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    • 4. 发明专利
    • CAPACITOR AND MANUFACTURE THEREOF
    • JPH0324712A
    • 1991-02-01
    • JP16006989
    • 1989-06-22
    • MITSUI PETROCHEMICAL IND
    • MIYAZAKI MASAHIROKARAIWA MASATOOGA AKIHITOMIYAZAKI TETSUYAITANI AKIRA
    • H01G4/12H01G4/30
    • PURPOSE:To easily manufacture a capacitor having high withstand voltage and large capacitance by piling up Si substrates respectively provided with silicon-oxide layers on both surfaces upon another with internal electrodes in between and, at the same time, providing insulating grooves on one sides of the internal electrodes. CONSTITUTION:After a plurality of Si substrates 4 respectively provided with dielectric films 6 formed of a silicon oxide on both upper and lower surfaces are piled upon another with internal electrodes 8 in between, insulating grooves 9 are formed on one side section of each electrode 8 and the first and second external electrodes 14 and 16 are respectively connected to the end faces of the substrates 4 on which the grooves are formed and end faces of the electrodes 8 opposite to the grooves 8. Since the silicon oxide forming the dielectric films 6 is compact and high in withstand voltage, the withstand voltage of the films 6 is improved. Moreover, since the substrates 4 are piled up, the electric capacity of this capacitor is multiplied as compared with the capacitor having dielectric films on one sides of substrates only. In addition, because of the insulating grooves 9 provided to the electrodes 8, the electrode connecting process can be carried out easily. Therefore, a capacitor having large capacitance and high withstand voltage can be manufactured easily.
    • 5. 发明专利
    • CAPACITOR AND MANUFACTURE THEREOF
    • JPH0324711A
    • 1991-02-01
    • JP16006889
    • 1989-06-22
    • MITSUI PETROCHEMICAL IND
    • MIYAZAKI MASAHIROKARAIWA MASATOOGA AKIHITOMIYAZAKI TETSUYAITANI AKIRA
    • H01G4/12H01G4/30
    • PURPOSE:To easily manufacture a capacitor having high withstand voltage and large capacitance by piling up Si substrates respectively provided with silicon-oxide films on both surfaces upon another with internal electrodes in between and, at the same time, filing insulating grooves formed on one sides of the internal electrodes with insulating members. CONSTITUTION:After dielectric films 6 are formed of a silicon oxide on upper and lower surfaces of a plurality of Si substrates 4, the substrates 4 are piled upon another in the thickness direction with internal electrodes 8 in between and insulating grooves 9 filled with insulating members 10 are formed on one sides of the electrodes 8. Then the first and second external electrodes 14 and 16 are respectively connected to one side faces of the substrates 4 where the grooves 9 are formed in the electrodes 8 and one side faces of the electrodes 8 opposite to the grooves 9. The silicon oxide forming the dielectric films 6 is compact and high in withstand voltage, the withstand voltage of the films 6 is improved. Moreover, since the substrates 4 are piled up, the capacitance of this capacitor is multiplied. In addition, the grooves 9 are filled with the insulating members 10, the electrode connecting process can be carried out easily. Therefore, a capacitor having large capacitance and high withstand voltage can be manufactured easily.
    • 8. 发明专利
    • MANUFACTURE OF CAPACITOR
    • JPH0316110A
    • 1991-01-24
    • JP6897989
    • 1989-03-20
    • MITSUI PETROCHEMICAL IND
    • MIYAZAKI MASAHIROKARAIWA MASATOOGA AKIHITOMIYAZAKI TETSUYA
    • H01G4/12H01G4/33
    • PURPOSE:To keep the quality of a capacitor constant and improve its productivity by making a metal deposit itself into voids of pin holes, cracks, and the like which are formed in dielectric thin films with an electric plating process and after that, changing the above metal into insulating substances after oxidizing the metal. CONSTITUTION:After forming a dielectric thin film 6 on the surface of a lower electrode 12 that is formed on a substrate 2, an electric plating is performed by using the lower electrode 12 as the cathode for electric plating to cause metals 22 to deposit in voids 20 of pin holes, cracks, and the like which are formed on the dielectric thin film 6. After that, the metals 22 deposited in the voids 20 are insulated after being oxidized. Subsequently, an upper electrode 8 is formed on the surface of the dielectric thin film 6. Even through the upper electrode 8 is formed on the dielectric thin film 6 in this way, this thin film prevents the metals which make up the upper electrode 8 from entering into the voids 20 and then, insulation between upper and lower electrodes 8 and 12 is maintained favorably and the quality of a capacitor is kept constant.
    • 9. 发明专利
    • THIN FILM CAPACITOR
    • JPH02260621A
    • 1990-10-23
    • JP8335089
    • 1989-03-31
    • MITSUI PETROCHEMICAL IND
    • MIYAZAKI MASAHIROKARAIWA MASATOOGA AKIHITOMIYAZAKI TETSUYAITANI AKIRA
    • H01G4/33H01G4/06
    • PURPOSE:To enhance the performance in simplified process by a method wherein a dielectric film is formed on an Si substrate and then an upper electrode is formed on the dielectric film. CONSTITUTION:The title thin film capacitor 2 is provided with an Si substrate 4 and a dielectric film formed on the surface of the Si substrate 4. On the other hand, an upper electrode 8 is laminated on the surface of the dielectric film 6 while a lower electrode 10 is laminated on the rear surface of the substrate 4. The laid substrate 4 in specific resistance not exceeding 0.1OMEGAcm fills the role of the lower electrode 10. Besides, the dielectric film 6 is a mixed layer comprising an Si oxide and a metallic oxide, a reaction product layer or a laminated layer structure of these layers. In such a constitutution, the substrate 4 becomes a part of the electrode 10 so that the dielectric layer 6 need not be laminated directly on the electrode 10 to simplify the process. Furthermore, the substrate 4 is thermally oxidized to form an SiO2 film thereby enabling the performance to be enhanced such as the augmented breakdown strength and finer-formed film.