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    • 10. 发明公开
    • PROBE DEVICE
    • 探针设备
    • EP2980838A1
    • 2016-02-03
    • EP14774764.6
    • 2014-03-18
    • Tokyo Electron Limited
    • SHINOHARA, EiichiNAGASAKA, MunetoshiTAOKA, KenKATO, Yoshiyasu
    • H01L21/66
    • G01R31/26G01R1/07314G01R1/07342G01R1/07378G01R3/00G01R31/2886G01R31/2887
    • A probe device includes an electrode plate arranged above a mounting table for mounting thereon a semiconductor wafer and electrically connected to a tester, a contact probe arranged at a side of the mounting table and electrically connected to a mounting table electrode of the mounting table. The contact probe includes a contact portion, having a top surface formed unenven, to be in contact with the electrode plate, and a cable connection portion formed as one unit with the contact portion. The contact portion and the cable connection portion are vertically movable by a biasing member provided below the cable connection portion. When the probes are made contact with electrodes of a semiconductor device of the semiconductor wafer by moving up the mounting table, the contact portion and the electrode plate are made contact with each other and the backside electrode and the tester are electrically connected to each other.
    • 本发明提供一种探针装置,其包括:配置在载置台上的电极板,其用于载置半导体晶片并与测试器电连接;接触探针,其配置在载置台的一侧,与载置台的载置台电极电连接。 接触探针包括接触部分和电缆连接部分,所述接触部分具有未形成的顶部表面,所述接触部分与所述电极板接触,所述电缆连接部分与所述接触部分形成为一个单元。 接触部分和电缆连接部分通过设置在电缆连接部分下方的偏置构件可垂直移动。 当通过向上移动安装台使探针与半导体晶片的半导体器件的电极接触时,接触部分和电极板彼此接触,并且背侧电极和测试器彼此电连接。