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1. 发明专利

JP2004039931A Method and device for cutting substrate 有权
公开(公告)号：JP2004039931A
公开(公告)日：2004-02-05
申请号：JP2002196371
申请日：2002-07-04
申请人： Daitron Technology Co Ltd , Sumitomo Electric Ind Ltd , ダイトロンテクノロジー株式会社 , 住友電気工業株式会社
发明人： FUJII SATORU , YOKOCHI KENICHI , FUJITA HIROTAKA , NISHI TERUHITO , ITAKURA KATSUHIRO
IPC分类号： H01L21/301
摘要： PROBLEM TO BE SOLVED: To provide a substrate cutting method and a device for effectively using an area of a base material when ae extremely hard substrate is cut and for suppressing distortion due to PROthe stress of a chip which is cut. SOLUTION: Grooves 8 are formed in one face 50u of the substrate 50 where a plurality of electronic elements 6 are formed. A blade 40 is made to abut on a position 52 corresponding to a position where the groove 8 is formed in the other face 50l of the substrate 50. Then, the substrate 50 is cut by pressing the blade 40 to the substrate 50. COPYRIGHT: (C)2004,JPO

2. 发明专利

JP2010274630A Method and apparatus for dividing substrate 审中-公开
标题翻译：用于分割基板的方法和装置
公开(公告)号：JP2010274630A
公开(公告)日：2010-12-09
申请号：JP2009132340
申请日：2009-06-01
申请人： Daitron Technology Co Ltd , ダイトロンテクノロジー株式会社
发明人： MURAYAMA YUSUKE , FUJITA HIROTAKA , HAYASHI KATSUHISA , YOKOCHI KENICHI
IPC分类号： B28D5/00 , H01L21/301
摘要： PROBLEM TO BE SOLVED: To provide a method and an apparatus for dividing a substrate wherein chipping, such as crack or break, is hardly caused in chips obtained by dividing, so that chips having a uniform shape can be manufactured with high yield. SOLUTION: In the dividing method wherein a substrate 1 in which a plurality of dividing scheduled lines 2 are formed along a first direction α is divided at the dividing scheduled lines 2, there are provided at least a first dividing process for dividing the substrate 1 at the dividing scheduled lines of integral multiple-numberth of n-th power of 2 (n is two or more integers) from one end in a second direction β orthogonal to the first direction α of the substrate 1, and a second dividing process for dividing the substrate 1 at the dividing scheduled lines of integral multiple-numberth of m-th power of 2 (m is one or more intergers and is equal to or smaller than n) from the one end in the second direction β of the substrate 1. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：解决的问题：提供一种分割基板的方法和装置，其中在通过分割获得的切屑中几乎不会引起诸如裂纹或断裂的切屑，使得可以以高产率制造具有均匀形状的切屑。解决方案：在分割方法中，其中沿着第一方向α形成多个分割预定行2的基板1在分割预定行2处被分割，至少提供了一个第一分割处理，用于将在与基板1的第一方向α正交的第二方向β上的一端的从2的整数倍的n次幂的分割预定线2（n为两个以上的整数）的基板1，以及第二分割在第二方向β的一端的分割预定行的分割预定行的2的m次幂的分割预定行（m是一个或多个间隔，并且等于或小于n）的处理底物1.版权所有（C）2011，JPO＆INPIT

3. 发明专利

JP2005191418A Semiconductor processing device 有权
标题翻译：半导体处理器件
公开(公告)号：JP2005191418A
公开(公告)日：2005-07-14
申请号：JP2003433316
申请日：2003-12-26
申请人： Daitron Technology Co Ltd , ダイトロンテクノロジー株式会社
发明人： KATOU AKINORI , KOBAYASHI TATSUHARU , YOKOCHI KENICHI , BANDO FUMIKAZU
IPC分类号： G08C17/02 , H01L21/68 , H01L21/683
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor processing device, such as a semiconductor inspecting device, a semiconductor machining device or the like, with their processing efficiency being easily enhanced through the speeding up of a rotating table. SOLUTION: The semiconductor processing device 10 comprises a lower table 20 and an upper table 30. A stage 24 for mounting a device 8 is provided on the lower table 20 and rotated intermittently. The upper table 30 is arranged on approximately the same shaft as that of the lower table 20, and is continuously rotated so that its number of revolution matches approximately the same as that of the rotating table 20. COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供诸如半导体检查装置，半导体加工装置等的半导体处理装置，其通过旋转台的加速容易地增强其处理效率。解决方案：半导体处理装置10包括下台20和上台30.用于安装装置8的台24设置在下台20上并间歇旋转。上台30布置在与下台20大致相同的轴上，并且连续旋转，使得其转数与旋转台20的转数大致相同。版权所有（C）2005 ，JPO＆NCIPI

