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1. 发明公开

EP1842234A1 A BGA-TYPE TEST AND BURN-IN SOCKET FOR INTEGRATED CIRCUITS(ICS) 审中-公开
标题翻译：测试及BGA型集成电路烧伤-IN BASE（ICS）
公开(公告)号：EP1842234A1
公开(公告)日：2007-10-10
申请号：EP06700093.5
申请日：2006-01-09
申请人： Hwang, Dong Won
发明人： Hwang, Dong Won
IPC分类号： H01L21/66
CPC分类号： G01R1/0483 , G01R1/0458 , G01R1/0466 , G01R31/2863
摘要： Disclosed herein is a BGA-type test and burn-in socket for ICs. The socket includes contacts, a socket body, a cover, a slide, and an IC holder. The socket body has contact holes to receive the contacts, and positioning pins to secure the socket body to a PCB. A stopper, receiving a contact body, and a lead guide, guiding a contact lead, are provided on the lower portion of the socket body, and the slide and the cover are provided on the upper portion of the socket body. The cover includes holder rotating pins, and open cams and closure cams to move the slide. The slide includes open cam contact parts contacting the open cams when the cover is pressed down, and closure cam contact parts contacting the closure cams when the cover moves upwards. The IC holder moves downwards by the holder rotating pins, thus pressing an IC.

2. 发明公开

EP1604217A1 APPARATUS AND METHOD FOR COOLING OPTICALLY PROBED INTEGRATED CIRCUITS 审中-公开
标题翻译：设备和勾引用于冷却集成电路，光学检测过
公开(公告)号：EP1604217A1
公开(公告)日：2005-12-14
申请号：EP03783539.4
申请日：2003-11-14
申请人： Isothermal Systems Research, Inc. , Optonics, Inc.
发明人： TAHIR, Cader , NATHAN, Stoddard , DONALD, Tilton , NADER, Pakdaman167 Villa Street
IPC分类号： G01R31/316
CPC分类号： G01R31/2875 , G01R1/0458 , G01R31/2891
摘要： A combination cooling plate and micro-spray cooling system beneficial for use in testers of electrically stimulated integrated circuit chips is disclosed. The system includes a transparent heat spreader and micro-spray heads disposed about the heat spreader. The spray heads spray cooling liquid onto a periphery of said heat spreader so as to remove heat from the chip. Alternatively, and micro-spray heads are provided inside the cooling plate holder so as to spray cooling liquid inside the interior of the holder so that the holder is cooled. The holder is in physical contact with the heat spreader, so that as the holder is cooled by the spray, heat is removed from the heat spreader, and thereby from the chip.

3. 发明公开

EP0069592A1 Device for testing semiconductor devices at a high temperature 失效
标题翻译： Vorrichtung zumPrüfenvon Halbleitereinheiten bei einer hohen Temperatur。
公开(公告)号：EP0069592A1
公开(公告)日：1983-01-12
申请号：EP82303546.4
申请日：1982-07-06
申请人： FUJITSU LIMITED
发明人： Horiuchi, Akinori , Binnaka, Toshio , Maruyama, Shigeyuki
IPC分类号： G01R1/073 , G01R31/28
CPC分类号： G01R31/2877 , G01R1/0458
摘要： A device for testing semiconductor devices (5) at high temperatures comprises a heating portion where the semiconductor device (5) to be tested is heated to a predetermined temperature; a testing station; a chuck (6) for holding the semiconductor device (5) and means for moving the chuck (6) to convey the semiconductor device (5) held by the chuck (6) to the testing station. The chuck (6) includes a heating means (2) for heating the semiconductor device (5) and a temperature sensor (3). The device also includes temperature control means for controlling the temperature of the heating means (2) in response to the output of the temperature sensor (3).
摘要翻译：用于在高温下测试半导体器件（5）的器件包括加热部分，其中待测试的半导体器件（5）被加热到预定温度; 一个测试站; 用于保持半导体器件（5）的卡盘（6）和用于移动卡盘（6）以将由卡盘（6）保持的半导体器件（5）传送到测试台的装置。卡盘（6）包括用于加热半导体器件（5）和温度传感器（3）的加热装置（2）。该装置还包括用于响应于温度传感器（3）的输出来控制加热装置（2）的温度的温度控制装置。

