TO BE SOLVED: To provide a suspension alignment system that improves the accuracy of a suspension alignment performed prior to the installment thereof in a vehicle body.SOLUTION: The suspension alignment system includes: a measurement device 11 for measuring positions of reference holes S1-S3 to specify, based on the measurement results, a reference position S that is a position to be a reference of the vehicle body 21, a vehicle traveling direction L, a vehicle width direction W, and a vehicle height direction H, and also measuring positions of installment reference parts P1-P4, which are used for positioning each of the suspensions 50, 60 with respect to the vehicle body 21, based on the reference position S along the vehicle traveling direction L, the vehicle width direction W, and the vehicle height direction H; and a transmission device 12 for calculating degrees of displacement of the installment reference parts P1-P4 in the vehicle traveling direction L, the vehicle width direction W, and the vehicle height direction H according to the measurement results of the measurement device 11 and setting alignment degree of each of the suspensions 50, 60 based on the calculation results.
    • 要解决的问题:提供一种悬架对准系统,其提高在其安装在车身中之前执行的悬架对准的精度。 解决方案:悬架对准系统包括:测量装置11,用于测量参考孔S1-S3的位置,以基于测量结果指定作为车身21的参考位置的基准位置S ,车辆行驶方向L,车宽方向W,车高方向H,以及测定各个悬架50,60相对于车体的各个安装基准部P1〜P4的位置 如图21所示,基于沿着车辆行驶方向L的基准位置S,车宽方向W和车辆高度方向H; 以及传动装置12,用于根据测量装置11的测量结果计算安装基准部件P1-P4在车辆行进方向L上的位移,车辆宽度方向W和车辆高度方向H的位移,以及设定对准 基于计算结果,每个悬架50,60的度数。 版权所有(C)2012,JPO&INPIT
    • 5. 发明专利
    • Semiconductor device
    • 半导体器件
    • JP2010141175A
    • 2010-06-24
    • JP2008316750
    • 2008-12-12
    • Mitsui High Tec IncToyota Motor Corpトヨタ自動車株式会社株式会社三井ハイテック
    • KADOGUCHI TAKUYASHIMIZU KOJI
    • H01L23/12
    • H01L24/73H01L2224/32245H01L2224/48247H01L2224/73265H01L2924/15311H01L2924/181H01L2924/00012
    • PROBLEM TO BE SOLVED: To provide a semiconductor device in which thermal and electric connections between a heat sink and a mounting substrate are improved.
      SOLUTION: The semiconductor device includes the mounting substrate 10 having a metal portion 11 patterned for heat dissipation and wiring, arrayed on a mounting surface, the heat sink 20 mounted on the mounting substrate 10 and connected to the metal portion 11, and a semiconductor element 30 mounted on the heat sink 20. The heat sink 20 has a plurality of solder mounting areas arranged in an area array on the side of the mounting surface 10A of the mounting substrate 10, and the heat sink 20 and mounting substrate 10 are connected to each other by fusing and connecting a first solder portion 26 arranged in the solder mounting area and a second solder portion 16 arranged at the metal portion 11 to each other.
      COPYRIGHT: (C)2010,JPO&INPIT
    • 要解决的问题:提供一种半导体器件,其中散热器和安装基板之间的热和电连接被改善。 解决方案:半导体器件包括安装基板10,其具有图案化用于散热和布线的金属部分11,排列在安装表面上,安装在安装基板10上并连接到金属部分11的散热器20以及 安装在散热器20上的半导体元件30.散热器20具有在安装基板10的安装面10A的侧面上以区域阵列布置的多个焊料安装区域,散热器20和安装基板10 通过将布置在焊料安装区域中的第一焊料部分26和布置在金属部分11处的第二焊料部分16熔合并连接而彼此连接。 版权所有(C)2010,JPO&INPIT
    • 7. 发明专利
    • Nozzle hole boring method of injector
    • 喷嘴孔喷孔方法
    • JP2008025552A
    • 2008-02-07
    • JP2006202573
    • 2006-07-25
    • Yanmar Co Ltdヤンマー株式会社
    • TAKAHASHI TAKASHITAKAHATA TERUMITSUUKAI TOMOMIASAI TAKESHISHIMIZU KOJIKAWABE TAKAO
    • F02M61/18B05B1/14
    • F02M61/182F02M61/168F02M61/18F02M61/188F02M61/1893F02M2200/8053F02M2200/8069Y10T29/49298Y10T408/03
    • PROBLEM TO BE SOLVED: To provide a processing method of a nozzle hole in an injector having a group nozzle hole capable of securing the processing accuracy of the nozzle hole and capable of reducing the variation of exhaust gas properties. SOLUTION: In the nozzle hole boring method of the injector 1 having the group nozzle hole 10 wherein a plurality of intersection points of an axial line of the injector 1 and an axial line of the nozzle hole 10a formed at the injector 1 exist, plane parts 10c and 10d perpendicular to the nozzle hole 10a and including an opening of the nozzle hole 10a are formed at a hole boring part of the nozzle hole 10a. A recess 10b is formed at the boring part and the plane part 10c is formed on at the bottom of the recess 10b, or the boring part is cut and the plane parts 10c and 10d are formed, or the boring part is forged and the plane parts 10c and 10d are formed. COPYRIGHT: (C)2008,JPO&INPIT
    • 要解决的问题:提供一种具有能够确保喷嘴孔的加工精度并能够减少排气性能变化的组喷嘴孔的喷射器中的喷嘴孔的处理方法。 解决方案:在具有组喷嘴孔10的喷射器孔喷孔方法中,其中喷射器1的轴线的多个相交点和形成在喷射器1处的喷嘴孔10a的轴线存在 在喷嘴孔10a的孔部形成有与喷嘴孔10a垂直且包括喷嘴孔10a的开口的平面部10c,10d。 凹部10b形成在镗孔部,平面部10c形成在凹部10b的底部,或者镗削部分被切割,并且平面部分10c和10d形成,或者镗孔部分被锻造,并且平面 部件10c和10d形成。 版权所有(C)2008,JPO&INPIT