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1. 发明专利

JP2007125678A Relative angle change detection device of workpiece and grinding wheel in grinding machine 有权
标题翻译：磨床与磨床相关角度变化检测装置
公开(公告)号：JP2007125678A
公开(公告)日：2007-05-24
申请号：JP2005322744
申请日：2005-11-07
申请人： Komatsu Ltd , Komatsu Machinery Corp , Sumco Techxiv株式会社 , Sumco Techxiv Corp , Waida Seisakusho:Kk , コマツ工機株式会社 , 株式会社和井田製作所 , 株式会社小松製作所
发明人： ONO HIROYUKI , YAMADA RYOICHI , KIKUCHI MASAO , YAMAZAKI JUNICHI , MASUTANI FUMIO
IPC分类号： B24B49/10 , B24B7/04
摘要： PROBLEM TO BE SOLVED: To provide a grinding machine capable of easily and exactly detecting a change of a relative angle of a workpiece and a grinding wheel.
SOLUTION: This grinding machine is provided with a workpiece base 5 for supporting the workpiece 8, a grinding wheel base 13 for supporting the grinding wheel 16, while rotating and driving the grinding wheel 16, and a movable mechanism capable of adjusting an angle of the grinding wheel base 13 on a supporting base 12. Inclination of the grinding wheel 16 is detected by a difference of displacement of a first sensor 53 and a second sensor 54. At this time, a distance between the two sensors 53 and 54 is constituted to be wider than a grinding width of the workpiece 8. As a result, only the inclination is extracted, apparent sensitivity of the sensors 53 and 54 is enhanced, and the change of the relative angle of the workpiece 8 and the grinding wheel 16 can be exactly detected.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种能够容易且精确地检测工件和砂轮的相对角度的变化的研磨机。解决方案：该磨床设置有用于支撑工件8的工件基座5，用于支撑砂轮16的砂轮座13，同时旋转和驱动砂轮16;以及可移动机构，其能够调节砂轮座13的角度在支撑基座12上。通过第一传感器53和第二传感器54的位移差来检测砂轮16的倾斜。此时，两个传感器53和54之间的距离构成为比工件8的磨削宽度宽。结果，仅提取倾斜，传感器53和54的视觉灵敏度增加，并且工件8和砂轮的相对角度的变化 16可以精确检测。版权所有（C）2007，JPO＆INPIT

2. 发明专利

JP2007184412A Cleaning method of chuck table of grinding apparatus 有权
标题翻译：研磨装置的清洁表的清洁方法
公开(公告)号：JP2007184412A
公开(公告)日：2007-07-19
申请号：JP2006001561
申请日：2006-01-06
申请人： Komatsu Ltd , Komatsu Machinery Corp , Sumco Techxiv株式会社 , Sumco Techxiv Corp , Waida Seisakusho:Kk , コマツ工機株式会社 , 株式会社和井田製作所 , 株式会社小松製作所
发明人： MASUTANI FUMIO , HASEGAWA SHINJI , KOBIKI YASUHIRO , YAMADA RYOICHI , YAMAZAKI JUNICHI , OKADA SHOJI
IPC分类号： H01L21/304 , B08B1/00 , B24B55/00
摘要： PROBLEM TO BE SOLVED: To provide a cleaning apparatus for grinding apparatus capable of improving the flatness of a silicon wafer by keeping the flatness of a chuck face at a high level for a long period of time, by making use of the prevention of biased ablation of the chuck surface caused by foreign matter on the chuck face.
SOLUTION: A cleaning member 31 having a length in response to a radius of the chuck face 12 of a chuck table 11 makes contact with the chuck face 12 of the chuck table 11, and is rotated relatively circumferentially with respect to the chuck face 12 of the chuck table 11. Of the cross section of the chuck face 12 of the chuck table 11 of the cleaning member 31 cut along a flat plane perpendicular to a radial direction J at least a portion comprises a curved line in contact with the chuck face 12 of the chuck table 11. Further, the cleaning member 31 is divided into plural portions in the radial direction J of the chuck face 12 of the chuck table 11, and the divided respective cleaning members 31A, 31B are pressed independently against the chuck face 12 of the chuck table 11 by pressing members 32A, 32B.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：解决的问题：为了提供一种能够通过将卡盘面的平坦度保持在高水平长时间来提高硅晶片的平坦度的研磨装置的清洁装置，通过利用预防由卡盘面上的异物引起的卡盘表面偏置消融。解决方案：具有响应于卡盘台11的卡盘面12的半径的长度的清洁部件31与卡盘台11的卡盘面12接触，并相对于卡盘相对周向地旋转在夹具台11的表面12上。沿着垂直于径向方向J的平面切割的清洁构件31的卡盘台11的卡盘面12的横截面中，至少一部分包括与另外，清扫部件31在卡盘台11的卡盘面12的径向方向J上被分割成多个部分，分开的各个清洁部件31A，31B被独立地压在卡盘台11上。通过按压构件32A，32B，卡盘台11的卡盘面12。版权所有（C）2007，JPO＆INPIT

