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1. 发明授权

EP4012425B1 HEATING DEVICE AND CONTROL METHOD OF LED 有权
公开(公告)号：EP4012425B1
公开(公告)日：2024-08-21
申请号：EP21212788.0
申请日：2021-12-07
IPC分类号： G01R31/28 , H01L21/67 , H05B45/18 , H05B47/28 , H05B3/00
CPC分类号： H01L21/67115 , H05B45/18 , H05B47/28 , H05B3/0047 , H01L21/67248 , G01R31/2875

2. 发明授权

EP3992645B1 PLACEMENT TABLE, TESTING DEVICE, AND TESTING METHOD 有权
公开(公告)号：EP3992645B1
公开(公告)日：2024-08-07
申请号：EP21204676.7
申请日：2021-10-26
IPC分类号： G01R31/28
CPC分类号： G01R31/2865 , G01R31/2875

3. 发明公开

EP2132580A4 ELECTRONICS TESTER WITH A SIGNAL DISTRIBUTION BOARD AND A WAFER CHUCK HAVING DIFFERENT COEFFICIENTS OF THERMAL EXPANSION 有权
标题翻译： ELEKTRONISCHER TESTER MIT SIGNALVERTEILER UND WAFERFUTTER MIT VERSCHIEDENENWÄRMEAUSDEHNUNGSKOEFFIZIENTEN
公开(公告)号：EP2132580A4
公开(公告)日：2012-12-19
申请号：EP08742563
申请日：2008-04-04
申请人： AEHR TEST SYSTEMS
发明人： LINDSEY SCOTT E , RICHMOND DONALD P , CALDERON ALBERTO , STEPS STEVEN C , DEBOE KENNETH W
IPC分类号： G01R31/02 , G01R31/28
CPC分类号： G01R31/2875 , G01R1/0491 , G01R31/2856 , G01R31/2863 , G01R31/2865 , G01R31/2879 , G01R31/2889

4. 发明公开

EP1611610A4 THERMAL APPARATUS FOR ENGAGING ELECTRONIC DEVICE 审中-公开
标题翻译： THERMISCHE VORRICHTUNGFÜRDEN BETRIEB EINER ELEKTRONISCHEN VORRICHTUNG
公开(公告)号：EP1611610A4
公开(公告)日：2006-09-06
申请号：EP04721069
申请日：2004-03-16
申请人： DELTA DESIGN INC
发明人： WAYBURN LEWIS A , MAHEFFEY CHARLES M , GAGE DEREK E , BARNES CYNTHIA M , SPEARING IAN G , SHARPLY TODD C
IPC分类号： H01L23/34 , F25B1/00 , F25B41/04 , F25B49/00 , F25D23/12 , F28D15/02 , G01R31/28 , G05D23/00 , H01L23/24 , H01L23/473 , H05K20060101 , H05K7/20
CPC分类号： F28D15/0266 , F28F2280/02 , G01R31/2865 , G01R31/2875 , G01R31/2891 , H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： An apparatus for controlling the temperature of an electronic device utilizes a thermal head attached to a base structure including an integral isolation arrangement. For example, the isolation arrangement can be formed as a planar spring defined by slots in the base structure. The base structure has a manifold configured to route refrigerant fluid between the thermal head and components of a refrigeration system. The isolation arrangement is normally planar but is movable to facilitate engagement of the thermal head with the electronic device. The isolation arrangement also compensates for variations in the planar orientation of the electronic device.
摘要翻译：一种用于控制电子设备的温度的设备利用附接到包括整体隔离装置的基部结构的热敏头。例如，隔离装置可以形成为由基部结构中的狭槽限定的平面弹簧。基座结构具有配置成在制冷系统的热头与部件之间引导制冷剂流体的歧管。隔离装置通常是平面的，但是可移动以便于热敏头与电子设备的接合。隔离装置还补偿电子设备的平面取向的变化。

5. 发明公开

EP0349042A2 Système de contrôle automatique de circuits intégrés 失效
标题翻译：系统，用于集成电路的自动控制。
公开(公告)号：EP0349042A2
公开(公告)日：1990-01-03
申请号：EP89201597.5
申请日：1989-06-19
申请人： LABORATOIRES D'ELECTRONIQUE PHILIPS , Philips Electronics N.V.
发明人： Binet, Michel Société Civile S.P.I.D.
IPC分类号： G01R31/28
CPC分类号： G01R31/2868 , G01R31/2862 , G01R31/2875
摘要： Système de contrôle automatique de circuits intégrés dans lequel la tranche de circuit intégré (10) à tester est supportée par un porte-échantillon (61) et reliée électriquement à une carte à pointes (60). Ce système comprend (a) une chambre (20) traversée par un flux de gaz sec et en surpression ; (b) un ensemble mécanique (40) de tables (41, 42, 43, 44) de commande des déplacements de la tranche à tester, avec interpolation d'une cale (46) thermiquement isolante entre ledit ensemble de tables et le porte-échantillon (61) ; (c) un dispositif (80) de refroidissement de porte-échantillon (61) interne au système et comprenant lui-même un réservoir (81) de fluide réfrigérant, un tube (83) se prolongeant dans ledit fluide pour conduire celui-ci vers une cavité (63) de refroidissement interne au porte-échantillon, et un dispositif (64, 65) d'évacuation du fluide gazeux apparu dans ladite cavité.
Application : tests de matériaux supraconducteurs

