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1. 发明公开

EP2343959A2 Cooler and display device having the same 有权转让
标题翻译：冷却器和显示设备具有相同的功能
公开(公告)号：EP2343959A2
公开(公告)日：2011-07-13
申请号：EP10177476.8
申请日：2010-09-17
申请人： SAMSUNG ELECTRONICS CO., LTD.
发明人： Lee, Moon-chul , Kim, Min-soo , Lee, Yong-soo , Kim, Sru
IPC分类号： H05K7/20
CPC分类号： H05K7/20972 , F04D25/166 , F04D29/441 , F04D29/444 , F05D2250/52 , H05K7/20172
摘要： A cooler and a display device including the cooler. The cooler includes: a housing; an air blowing unit disposed inside the housing and sucking external air and blowing the external air in the housing, wherein the air blowing unit includes a plurality of groups each including two air blowers; a guide vane disposed above the air blowing unit and to guide air flowed out from the air blowing unit to flow in different directions; and a plurality of auxiliary guide vanes disposed between the air blowing unit and the guide vane, and each disposed in each of the groups each including two air blowers, so as to guide air flowing below the air blowing unit to flow toward the guide vane.
摘要翻译：冷却器和包括该冷却器的显示装置。该冷却器包括：壳体; 设置在所述壳体内并且吸入外部空气并将所述外部空气吹入所述壳体内的鼓风单元，其中所述鼓风单元包括多个组，每个组包括两个鼓风机; 引导叶片，所述引导叶片设置在所述鼓风单元上方并且引导从所述鼓风单元流出的空气沿不同的方向流动; 以及多个辅助导向叶片，设置在所述鼓风单元和所述导向叶片之间，并且每个辅助导向叶片设置在每个包括两个鼓风机的组中，以引导在所述鼓风单元下方流动的空气流向所述导向叶片。

2. 发明授权

EP1750370B1 Monolithic duplexer and fabrication method thereof 有权
标题翻译：单片双工器和过程及其制备
公开(公告)号：EP1750370B1
公开(公告)日：2009-12-09
申请号：EP06253822.8
申请日：2006-07-20
申请人： Samsung Electronics Co., Ltd.
发明人： Sul, Sang-chul, 901-406 Byeokjeokgol , Kim, Chul-soo , Kim, Duck-hwan, 505-803 Hosu-maeul , Song, In-sang , Lee, Moon-chul , Jung, Kyu-dong , Shin, Jea-shik
IPC分类号： H03H9/10 , H03H3/02
CPC分类号： H03H3/02 , H03H9/0571 , H03H9/706

3. 发明公开

EP1908593A1 Inkjet printhead and method of manufaturing the same 审中-公开
标题翻译：喷墨打印头及其制造方法
公开(公告)号：EP1908593A1
公开(公告)日：2008-04-09
申请号：EP07103109.0
申请日：2007-02-27
申请人： Samsung Electronics Co., Ltd.
发明人： Shim, Dong-sik , Yoon, Yong-seop , Lee, Moon-chul , Jun, Chan-bong , Choi, Hyung , Jeong, Yong-won
IPC分类号： B41J2/14 , B41J2/16
CPC分类号： B41J2/1404 , B41J2/1603 , B41J2/1626 , B41J2/1631
摘要： There are provided an inkjet printhead and a method of manufacturing the same. The inkjet printhead includes a substrate through which an ink feed hole for supplying ink is formed; a chamber layer stacked above the substrate and including a plurality of ink chambers filled with ink supplied from the ink feed hole; and a nozzle layer stacked on the chamber layer, wherein a plurality of nozzles through which ink is ejected and a plurality of via holes are formed in the nozzle layer.
摘要翻译：提供了一种喷墨打印头及其制造方法。喷墨打印头包括基板，通过该基板形成用于供应墨水的供墨孔; 腔室层，所述腔室层堆叠在所述基板上方并且包括填充有从所述供墨孔供应的墨水的多个墨室; 以及堆叠在所述腔室层上的喷嘴层，其中喷射墨水的多个喷嘴和多个通孔形成在所述喷嘴层中。