3. 发明专利

JP2003077871A Planar grinding system of semiconductor wafer and working method therefor 审中-公开
标题翻译：半导体晶圆平面磨削系统及其工作方法
公开(公告)号：JP2003077871A
公开(公告)日：2003-03-14
申请号：JP2001267984
申请日：2001-09-04
申请人： Komatsu Ltd , Komatsu Machinery Corp , Waida Seisakusho:Kk , コマツ工機株式会社 , 株式会社和井田製作所 , 株式会社小松製作所
发明人： YAMAZAKI JUNICHI , YAMADA RYOICHI
IPC分类号： B24B7/04 , H01L21/304
摘要： PROBLEM TO BE SOLVED: To enable construction of a compact planar grinding system where grinding work of low damage and high flatness is enabled to a semiconductor wafer, a wafer free from dimples and stains can be obtained, maintainability is superior and productivity is high.
SOLUTION: In a lateral-type planar grinder (10), a whetstone unit (11) for grinding and working the surface of a wafer (2), and a chuck unit (12) which is arranged facing the whetstone unit (11) and sucks and holds the wafer (2) when grinding is performed are installed in the peripheral transfer area of one transfer robot (20) for transferring the wafer (2) when the robot is positioned at an almost center. The respective rotating axes of the units (11), (12) are arranged in parallel with each other and almost horizontally. In a planar grinding system (1) of the semiconductor wafer (2), the planar grinding plate (10), a cassette unit (30), in which the wafers (2) are accommodated when carried in and out, pre-cleaning equipment (41) for cleaning the wafer 2 before grinding, and/or post-cleaning equipment (42) for cleaning the wafer 2 after grinding work are arranged.
COPYRIGHT: (C)2003,JPO
摘要翻译：要解决的问题：为了能够构建能够对半导体晶片进行低损伤和高平坦度的研磨作业的小型平面磨削系统，可以获得没有凹坑和污渍的晶片，可维护性优异且生产率高。解决方案：在侧面平面磨床（10）中，用于磨削和加工晶片表面的磨石单元（11）和面对砂轮单元（11）的卡盘单元（12）和当机器人位于几乎中心位置时，在执行研磨时将晶片（2）吸入并保持晶片（2）安装在用于传送晶片（2）的一个传送机器人（20）的周边传送区域中。各单元（11），（12）的旋转轴相互平行配置，几乎水平。在所述半导体晶片（2）的平面磨削系统（1）中，所述平面磨盘（10），当携带和排出时容纳所述晶片（2）的盒单元（30），预清洁设备（41），用于在研磨之前清洁晶片2，和/或后清洗用于在研磨工作之后清洁晶片2的设备（42）。

