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    • 1. 发明专利
    • Inspection jig and inspection device
    • 检验检验检测设备
    • JP2010122182A
    • 2010-06-03
    • JP2008298525
    • 2008-11-21
    • Daitron Technology Co Ltdダイトロンテクノロジー株式会社
    • TANIKAKE KOJIONOE MINORUMUTA NAOYUKITOYOFUKU RYOGEN
    • G01R31/26
    • PROBLEM TO BE SOLVED: To provide an inspection jig and an inspection device, capable of uniformly setting and managing the temperature of each semiconductor element that is less apt to be influenced by the heat generated from the adjacent semiconductor element, even when the plurality of semiconductor elements placed on an inspection jig are simultaneously driven and inspected.
      SOLUTION: The semiconductor elements 1, placed on a placement board 52, are driven to inspect the electrical characteristics of the semiconductor elements 1, by using the inspection jig 50 which includes the placement board 52 with the plurality of semiconductor elements 1 placed thereon, in a heat exchangeable state and in which recessed grooves 61, 62 partitioning the space of adjacent semiconductor elements 1 are formed on the placement board 52.
      COPYRIGHT: (C)2010,JPO&INPIT
    • 要解决的问题:为了提供一种检查夹具和检查装置,能够均匀地设定和管理由相邻的半导体元件产生的热量不太受影响的每个半导体元件的温度,即使当 同时驱动和检查放置在检查夹具上的多个半导体元件。 解决方案:通过使用包括放置板52的检查夹具50驱动放置在放置板52上的半导体元件1,以检查半导体元件1的电特性,其中放置了多个半导体元件1 在其上,在可热交换状态下,并且在放置板52上形成分隔相邻半导体元件1的空间的凹槽61,62。(C)2010,JPO&INPIT
    • 2. 发明专利
    • Pressing plate and inspection device using the same
    • 使用相同的压板和检查装置
    • JP2010122181A
    • 2010-06-03
    • JP2008298520
    • 2008-11-21
    • Daitron Technology Co Ltdダイトロンテクノロジー株式会社
    • TANIKAKE KOJIONOE MINORUMUTA NAOYUKITOYOFUKU RYOGEN
    • G01R31/26
    • PROBLEM TO BE SOLVED: To provide a pressing plate capable of fixing a plurality of semiconductor elements placed on an inspection jig using a simple structure, and to provide a semiconductor inspection device that uses the same.
      SOLUTION: The semiconductor element 1, placed on the inspection jig 50, is pressed and fixed to the inspection jig 50, by using the pressing plate 22 in which a plurality of pressing parts 30 are formed on a plate body 23 and in which support pieces 32 abutting against the semiconductor element 1 are formed on the pressing parts 30 by means of opening parts 26, bored in the plate body 23 and cutout parts 28 bored in the plate body 23 and in communication with the opening parts 26. The electrical characteristics of the semiconductor element 1 are inspected by making the semiconductor element 1 drive by a drive part 11.
      COPYRIGHT: (C)2010,JPO&INPIT
    • 要解决的问题:提供一种能够使用简单结构固定放置在检查夹具上的多个半导体元件的压板,并提供使用该加压板的半导体检查装置。 解决方案:将放置在检查夹具50上的半导体元件1通过使用在板体23上形成有多个按压部30的按压板22而被压固固定在检查夹具50上 通过在板体23上钻出的开口部分26和在板体23上钻出并与开口部分26连通的切口部分28,在按压部分30上形成有抵靠半导体元件1的支撑件32。 通过使驱动部11驱动半导体元件1来检查半导体元件1的电特性。(C)2010,JPO&INPIT
    • 3. 发明专利
    • Inspection tool and inspection device for inspecting semiconductor element
    • 用于检查半导体元件的检查工具和检查装置
    • JP2008232862A
    • 2008-10-02
    • JP2007073690
    • 2007-03-20
    • Daitron Technology Co Ltdダイトロンテクノロジー株式会社
    • TANIKAKE KOJIONOE MINORUKITORA MASATOSHINAKANO SEISHI
    • G01R31/26H01S5/02
    • PROBLEM TO BE SOLVED: To provide an inspection device for a semiconductor element capable of restraining a dispersion of a temperature in the semiconductor element to enhance reliability of inspection.
      SOLUTION: This inspection device 10 for the semiconductor element 1 is provided with a thermostat 20 for storing an inspecting tool 100 for holding the semiconductor element 1, a temperature control means 60 for controlling a temperature in an inside of the thermostat 20, and a detecting means 70 for detecting a signal by driving the semiconductor element 1. In the inspection device 10, the inspecting tool 100 is provided with a base plate 102 having a through hole 106, a holding means 104 arranged on the base plate 102 and for holding the semiconductor element 1, and a heat radiator 110 for radiating heat generated from the semiconductor element 1 held by the holding means 104, the thermostat 20 has an air flow channel 34 storing one inspecting tool 100, the air flow channel 34 is partitioned into an upstream air flow channel 36 and a downstream air flow channel 38, by the inspecting tool 100, and air from the temperature control means 60, supplied to the upstream air flow channel 36, is discharged from the downstream air flow channel 38 via the through hole 106.
      COPYRIGHT: (C)2009,JPO&INPIT
    • 要解决的问题:提供一种能够抑制半导体元件中的温度分散的半导体元件检查装置,以提高检查的可靠性。 解决方案:该半导体元件1的检查装置10设置有用于存储用于保持半导体元件1的检查工具100的恒温器20,用于控制恒温器20内部的温度的温度控制装置60, 以及检测装置70,用于通过驱动半导体元件1检测信号。在检查装置10中,检查工具100设置有具有通孔106的基板102,布置在基板102上的保持装置104和 用于保持半导体元件1的散热器110和用于散发由保持装置104保持的半导体元件1产生的热量的散热器110,恒温器20具有存储一个检查工具100的空气流动通道34,空气流动通道34被分隔 通过检查工具100进入上游气流通道36和下游空气流通道38,以及来自温度控制装置60的供应到上游空气流动通道的空气 36通过通孔106从下游气流通道38排出。版权所有(C)2009,JPO&INPIT