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    • 3. 发明公开
    • A method of producing a semiconductor laser device
    • 一种制造半导体激光器件的方法
    • EP0789430A3
    • 1997-11-05
    • EP97106425.8
    • 1992-12-24
    • SHARP KABUSHIKI KAISHA
    • Watanabe, MasanoriOhbayashi, KenSasaki, KazuakiYamamoto, OsamuMatsumoto, Mitsuhiro
    • H01S3/025H01S3/085
    • H01S5/0425H01S5/0201H01S5/0281H01S5/164Y10S148/026Y10S148/095Y10S148/104Y10S148/106Y10S148/143Y10S438/945
    • A method for producing a semiconductor laser device includes the steps of: forming window layers on either one of a top surface of an internal structure or a reverse surface of a substrate and on light-emitting end facets of the internal structure; forming a reflection film on the light-emitting end facets; removing the window layer formed on either one of the top surface or the reverse surface by using an etchant which hardly etches the reflection film; and forming electrodes on the surface from which the window layer is removed by etching and on the other surface. Another method for producing a semiconductor laser device includes the steps of: forming window layers on light-emitting end facets of the bars; inserting the bars into an apparatus having openings for forming electrodes and a supporting portion for preventing a positional shift between the bars and the openings, and forming the electrodes on the top surfaces and the reverse surfaces of the bars; and cutting the bars into the chips.
    • 一种用于制造半导体激光器件的方法,包括以下步骤:在内部结构的顶表面或衬底的背面中的任一个上以及内部结构的发光端面上形成窗口层; 在发光端面上形成反射膜; 通过使用几乎不蚀刻反射膜的蚀刻剂去除形成在顶表面或反面中的任一个上的窗口层; 并在通过蚀刻去除窗口层的表面上形成电极,并在另一表面上形成电极。 另一种制造半导体激光器件的方法包括以下步骤:在棒的发光端面上形成窗口层; 将棒插入具有用于形成电极的开口和用于防止棒与开口之间的位置偏移的支撑部的装置中,并且在棒的顶表面和相反表面上形成电极; 并将棒切成碎片。
    • 6. 发明公开
    • Ridge stripe type laser diode and method for fabricating the same
    • 激光镭射仪和Herstellungsverfahren。
    • EP0657977A3
    • 1995-12-27
    • EP94119425.0
    • 1994-12-08
    • NEC CORPORATION
    • Fujii, Hiroaki, c/o NEC Corporation
    • H01S3/19H01L33/00H01L21/20
    • B82Y20/00H01S5/2209H01S5/221H01S5/2231H01S5/34326Y10S148/095
    • A semiconductor laser diode of a ridge type includes a double heterostructure in which a cladding layer (2) is formed in a mesa stripe form and a current block layer (8) which selectively buries mesa side and bottom surfaces of the cladding layer (2). For fabrication, a first step is to grow, sequentially above a substrate, a second cladding layer (3), an active layer (4), a first cladding layer (5) and a cap layer (6). A second step is to etch the first cladding layer (5) and the cap layer (6) respectively in mesa stripe forms. A third step is to selectively grow current blocking layer (7) on the first cladding layer (5) by a metalorganic vapor phase epitaxy process. A fourth step is to grow contact layers respectively on surfaces of the current blocking layer (7) and the cap layer (6). In the third step, a gas in which HCl is mixed in a concentration within a range of 0.2∼2 in a (HCl)/(III gas) ratio is used, which enhances re-evaporation of material on a selective mask. Thus, the protrusion formed in the current blocking layer (7) at each of the mesa side surfaces can be suppressed to a thickness not larger than 10% of a thickness of the current blocking layer (7) at its flat portion. In this way, the stress caused by lattice mismatch at the mesa side portions can be suppressed.
    • 脊型半导体激光二极管包括其中以条状形式形成包层(2)的双异质结构和选择性地埋置包层(2)的台面侧和底表面的电流阻挡层(8) 。 为了制造,第一步骤是依次在衬底上生长第二包覆层(3),有源层(4),第一覆盖层(5)和覆盖层(6)。 第二步是分别以台条形式蚀刻第一包覆层(5)和盖层(6)。 第三步是通过金属有机气相外延法选择性地增加第一包层(5)上的电流阻挡层(7)。 第四步是分别在电流阻挡层(7)和盖层(6)的表面上生长接触层。 在第三步骤中,使用其中以(HCl)/(III气)比)浓度在0.2-2范围内混合HCl的气体,这增强了选择性掩模上材料的再蒸发。 因此,能够将形成在各台面侧的电流阻挡层(7)的突起的厚度抑制在不大于其平坦部的电流阻挡层(7)的厚度的10%的厚度。 以这种方式,可以抑制由台面侧部分的晶格失配引起的应力。