4. 发明公开

EP1783902A2 Wafer level package for surface acoustic wave device and fabrication method thereof 审中-公开
标题翻译：壳体在表面声波装置和方法，用于其生产的晶片级
公开(公告)号：EP1783902A2
公开(公告)日：2007-05-09
申请号：EP06013871.6
申请日：2006-07-04
申请人： Samsung Electronics Co., Ltd.
发明人： Lim, Ji-hyuk , Hwang, Jun-sik , Kim, Woon-bae , Ham, Suk-jin , Kwon, Jong-oh , Lee, Moon-chul , Moon, Chang-youl
IPC分类号： H03H9/10 , H03H3/08
CPC分类号： H03H9/1092
摘要： A wafer level package for a surface acoustic wave device (100) and a fabrication method thereof include a SAW device (110) formed with a SAW element (112) on an upper surface of a device wafer (111); a cap wafer (120) joined on an upper part of the SAW element; a cavity part (130) housing the SAW element between the cap wafer and the SAW device; a cap pad (121) formed on an upper surface of the cap wafer; and a metal line (122) formed to penetrate through the cap wafer to electrically connect the cap pad and the SAW element, the device wafer and the cap wafer being made of the same materials.
摘要翻译：晶圆级封装的表面声波装置（100）和制造方法，可以举出与上到装置晶片（111）的上表面上的SAW元件（112）形成的SAW器件（110）; 盖晶片（120）接合到SAW元件的上部; 的空腔部分（130）容纳所述帽晶片和SAW器件之间的SAW元件; 形成在所述帽晶片的上表面上的盖焊盘（121）; 以及形成通过所述帽晶片渗透到电连接帽垫和SAW元件，器件晶片和盖晶片的金属线（122）由相同的材料制成。

5. 发明公开

EP1618958A2 Sample processing apparatus and method using vacuum chamber 审中-公开
标题翻译： Probenverarbeitungsvorrichtung und Verfahren mit einer Vakuumkammer
公开(公告)号：EP1618958A2
公开(公告)日：2006-01-25
申请号：EP05254588.6
申请日：2005-07-22
申请人： Samsung Electronics Co., Ltd.
发明人： Park, Tae-sik, 331-203 Byucksan Apt. , Kang, Jung-ho, 1-408 Samsung 3rd Apt. , Lee, sung-hee, 602-303 Punglim Apt. , Kim, Young-il, 109-403 Cheoncheon Racmian , Lee, Moon-chul
IPC分类号： B01L3/00
CPC分类号： B01L3/50273 , B01L3/502715 , B01L2200/10 , B01L2300/049 , B01L2400/049 , B01L2400/06
摘要： A bio sample processing apparatus and method using vacuum chambers in which a bio sample is injected into a first vacuum chamber connected with one end of a bio processor and, after processing, is ejected into a second vacuum chamber connected with the other end of the bio processor. The vacuum chambers and bio processor are connected with each other to form an environment with a pressure lower than atmospheric pressure, and the bio sample moves toward the second vacuum chamber due to the pressure difference created by the injection of the bio sample into the first vacuum chamber.
摘要翻译：一种使用真空室的生物样品处理装置和方法，其中将生物样品注入与生物处理器的一端连接的第一真空室中，并且在处理之后被喷射到与生物体的另一端连接的第二真空室中处理器。真空室和生物处理器相互连接以形成压力低于大气压力的环境，并且生物样品由于将生物样品注入第一真空产生的压差而向第二真空室移动室。

