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1. 发明专利

JP2010122182A Inspection jig and inspection device 有权
标题翻译：检验检验检测设备
公开(公告)号：JP2010122182A
公开(公告)日：2010-06-03
申请号：JP2008298525
申请日：2008-11-21
申请人： Daitron Technology Co Ltd , ダイトロンテクノロジー株式会社
发明人： TANIKAKE KOJI , ONOE MINORU , MUTA NAOYUKI , TOYOFUKU RYOGEN
IPC分类号： G01R31/26
摘要： PROBLEM TO BE SOLVED: To provide an inspection jig and an inspection device, capable of uniformly setting and managing the temperature of each semiconductor element that is less apt to be influenced by the heat generated from the adjacent semiconductor element, even when the plurality of semiconductor elements placed on an inspection jig are simultaneously driven and inspected.
SOLUTION: The semiconductor elements 1, placed on a placement board 52, are driven to inspect the electrical characteristics of the semiconductor elements 1, by using the inspection jig 50 which includes the placement board 52 with the plurality of semiconductor elements 1 placed thereon, in a heat exchangeable state and in which recessed grooves 61, 62 partitioning the space of adjacent semiconductor elements 1 are formed on the placement board 52.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：为了提供一种检查夹具和检查装置，能够均匀地设定和管理由相邻的半导体元件产生的热量不太受影响的每个半导体元件的温度，即使当同时驱动和检查放置在检查夹具上的多个半导体元件。解决方案：通过使用包括放置板52的检查夹具50驱动放置在放置板52上的半导体元件1，以检查半导体元件1的电特性，其中放置了多个半导体元件1 在其上，在可热交换状态下，并且在放置板52上形成分隔相邻半导体元件1的空间的凹槽61,62。（C）2010，JPO＆INPIT

2. 发明专利

JP2009148982A Wafer breaking apparatus 审中-公开
标题翻译：破碎设备
公开(公告)号：JP2009148982A
公开(公告)日：2009-07-09
申请号：JP2007329159
申请日：2007-12-20
申请人： Daitron Technology Co Ltd , ダイトロンテクノロジー株式会社
发明人： FUJITA HIROTAKA , MURAYAMA YUSUKE , HAYASHI KATSUHISA
IPC分类号： B28D5/04 , H01L21/301
摘要： PROBLEM TO BE SOLVED: To provide a wafer breaking apparatus enabling automation of cutting of a substrate at low costs.
SOLUTION: The wafer breaking apparatus 10 includes a support base 30 supporting a substrate 1 having a cutting line 2 and a stress imparting section 50 applying a bending stress to the substrate 1 supported with the support base 30 by moving a blade 52 and cuts the substrate 1 along the cutting line 2. It also has a cutting detection section 76 which detects cutting of the substrate 1 by detecting vibrations of the support base 30.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种能够以低成本自动切割基板的晶片断开装置。解决方案：晶片断开装置10包括：支撑基座30，其支撑具有切割线2的基板1和施加弯曲应力的应力施加部分50，所述应力施加部分50通过移动叶片52和向支撑基座30支撑的基板1支撑; 沿着切割线2切割基板1.它还具有切割检测部分76，其通过检测支撑基底30的振动来检测基板1的切割。版权所有：（C）2009，JPO＆INPIT

3. 发明专利

JP2008151546A Wavelength measuring apparatus for semiconductor device, and inspection apparatus for semiconductor device 有权
标题翻译：半导体器件的波长测量装置和半导体器件的检测装置
公开(公告)号：JP2008151546A
公开(公告)日：2008-07-03
申请号：JP2006337626
申请日：2006-12-14
申请人： Daitron Technology Co Ltd , ダイトロンテクノロジー株式会社
发明人： IGAWA KATSUHIKO
IPC分类号： G01J9/00 , H01S5/00
摘要： PROBLEM TO BE SOLVED: To measure the wave length of light emission of semiconductor device in a wide band of wavelength with a low cost constitution.
SOLUTION: The wave length measurement apparatus for measuring the wave length λ of the emission light of the semiconductor device 1 is characteristically provide with: a threshold voltage measurement means 20 for measuring the forward rising voltage V
F of the semiconductor device 1; a light receiving means 40 for detecting the output light from the semiconductor device 1; a plurality of color filters 70a, 70b and 70c with different transparency properties; a filter selection means 84 for selecting one color filter from among the plurality of color filters 70a, 70b and 70c based on the forward rising voltage V
F measured by the threshold voltage measurement means 20; a transmittance detection means 86 for calculating the transmittance R
P of the one color filter selected based on the each detected value P
O1 , P
O2 while detecting respectively the filtered light by the light receiving means 80 through the one color filter selected and the light not filtered; and a wave length calculation means 88 for calculating the emission light wave length λ of the semiconductor device 1 from the transmittance R
P .
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：以低成本构成测量宽波段的半导体器件的发光波长。解决方案：用于测量半导体器件1的发射光的波长λ的波长测量装置的特征在于提供：阈值电压测量装置20，用于测量正向上升电压V SB> >半导体器件1; 用于检测来自半导体器件1的输出光的光接收装置40; 具有不同透明性的多个滤色片70a，70b，70c; 滤波器选择装置84，用于基于由阈值电压测量装置20测量的正向上升电压V SB> F而从多个滤色器70a，70b和70c中选择一个滤色器; 用于计算基于每个检测值P O1 ，P O2 的一个滤色器的透射率R SB> P 的透射率检测装置86，同时通过所选择的一个滤色器分别检测由光接收装置80滤光的光，并且不过滤光; 以及用于从透射率R SB> P 计算半导体器件1的发射光波长λ的波长计算装置88。版权所有（C）2008，JPO＆INPIT

