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1. 发明专利

JP2010031987A Method and device for determining center hole of crankshaft 有权
标题翻译：用于确定起重机中心孔的方法和装置
公开(公告)号：JP2010031987A
公开(公告)日：2010-02-12
申请号：JP2008195807
申请日：2008-07-30
申请人： Komatsu Machinery Corp , コマツ工機株式会社
发明人： YOSHIMOTO AKIHIRO
IPC分类号： F16C3/08 , G05B19/4097
CPC分类号： F16C3/08 , B23P2700/07 , G01M1/10 , G01M1/24 , G05B19/401 , G05B19/4097 , G05B2219/32189 , G05B2219/37205 , Y02P90/22 , Y02P90/265
摘要： PROBLEM TO BE SOLVED: To easily and properly determine a position of a center hole of a crankshaft. SOLUTION: A center hole determination method determines the center hole of a material crankshaft formed by molding with a cope and a drag, and includes first to fourth steps. In the first step, shape data of each part molded with the cope and drag is obtained. In the second step, measurement data of each part is compared with the corresponding design data to calculate a mismatch amount caused by mismatch of each part. In the third step, based on the mismatch amount, the data corresponding to the mismatch amount is interpolated to reproduce actual shape data. In the fourth step, a center hole is determined so that a rotation balance of the material crankshaft is within a predetermined range based on the actual shape data. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：为了容易且适当地确定曲轴的中心孔的位置。解决方案：中心孔确定方法确定通过用上模和拖曳成型形成的曲轴形成的曲轴的中心孔，并且包括第一至第四步骤。在第一步骤中，获得用上模和拖曳模制的每个部件的形状数据。在第二步中，将每个部分的测量数据与对应的设计数据进行比较，以计算由每个部分的不匹配引起的失配量。在第三步骤中，基于不匹配量，对与失配量对应的数据进行内插以再现实际形状数据。在第四步骤中，基于实际形状数据确定曲轴坯料的旋转平衡在预定范围内的中心孔。版权所有（C）2010，JPO＆INPIT

2. 发明专利

JP2009111038A Cleaning device of chuck table 审中-公开
标题翻译：清洁表的清洁装置
公开(公告)号：JP2009111038A
公开(公告)日：2009-05-21
申请号：JP2007279791
申请日：2007-10-29
申请人： Komatsu Machinery Corp , Waida Seisakusho:Kk , コマツ工機株式会社 , 株式会社和井田製作所
发明人： TAKEDA HIDETOSHI , YAMADA RYOICHI , OKADA SHOJI
IPC分类号： H01L21/304 , B24B55/06
摘要： PROBLEM TO BE SOLVED: To uniformly clean the chucking face of a chuck table, and prevent the generation of ring-like remaining abrasion or deflected abrasion, as well as the abrasive damage of the chucking face by an edge of a cleaner stone. SOLUTION: A stone pressing mechanism 600 elastically supports the table turning-direction upstream-side ends 511 and 521 of stone holders 510 and 520 by cantilever plate springs 621 and 622 extended to the turning-direction upstream side so that they may be elastically close or away to/from the chucking face 210. A cleaner stone 400 is comprised of a plurality of divided stones 410 and 420, and the divided stones 410 and 420 are arranged in a vertical row along the radial direction of the chucking face when they land on the chucking face 210. Furthermore, the ends 411 and 421 of the divided stones 410 and 420 which are adjacent to each other are overlaid in the table turning direction. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：为了均匀地清洁卡盘的卡盘面，并且防止产生环状的剩余磨损或偏转磨损，以及由清洁石头的边缘产生的卡盘面的磨损损伤。解石：压石机构600通过向转向方向上游侧延伸的悬臂板簧621,622弹性地支承石座510,520的台转向方向上游侧端部511,521，弹性地闭合或离开夹持面210.清洁石400由多个分开的石块410和420组成，并且分割的石块410和420沿夹紧面的径向布置成垂直排，当它们落在夹紧面210上。此外，分割石410和420的彼此相邻的端部411和421在工作台转动方向上重叠。版权所有（C）2009，JPO＆INPIT

