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1. 发明公开

EP4362083A1 KÜHLEINRICHTUNG 审中-公开
公开(公告)号：EP4362083A1
公开(公告)日：2024-05-01
申请号：EP23204097.2
申请日：2023-10-17
申请人： Erwin Quarder Systemtechnik GmbH
发明人： Siewert, Georg , Bruns, Stefan , Heitbrink, Alexander
IPC分类号： H01L23/473
CPC分类号： H01L23/473
摘要： Die vorliegende Erfindung betrifft eine Kühleinrichtung zum Abführen von Wärme von zu kühlenden Gegenständen (12), wie etwa von Leistungselektronikmodulen, mit einem ersten Hybrid-Kühlbauteil (13), durch das Kühlfluid durchleitbar ist und das über einen insbesondere starren, fluiddicht mit einem Grundkörper aus Kunststoff des ersten Hybrid-Kühlbauteils (13) verbundenen, insbesondere plattenartigen Kühlkörper aus Metall oder einer Metalllegierung zur Anordnung an zu kühlenden Gegenständen (12) verfügt, und mit einem mit dem ersten Hybrid-Kühlbauteil (13) insbesondere lösbar verbundenen zweiten Hybrid-Kühlbauteil (14), durch das Kühlfluid leitbar ist und das mehrere, bevorzugt mindestens drei Kühlbauteilabschnitte aufweist, die insbesondere über Verbindungsgelenke (24, 25) (paarweise) gelenkig miteinander verbunden sind und über jeweils einen, vorzugsweise plattenartigen Kühlkörper aus Metall oder einer Metalllegierung zur Anordnung an zu kühlenden Gegenständen (12) verfügen, der mit einem Grundkörper aus Kunststoff des zweiten Hybrid-Kühlbauteils (14) fluiddicht verbunden ist, wobei die beiden Hybrid-Kühlbauteile (13, 14) unter Bildung eines zwischen ihnen angeordneten Aufnahmeraums für zu kühlenden Gegenstände (12) mit Abstand zueinander positioniert und miteinander insbesondere lösbar verbunden sind.

2. 发明公开

EP3427071A1 SYSTEM AND METHOD FOR TEMPERATURE FORCING WITH CONDUCTIVE THERMAL PROBES 审中-公开
公开(公告)号：EP3427071A1
公开(公告)日：2019-01-16
申请号：EP17709304.4
申请日：2017-02-24
申请人： Temptronic Corporation
发明人： ELSDOERFER, Norbert
IPC分类号： G01R1/04 , G01R31/28 , G05D23/19 , G05D23/22 , F28D15/00
CPC分类号： G01R31/2874 , F28D15/00 , F28F3/12 , F28F2200/00 , G01R1/067 , G05D23/192 , G05D23/22 , H01L23/473
摘要： A temperature-controlled fluid forcing system includes a temperature control system generating a stream of flowing temperature-controlled fluid. A heat exchanger includes a thermally conductive housing within which a plurality of walls define a shaped flow space. The stream of temperature-controlled fluid flows through the shaped flow space and is in thermal communication with the housing. A thermally conductive probe is in thermal communication with the exterior of the housing of the heat exchanger, the thermally conductive probe comprising a thermally conductive protrusion in thermal communication with the exterior of the housing of the heat exchanger, such that, when the thermally conductive probe makes contact with a device under test (DUT), heat is conducted to or from DUT.

3. 发明公开

EP3417229A1 HIGH EFFICIENCY HEAT DISSIPATION METHODS AND SYSTEMS FOR ELECTRONIC CIRCUITS AND SYSTEMS 审中-公开
公开(公告)号：EP3417229A1
公开(公告)日：2018-12-26
申请号：EP17752781.9
申请日：2017-02-17
申请人： IRONSIDE ENGINEERING, INC.
发明人： Matte, Eric , Strentse, Matthew
IPC分类号： F28F7/02 , F25D31/00 , F28D1/03 , F28D9/02 , F28F3/00 , H01L23/46 , H05K7/20
CPC分类号： H05K7/20409 , F28D1/03 , F28D2021/0031 , F28F3/025 , F28F3/06 , H01L23/3677 , H01L23/467 , H01L23/473 , H01M8/04067 , H05K7/20263 , H05K7/20509
摘要： A fluidic thermal exchange element adapted to cool a heat generating component includes a thermal conductive element having a first surface that thermally contacts the heat generating component and a second surface having fins in a cell configuration. A cover is fluidically sealed relative to the thermal conductive element to form a cavity and has first and second fluid access points arranged relative to the fins such that cooled fluid flowing from the first access point to the second access point in the cavity interacts with the fins and acquires thermal energy therefrom to create heated fluid at the second access point. A modular radiator receives the heated fluid from the second access point and cools the fluid to create the cooled fluid for recirculation to the first access point. The modular radiator has a plurality of fluid-fluid thermal coupling elements (FFTCEs), each including first and second fluid thermal interface elements disposed in a frame. A plurality of the FFTCEs are stacked upon each other between top and bottom plates to mechanically restrain the FFTCEs, and the top plate comprises a first fluid access port for accepting the heated fluid and directing the heated fluid to flow through access channels in the respective frames of the FFTCEs to provide heat exchange with the respective FFTCEs to provide the cooled fluid at a second fluid access port that is connected to the first fluid access point.