4. 发明专利

JP2006196507A Cleaning device of wafer 有权
标题翻译：清洗装置
公开(公告)号：JP2006196507A
公开(公告)日：2006-07-27
申请号：JP2005003700
申请日：2005-01-11
申请人： Daitron Technology Co Ltd , Sci Technol Kk , Kazuo Tanabe , サイエンステクノロジー株式会社 , ダイトロンテクノロジー株式会社 , 和夫田▲邉▼
发明人： TANABE KAZUO
IPC分类号： H01L21/304 , H01L21/683
摘要： PROBLEM TO BE SOLVED: To clean a wafer different in a diameter and a shape with a simple switch operation in a double-sided cleaning device of the wafer. SOLUTION: An upper brush (12) and a lower brush (13) are rotated in an opposite direction so that they are energized to a side while they clean the wafer (1) by sandwiching it. A swivel base (9) is arranged at the side of the upper/lower brushes so that it can turn. A drive roller which is brought into contact with a part of the side of the wafer and rotates the wafer exists in the swivel base. The swivel base is also provided with a plurality of drive units (3), (4), (5), (6) and (7) where arc-like curve faces which the drive roller forms are changed in accordance with the wafer and a square substrate unit (8) loading and moving a square substrate. The drive units corresponding to the wafer sent to the upper/lower brushes rotate on the swivel base so that they face the brushes so as to perform brush cleaning. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：通过在晶片的双面清洁装置中的简单的开关操作来清洁直径和形状不同的晶片。解决方案：上刷（12）和下刷（13）沿相反方向旋转，使得它们通过夹持来清洁晶片（1）而向一侧通电。旋转底座（9）设置在上/下刷子的侧面，使其能转动。与晶片的一部分侧接触并使晶片旋转的驱动辊存在于旋转基座中。旋转基座还设置有多个驱动单元（3），（4），（5），（6）和（7），其中根据晶片改变驱动辊形成的弧形曲面，正方形衬底单元（8），负载和移动正方形衬底。对应于发送到上/下刷的晶片的驱动单元在旋转底座上旋转，使得它们面对刷子，以进行刷清洁。版权所有（C）2006，JPO＆NCIPI

5. 发明专利

JP2006032815A Method and apparatus for sticking wafer on supporting substrate 审中-公开
标题翻译：用于在支撑基板上遮挡波浪的方法和装置
公开(公告)号：JP2006032815A
公开(公告)日：2006-02-02
申请号：JP2004212467
申请日：2004-07-21
申请人： Daitron Technology Co Ltd , Sci Technol Kk , Kazuo Tanabe , サイエンステクノロジー株式会社 , ダイトロンテクノロジー株式会社 , 和夫田▲邉▼
发明人： TANABE KAZUO
IPC分类号： H01L21/683 , H01L21/02 , H01L27/12
摘要： PROBLEM TO BE SOLVED: To stick a wafer processed thinly and having distortion in its smoothed state on a supporting substrate. SOLUTION: A method for sticking the wafer on the supporting substrate has a process for applying thickly a bonding agent to the circuit-pattern surface of the wafer (1), a process for so sucking and holding the nearly whole area of the rear surface of the wafer by a holding chuck (8) having a central chuck (9) and an outer peripheral chuck (10) as to eliminate nearly the distortion of the wafer (1), a process for mounting a supporting substrate (2) on a supporting stage (32) and so heating the supporting substrate as to be able to vaporize enough a solvent contained in the bonding agent, a process for so turning inversely the holding chuck (8) as to bond the wafer (1) to the supporting substrate (2), and a process for so moving thereafter immediately the sticking stage (32) to a cooling position as to bond compressively the wafer (1) in its smoothed state to the supporting substrate (2) and as to cool the bonding agent at the same time. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：将在其平滑状态下变形的薄片加工成薄片状的支撑基板。解决方案：用于将晶片粘贴在支撑基板上的方法具有将粘合剂厚度施加到晶片（1）的电路图案表面的方法，一种用于吸附和保持晶片的几乎整个区域的工艺通过具有中心卡盘（9）和外周卡盘（10）的保持卡盘（8）来消除晶片（1）的几乎变形的晶片后表面，安装支撑基板（2）的工艺，在支撑台（32）上，并且因此加热支撑基板以便能够使包含在粘合剂中的足够的溶剂蒸发;将保持卡盘（8）反向旋转以将晶片（1）接合到支撑基板（2），以及其后立即将粘贴台（32）移动到冷却位置以将其平滑状态的晶片（1）压缩到支撑基板（2）并且为了冷却粘合代理商在同一时间。版权所有（C）2006，JPO＆NCIPI