6. 发明公开

EP1544165A2 Method for gyroscope using SMS wafer and gyroscope fabricated by the same 审中-公开
标题翻译： SMS-Wafer verendendes Herstellungsverfahren eines Kreisels，und damit hergestellter Kreisel。
公开(公告)号：EP1544165A2
公开(公告)日：2005-06-22
申请号：EP04256530.9
申请日：2004-10-22
申请人： Samsung Electronics Co., Ltd.
发明人： Lee, Moon-chul , Kang, Seok-JIn , Choi, Hyung
IPC分类号： B81C1/00 , B81B3/00 , G01C19/56
CPC分类号： G01C19/5769 , B81B3/0035 , B81B2201/0242 , B81C1/00579 , B81C1/0092 , B81C1/00936 , H01R13/52 , Y10T29/49002 , Y10T29/49005 , Y10T29/4902 , Y10T74/12 , Y10T74/1229
摘要： Method for fabricating a gyroscope including: fabricating a SMS wafer where a first wafer, a metal film, and a second wafer are sequentially stacked; forming a cantilever or a bridge shaped-structure on the relevant portion of the first wafer through the photolithography process; attaching to the surface of the first wafer, a first cap made of glass and having a predetermined space for sealing the movable structure in a vacuum state; separating and removing the metal film and the second wafer from the first wafer; and attaching to the backside of the first wafer, the second cap which is structurally and materially symmetric to the first cap. The SMS wafer is fabricated by depositing the metal film on the second wafer and bonding the first wafer on the metal film using metal paste or material of polymer series. With lower material costs, improvements in performance and characteristics can be achieved.
摘要翻译：制造陀螺仪的方法，包括：制造顺序堆叠第一晶片，金属膜和第二晶片的SMS晶片; 通过光刻工艺在第一晶片的相关部分上形成悬臂或桥形结构; 附接到第一晶片的表面，由玻璃制成的第一盖，并且具有用于在真空状态下密封可移动结构的预定空间; 从第一晶片分离和去除金属膜和第二晶片; 并且附接到第一晶片的背面，第二盖与第一盖结构和物理对称。通过在第二晶片上沉积金属膜并使用金属浆料或聚合物系列材料将第一晶片接合在金属膜上来制造SMS晶片。随着材料成本的降低，可以实现性能和特性的提高。

7. 发明公开

EP1434031A2 Mems gyroscope and fabrication method thereof 审中-公开
标题翻译： Mems-Kreisel und sein Herstellungsverfahren
公开(公告)号：EP1434031A2
公开(公告)日：2004-06-30
申请号：EP03258036.7
申请日：2003-12-19
申请人： Samsung Electronics Co., Ltd.
发明人： Kang, Seok-jin , Lee, Moon-chul , Chung, Seok-whan , Jung, Kyu-dong , Hong,, Seog-woo
IPC分类号： G01C19/56 , G01P9/04
CPC分类号： G01C19/5762 , B81B3/0059 , B81B2201/0242 , B81B2203/051 , B81B2203/053
摘要： A vertical MEMS gyroscope operated by horizontal driving includes a substrate, a support layer fixed on an upper surface of an area of the substrate, a driving structure floating above the substrate and having a portion fixed to the upper surface of the support layer and another portion in parallel with the fixed portion, the driving structure having a predetermined area capable of vibrating in a predetermined direction parallel to the substrate, a detection structure fixed to the driving structure on a same plane as the driving structure, and having a predetermined area capable of vibrating in a vertical direction with respect to the substrate, a cap wafer bonded with the substrate positioned above the driving structure and the detection structure, and a fixed vertical displacement detection electrode formed at a predetermined location of an underside of the cap wafer, for detecting displacement of the detection structure in the vertical direction.
摘要翻译：通过水平驱动操作的垂直MEMS陀螺仪包括：基板，固定在基板区域的上表面上的支撑层，浮动在基板上方的驱动结构，并且具有固定到支撑层上表面的部分和另一部分与固定部分平行地，驱动结构具有能够在平行于基板的预定方向上振动的预定区域，在与驱动结构相同的平面上固定到驱动结构的检测结构，并且具有能够相对于基板在垂直方向上振动，与位于驱动结构上方的基板接合的盖晶片和检测结构，以及形成在盖晶片的下侧的预定位置处的固定垂直位移检测电极，用于检测检测结构在垂直方向的位移。