3. 发明专利

JP2009066748A Milling cutter of crankshaft miller, and cutter tip and cutter tip set used for the same 有权
标题翻译：铣刀切割机，切割机提示和切割机提示
公开(公告)号：JP2009066748A
公开(公告)日：2009-04-02
申请号：JP2008172008
申请日：2008-07-01
申请人： Komatsu Machinery Corp , コマツ工機株式会社
发明人： SHIMIZU YOICHIRO
IPC分类号： B23C5/20 , B23C5/12
CPC分类号： B23C3/06 , B23C5/207 , B23C2200/083 , B23C2200/162 , B23C2200/203
摘要： PROBLEM TO BE SOLVED: To allow all of multiple cutting edges of a cutter tip to be fully used, and to reduce frequency of replacement of the cutter tip to lower running cost of a milling cutter.
SOLUTION: A vertical peripheral tip 3 has substantially a hourglass shape whose central part is narrower than its upper and lower ends, when viewed from the front and rear, and all of its eight corners are acute-angled, when viewed from the front and rear. There is a recess of angle α on each side of the vertical peripheral chip 3. This recess prevents excessive friction caused in cutting the side of a counterweight 37 with the vertical peripheral tip 3. The upper and lower ends of the vertical peripheral tip 3 are formed into a very gradual projecting shape with a recess of angle β. This recess prevents abrasion of the upper and lower ends of the vertical peripheral tip 3 before the acute-angled corners used for cutting are damaged.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：允许刀尖的所有多个切削刃被完全使用，并且减少铣刀尖端的更换频率以降低铣刀的运行成本。
解决方案：垂直周边末端3具有基本上沙漏形状，其中心部分比其上端和下端窄，当从前后观察时，其所有八个角都是锐角的，当从前后。在垂直周边芯片3的每一侧上存在角度α的凹部。该凹部防止了在垂直周边尖端3切割配重37的侧面时产生的过度摩擦。垂直周边末端3的上端和下端形成具有β角凹陷的非常渐进的突出形状。在用于切割的锐角之间的角落被损坏之前，该凹部防止垂直周边末端3的上端和下端的磨损。版权所有（C）2009，JPO＆INPIT

4. 发明专利

JP2007273731A Wafer carrying hand 有权
标题翻译：水手携带
公开(公告)号：JP2007273731A
公开(公告)日：2007-10-18
申请号：JP2006097671
申请日：2006-03-31
申请人： Komatsu Ltd , Komatsu Machinery Corp , Sumco Techxiv株式会社 , Sumco Techxiv Corp , コマツ工機株式会社 , 株式会社小松製作所
发明人： YAMAZAKI JUNICHI , YAMADA RYOICHI , KIKUCHI MASAO , MASUTANI FUMIO
IPC分类号： H01L21/677 , B25J15/06 , B65G49/07
摘要： PROBLEM TO BE SOLVED: To provide a thin wafer carrying hand in which maintenance of an air passage is easy and a wafer can be set to a chuck even if reteaching is not performed for a robot. SOLUTION: A thin plate-shaped hand body (13) having a wafer suction surface provided on the top surface thereof is supported on a robot arm (19) at a rear end part (305) thereof. The hand body (13) is elastically supported on the robot arm (19) movably in a vertical direction to the wafer suction surface. An air passage (307) in the hand body (13) is a groove dug from a lower surface of the hand body (13) which is covered with a cover (323). A resin tape (325) is stuck on a region covering the cover (323) on the lower surface of the hand body (13) to seal a gap around the cover (323) of the air passage (307). By peeling the resin tape (325) to remove the cover (323) the air passage (307) can be cleaned. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：为了提供容易维护空气通道的薄晶片携带手，并且即使不对机器人进行再加工，也可以将晶片设置到卡盘。解决方案：具有设置在其顶表面上的晶片吸附表面的薄板形手柄（13）在其后端部（305）处被支撑在机器人手臂（19）上。所述手柄（13）在与所述晶片吸引面垂直的方向上可移动地弹性地支撑在所述机械手臂（19）上。手柄（13）中的空气通道（307）是从手柄（13）的下表面上挖出的，被盖子（323）覆盖的凹槽。将树脂带（325）粘贴在手柄（13）的下表面上覆盖盖（323）的区域上，以密封空气通道（307）的盖子（323）周围的间隙。通过剥离树脂带（325）以去除盖（323），可以清洁空气通道（307）。版权所有（C）2008，JPO＆INPIT