6. 发明专利

JP2004101461A Motion characteristic measuring device for electronic element 有权
标题翻译：电子元件运动特性测量装置
公开(公告)号：JP2004101461A
公开(公告)日：2004-04-02
申请号：JP2002266553
申请日：2002-09-12
申请人： Daitron Technology Co Ltd , ダイトロンテクノロジー株式会社
发明人： SUGIYAMA YASUHISA , IGAWA KATSUHIKO
IPC分类号： G01R31/26
摘要： PROBLEM TO BE SOLVED: To provide an index table type measuring device for fully-automatically and efficiently measuring the motion characteristic of an electronic element sensitive to an environmental temperature.
SOLUTION: A unique probe electrode mechanism created by this inventor and the like is used for a rotary connector, and the electric connection among various electronic or electric elements mounted in a rotating table and various electronic or electric apparatuses statically mounted at the external of the rotating table is switchable. Further the discontinuity of the operation amount to a controlled object by an electronic temperature controller, generated in accompany with the intermittent rotation of an index table is regarded and processed as disturbance to solve the discontinuity of the control at short times. Further the specific correspondence between a thermoelectric element on the table and the electronic temperature controller mounted around the external of the table, generated in accompany with the intermittent rotation of the index table, is constantly kept.
COPYRIGHT: (C)2004,JPO
摘要翻译：要解决的问题：提供一种用于全面自动且有效地测量对环境温度敏感的电子元件的运动特性的指标表型测量装置。解决方案：由本发明人等创建的独特的探针电极机构用于旋转连接器，并且安装在旋转台中的各种电子或电气元件之间的电连接以及静态安装在外部的各种电子或电气设备的旋转台是可切换的。此外，伴随着索引表的间歇旋转而产生的电子温度控制器对受控对象的操作量的不连续性被认为是处理为干扰，以在短时间内解决控制的不连续性。此外，不断保持桌子上的热电元件与安装在桌子外部的电子温度控制器之间的特定对应关系，伴随着折射台的间歇旋转而产生。版权所有（C）2004，JPO

7. 发明专利

JP2004039931A Method and device for cutting substrate 有权
公开(公告)号：JP2004039931A
公开(公告)日：2004-02-05
申请号：JP2002196371
申请日：2002-07-04
申请人： Daitron Technology Co Ltd , Sumitomo Electric Ind Ltd , ダイトロンテクノロジー株式会社 , 住友電気工業株式会社
发明人： FUJII SATORU , YOKOCHI KENICHI , FUJITA HIROTAKA , NISHI TERUHITO , ITAKURA KATSUHIRO
IPC分类号： H01L21/301
摘要： PROBLEM TO BE SOLVED: To provide a substrate cutting method and a device for effectively using an area of a base material when ae extremely hard substrate is cut and for suppressing distortion due to PROthe stress of a chip which is cut. SOLUTION: Grooves 8 are formed in one face 50u of the substrate 50 where a plurality of electronic elements 6 are formed. A blade 40 is made to abut on a position 52 corresponding to a position where the groove 8 is formed in the other face 50l of the substrate 50. Then, the substrate 50 is cut by pressing the blade 40 to the substrate 50. COPYRIGHT: (C)2004,JPO

8. 发明专利

JP2003086558A METHOD AND APPARATUS FOR CLEANING DISK-LIKE WORK 审中-公开
公开(公告)号：JP2003086558A
公开(公告)日：2003-03-20
申请号：JP2001276468
申请日：2001-09-12
申请人： DAITRON TECHNOLOGY CO LTD
发明人： NAGAYA MANABU
IPC分类号： B08B1/04 , B08B3/02 , B08B7/04 , H01L21/304
摘要： PROBLEM TO BE SOLVED: To minimize an exposure time of a work to air in a cleaning process, without needing work-reversing work, thereby lessening the number of cleaning steps and reducing work contamination. SOLUTION: Three or more portions of the peripheral face of a disc-like work to be cleaned are gripped and held, the held work is made rotatable around its center axis, and at least two brushes are disposed at both sides of the work so as to sandwich the work. The brushes are contacted or put close to both-side cleaning portions of the work during the rotation of the work, and moved from the center of the work to its periphery or vice versa, while cleaning liquid is fed to brushing surface of the work.

