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1. 发明专利

JP2010122182A Inspection jig and inspection device 有权
标题翻译：检验检验检测设备
公开(公告)号：JP2010122182A
公开(公告)日：2010-06-03
申请号：JP2008298525
申请日：2008-11-21
申请人： Daitron Technology Co Ltd , ダイトロンテクノロジー株式会社
发明人： TANIKAKE KOJI , ONOE MINORU , MUTA NAOYUKI , TOYOFUKU RYOGEN
IPC分类号： G01R31/26
摘要： PROBLEM TO BE SOLVED: To provide an inspection jig and an inspection device, capable of uniformly setting and managing the temperature of each semiconductor element that is less apt to be influenced by the heat generated from the adjacent semiconductor element, even when the plurality of semiconductor elements placed on an inspection jig are simultaneously driven and inspected.
SOLUTION: The semiconductor elements 1, placed on a placement board 52, are driven to inspect the electrical characteristics of the semiconductor elements 1, by using the inspection jig 50 which includes the placement board 52 with the plurality of semiconductor elements 1 placed thereon, in a heat exchangeable state and in which recessed grooves 61, 62 partitioning the space of adjacent semiconductor elements 1 are formed on the placement board 52.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：为了提供一种检查夹具和检查装置，能够均匀地设定和管理由相邻的半导体元件产生的热量不太受影响的每个半导体元件的温度，即使当同时驱动和检查放置在检查夹具上的多个半导体元件。解决方案：通过使用包括放置板52的检查夹具50驱动放置在放置板52上的半导体元件1，以检查半导体元件1的电特性，其中放置了多个半导体元件1 在其上，在可热交换状态下，并且在放置板52上形成分隔相邻半导体元件1的空间的凹槽61,62。（C）2010，JPO＆INPIT

2. 发明专利

JP2010122181A Pressing plate and inspection device using the same 审中-公开
标题翻译：使用相同的压板和检查装置
公开(公告)号：JP2010122181A
公开(公告)日：2010-06-03
申请号：JP2008298520
申请日：2008-11-21
申请人： Daitron Technology Co Ltd , ダイトロンテクノロジー株式会社
发明人： TANIKAKE KOJI , ONOE MINORU , MUTA NAOYUKI , TOYOFUKU RYOGEN
IPC分类号： G01R31/26
摘要： PROBLEM TO BE SOLVED: To provide a pressing plate capable of fixing a plurality of semiconductor elements placed on an inspection jig using a simple structure, and to provide a semiconductor inspection device that uses the same.
SOLUTION: The semiconductor element 1, placed on the inspection jig 50, is pressed and fixed to the inspection jig 50, by using the pressing plate 22 in which a plurality of pressing parts 30 are formed on a plate body 23 and in which support pieces 32 abutting against the semiconductor element 1 are formed on the pressing parts 30 by means of opening parts 26, bored in the plate body 23 and cutout parts 28 bored in the plate body 23 and in communication with the opening parts 26. The electrical characteristics of the semiconductor element 1 are inspected by making the semiconductor element 1 drive by a drive part 11.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种能够使用简单结构固定放置在检查夹具上的多个半导体元件的压板，并提供使用该加压板的半导体检查装置。解决方案：将放置在检查夹具50上的半导体元件1通过使用在板体23上形成有多个按压部30的按压板22而被压固固定在检查夹具50上通过在板体23上钻出的开口部分26和在板体23上钻出并与开口部分26连通的切口部分28，在按压部分30上形成有抵靠半导体元件1的支撑件32。通过使驱动部11驱动半导体元件1来检查半导体元件1的电特性。（C）2010，JPO＆INPIT

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