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1. 发明公开

EP1946928A3 Ink-jet printhead and manufacturing method thereof 审中-公开
标题翻译：喷墨打印头及其制造方法
公开(公告)号：EP1946928A3
公开(公告)日：2010-04-14
申请号：EP07119758.6
申请日：2007-10-31
申请人： Samsung Electronics Co., Ltd.
发明人： Kwon, Myoung-jong , Park, Sung-joon , Lee, Moon-chul
IPC分类号： B41J2/14 , B41J2/16
CPC分类号： B41J2/1603 , B41J2/1606 , B41J2/1628 , B41J2/1631 , B41J2/1639 , B41J2/1645
摘要： An inkjet printhead and a method of manufacturing the printhead. The inkjet printhead includes a substrate through which an ink supply passage is formed, a chamber plate stacked on the substrate having an ink chamber filled with ink supplied through the ink supply passage and heating resistors to heat the ink formed in the ink chamber, a nozzle plate formed on the chamber plate and through which a plurality of nozzles through which ink is ejected are formed, and a water repellent layer formed on the nozzle plate, wherein portions of a covalent bond formed by reaction between the material forming the nozzle plate and a hydrolysis material used to form the water repellent layer are discontinuously formed.

2. 发明授权

EP1688994B1 Wafer level packaging cap and fabrication method thereof 有权
标题翻译：模具格罗斯盖帽及其制备方法
公开(公告)号：EP1688994B1
公开(公告)日：2008-08-13
申请号：EP06000605.3
申请日：2006-01-12
申请人： Samsung Electronics Co., Ltd.
发明人： Lee, Moon-chul , Kim, Woon-bae , Back, Kae-dong , Wang, Qian Samsung Advanced Instit. of Technology , Hwang, Jun-sik , Jung, Kyu-dong
IPC分类号： H01L23/48
CPC分类号： B81C1/00301 , B81B2207/095 , H01L21/76898 , H01L23/04 , H01L23/10 , H01L23/481 , H01L2924/0002 , H01L2924/00
摘要： A wafer level packaging cap and method thereof for a wafer level packaging are provided. The wafer level packaging cap covering a device wafer with a device thereon, includes a cap wafer having on a bottom surface a cavity providing a space for receiving the device, and integrally combined with the device wafer, a plurality of metal lines formed on the bottom surface of the cap wafer to correspond to a plurality of device pads formed on the device wafer to be electrically connected to the device, a plurality of buffer portions connected to the plurality of metal lines and comprising a buffer wafer with a plurality of grooves and a metal filled in the plurality of grooves, a plurality of connection rods electrically connected to the plurality of buffer portions and penetrating the cap wafer from a top portion of the buffer portion, and a plurality of cap pads formed on a top surface of the cap wafer and electrically connected to a plurality of connection rods.

3. 发明公开

EP1619697A3 Low-loss inductor device and fabrication method thereof 有权
标题翻译：低损耗电感装置和方法，用于制备它们的
公开(公告)号：EP1619697A3
公开(公告)日：2006-03-22
申请号：EP05014684.4
申请日：2005-07-06
申请人： SAMSUNG ELECTRONICS CO., LTD.
发明人： Lee, Moon-chul , Choi, Hyung
IPC分类号： H01F17/00
CPC分类号： H01L27/08 , H01F17/0006 , H01F17/02 , H01F27/027 , H01F2017/002 , H01F2017/008
摘要： An inductor device having an improved quality factor is provided. To obtain the improved quality factor, the inductor device includes a substrate etched away at predetermined intervals; first and second inductors formed on the top and bottom of the substrate, respectively; and first and second protection packages for shielding the first and second inductors, respectively, from outside. The first and second inductors are formed in a symmetrical structure with respect to the substrate, and the inductor device further includes connection parts for electrically connecting the first and second inductors. Further, the inductor device has air gaps between the substrate, first inductor, and second inductor in order for the first and second inductors to be exposed in the air, and the first protection package has an electrode layer formed thereon at predetermined positions to supply electric currents to the inductor device.

4. 发明公开

EP1602896A2 Gyro-sensor comprising a plurality of component units, and fabricating method thereof 审中-公开
标题翻译：具有用于其制备多个组件单元的过程和陀螺仪传感器
公开(公告)号：EP1602896A2
公开(公告)日：2005-12-07
申请号：EP05253351.0
申请日：2005-06-01
申请人： SAMSUNG ELECTRONICS CO., LTD.
发明人： Park, Tae-sik, 331-203, Byucksan Apt. , Moon, Chang-youl , Lee, Moon-chul
IPC分类号： G01C19/56
CPC分类号： B81C1/0023 , B81B2207/07 , G01C19/56 , H01L2224/16225
摘要： Provided are a gyro-sensor including a plurality of component units and a method of fabricating the gyro-sensor. The gyro-sensor includes: a substrate; a micro electro mechanical system structure including a surface including a predetermined area in which a cavity is formed and connected to an upper surface of the substrate to output a vibration signal proportional to an external rotation force; and a circuit unit positioned in the cavity, converting the vibration signal into a predetermined electric signal proportional to a circular angular velocity, and outputting the predetermined electric signal.