9. 发明专利

JP2013038434A Braking device 审中-公开
标题翻译：制动装置
公开(公告)号：JP2013038434A
公开(公告)日：2013-02-21
申请号：JP2012201575
申请日：2012-09-13
申请人： Daitron Technology Co Ltd , ダイトロンテクノロジー株式会社
发明人： KATO AKINORI , FUJITA HIROTAKA , MURAYAMA YUSUKE
IPC分类号： H01L21/301 , B26F3/00 , B28D5/00 , C03B33/033
摘要： PROBLEM TO BE SOLVED: To provide a braking device and a braking method capable of suppressing a false operation to conduct an automation by accurately detecting breaking of a substrate.SOLUTION: The braking device 10 which make a blade 52 hit and contact a substrate 1 formed with a breaking-proposed-line 2 to apply bending stress and breaks the substrate 1 comprises: a load applying part 62 for applying a load to the blade 52; a load measuring part 64 for measuring resultant force of a load applied to the blade 52 by the load applying part 62 and a load applied to the blade 52 by the substrate 1; and a breaking detection unit 70 for detecting breaking of the substrate 1 by a measurement value of the load measuring part 64.
摘要翻译：要解决的问题：提供一种能够通过精确地检测基板的断裂来抑制误操作进行自动化的制动装置和制动方法。解决方案：制造装置10，其使叶片52撞击并与形成有断裂提出线2的基板1接触以施加弯曲应力并破坏基板1包括：负载施加部62，用于施加负载叶片52; 负载测量部分64，用于测量由负载施加部分62施加到叶片52的负载的合力和由基板1施加到叶片52的负载; 以及用于通过负载测量部分64的测量值检测基板1的断裂的断裂检测单元70.版权所有：（C）2013，JPO＆INPIT

10. 发明专利

JP2011245576A Polishing device 审中-公开
标题翻译：抛光装置
公开(公告)号：JP2011245576A
公开(公告)日：2011-12-08
申请号：JP2010119364
申请日：2010-05-25
申请人： Daitron Technology Co Ltd , ダイトロンテクノロジー株式会社
发明人： TANIMORI KAZUHIKO , TAKEBE HIROYUKI
IPC分类号： B24B41/04 , B24B9/00 , B24B47/26 , H01L21/304
摘要： PROBLEM TO BE SOLVED: To provide a device for performing polishing work by following shape dispersion of a workpiece with a simple mechanism.SOLUTION: In this polishing device 10 including grinding tools 42 for polishing a workpiece 100, grinding tool rotary shafts 44 each mounted with the grinding tool 42, drive portions 46 for rotating the grinding tool rotary shafts 44, and bases 54, 56 for moving the grinding tools 42, the bases 54, 56 include first bases 54 each mounted with the drive portion 46, and second bases 56 each rotatably arranged with the grinding tool rotary shaft 44, and each arranged movably in a direction along the grinding tool rotary shaft 44 with respect to the first base 54; and power transmission mechanisms 52 each allowing axial movement of the grinding tool rotary shaft 44 and each capable of transmitting rotative force from the drive portion 46 to the grinding tool rotary shaft 44 are arranged between the drive portions 46 and the grinding tool rotary shafts 44.
摘要翻译：要解决的问题：提供一种通过以简单的机构跟随工件的形状分散来进行抛光加工的装置。解决方案：在包括用于抛光工件100的研磨工具42的抛光装置10中，每个安装有研磨工具42的研磨工具旋转轴44，用于使研磨工具旋转轴44和底座54,56旋转的驱动部分46 为了移动研磨工具42，基部54,56包括各自安装有驱动部分46的第一基座54和每个可旋转地布置有研磨工具旋转轴44的第二基座56，并且每个基座56沿着研磨工具的方向可移动地布置旋转轴44相对于第一基座54; 并且能够在驱动部46和研磨工具旋转轴44之间配置有能够使磨削工具旋转轴44轴向移动并能够将驱动部46向磨削工具旋转轴44传递旋转力的动力传递机构52。版权所有（C）2012，JPO＆INPIT

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