4. 发明公开

EP3062117A1 METHOD OF CONTACTING INTEGRATED CIRCUIT COMPONENTS IN A TEST SYSTEM 有权
标题翻译：欧洲公民组织中的VERFAHREN ZUR KONTAKTIERUNG VON INTEGRIERTEN SCHALTKOMPONENTEN
公开(公告)号：EP3062117A1
公开(公告)日：2016-08-31
申请号：EP16164874.6
申请日：2013-06-14
申请人： Rasco GmbH
发明人： Croce, Karl
IPC分类号： G01R31/28 , G01R31/319 , G01R1/04
CPC分类号： G01R31/2881 , G01R1/0458 , G01R31/2862 , G01R31/2863 , G01R31/2874
摘要： The invention provides a method of contacting integrated circuit components in a test system for testing integrated circuit components comprises the steps of providing an atmosphere comprising an inert gas; and contacting tips of a contactor of the test system with respective contacting areas of an integrated circuit component to be tested, the contacting being performed in the provided atmosphere comprising the inert gas, characterized in that the inert gas has a temperature of at least 42°C; and a flow of the inert gas is directed and concentrated to the contact regions of the contact socket by means of nozzles provided in the contact socket. The invention further provides a test system for testing integrated circuit components
摘要翻译：本发明提供了一种接触用于测试集成电路部件的测试系统中的集成电路部件的方法，包括提供包括惰性气体的气氛的步骤; 以及将所述测试系统的接触器的尖端接触到待测试的集成电路部件的相应接触区域，所述接触在包括所述惰性气体的所提供的气氛中进行，其特征在于，所述惰性气体具有至少42°的温度 C; 并且通过设置在接触插座中的喷嘴将惰性气体流引导并集中到接触插座的接触区域。本发明还提供了一种用于测试集成电路部件的测试系统

5. 发明公开

EP1723438A4 BURN-IN TESTING APPARATUS AND METHOD 审中-公开
标题翻译： BURN-IN测试装置和方法
公开(公告)号：EP1723438A4
公开(公告)日：2011-08-03
申请号：EP05724298
申请日：2005-02-28
申请人： WELLS CTI LLC
发明人： LOPEZ CHRISTOPHER A , DENHEYER BRIAN J , KUENSTER GORDON B
IPC分类号： G01R31/02 , G01K1/02 , G01K1/16 , G01R1/04 , G01R31/28
CPC分类号： G01R1/0458 , G01K1/16

6. 发明公开

EP2138852A1 CONDUCTIVE CONTACT HOLDER AND CONDUCTIVE CONTACT UNIT 审中-公开
标题翻译：导电接触套和导电接触单元
公开(公告)号：EP2138852A1
公开(公告)日：2009-12-30
申请号：EP08739875.6
申请日：2008-04-04
申请人： NHK Spring Co., Ltd.
发明人： HIRONAKA, Kohei , NAKAMURA, Toru , KONDO, Mitsuhiro
IPC分类号： G01R1/073 , G01R31/26
CPC分类号： G01R1/0458 , G01R1/0466 , G01R1/0483 , G01R31/2874
摘要： Provided are a conductive contact holder and a conductive contact unit that enable a test to be performed in a precise temperature environment. For this objective, a construction includes a holder substrate (4) that individually receives plural conductive contacts, and a floating member (5) attached to the holder substrate (4) such that a distance from a surface of the holder substrate (4) is varied within a predetermined range by an external force. The floating member has plural hole sections into which a front end section of each of the conductive contacts (2) received in the holder substrate (4) is inserted. A gap (Sp) between the holder substrate (4) and the floating member (5) forms at least a part of a passage of fluid introduced from outside of the conductive contact holder.
摘要翻译：提供了一种能够在精确的温度环境下进行测试的导电触点支架和导电触点单元。为此目的，一种结构包括一个单独容纳多个导电接点的支架基板（4）和一个安装在支架基板（4）上的浮动元件（5），使得与支架基板（4）表面的距离为通过外力在预定范围内变化。浮动构件具有多个孔部分，容纳在保持器基板（4）中的每个导电触点（2）的前端部插入该多个孔部分中。保持基板（4）与浮动部件（5）之间的间隙（Sp）形成从导电性触头支架的外部导入的流体的流路的至少一部分。