5. 发明专利

JP2007237363A Substrate surface machining apparatus 审中-公开
标题翻译：基材表面加工设备
公开(公告)号：JP2007237363A
公开(公告)日：2007-09-20
申请号：JP2006065730
申请日：2006-03-10
申请人： Komatsu Machinery Corp , コマツ工機株式会社
发明人： TAKEDA HIDETOSHI , YAMAZAKI JUNICHI
IPC分类号： B24B49/04 , B24B37/04 , H01L21/304
摘要： PROBLEM TO BE SOLVED: To measure the thickness of a wafer with good accuracy using a non-contact thickness sensor by favorably removing a water film formed on the surface of a wafer even in a wafer grinder.
SOLUTION: First and second air nozzles 15, 17 are disposed on the upstream side in the rotating direction of the wafer 5 on a circumference formed around the center of rotation of the wafer 5, to which a measurement point 23 belongs, and have the same construction. Clean air supplied at predetermined pressure from an air supply device having two or more linear small-diameter circular holes is jetted from the respective circular holes toward an area including the above circumference on the surface of the wafer 5 rotated in one direction. In the second air nozzle 17, the respective circular holes are disposed along the tangential direction of the circumference. In the first air nozzle 15, linear two or more small-diameter circular holes are disposed in the state of being not at right angles and parallel to the tangent of the circumference such as an angle about 45 degrees.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：即使在晶片研磨机中，通过有利地除去形成在晶片表面上的水膜，也可以使用非接触式厚度传感器，以高精度测量晶片的厚度。解决方案：第一和第二空气喷嘴15,17设置在晶片5的旋转方向的上游侧，该圆周围绕测量点23所属的晶片5的旋转中心形成，并且具有相同的结构。从具有两个或更多个线性小直径圆形孔的空气供应装置供应的从空气供应装置供应的清洁空气从在各个圆形孔处朝向在一个方向上旋转的晶片5的表面上的包括上述圆周的区域喷射。在第二空气喷嘴17中，相应的圆形孔沿圆周的切线方向设置。在第一空气喷嘴15中，线状的两个以上的小直径的圆形孔不以直角为中心并且平行于圆周的切线例如45度的角度设置。版权所有（C）2007，JPO＆INPIT

