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1. 发明授权

EP3992645B1 PLACEMENT TABLE, TESTING DEVICE, AND TESTING METHOD 有权
公开(公告)号：EP3992645B1
公开(公告)日：2024-08-07
申请号：EP21204676.7
申请日：2021-10-26
IPC分类号： G01R31/28
CPC分类号： G01R31/2865 , G01R31/2875

2. 发明公开

EP2859365A1 AN ASSEMBLY FOR TESTING THE PERFORMANCE OF A COMPONENT 审中-公开
标题翻译：安排测试组件的性能
公开(公告)号：EP2859365A1
公开(公告)日：2015-04-15
申请号：EP13735051.8
申请日：2013-07-11
申请人： ISMECA Semiconductor Holding SA
发明人： ROY, Philippe , EME, Thierry
IPC分类号： G01R31/28
CPC分类号： G01M99/008 , G01M99/004 , G01R31/2865 , G01R31/2881
摘要： According to the present invention there is provided an assembly for testing performance of a component, the assembly comprising, a rotatable turret which comprises a plurality of component handling heads each of which can hold a component; a rotatable head assembly, the rotatable head assembly comprising, a rotatable head, wherein the rotatable head comprises one or more nests, each of which has an electrical contact, and each of which is suitable for receiving a component such that the component can electrically connect to the electrical contact of that nest; wherein the nest is further configured such that it can hold a component such that the component remains electrically connected to the electrical contact, as the rotatable head rotates; wherein the rotatable head is arranged to be adjacent the turret so that a component can be passed directly from a component handling head on the rotatable turret to a nest on the rotatable head; a processor which is arranged in electrical communication with the electrical contact(s) of the one or more nests on the rotatable head such that the processor can, both, send command signals to a component held in a nest which cause the component to operate in a predefined manner, and receive response signals from the component which are generated by the component when the component operates in the predefined manner, while the component is rotated by the rotatable head, and wherein the processor is configured to determine the performance of the component from the response signals it receives. There is further provided a corresponding method.

3. 发明公开

EP2132580A4 ELECTRONICS TESTER WITH A SIGNAL DISTRIBUTION BOARD AND A WAFER CHUCK HAVING DIFFERENT COEFFICIENTS OF THERMAL EXPANSION 有权
标题翻译： ELEKTRONISCHER TESTER MIT SIGNALVERTEILER UND WAFERFUTTER MIT VERSCHIEDENENWÄRMEAUSDEHNUNGSKOEFFIZIENTEN
公开(公告)号：EP2132580A4
公开(公告)日：2012-12-19
申请号：EP08742563
申请日：2008-04-04
申请人： AEHR TEST SYSTEMS
发明人： LINDSEY SCOTT E , RICHMOND DONALD P , CALDERON ALBERTO , STEPS STEVEN C , DEBOE KENNETH W
IPC分类号： G01R31/02 , G01R31/28
CPC分类号： G01R31/2875 , G01R1/0491 , G01R31/2856 , G01R31/2863 , G01R31/2865 , G01R31/2879 , G01R31/2889