7. 发明公开

EP1271156A2 Test/burn in socket assembly 审中-公开
标题翻译： Einbrenn-Testfassungsanordnung
公开(公告)号：EP1271156A2
公开(公告)日：2003-01-02
申请号：EP02077513.6
申请日：2002-06-25
申请人： Xpeqt AG
发明人： Dreesen,Raf , Croes,Kristof
IPC分类号： G01R1/04
CPC分类号： G01R31/2863 , G01R1/0433 , G01R1/0458
摘要： Improved socket assembly structures that reduce the thermally induced stresses on socket assemblies by a novel combination of socket frame structures, materials and methods of connecting the ceramic slabs, that receive a packaged integrated circuit, with the frame structures, where the socket assembly includes an upper slab mounted on a frame structure and where the upper slab is connected with the frame structure along only one edge of the slab, thus allowing a relative movement between the slab and the frame structure at least in a direction generally perpendicular to the one edge, the slab having a plurality of pin holes to receive the leads of an electronic package. Furthermore, certain embodiments of the present invention provide a stiffener that is attached to the underside of the circuit board to help reduce the thermally induced deflection of the circuit board during elevated temperature testing.
摘要翻译：改进的插座组件结构，其通过插座框架结构，将陶瓷板（其接收封装的集成电路）与框架结构连接的陶瓷板的新颖组合的新颖组合来减少插座组件上的热诱导应力，其中插座组件包括上部平板安装在框架结构上，并且上板与框架结构沿着板坯的一个边缘连接，从而允许板坯和框架结构之间的至少沿大致垂直于一个边缘的方向相对移动，板具有多个针孔以接收电子封装的引线。此外，本发明的某些实施例提供了一个加强件，其附接到电路板的下侧，以帮助在升高的温度测试期间减少电路板的热诱导偏转。

8. 发明公开

EP0465017A1 Integrated circuit test fixture and method 失效
标题翻译： Fixierung und Verfahren zum Test integrierter Schaltungen。
公开(公告)号：EP0465017A1
公开(公告)日：1992-01-08
申请号：EP91305227.0
申请日：1991-06-11
申请人： DIGITAL EQUIPMENT CORPORATION
发明人： Hamburgen, William Riis
IPC分类号： G01R31/28
CPC分类号： G01R1/0458 , G01R31/2877
摘要： A test fixture (10) for integrated circuits includes a wafer chuck (12). The chuck (12) has a plurality of concentrically arranged vacuum hold down rings (14) which communicate with top (18) of the chuck (12). Between the hold down rings (14) are a plurality of concentrically arranged helium gas supply rings (20), connected to a source of helium gas (22), and also communicating with top (18) of the chuck (12). An integrated circuit wafer (24) is mounted on the top (18) of the chuck (12), held in place by the vacuum hold down rings (14). Helium has a thermal conductivity five times that of air. Flow of helium gas in the helium supply rings (20) between the wafer (24) and the chuck (12) therefore reduces the interface thermal resistance between the wafer (24) and the chuck (12) as much as five times. A coolant supply tube (32) extends through the probe card (26), terminating proximate to the wafer (24), and is connected to a source of coolant (33), to assist the cooling.
摘要翻译：用于集成电路的测试夹具（10）包括晶片卡盘（12）。卡盘（12）具有与卡盘（12）的顶部（18）连通的多个同心布置的真空压紧环（14）。在所述压紧环（14）之间是多个同心配置的氦气供应环（20），其连接到氦气源（22），并且还与所述卡盘（12）的顶部（18）连通。集成电路晶片（24）安装在卡盘（12）的顶部（18）上，通过真空压紧环（14）保持就位。氦气的导热系数是空气的五倍。因此，晶片（24）和卡盘（12）之间的氦气供给环（20）中的氦气的流动将晶片（24）和卡盘（12）之间的界面热阻降低了五倍。冷却剂供给管（32）延伸穿过探针卡（26），接近晶片（24）终止，并且连接到冷却剂源（33），以帮助冷却。