6. 发明专利

JP2006212713A Crankshaft machining device 审中-公开
标题翻译：起重机加工设备
公开(公告)号：JP2006212713A
公开(公告)日：2006-08-17
申请号：JP2005025255
申请日：2005-02-01
申请人： Komatsu Machinery Corp , Toyota Motor Corp , コマツ工機株式会社 , トヨタ自動車株式会社
发明人： KIMURA TOMOHISA , ISHIKAWA SHIGERU
IPC分类号： B23B5/18
摘要： PROBLEM TO BE SOLVED: To eliminate the backlash of gears of a tool drive mechanism to enhance the roundness of a pin journal after machined in a device for machining the pin journal while moving a tool corresponding to the eccentric rotation of the pin journal by rotating a crankshaft around a main journal.
SOLUTION: The power of a motor 46 is transmitted to rotating spindles 33a, 33b via a pinion gear 48, an idler gear 50 and final gears 52a, 52b in this order. These gears 48, 50, 52a, 52b are all helical gears. The idler gear 50 is divided into a plurality of sub-gears 50b, 50a, 50c in the face width direction, and spacers 50d, 50e are inserted between the sub-gears 50b, 50a, 50c. The thickness of the spacers 50d, 50e is adjusted according to the wear of the gears to substantially adjust the pitch of the idler gear 50 to thereby minimize the backlash between the gears.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：为了消除工具驱动机构的齿轮的齿隙，以增强在用于加工销轴颈的装置中加工后的销轴颈的圆度，同时移动对应于销轴颈的偏心旋转的工具通过绕主轴颈旋转曲轴。解决方案：马达46的动力依次通过小齿轮48，空转齿轮50和最终齿轮52a，52b传递到旋转主轴33a，33b。这些齿轮48,50,52a，52b都是斜齿轮。空转齿轮50在面宽方向被分割为多个副齿轮50b，50a，50c，间隔件50d，50e插入在副齿轮50b，50a，50c之间。间隔件50d，50e的厚度根据齿轮的磨损进行调节，从而基本上调节惰轮50的间距，从而最小化齿轮间的间隙。版权所有（C）2006，JPO＆NCIPI

7. 发明专利

JP2004009211A MACHINING METHOD FOR CAM SHAFT OR CRANK SHAFT 审中-公开
公开(公告)号：JP2004009211A
公开(公告)日：2004-01-15
申请号：JP2002166515
申请日：2002-06-07
申请人： KOMATSU MACHINERY CORP
发明人： SHIMOMURA MASUMI , YAMADA SHINGO
IPC分类号： B23Q15/00 , B23C3/06 , B23C3/08 , B23Q5/04 , B23Q15/08 , G05B19/416
摘要： PROBLEM TO BE SOLVED: To provide a machining method capable of enhancing machining efficiency and machining accuracy at a cam of a cam shaft or a pin journal of a crank shaft. SOLUTION: The cam shaft (11) or the crank shaft (12) is rotated around a C shaft, i.e., a shaft of the respective ones at an equal speed and two cutters (32, 32) rotatable around an axis parallel to the C shaft in synchronous with the rotation of the C shaft respectively and movable in the X shaft direction perpendicular to the C shaft respectively are used. The cutting rotation speed of the respective cutters is controlled so that a cutting load becomes approximately uniform corresponding to the varied cutting load during cutting the cams (11a, 11a) of the cam shaft or the pin journals (12a, 12a) of the crank shaft. Thereby, the two cams of the cam shaft or the two pin journals of the crank shaft are simultaneously processed by the respective cutters. COPYRIGHT: (C)2004,JPO