4. 发明专利

JP2003025197A Device for adjusting relative position relationship between work and grinding wheel on grinder 有权
标题翻译：调整磨床与研磨轮之间相对位置关系的装置
公开(公告)号：JP2003025197A
公开(公告)日：2003-01-29
申请号：JP2001213592
申请日：2001-07-13
申请人： Komatsu Machinery Corp , Waida Seisakusho:Kk , コマツ工機株式会社 , 株式会社和井田製作所
发明人： MATSUYAMA MICHIO , YAMAZAKI JUNICHI
IPC分类号： B24B41/04 , B24B7/04
摘要： PROBLEM TO BE SOLVED: To provide high-precision grinding by facilitating the adjustment of a relative position relationship between a work rotational center line 7a and a grinding wheel rotational center line 15a.
SOLUTION: A grinder has a work table 5 capable of rotatably supporting a work 8 and a wheel spindle stock 13 capable of rotatably supporting a grinding wheel 16 as well as a work moving mechanism 18 and a grinding wheel moving mechanism 29. The work moving mechanism 18 can turnably adjust the work table 5 around a work angle changing central portion 19 so that the direction of the work rotational center line 7a is changed on a vertical changing plane. The grinding wheel moving mechanism 29 can turnably adjust the wheel spindle stock 13 around a grinding wheel angle changing central portion 30 so that the direction of the grinding wheel rotational center line 15a is changed on a horizontal changing plane H.
COPYRIGHT: (C)2003,JPO
摘要翻译：要解决的问题：通过促进调整作业旋转中心线7a和砂轮旋转中心线15a之间的相对位置关系来提供高精度研磨。解决方案：研磨机具有能够可旋转地支撑工件8的工作台5和能够可旋转地支撑砂轮16以及工件移动机构18和砂轮移动机构29的车轮主轴坯料13.工作移动机构 18可以围绕工作角度改变中心部分19可旋转地调节工作台5，使得工作旋转中心线7a的方向在垂直切换面上改变。砂轮移动机构29可以围绕砂轮角度改变中心部分30可转动地调整车轮主轴原料13，使得砂轮旋转中心线15a的方向在水平切换平面H上改变。

5. 发明专利

JP2007273731A Wafer carrying hand 有权
标题翻译：水手携带
公开(公告)号：JP2007273731A
公开(公告)日：2007-10-18
申请号：JP2006097671
申请日：2006-03-31
申请人： Komatsu Ltd , Komatsu Machinery Corp , Sumco Techxiv株式会社 , Sumco Techxiv Corp , コマツ工機株式会社 , 株式会社小松製作所
发明人： YAMAZAKI JUNICHI , YAMADA RYOICHI , KIKUCHI MASAO , MASUTANI FUMIO
IPC分类号： H01L21/677 , B25J15/06 , B65G49/07
摘要： PROBLEM TO BE SOLVED: To provide a thin wafer carrying hand in which maintenance of an air passage is easy and a wafer can be set to a chuck even if reteaching is not performed for a robot. SOLUTION: A thin plate-shaped hand body (13) having a wafer suction surface provided on the top surface thereof is supported on a robot arm (19) at a rear end part (305) thereof. The hand body (13) is elastically supported on the robot arm (19) movably in a vertical direction to the wafer suction surface. An air passage (307) in the hand body (13) is a groove dug from a lower surface of the hand body (13) which is covered with a cover (323). A resin tape (325) is stuck on a region covering the cover (323) on the lower surface of the hand body (13) to seal a gap around the cover (323) of the air passage (307). By peeling the resin tape (325) to remove the cover (323) the air passage (307) can be cleaned. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：为了提供容易维护空气通道的薄晶片携带手，并且即使不对机器人进行再加工，也可以将晶片设置到卡盘。解决方案：具有设置在其顶表面上的晶片吸附表面的薄板形手柄（13）在其后端部（305）处被支撑在机器人手臂（19）上。所述手柄（13）在与所述晶片吸引面垂直的方向上可移动地弹性地支撑在所述机械手臂（19）上。手柄（13）中的空气通道（307）是从手柄（13）的下表面上挖出的，被盖子（323）覆盖的凹槽。将树脂带（325）粘贴在手柄（13）的下表面上覆盖盖（323）的区域上，以密封空气通道（307）的盖子（323）周围的间隙。通过剥离树脂带（325）以去除盖（323），可以清洁空气通道（307）。版权所有（C）2008，JPO＆INPIT