4. 发明公开

EP1611610A4 THERMAL APPARATUS FOR ENGAGING ELECTRONIC DEVICE 审中-公开
标题翻译： THERMISCHE VORRICHTUNGFÜRDEN BETRIEB EINER ELEKTRONISCHEN VORRICHTUNG
公开(公告)号：EP1611610A4
公开(公告)日：2006-09-06
申请号：EP04721069
申请日：2004-03-16
申请人： DELTA DESIGN INC
发明人： WAYBURN LEWIS A , MAHEFFEY CHARLES M , GAGE DEREK E , BARNES CYNTHIA M , SPEARING IAN G , SHARPLY TODD C
IPC分类号： H01L23/34 , F25B1/00 , F25B41/04 , F25B49/00 , F25D23/12 , F28D15/02 , G01R31/28 , G05D23/00 , H01L23/24 , H01L23/473 , H05K20060101 , H05K7/20
CPC分类号： F28D15/0266 , F28F2280/02 , G01R31/2865 , G01R31/2875 , G01R31/2891 , H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： An apparatus for controlling the temperature of an electronic device utilizes a thermal head attached to a base structure including an integral isolation arrangement. For example, the isolation arrangement can be formed as a planar spring defined by slots in the base structure. The base structure has a manifold configured to route refrigerant fluid between the thermal head and components of a refrigeration system. The isolation arrangement is normally planar but is movable to facilitate engagement of the thermal head with the electronic device. The isolation arrangement also compensates for variations in the planar orientation of the electronic device.
摘要翻译：一种用于控制电子设备的温度的设备利用附接到包括整体隔离装置的基部结构的热敏头。例如，隔离装置可以形成为由基部结构中的狭槽限定的平面弹簧。基座结构具有配置成在制冷系统的热头与部件之间引导制冷剂流体的歧管。隔离装置通常是平面的，但是可移动以便于热敏头与电子设备的接合。隔离装置还补偿电子设备的平面取向的变化。

5. 发明公开

EP0841572A2 Wafer-level burn-in system 失效
标题翻译：烧制系统auf Wafer-Ebene
公开(公告)号：EP0841572A2
公开(公告)日：1998-05-13
申请号：EP97308888.3
申请日：1997-11-05
申请人： W.L. GORE & ASSOCIATES, INC.
发明人： Budnaitis, John J. , Leong, Jimmy
IPC分类号： G01R31/316
CPC分类号： G01R31/2865 , G01R1/06761 , G01R1/07314 , G01R3/00 , G01R31/2831 , G01R31/2863
摘要： The present invention relates to a system and method for performing reliability screening on semi-conductor wafers and particularly to a highly planar burn in apparatus and method for uses including wafer level burn-in (WLBI), diced die burn-in (DDBI), and packaged die burn-in (PDBI). The burn-in system includes a burn-in substrate with a planar base. a temporary Z-axis connecting member, and a Z-axis wafer level contact sheet electrically coupled to one another for screening wafers, diced die, and packaged electronic components, their assembly and use.
摘要翻译：本发明涉及一种用于对半导体晶片执行可靠性筛选的系统和方法，特别涉及用于包括晶片级老化（WLBI），切割模具老化（DDBI），和封装模具老化（PDBI）。老化系统包括具有平面基座的老化基板。一个临时的Z轴连接构件和一个Z轴晶片级接触片，它们彼此电连接，用于筛选晶片，切割模具和封装的电子部件，它们的组装和使用。

6. 发明公开

EP2980840A4 PROBE DEVICE 有权
标题翻译： SONDENVORRICHTUNG
公开(公告)号：EP2980840A4
公开(公告)日：2016-12-07
申请号：EP14776367
申请日：2014-03-18
申请人： TOKYO ELECTRON LTD
发明人： HATTA MASATAKA
IPC分类号： G01R31/28 , G01R1/18 , H01L21/66
CPC分类号： G01R31/2874 , G01R1/18 , G01R31/2865 , G01R31/2891
摘要： A probe device, for performing an electrical test of a semiconductor device formed on a semiconductor wafer, includes a mounting table on which the semiconductor wafer is mounted, a driving mechanism configured to bring a probe into contact with an electrode of the semiconductor device mounted on the mounting table, and a temperature control mechanism configured to control a temperature of the mounting table. The mounting table includes a disk-shaped first electrode, a disk-shaped second electrode, and a disk-shaped insulating plate interposed between the first electrode and the second electrode. The first electrode, the second electrode and the insulating plate are fixed to each other at a fixing part provided at their respective centers, and are locked to be movable in a diametric direction at a locking part provided at an outer side of the fixing part in the diametric direction.
摘要翻译：一种用于对形成在半导体晶片上的半导体器件进行电测试的探针装置，包括安装有半导体晶片的安装台，驱动机构，其配置成使探针与安装在该半导体晶片上的半导体器件的电极接触安装台和配置成控制安装台的温度的温度控制机构。安装台包括盘形第一电极，盘形第二电极和插在第一电极和第二电极之间的盘形绝缘板。第一电极，第二电极和绝缘板在设置在其各自中心处的固定部分彼此固定，并且被锁定以在设置在固定部分的外侧的锁定部分处沿直径方向可移动直径方向。

