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    • 4. 发明专利
    • SAMPLE SUPPORTING DEVICE
    • JPH10317171A
    • 1998-12-02
    • JP13193597
    • 1997-05-22
    • HITACHI LTD
    • ONUKI HISAOOISHI SEITAROTANAKA SHIGERUSEKIMOTO SHINYA
    • C23F4/00H01L21/302H01L21/3065H01L21/68H01L21/683
    • PROBLEM TO BE SOLVED: To increase the number of samples to be attached in the same area, and to easily attach/detach the samples by pressing the sample arranged between an inner pressing piece and an outer pressing piece mounted on a sample stage against the pressing piece on one side by the pressing piece on the other side, and fixing the sample. SOLUTION: In a vacuum chamber, a sample mounted on a sample stage of a rotating sample holder is irradiated with the ion beam in which the introduced ion gas is accelerated by acceleration electrodes. An inner pressing piece 30 and an outer pressing piece 31 are movably mounted by screws 32 on a sample stage 14A of a sample supporting device of an ion beam machining equipment. A plurality of samples 13A-13D are arranged between the pressing pieces, held and temporarily fixed thereto. The screws 32 of the outer pressing piece 31 are loosened while the inner pressing piece 30 is fixed, the samples 13A-13D are pressed against the inner pressing piece 30 through the outer pressing piece 31, and then, the screws 32 are tightened to fix the samples between the pressing pieces.
    • 9. 发明专利
    • SPUTTERING DEVICE AND OPERATION THEREOF
    • JPH0426761A
    • 1992-01-29
    • JP13286290
    • 1990-05-23
    • HITACHI LTD
    • TANAKA SHIGERUSETOYAMA HIDETSUGUGUNJI HIDEKI
    • C23C14/38C23C14/34C23C14/36C23C14/40
    • PURPOSE:To prevent the misregistration of a magnetic material substrate with a change in magnetic field at the time of forming of a film on the substrate by controlling, with time, the energization to a coil which generates a magnetic field for confining plasma of the bipolar flat plate electrode type sputtering device. CONSTITUTION:A power source is turned on from a high-frequency power source 10 to generate the plasma in a discharge space 11 faced each other with a substrate electrode 5 and a target electrode 3. Currents are passed to four coils 12a to 12d to generate magnetic fields so as not to diffuse the plasma to the outside of the discharge space 11. The ions generated in this plasma bombard the target plate 2 and sputter the plate, thereby depositing the target atoms on the substrate 4 and forming the thin film thereon. The currents to be passed to the coils 12a to 12d are changed by a current controller 20 to gradually change the intensity of the magnetic field, by which the change in the position of the substrate 4 by the rapid fluctuation in the magnetic field is prevented.
    • 10. 发明专利
    • VACUUM TREATMENT EQUIPMENT
    • JPH01301853A
    • 1989-12-06
    • JP13134488
    • 1988-05-31
    • HITACHI LTD
    • TANAKA SHIGERU
    • C23C14/22C23C14/56C23C16/54
    • PURPOSE:To carry out plural treatments while preventing the admission of gas, etc., among respective treatment sources by providing a closed region, leaving a space necessary to transfer a substrate, to each treatment source in equipment having plural treatment sources in the same vacuum vessel. CONSTITUTION:In vacuum treatment equipment equipped with plural treatment sources for forming a film on a substrate 11 in the same vacuum vessel 1, the substrate 11 is attached to a substrate holder 9 moved by means of a drive mechanism 10. Further, a region which is divided with partition plates 8 and closed is provided, leaving a space (g) for transferring the holder 9, to each treatment source mentioned above, and the substrate 11 is passed through the space (g) and made to face respective treatment sources in succession to undergo treatments. Although the contaminants of the used gases and grains are generated in the regions in which the treatment sources exist in the course of the above treatments, the admission of the above contaminants into the other regions can be inhibited because the spaces among respective regions are narrow.