4. 发明专利

JP2009150778A Contact device 审中-公开
标题翻译：联系设备
公开(公告)号：JP2009150778A
公开(公告)日：2009-07-09
申请号：JP2007329162
申请日：2007-12-20
申请人： Daitron Technology Co Ltd , ダイトロンテクノロジー株式会社
发明人： WATANABE KEITA , YOKOCHI KENICHI , BANDO FUMIKAZU , KATO AKI
IPC分类号： G01R31/28 , G01R1/067 , G01R31/26
摘要： PROBLEM TO BE SOLVED: To provide a contact device capable of easily checking the contact between a probe and a lead.
SOLUTION: An upper part comprises the probe 12 which comes into contact with the lead 52 of a semiconductor element 50, a base section 20 which holds a lower part 13 of the probe 12, and an imaging means 40 which images the probe 12 and the lead 52 via a light-transmitting section 24 installed on the base section 20, and the probe 12 makes a claw 30 come into contact with the lead 52 by making the lead deform elastically.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供能够容易地检查探针和引线之间的接触的接触装置。解决方案：上部包括与半导体元件50的引线52接触的探针12，保持探针12的下部13的基部20和成像装置40，其对探针进行成像 12和引线52经由安装在基座部20上的透光部24，探头12通过使引线弹性变形而与引线52接触。版权所有（C）2009，JPO＆INPIT

5. 发明专利

JP2008249644A Inspection device 审中-公开
标题翻译：检查装置
公开(公告)号：JP2008249644A
公开(公告)日：2008-10-16
申请号：JP2007094302
申请日：2007-03-30
申请人： Daitron Technology Co Ltd , ダイトロンテクノロジー株式会社
发明人： YOKOCHI KENICHI , BANDO FUMIKAZU , KATOU AKINORI , WATANABE KEITA
IPC分类号： G01R31/26 , H01S5/02
摘要： PROBLEM TO BE SOLVED: To provide an inspection device for semiconductor elements capable of inspecting efficiently even the semiconductor elements different in temperature regulating times and measuring times.
SOLUTION: This inspection device 10 for measuring an electric characteristic of each semiconductor element 1 regulated at a prescribed temperature has a plurality of sample blocks 20 mounted with one semiconductor element 1 and for regulating a temperature of the semiconductor element 1, a sample table 50 provided at a prescribed interval in one line with the plurality of sample blocks 20, a measuring part 60 for measuring the electric characteristics of the semiconductor elements 1 mounted on the sample blocks 20, and a conveying means 70 for carrying the semiconductor elements 1 in onto the sample blocks 20, and for taking out each semiconductor element 1 measurement-finished in the measuring part 60, from each sample block 20, and the semiconductor elements 1 are mounted on the sample blocks 20 of integer n with a raised-up decimal point fraction of a value Ta/Tm obtained by dividing the temperature regulating time Ta required for regulating the semiconductor elements 1 to the prescribed temperature in the sample blocks 20, with the measuring time Tm required for measuring one semiconductor element 1 by the measuring part 60, out of the plurality of sample blocks 20 provided in the sample stage (table) 50.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种能够有效地检查温度调节时间和测量次数不同的半导体元件的半导体元件的检查装置。解决方案：用于测量在规定温度下调节的每个半导体元件1的电特性的检查装置10具有安装有一个半导体元件1并用于调节半导体元件1的温度的多个样品块20，样品工作台50与多个采样块20一个规定的间隔设置，用于测量安装在样品块20上的半导体元件1的电特性的测量部分60和用于承载半导体元件1的传送装置70 在样品块20中，并且从每个样品块20取出在测量部分60中测量的每个半导体元件1，并且将半导体元件1安装在整数n的样品块20上，通过将用于调节半导体元件1所需的温度调节时间Ta除以pr而获得的Ta / Tm的小数点分数具有测量部分60测量一个半导体元件1所需的测量时间Tm的采样块20中的冷却温度，从设置在样品台（工作台）50中的多个样品块20中。 C）2009，JPO＆INPIT

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