6. 发明专利

JP2007329375A Holder for thin film article 审中-公开
标题翻译：薄膜文章夹
公开(公告)号：JP2007329375A
公开(公告)日：2007-12-20
申请号：JP2006160589
申请日：2006-06-09
申请人： Komatsu Machinery Corp , コマツ工機株式会社
发明人： TAKEDA HIDETOSHI , YAMAZAKI JUNICHI
IPC分类号： H01L21/677 , B25J15/06 , B65G49/07 , B65H5/10 , B65H5/22
摘要： PROBLEM TO BE SOLVED: To prevent sideslip without damaging a thin film article when the thin film article is sucked by a hand utilizing the Bernoulli effect. SOLUTION: A holder is provided with a friction member 13 for abutting against a semiconductor wafer 2, gas jetting ports 12, 12 and so forth provided around the friction member 13, and a sucking pad 11 for contactlessly sucking and holding the semiconductor wafer 2 using a negative pressure generated due to a gas radially jetted from the gas jetting ports 12, 12 and so forth. While the semiconductor wafer 2 is being sucked by the sucking pad 11, the semiconductor wafer 2 abuts against the friction member 13. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：为了防止侧滑而不损坏薄膜制品，当利用伯努利效应用手吸取薄膜制品时。解决方案：保持器设置有用于抵靠设置在摩擦构件13周围的半导体晶片2，气体喷射口12,12等的摩擦构件13和用于非接触地吸住并保持半导体的吸盘11 使用由于从气体喷射口12,12等径向喷射的气体而产生的负压的晶片2。在半导体晶片2被吸盘11吸引的同时，半导体晶片2与摩擦构件13抵接。（C）2008，JPO＆INPIT

7. 发明专利

JP2007329297A Holder of thin-film article, and hand for holding thin-film article 审中-公开
标题翻译：薄膜制品的夹持器，以及用于保存薄膜文章的手段
公开(公告)号：JP2007329297A
公开(公告)日：2007-12-20
申请号：JP2006159272
申请日：2006-06-08
申请人： Komatsu Machinery Corp , コマツ工機株式会社
发明人： TAKEDA HIDETOSHI , YAMAZAKI JUNICHI
IPC分类号： H01L21/677 , B25J15/06
摘要： PROBLEM TO BE SOLVED: To hold thin-film articles having different diameters and to prevent damage of an edge of each of the thin-film articles when holding the thin-film articles. SOLUTION: A universal hand 1 has a sucking surface 1A capable of sucking and holding a small-diameter wafer 31 and a large-diameter wafer 32 which have a substantially circular shape. The sucking surface 1A has a recess 13 so that an edge 31A may not contact the sucking surface 1A when the small-diameter wafer 31 is sucked. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：保持具有不同直径的薄膜制品，并且在保持薄膜制品时防止每个薄膜制品的边缘的损坏。解决方案：通用手1具有能够吸持和保持具有大致圆形形状的小直径晶片31和大直径晶片32的吸附表面1A。吸引面1A具有凹部13，使得当小直径晶片31被吸入时边缘31A可能不接触吸附表面1A。版权所有（C）2008，JPO＆INPIT