4. 发明授权

EP2977705B1 HEAT TRANSFER PLATE 有权
公开(公告)号：EP2977705B1
公开(公告)日：2018-12-12
申请号：EP15176914.8
申请日：2015-07-15
申请人： Hamilton Sundstrand Space Systems International, Inc.
发明人： STRANGE, Jeremy M. , DIEP, Chuong H. , BANACH, Thomas E.
IPC分类号： F28F3/12 , H01L23/46 , F28D1/02 , F28F3/04 , F28D1/03 , F28F1/08
CPC分类号： F28F1/08 , B23P15/26 , F28D1/0246 , F28D1/0316 , F28F3/048 , F28F3/12 , F28F2255/18 , H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： A heat transfer device includes a body (101) defining fluid inlet (103) and fluid outlet (105). The body further defines a plurality of channels (107) defined within the body in fluid connection between the fluid inlet and the fluid outlet, wherein the channels are fluidly isolated from one another between the fluid inlet and the fluid outlet.

5. 发明公开

EP3407692A1 POWER MODULE, POWER MODULE ASSEMBLY AND ASSEMBLING METHOD THEREOF 审中-公开
公开(公告)号：EP3407692A1
公开(公告)日：2018-11-28
申请号：EP18168444.0
申请日：2018-04-20
申请人： Delta Electronics (Thailand) Public Co., Ltd.
发明人： HUANG, Zhenrong , YOU, Peiai , SUN, Hao
IPC分类号： H05K7/20 , H01L23/40
CPC分类号： H05K7/20927 , H01L23/367 , H01L23/4006 , H01L23/4093 , H01L23/473 , H01L25/115 , H01L25/50 , H01L2023/4031 , H01L2023/405 , H01L2023/4081 , H01L2023/4087 , H02M7/003 , H05K1/181 , H05K5/0008 , H05K5/0204 , H05K7/20327 , H05K7/2049 , H05K7/209 , H05K2201/09063 , H05K2201/1003 , H05K2201/1006 , H05K2201/10166 , H05K2201/10393 , H05K2201/10409 , H05K2201/10522
摘要： The present disclosure provides a power module (lb), a power module assembly (1, 1a) and an assembling method thereof. The power module assembly (1, 1a) includes a housing (2), a resilient bracket (3, 3a), a circuit board (4), a power device (5) and a fastening unit (6). The housing (2) includes a first heat-dissipation surface (21). The resilient bracket (3, 3a) is pre-fastened on the housing (2). The resilient bracket (3, 3a) is located near the first heat-dissipation surface (21) and configured with the first heat-dissipation surface (21) to form an accommodating space (7). The circuit board (4) is configured to assemble on the housing (2). The power device (5) is plugged in the circuit board (4) and accommodated in the accommodating space (7). The fastening unit (6) is pre-fastened on the housing (2) and pressing the resilient bracket (3, 3a). While the resilient bracket (3, 3a) pushes against the power device (5), the power device (5) is attached to the first heat-dissipation surface (21).

6. 发明公开

EP3405976A1 ELECTROHYDRODYNAMIC CONTROL DEVICE 审中-公开
公开(公告)号：EP3405976A1
公开(公告)日：2018-11-28
申请号：EP17741738.3
申请日：2017-01-20
申请人： APR Technologies AB
发明人： THORSLUND, Robert , NILSSON, Peter , BJÖRNEKLETT, Are
IPC分类号： H01L23/467 , F04B19/00 , F28F13/16
CPC分类号： F04B19/00 , F04B17/00 , F04B17/03 , F04B19/006 , F04B49/06 , F04B53/00 , F28F13/16 , F28F2250/08 , H01L23/473
摘要： A fluidic deviceis disclosed, comprisingan enclosed passage that is adapted to convey a circulating fluid. The enclosed passage comprises a flow unit having a first electrode anda second electrode offset fromthe first electrode in a downstream direction of a flow of the circulating fluid. The first electrode is formed as a grid structure and arranged to allow the circulating fluid to flow through the first electrode.The fluidic device may be used for controlling or regulating the flow of the fluid circulating in the enclosed passage, and thereby act as a valve opening, reducing or even closing the passage.