7. 发明授权

EP2812713B1 NEST FOR TESTING ELECTRICAL COMPONENTS 有权
标题翻译：容器测试电器元件
公开(公告)号：EP2812713B1
公开(公告)日：2015-11-25
申请号：EP12795810.6
申请日：2012-12-05
申请人： ISMECA Semiconductor Holding SA
发明人： VIENOT, Sylvain , VIVERGE, Philippe , SCARPELLA, Massimo , ROY, Philippe
IPC分类号： G01R31/28 , G01R1/04 , G01R31/26
CPC分类号： G01R1/0408 , G01R31/2635 , G01R31/2865 , G01R31/2893

8. 发明授权

EP2577334B1 HIGH VOLTAGE CHUCK FOR A PROBE STATION 有权转让
标题翻译：高压衬砌计算探针台
公开(公告)号：EP2577334B1
公开(公告)日：2015-03-04
申请号：EP11792822.6
申请日：2011-04-11
申请人： Cascade Microtech, Inc.
发明人： SIMMONS, Michael, E. , NEGISHI, Kazuki , JENSEN, Roy , GARRISON, Ryan , WOLF, Philip
IPC分类号： G01R31/26 , G01R31/28 , H01L21/683
CPC分类号： H01L21/6838 , G01R31/2601 , G01R31/2865 , G01R31/2874 , Y10T279/11 , Y10T279/34
摘要： A chuck for testing an integrated circuit includes an upper conductive layer having a lower surface and an upper surface suitable to support a device under test. An upper insulating layer has an upper surface at least in partial face-to-face contact with the lower surface of the upper conductive layer, and a lower surface. A middle conductive layer has an upper surface at least in partial face-to-face contact with the lower surface of the upper insulating layer, and a lower surface.

9. 发明公开

EP1455388A1 RELIABILITY EVALUATION TESTER, RELIABILITY EVALUATION TEST SYSTEM, CONTACTOR, AND RELIABILITY EVALUATION TEST METHOD 有权
标题翻译：系统VERFAHREN ZURZUVERLÄSSIGKEITSBEWERTUNG
公开(公告)号：EP1455388A1
公开(公告)日：2004-09-08
申请号：EP02788667.0
申请日：2002-11-27
申请人： TOKYO ELECTRON LIMITED , Kabushiki Kaisha Toshiba , IBIDEN CO., LTD.
发明人： Takekoshi, Kiyoshi, TOKYO ELECTRON AT LIMITED , Hosaka, Hisatomi, TOKYO ELECTRON AT LIMITED , Hagihara, Junichi, TOKYO ELECTRON AT LIMITED , Hatsushika, Kunihiko, TOKYO ELECTRON AT LIMITED , Usui, Takamasa , Kaneko, Hisashi , Hayasaka, Nobuo , Ido, Yoshiyuki
IPC分类号： H01L21/66
CPC分类号： G01R31/2862 , G01R1/0433 , G01R1/0491 , G01R31/2831 , G01R31/286 , G01R31/2865 , G01R31/2867 , G01R31/287 , G01R31/2886
摘要： A reliability evaluation test apparatus (10) of this invention includes a wafer storage section (12) which stores a wafer (W) in a state wherein the electrode pads of a number of devices formed on the wafer and the bumps of a contactor (11) are totally in electrical contact with each other. The wafer storage section (12) transmits/receives a test signal to/from a measurement section (15) and has a hermetic and heat insulating structure. The wafer storage section (12) has a pressure mechanism (13) which presses the contactor (11) and a heating mechanism (14) which directly heats the wafer (W) totally in contact with the contactor (11) to a predetermined high temperature. The reliability of an interconnection film and insulating film formed on the semiconductor wafer are evaluated under an accelerated condition.
摘要翻译：本发明的可靠性评价试验装置（10）包括晶片储存部（12），其存储晶片（W）的状态，其中形成在晶片上的多个器件的电极焊盘和接触器（11 ）彼此完全电接触。晶片存储部分（12）向/从测量部分（15）发送/接收测试信号，并具有密封和隔热结构。晶片储存部分（12）具有压力接触器（11）的压力机构（13）和将与接触器（11）完全接触的晶片（W）直接加热至预定高温的加热机构（14）。在加速条件下评估形成在半导体晶片上的互连膜和绝缘膜的可靠性。