8. 发明公开

EP1270505A2 Anti-stiction method and apparatus for drying wafer using centrifugal force 审中-公开
标题翻译：抗逆转录病毒和Vorrichtung zum Trocknen von Wafern，死Zentrifugalkraft verwendet
公开(公告)号：EP1270505A2
公开(公告)日：2003-01-02
申请号：EP02014541.3
申请日：2002-07-01
申请人： SAMSUNG ELECTRONICS CO., LTD.
发明人： Cho, Jin-woo , Lee, Moon-chul , Lee, Eun-sung
IPC分类号： B81B3/00
CPC分类号： H01L21/67034 , B81C1/00928
摘要： An anti-stiction method and apparatus for drying a wafer using a centrifugal force is provided. The anti-stiction method includes the steps of (a) removing a sacrificial layer stacked between the wafer and the micro structure, using an etching solution, (b) rinsing the etched micro structure and the etched wafer in a rinse solution for a predetermined time so that the etching solution between the micro structure and the wafer is replaced with the rinse solution, and (c) mounting the rinsed wafer in a mounting unit connected to a rotation axis and eliminating the rinse solution left between the wafer and the micro structure by the rotation of the axis. The wafer is mounted in the mounting unit in a vertical position so that the micro structure faces outwards from the rotation axis. Accordingly, a stiction phenomenon between the micro structure manufactured by a MEMS process and the wafer in a drying process can be prevented.
摘要翻译：提供了一种使用离心力干燥晶片的防静电方法和装置。抗静电方法包括以下步骤：（a）使用蚀刻溶液去除叠置在晶片和微结构之间的牺牲层，（b）在冲洗溶液中冲洗蚀刻的微结构和蚀刻的晶片达预定时间使得微结构和晶片之间的蚀刻溶液被冲洗溶液代替，并且（c）将冲洗的晶片安装在连接到旋转轴线的安装单元中，并且通过以下步骤消除晶片和微结构之间留下的冲洗溶液：轴的旋转。晶片以垂直位置安装在安装单元中，使得微结构从旋转轴线向外。因此，可以防止由MEMS工艺制造的微结构与干燥工艺中的晶片之间的静电现象。

9. 发明公开

EP1946928A3 Ink-jet printhead and manufacturing method thereof 审中-公开
标题翻译：喷墨打印头及其制造方法
公开(公告)号：EP1946928A3
公开(公告)日：2010-04-14
申请号：EP07119758.6
申请日：2007-10-31
申请人： Samsung Electronics Co., Ltd.
发明人： Kwon, Myoung-jong , Park, Sung-joon , Lee, Moon-chul
IPC分类号： B41J2/14 , B41J2/16
CPC分类号： B41J2/1603 , B41J2/1606 , B41J2/1628 , B41J2/1631 , B41J2/1639 , B41J2/1645
摘要： An inkjet printhead and a method of manufacturing the printhead. The inkjet printhead includes a substrate through which an ink supply passage is formed, a chamber plate stacked on the substrate having an ink chamber filled with ink supplied through the ink supply passage and heating resistors to heat the ink formed in the ink chamber, a nozzle plate formed on the chamber plate and through which a plurality of nozzles through which ink is ejected are formed, and a water repellent layer formed on the nozzle plate, wherein portions of a covalent bond formed by reaction between the material forming the nozzle plate and a hydrolysis material used to form the water repellent layer are discontinuously formed.

10. 发明授权

EP1688994B1 Wafer level packaging cap and fabrication method thereof 有权
标题翻译：模具格罗斯盖帽及其制备方法
公开(公告)号：EP1688994B1
公开(公告)日：2008-08-13
申请号：EP06000605.3
申请日：2006-01-12
申请人： Samsung Electronics Co., Ltd.
发明人： Lee, Moon-chul , Kim, Woon-bae , Back, Kae-dong , Wang, Qian Samsung Advanced Instit. of Technology , Hwang, Jun-sik , Jung, Kyu-dong
IPC分类号： H01L23/48
CPC分类号： B81C1/00301 , B81B2207/095 , H01L21/76898 , H01L23/04 , H01L23/10 , H01L23/481 , H01L2924/0002 , H01L2924/00
摘要： A wafer level packaging cap and method thereof for a wafer level packaging are provided. The wafer level packaging cap covering a device wafer with a device thereon, includes a cap wafer having on a bottom surface a cavity providing a space for receiving the device, and integrally combined with the device wafer, a plurality of metal lines formed on the bottom surface of the cap wafer to correspond to a plurality of device pads formed on the device wafer to be electrically connected to the device, a plurality of buffer portions connected to the plurality of metal lines and comprising a buffer wafer with a plurality of grooves and a metal filled in the plurality of grooves, a plurality of connection rods electrically connected to the plurality of buffer portions and penetrating the cap wafer from a top portion of the buffer portion, and a plurality of cap pads formed on a top surface of the cap wafer and electrically connected to a plurality of connection rods.

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