8. 发明专利

JP2003077871A Planar grinding system of semiconductor wafer and working method therefor 审中-公开
标题翻译：半导体晶圆平面磨削系统及其工作方法
公开(公告)号：JP2003077871A
公开(公告)日：2003-03-14
申请号：JP2001267984
申请日：2001-09-04
申请人： Komatsu Ltd , Komatsu Machinery Corp , Waida Seisakusho:Kk , コマツ工機株式会社 , 株式会社和井田製作所 , 株式会社小松製作所
发明人： YAMAZAKI JUNICHI , YAMADA RYOICHI
IPC分类号： B24B7/04 , H01L21/304
摘要： PROBLEM TO BE SOLVED: To enable construction of a compact planar grinding system where grinding work of low damage and high flatness is enabled to a semiconductor wafer, a wafer free from dimples and stains can be obtained, maintainability is superior and productivity is high.
SOLUTION: In a lateral-type planar grinder (10), a whetstone unit (11) for grinding and working the surface of a wafer (2), and a chuck unit (12) which is arranged facing the whetstone unit (11) and sucks and holds the wafer (2) when grinding is performed are installed in the peripheral transfer area of one transfer robot (20) for transferring the wafer (2) when the robot is positioned at an almost center. The respective rotating axes of the units (11), (12) are arranged in parallel with each other and almost horizontally. In a planar grinding system (1) of the semiconductor wafer (2), the planar grinding plate (10), a cassette unit (30), in which the wafers (2) are accommodated when carried in and out, pre-cleaning equipment (41) for cleaning the wafer 2 before grinding, and/or post-cleaning equipment (42) for cleaning the wafer 2 after grinding work are arranged.
COPYRIGHT: (C)2003,JPO
摘要翻译：要解决的问题：为了能够构建能够对半导体晶片进行低损伤和高平坦度的研磨作业的小型平面磨削系统，可以获得没有凹坑和污渍的晶片，可维护性优异且生产率高。解决方案：在侧面平面磨床（10）中，用于磨削和加工晶片表面的磨石单元（11）和面对砂轮单元（11）的卡盘单元（12）和当机器人位于几乎中心位置时，在执行研磨时将晶片（2）吸入并保持晶片（2）安装在用于传送晶片（2）的一个传送机器人（20）的周边传送区域中。各单元（11），（12）的旋转轴相互平行配置，几乎水平。在所述半导体晶片（2）的平面磨削系统（1）中，所述平面磨盘（10），当携带和排出时容纳所述晶片（2）的盒单元（30），预清洁设备（41），用于在研磨之前清洁晶片2，和/或后清洗用于在研磨工作之后清洁晶片2的设备（42）。

9. 发明专利

JP2002107141A METHOD FOR MEASURING SHAPE OF SHAFT HAVING TWISTED BLADE, AND APPARATUS THEREFOR 失效
公开(公告)号：JP2002107141A
公开(公告)日：2002-04-10
申请号：JP2000295504
申请日：2000-09-28
申请人： KOMATSU MACHINERY CORP , TOYOTA MOTOR CORP
发明人： YAMAMOTO MAKOTO , IGARASHI HIDEO
IPC分类号： G01B21/20 , G01B21/00 , G01B21/02 , G01B21/10
摘要： PROBLEM TO BE SOLVED: To measure the shape of a shaft having a twisted blade, at a high speeds and highly accurately. SOLUTION: A work 14 is rotated about an axis and registered to a prescribed rotation position, while one end part and the other end part are supported. A stylus of a touch probe 26 is pressed into contact with a surface of the work at this position. A rotation angle of the work, when the stylus is pressed in contact with the work surface, and the position of the touch probe 26 in the axial direction of the work and in a direction perpendicular to the axis are measured. Any of the blade outline of a twisted blade part, position/run out of the longitudinal reference surface of a shaft part, a position/a run out of a step part formed to the shaft part, and position/diameter/width of a groove part formed on the shaft part is obtained, on the basis of the measured values.

10. 发明专利

JP2008044036A Crankshaft miller, its controller, and its operating method 有权
标题翻译： CRANKSHAFT MILLER，其控制器及其操作方法
公开(公告)号：JP2008044036A
公开(公告)日：2008-02-28
申请号：JP2006220195
申请日：2006-08-11
申请人： Komatsu Machinery Corp , コマツ工機株式会社
发明人： SUZUKI TAKESHI
IPC分类号： B23Q15/00 , B23C3/06
摘要： PROBLEM TO BE SOLVED: To surely prevent chips from sticking to an inner peripheral surface of a cutter drum on a crankshaft miller for a long term.
SOLUTION: In the crankshaft miller 1 for successively carrying out a plurality of cutting steps on a workpiece 5 by a cutter 55 mounted on a cutter drum 41 rotated at prespecified machining rotation speed VH, rotation speed of the cutter drum 41 is once decreased from the machining rotation speed VH to non-machining rotation speed VL during a non-machining period between a cutting step previously taking place by the cutter 55 and a subsequent cutting step.
COPYRIGHT: (C)2008,JPO&INPIT

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