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    • 72. 发明专利
    • MANUFACTURE OF LAMINATED FILM
    • JPH05217814A
    • 1993-08-27
    • JP1985492
    • 1992-02-05
    • TOSHIBA CORP
    • OKUWADA HISAMI
    • C01G23/00C01G25/00C23C18/14H01G4/06H01G4/10H01G4/12H01G4/33H01G13/00
    • PURPOSE:To prevent the delamination of the laminated film from being caused by repeating the following: a coating process wherein the face of a support substrate is coated with a compound solution containing a required metal element; and a process wherein a coating layer formed in the coating process is ashed. CONSTITUTION:The manufacturing method of a coating film repeats a process wherein, after the face of a support substrate has been coated with a compound solution containing a required metal element, a coating layer is ashed. As the compound solution containing the metal element, the solution of an organic metal compound such as metal alkoxide, metal soap, the acetate of a metal, the sulfone resin salt of a metal or the like or the solution of an inorganic metal salt such as the acetate of a metal is used. By an ashing treatment, the compound containing the metal element is decomposed by using oxygen radicals which are generated in a plasma or obtained by decomposing ozone; a metal layer is precipitated and formed or a metal oxide layer is formed. Thereby, a laminated film which is uniform and whose quality is high can be manufactured without causing the delamination between laminated films or between the laminated films and the support substrate.
    • 77. 发明专利
    • LAMINATED THIN-FILM DIELECTRIC ELEMENT AND MANUFACTURE THEREOF
    • JPH03200309A
    • 1991-09-02
    • JP33978389
    • 1989-12-27
    • TAIYO YUDEN KK
    • URANO TETSUYAFUJIMOTO MASAYUKI
    • H01G4/008H01G4/06H01G4/10H01G4/30H01G4/33
    • PURPOSE:To enable forming the title dielectric element according to a thin film thickness by forming double electrode films having SnO2 thin film on the surface and Cr, Ni or Cu thin film on the rear surface and further TiO2 dielectric thin films through causing these films to make an epitaxial growth respectively by means of vapor deposition and by laminating these two sorts of films alternately. CONSTITUTION:The title dielectric element has a fundamental structure, in which double electrode films 2, 3 which the thickness of 10mum and less having SnO2 thin film 3 on the front and Cr, Ni or Cu thin film 2 on the rear and TiO2 dielectric films 4 with the thickness of 10mum and less are alternately laminated on a glass substrate 1. In this case, a part or the whole of plural SnO2/(Cr, Ni or Cu) double electrode films 2, 3, 5, 7 and 9, as internal electrode layers for obtaining capacity, is composed of at least two groups connected with lead-out ends differing from each other. Thus, a low-cost glass substrate 1 is used so that internal electrode thin films can alternately be laminated on the glass substrate according to a thin thickness while holding dielectric thin films 4, 6 and 8 between them.