6. 发明公开

EP3343704A1 ELECTRICAL CONTACT AND SOCKET FOR ELECTRICAL COMPONENT 审中-公开
公开(公告)号：EP3343704A1
公开(公告)日：2018-07-04
申请号：EP16839142.3
申请日：2016-08-16
申请人： Enplas Corporation
发明人： ODA, Takahiro
IPC分类号： H01R13/03 , G01R1/073 , G01R31/26
CPC分类号： H01R13/03 , G01R1/0458 , G01R1/073 , G01R31/26 , G01R31/2875 , H01R2201/20
摘要： Contact pins are provided to a socket main body for accommodating an IC package so as to be in contact with connection terminals of the IC package accommodated in the socket main body. Each contact pin includes a conductive substrate and multiple layers laminated on the surface of the substrate, including: an underlying layer formed on the substrate by Ni plating; a first surface layer formed on the underlying layer by Pd-Ni alloy plating; a second surface layer formed on the first surface layer by Ni plating, thus allowing Sn from the corresponding connection terminal to diffuse into the second surface layer at a rate lower than into a conventional plated Ag layer; and an outermost surface layer formed on the second surface layer by Au plating to serve as an electrical contact layer.

7. 发明公开

EP3286618A1 DEVICE SPECIFIC THERMAL MITIGATION 审中-公开
公开(公告)号：EP3286618A1
公开(公告)日：2018-02-28
申请号：EP16716339
申请日：2016-03-22
申请人： QUALCOMM INC
发明人： DASNURKAR SACHIN DILEEP , DUSETY KRISHNA REDDY , BHADRI PRASAD RAJEEVALOCHANAM
IPC分类号： G06F1/20 , G06F1/32
CPC分类号： G01R31/2875 , G05B15/02 , G05D23/1917 , G05F1/66 , G06F1/206 , G06F1/3206 , Y02D10/16
摘要： Embodiments contained in the disclosure provide a method and apparatus for device specific thermal mitigation. The thermal and power behavior of the device, is characterized. A thermal threshold is then determined for the device. The thermal data and thermal ramp factor for each device are determined and stored in a cross-reference matrix. A correlation factor is determined for temperature and frequency. These correlation factors determine a device mitigation temperature. The device mitigation temperature may be stored in a fuse table on the device, with a fuse blown on the device to permanently store the device mitigation temperature. The apparatus includes: an electronic device, a memory within the electronic device, and a set of fuses within the electronic device. The device also includes means for determining if a static or dynamic frequency is high, and means for mitigating a voltage and frequency used by the device, based on that determination.

8. 发明公开

EP2940734A1 METHOD AND SYSTEM FOR TRANSIENT VOLTAGE SUPPRESSION DEVICES WITH ACTIVE CONTROL 有权转让
标题翻译：方法和系统的设备用于与主动控制瞬态电压降低
公开(公告)号：EP2940734A1
公开(公告)日：2015-11-04
申请号：EP15164717.9
申请日：2015-04-22
申请人： General Electric Company
发明人： Kashyap, Avinash Srikrishnan , Sandvik, Peter Micah , Kirstein, Joe Walter , Bolotnikov, Alexander Viktorovich
IPC分类号： H01L29/423 , H01L29/732 , H01L27/06 , H01L27/08 , H01L27/082 , H01L29/861 , H01L29/16
CPC分类号： H02H9/04 , G01R1/0458 , G01R31/2642 , G01R31/2874 , G01R31/2875 , G01R31/2891 , H01L21/02378 , H01L21/02529 , H01L21/76898 , H01L25/0657 , H01L25/50 , H01L27/0255 , H01L29/1608 , H01L29/423 , H01L29/42304 , H01L29/70 , H01L29/732 , H01L2225/06541 , H01L2924/0002 , H02H9/044 , H01L2924/00
摘要： A transient voltage suppression (TVS) device (102) and a method of forming the TVS device (102) are provided. The transient voltage suppression (TVS) device (102) includes a first layer (106) of wide band gap semiconductor material formed of a first conductivity type material, a second layer (108) of wide band gap semiconductor material formed of a second conductivity type material over at least a portion of the first layer (106), and a third layer (110) of wide band gap semiconductor material formed of the first conductivity type material over at least a portion of the second layer (108). The TVS device (102) also includes a conductive path (121) electrically coupled between the second layer (108) and an electrical connection to a circuit external to the TVS device (102), the conductive path (121) configured to permit controlling a turning on of the TVS device (102) at less than a breakdown voltage of the TVS device (102).
摘要翻译：本发明提供一种瞬态电压抑制（TVS）设备（102）和形成TVS设备（102）的方法。瞬态电压抑制（TVS）设备（102）包括形成形成的第二导电类型的宽带隙半导体材料的第一导电类型的材料，第二层（108）的宽带隙半导体材料的第一层（106）材料在第一层（106）的至少一部分，并且在该第二层（108）的至少一部分形成的第一导电类型的材料的宽带隙半导体材料的第三层（110）。 TVS器件（102），从而包括电耦接在所述第二层（108）之间和在外部的TVS设备（102）的电路电连接的导电通路（121），所述导电路径（121）被配置为允许控制在低于TVS设备（102）的击穿电压接通TVS设备（102）的。