8. 发明专利

JP2007237363A Substrate surface machining apparatus 审中-公开
标题翻译：基材表面加工设备
公开(公告)号：JP2007237363A
公开(公告)日：2007-09-20
申请号：JP2006065730
申请日：2006-03-10
申请人： Komatsu Machinery Corp , コマツ工機株式会社
发明人： TAKEDA HIDETOSHI , YAMAZAKI JUNICHI
IPC分类号： B24B49/04 , B24B37/04 , H01L21/304
摘要： PROBLEM TO BE SOLVED: To measure the thickness of a wafer with good accuracy using a non-contact thickness sensor by favorably removing a water film formed on the surface of a wafer even in a wafer grinder.
SOLUTION: First and second air nozzles 15, 17 are disposed on the upstream side in the rotating direction of the wafer 5 on a circumference formed around the center of rotation of the wafer 5, to which a measurement point 23 belongs, and have the same construction. Clean air supplied at predetermined pressure from an air supply device having two or more linear small-diameter circular holes is jetted from the respective circular holes toward an area including the above circumference on the surface of the wafer 5 rotated in one direction. In the second air nozzle 17, the respective circular holes are disposed along the tangential direction of the circumference. In the first air nozzle 15, linear two or more small-diameter circular holes are disposed in the state of being not at right angles and parallel to the tangent of the circumference such as an angle about 45 degrees.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：即使在晶片研磨机中，通过有利地除去形成在晶片表面上的水膜，也可以使用非接触式厚度传感器，以高精度测量晶片的厚度。解决方案：第一和第二空气喷嘴15,17设置在晶片5的旋转方向的上游侧，该圆周围绕测量点23所属的晶片5的旋转中心形成，并且具有相同的结构。从具有两个或更多个线性小直径圆形孔的空气供应装置供应的从空气供应装置供应的清洁空气从在各个圆形孔处朝向在一个方向上旋转的晶片5的表面上的包括上述圆周的区域喷射。在第二空气喷嘴17中，相应的圆形孔沿圆周的切线方向设置。在第一空气喷嘴15中，线状的两个以上的小直径的圆形孔不以直角为中心并且平行于圆周的切线例如45度的角度设置。版权所有（C）2007，JPO＆INPIT

9. 发明专利

JPS6190853A Tool diameter correcting method of boring tool in tool diameter variable main spindle device 失效
标题翻译：刀具直径可变主主轴装置的工具直径校正方法
公开(公告)号：JPS6190853A
公开(公告)日：1986-05-09
申请号：JP21037484
申请日：1984-10-09
申请人： Komatsu Ltd
发明人： YAMAZAKI JUNICHI
IPC分类号： B23Q15/22 , G05B19/18
CPC分类号： G05B19/182 , G05B2219/50291 , G05B2219/50293
摘要： PURPOSE:To automatically correct a tool diameter with no necessity for edge point adjusting work, by storing an error between an aiming machined bore and an actual machined bore to be fed back to an eccentric angle of an internal main spindle when it performs the next boring and adding a correction angle to the eccentric angle so as to position it to a degree of the eccentric angle of the internal main spindle. CONSTITUTION:If an error 2DELTAR is assumed to be provided between an aiming machined bore U and an actual machined bore 2R, a device, storing an error DELTAR obtained when a machine bore is measured and feeding back the error to an eccentric angle theta when this tool 3 performs the next boring, obtains the aiming machined bore U by adding an eccentric correction angle DELTAtheta to the eccentric angle theta and positioning it to a degree of theta+DELTAtheta.
摘要翻译：目的：为了自动校正刀具直径，无需边缘点调整工作，通过在对准加工孔和实际加工孔之间存储误差，在进行下一次钻孔时反馈到内部主轴的偏心角度并且向偏心角度添加校正角度以将其定位到内部主轴的偏心角度。构成：如果在瞄准加工孔U和实际机加工孔2R之间假设提供误差2DELTAR，则在测量机器孔时存储获得的误差DELTAR的装置，当将该误差反馈到偏心角θ时，工具3执行下一个钻孔，通过将偏心校正角DELTAta加到偏心角θ并将其定位到θ+ DELTAta的角度来获得瞄准加工孔U。

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