9. 发明公开

EP4372388A1 A TEST SOCKET FOR AND METHOD OF TESTING ELECTRONIC COMPONENTS, IN PARTICULAR HIGH-POWER SEMICONDUCTOR COMPONENTS 审中-实审
公开(公告)号：EP4372388A1
公开(公告)日：2024-05-22
申请号：EP22208362.8
申请日：2022-11-18
申请人： Cohu GmbH
发明人： ENGELBRECHT, Stefan , PÖTZINGER, Johann , MEDERER, Christoph , WAGNER, Markus
IPC分类号： G01R1/04 , G01R1/073
CPC分类号： G01R1/0441 , G01R1/0458 , G01R1/07357
摘要： A test socket (100) for and a method of testing electronic components (190), in particular high-power semiconductor components comprise: a plurality of contact elements (110, 120, 130, 140), being adapted to contact to the electronic component; a holder block (150) for holding and arranging the plurality of contact elements, wherein each contact element of the plurality of contact elements comprises at least one conductive surface portion (112, 132); wherein the holder block comprises a plurality of electrically conductive support sections (156, 157), for supporting the conductive surface portions of the plurality of contact elements, wherein the plurality of support sections, makes electrical contact to the plurality of conductive surface portions by supporting the conductive surface portions, and wherein the holder block at least partially transmits a test signal.

10. 发明公开

EP3173801A1 HIGH-TEMPERATURE TEST FIXTURE 有权转让
标题翻译：高温试验装置
公开(公告)号：EP3173801A1
公开(公告)日：2017-05-31
申请号：EP14898170.7
申请日：2014-07-25
申请人： R&D Center Of Shanghai Institute Of Ceramics , Shanghai Institute of Ceramics, Chinese Academy of Sciences
发明人： TU, Xiaoniu , ZHENG, Yanqing , KONG, Haikuan , SHI, Erwei
IPC分类号： G01R27/02 , G01R27/04 , G01R1/04 , G01R31/00
CPC分类号： G01R31/281 , G01N27/041 , G01R1/0458 , G01R1/0491 , G01R19/225 , G01R27/02 , G01R2019/24
摘要： A high temperature fixture, said fixture comprising: at least three noble metal electrodes (11, 12, 13) arranged in parallel, among which two adjacent noble metal electrodes (11, 12 13) are used for clamping a test sample; noble metal wires (1, 2, 5) connected to the noble metal electrodes (11, 12, 13) at one end, and to a test device at the other end for transmitting test signals generated by the test sample to the test device through the noble metal electrodes (11, 12, 13); and a thermocouple for measuring the temperature of the test materials.
摘要翻译： 1。一种高温固定装置，所述固定装置包括：平行布置的至少三个贵金属电极（11,12,13），其中两个相邻的贵金属电极（11,12,13）用于夹持测试样本; 在一端连接到贵金属电极（11,12,13）的贵金属导线（1,2,5）和在另一端连接到测试装置的贵金属导线（1,2,5），用于通过测试样本将测试样本产生的测试信号传输到测试装置贵金属电极（11,12,13）; 和用于测量测试材料温度的热电偶。

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