9. 发明公开

EP2772768A1 Electronics tester with a signal distribution board and a wafer chuck having different coefficients of thermal expansion 有权
标题翻译： Elektronischer Tester mit Signalverteiler und Waferfutter mit verschiedenenWärmeausdehnungskoeffizienten
公开(公告)号：EP2772768A1
公开(公告)日：2014-09-03
申请号：EP14161272.1
申请日：2008-04-04
申请人： AEHR Test Systems
发明人： Lindsey, Scott, E. , Richmond, Donald, P. , Calderon, Alberto , Deboe, Kenneth, W. , Steps, Steven C.
IPC分类号： G01R31/02 , G01R31/28 , G01R1/04
CPC分类号： G01R31/2875 , G01R1/0491 , G01R31/2856 , G01R31/2863 , G01R31/2865 , G01R31/2879 , G01R31/2889
摘要： A tester apparatus of the kind including a portable pack (108) comprising a portable supporting structure (10 and 110) for removably holding and testing a substrate (82) carrying a microelectronic circuit. A plurality of lands (193) forming a first interface and a plurality of contacts (188) connected to the first interface are arranged on the portable supporting structure. An interface on the stationary structure is connected to the first interface when the portable structure is held by the stationary structure and is disconnected from the first interface when the portable supporting structure is removed from the stationary structure. An electrical tester is connected through the interfaces so that signals may be transmitted between the electrical tester and the microelectronic circuit to test the microelectronic circuit.
摘要翻译：一种包括便携式包装盒（108）的测试器装置，包括便携式支撑结构（10和110），用于可移除地保持和测试承载微电子电路的基板（82）。形成第一界面的多个平台（193）和连接到第一界面的多个触点（188）布置在便携式支撑结构上。当便携式结构由固定结构保持时，固定结构上的接口连接到第一接口，并且当便携式支撑结构从静止结构移除时，与第一接口断开连接。电气测试仪通过接口连接，从而可以在电测试器和微电子电路之间传输信号，以测试微电子电路。

10. 发明公开

EP1940213A2 Cooling assembly with direct cooling of active electronic components 审中-公开
标题翻译： KühlvorrichtungmitDirektkühlungaktiver elektronischer Komponenten
公开(公告)号：EP1940213A2
公开(公告)日：2008-07-02
申请号：EP08004223.7
申请日：2002-12-23
申请人： FormFactor, Inc.
发明人： Miller, Charles A.
IPC分类号： H05K7/20 , G01R31/28
CPC分类号： G01R31/2875 , G01R1/06733 , G01R1/07385 , G01R31/2863 , G01R31/2877 , G01R31/2886 , G01R31/2891 , H05K7/20218
摘要： The invention relates to a probe card assembly (300) comprising spring probe elements (305); and a package (400) coupled to the probe elements (305), wherein the package includes at least one die (430a-c) with active electronic components, the die (430a-c) electrically connected to the package by a plurality of first compliant interconnects (432a-c), wherein each of the first compliant interconnects is a structural element that is structurally distinct from each of the probe elements (305), and at least one coolant port (442, 444) that allows a coolant to enter the package (400) and directly cool the active electronic components of each die (430a-c) during a testing operation. Therein the probe elements (305) are directly connected to the package (400).
摘要翻译：本发明涉及一种包括弹簧探针元件（305）的探针卡组件（300）。以及耦合到所述探针元件（305）的封装（400），其中所述封装包括具有有源电子部件的至少一个管芯（430a-c），所述管芯（430a-c）通过多个第一（432a-c），其中每个第一顺应性互连是在结构上与每个探针元件（305）不同的结构元件，以及允许冷却剂进入的至少一个冷却剂端口（442,444）所述封装（400）并且在测试操作期间直接冷却每个管芯（430a-c）的有源电子部件。其中探针元件（305）直接连接到包装（400）。

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