10. 发明公开

EP1445620A1 Wafer-level burn-in or testing method using a burn-in or test cartridge 审中-公开
标题翻译：烘焙方法（预烧），或测试的晶片，其使用盒进行烘烤或测试
公开(公告)号：EP1445620A1
公开(公告)日：2004-08-11
申请号：EP04008959.1
申请日：2000-07-13
申请人： AEHR TEST SYSTEMS, INC.
发明人： Uher, Frank Otto , Andberg, John William , Carbone, Mark Charles , Richmond, Donald Paul II
IPC分类号： G01R31/316 , G01R31/28 , G01R1/04
CPC分类号： G01R1/0491 , G01R31/2806 , G01R31/2831 , G01R31/2863 , G01R31/2865 , G01R31/2867 , G01R31/2886 , H05K3/4691
摘要： A cartridge (10) includes a chuck plate (12) for receiving a wafer (74) and a probe plate (14) for establishing electrical contact with the wafer. In use, a mechanical connecting device (90) locks the chuck plate and the probe plate fixed relative to one another to maintain alignment of the wafer and the probe plate. Preferably, electrical contact with the wafer is established using a probe card (50) that is movably mounted to the probe plate by means of a plurality of leaf springs (52). The mechanical connecting device is preferably a kinematic coupling including a male connector (94) and a first and second opposed jaws (122, 124). Each of the jaws is pivotable from a retracted position in which the male connector can be inserted between the jaws and an engaging position in which the jaws prevent withdrawal of the male connector from between the jaws. The male connector is movable between an extended and retracted position, and is biased towards the retracted position. This provides a positive clamping force that pulls the chuck and probe plates together when the mechanical connecting device is engaged. To leaf a wafer into the cartridge, the wafer is placed on the chuck plate, the probe plate is aligned with the wafer, and the chuck plate and the probe plate are locked together. The cartridge can then be removed from the alignment device and placed in a burn-in or test chamber that does not itself require means for aligning the wafer or for providing a probe actuation force.
摘要翻译：的盒（10），包括：用于接收晶片（74）和用于建立与所述晶片的电接触的样品板（14）的卡盘板（12）。板在使用中，机械连接装置（90）锁定所述卡盘板和所述样品板固定相对于彼此保持在晶片和探针的对准。优选地，与晶片的电接触使用探针卡（50）那样通过板簧的多个（52）的装置是可移动地安装到探针板建立的。机械连接装置优选地是包括凸型连接器（94）和第一和第二相对的钳口（122，124）的运动的耦合。每个夹爪从缩回位置，其中阳连接器可以在夹爪和卡合位置，其中夹爪防止阳连接器的撤出从钳口之间之间插入能够枢轴。阳连接器是延长的，在缩回位置之间可移动的，并且朝向所述缩回位置偏压。这提供了一个正的夹紧力并拉动卡盘和样品板一起。当机械连接装置接合。到叶的晶片到盒中，晶片被放置在卡盘板，所述样品板与晶片对准，并且该卡盘板和所述样品板被锁定在一起。盒然后可从所述对准装置取出并在老化测试室放置或做本身不要求装置，用于对准所述晶片或用于提供样品的致动力。

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