7. 发明公开

EP3404711A1 INTEGRATED POWER SEMICONDUCTOR PACKAGING APPARATUS AND POWER CONVERTER 审中-公开
公开(公告)号：EP3404711A1
公开(公告)日：2018-11-21
申请号：EP18169391.2
申请日：2018-04-26
申请人： General Electric Company
发明人： MAO, Saijun , QU, Bo , SHI, Jingkui , XU, He , SHEN, Jie , LAN, Lin , LI, Rui , YUAN, Zhihui , WADDELL, Alistair Martin , SCHROEDER, Stafan , MECHLINSKI, Marius Michael , CHAN, Mark Aaron Chan
IPC分类号： H01L23/473 , H01L25/07
CPC分类号： H01L23/473 , H01L23/367 , H01L25/072
摘要： The present disclosure relates to an integrated power semiconductor packaging apparatus (200) and a power converter containing the integrated power semiconductor packaging apparatus (200). The integrated power semiconductor packaging apparatus comprises a plurality of power semiconductor devices (231-238) and an electrically insulative substrate (250) formed integrally. The electrically insulative substrate comprises a flat surface, at least one separation wall (2511,2513,2515,2517) protruding from the flat surface and a flow channel (2530) inside the electrically insulative substrate (250). The at least one separation wall (2511,2513,2515,2517) is configured to separate the flat surface into a plurality of flat areas (2521), and each of the plurality of flat areas is configured to receive one of the plurality of power semiconductor devices (231-238). The flow channel (2530) is configured for allowing a coolant flowing through to remove heat from the plurality of power semiconductor devices (231-238).

8. 发明公开

EP3401955A1 PLUG-IN CONNECTOR WITH A COOLING JACKET 审中-公开
公开(公告)号：EP3401955A1
公开(公告)日：2018-11-14
申请号：EP17170805.0
申请日：2017-05-12
申请人： ODU GmbH & Co KG.
发明人： Leitl, Josef , Huber, Bernhard , Spitzenberger, Dieter , Mitter, Alfred
IPC分类号： H01L23/473 , H02K5/20 , H02K9/19 , H01B7/42
CPC分类号： B60L11/1818 , H01L23/473 , H01R13/111 , H01R13/533 , H01R2201/26
摘要： A plug-in connector is described. The plug-in connector comprises a contact element with a connector element and at least one terminal connector and a cooling jacket with a first fluid port adapted for fluidically connecting the cooling jacket with a first tube and a second fluid port adapted for fluidically connecting the cooling jacket with a second tube. The cooling jacket further comprises a connecting sleeve for accommodating the contact element, wherein the cooling jacket is manufactured in one piece and wherein the cooling jacket is made of a polymeric material. An outer surface of the contact element is encompassed by the connecting sleeve in a fluid-tight manner, wherein the connector element is at least partly exposed to the outside of the cooling jacket and wherein the at least one terminal connector is at least partly disposed in the interior of the cooling jacket. The at least one terminal connector is configured for being electrically connected with at least one electrical wire that is introducible into the cooling jacket via at least one of the fluid ports.

9. 发明授权

EP2289098B1 LIQUID COOLER AND METHOD OF ITS MANUFACTURE 有权
公开(公告)号：EP2289098B1
公开(公告)日：2018-11-14
申请号：EP09766946.9
申请日：2009-06-16
申请人： Sapa Profiles (Shanghai) Ltd.
发明人： HOU, Jin , TUOVINEN, Seppo , LITTLER, David , WANG, Yamin
IPC分类号： H01L23/473 , H05K7/20 , F28F3/12 , F28F3/04
CPC分类号： H05K7/20254 , F28F3/048 , F28F3/12 , F28F2255/16 , H01L23/473 , H01L2924/0002 , Y10T29/4935 , H01L2924/00
摘要： A liquid cooler including a heat sink. A hollow body is produced by extrusion having at least one flat outer surface between a first and a second end. At least one elongated cavity passes through the body from the first to the second end. The hollow body includes a plurality of parallel fins directed into and along the at least one cavity. An insert housed in the at least one cavity connects the tops of the fins in a fluid-tight manner thereby forming liquid channels for a coolant liquid between the insert and the hollow body. A lid is attached at both ends of the hollow body for forming a liquid cooling system.

10. 发明公开

EP3376536A1 FLOW PATH MEMBER AND SEMICONDUCTOR MODULE 有权
公开(公告)号：EP3376536A1
公开(公告)日：2018-09-19
申请号：EP16875804.3
申请日：2016-12-16
申请人： Kyocera Corporation , Toshiba Materials Co., Ltd.
发明人： ISHIMINE, Yuusaku , MUNEISHI, Takeshi , FUJIO, Kazuhiko , FUKUDA, Yoshiyuki , TAKANAMI, Kentaro , SHIRAI, Takao
IPC分类号： H01L23/473 , H05K7/20 , F28F13/02
CPC分类号： H01L23/473 , C04B35/587 , F28F13/02 , F28F21/04 , F28F2255/20 , H01L23/36 , H05K7/20
摘要： A flow path member includes silicon nitride ceramics, the flow path member being provided with an inlet port; an outlet port; and a flow path connected to the inlet port and the outlet port inside the flow path member, wherein a plurality of needle-shaped crystals which exist on a surface of the flow path, intersect each other.

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