5. 发明公开

EP1591774A1 Apparatus and method for the detection of biomolecules 审中-公开
标题翻译：装置和方法，用于检测生物分子的
公开(公告)号：EP1591774A1
公开(公告)日：2005-11-02
申请号：EP05252603.5
申请日：2005-04-26
申请人： SAMSUNG ELECTRONICS CO., LTD.
发明人： Park, Tae-sik, 331-203 Byucksan Apartment , Won, Jong-hwa , Kang, Jung-ho , Kim, Young-il , Lee, Moon-chul
IPC分类号： G01N27/02 , G01N27/22 , C12Q1/68
CPC分类号： G01N27/3275 , G01N33/48792
摘要： An apparatus and method for detecting biomolecules by measuring a variation of an electrical characteristic of a circuit having an inductance device and a capacitance device. The method comprises providing a signal converting unit having at least one inductance device and at least one capacitance device connected with each other, disposing a biochip, which has capturing probe biomolecules attached to a substrate, at a location in the signal converting unit, and measuring an electrical characteristic of the signal converting unit, performing a coupling reaction of the biochip and a sample to be analyzed; and measuring an electrical characteristic of the signal converting unit after the coupling reaction.

6. 发明公开

EP1344746A3 MEMS device and fabrication method thereof 有权
标题翻译： MEMS器件和它们的制备方法
公开(公告)号：EP1344746A3
公开(公告)日：2005-03-02
申请号：EP03251321.0
申请日：2003-03-05
申请人： SAMSUNG ELECTRONICS CO., LTD.
发明人： Lee, Eun-sung , Kim, Chung-woo, 101-705 Park Town Daelim Apt. , Song, In-sang , Kim, Jong-seok , Lee, Moon-chul
IPC分类号： B81C1/00 , B81B3/00
CPC分类号： B81B3/0078 , B81B2201/014 , B81B2203/0118 , B81B2203/0307 , B81B2203/04 , B81C2201/0107 , B81C2201/014 , H01H59/0009
摘要： A method for fabricating a MEMS device having a fixing part, driving part, electrode part, and contact parts on a substrate. A driving electrode is formed on the substrate, and then an insulation layer is formed thereon. The insulation layer is patterned, and the regions of the insulation layer in which the fixing part and the contact parts are formed are etched. A metal layer is formed on the substrate. The metal layer is planarized down to the insulation layer, and the driving electrode is formed. A sacrificial layer is formed on the substrate, and a groove-shaped space is formed in a region in which the fixing part is formed. A MEMS structure layer is formed on the sacrificial layer. Sidewalls are formed in the groove-shaped space, and the fixing part and driving part are formed, leaving the sacrificial layer underneath the fixing part.

7. 发明公开

EP1419990A2 Method of forming a via hole through a glass wafer 有权
标题翻译：一种用于制备在晶片中的通孔的过程由玻璃制成
公开(公告)号：EP1419990A2
公开(公告)日：2004-05-19
申请号：EP03256961.8
申请日：2003-11-04
申请人： SAMSUNG ELECTRONICS CO., LTD.
发明人： Lee, Moon-chul , Choi, Hyung , Jung, Kyu-dong , Jang, Mi
IPC分类号： B81B1/00
CPC分类号： B81C1/00087 , H01L21/486 , H01L23/13 , H01L2924/0002 , H01L2924/00
摘要： A method of forming a via hole through a glass wafer includes depositing a material layer (110) on an outer surface of the glass wafer, the material layer having a selection ratio higher than that of the glass wafer (200), forming a via-patterned portion on one side of the material layer, performing a first etching in which the via-patterned portion is etched to form a preliminary via hole (130), eliminating any remaining patterning material (120) used in the formation of the via-patterned portion, performing a second etching in which the preliminary via hole (130) is etched to form a via hole (130') having a smooth surface and extending through the glass wafer, and eliminating the material layer (110). The method according to the present invention is able to form a via hole through a glass wafer without allowing formation of an undercut or minute cracks, thereby increasing the yield and reliability of MEMS elements.

8. 发明公开

EP1418154A2 Method and apparatus for vacuum-mounting a micro electro mechanical system on a substrate 审中-公开
标题翻译：对方法和装置真空安装在衬底上的微机电系统
公开(公告)号：EP1418154A2
公开(公告)日：2004-05-12
申请号：EP03256889.1
申请日：2003-10-30
申请人： Samsung Electronics Co., Ltd.
发明人： Jung, Kyu-dong , Choi, Hyung , Jun, Chan-bong , Kang, Seok-jin , Hong, Seog-woo , Chung, Seok-whan , Lee, Moon-chul , Lee, Eun-sung
IPC分类号： B81C5/00 , B81C1/00
CPC分类号： B81C1/00285
摘要： A method and apparatus for vacuum-mounting at least one micro electro mechanical system (MEMS) on a substrate includes a gas injecting section for injecting an inert gas into a vacuum chamber; a substrate aligning section for aligning a semiconductor substrate and a cover, the cover having a cavity formed therein and a getter attached to an interior surface of the cavity; a bonding section for bonding the semiconductor substrate and the cover together; and a controlling section for controlling the substrate aligning section to align the semiconductor and the cover, for controlling the gas injecting section to inject the inert gas into the vacuum chamber, and for controlling the bonding section to bond the semiconductor substrate and the cover together after the inert gas is injected.
摘要翻译：上的基片用于真空安装至少一个微机电系统的方法和装置（MEMS）包括用于惰性气体注入到真空室中注入部的气体; 用于对准半导体衬底和盖对准部一基底，具有空腔形成于其中盖和吸气剂附着于所述空腔的内表面上; 用于粘结半导体衬底和盖一起的接合部分; 以及控制部分，用于控制对准部以对准半导体和盖，用于控制注入部至所述惰性气体注入到真空室中的气体底物，以及用于控制所述接合部分接合所述半导体衬底和盖一起后该惰性气体被注入。

9. 发明公开

EP1325884A2 MEMS structure having a blocked-sacrificial layer support/anchor and a fabrication method of the same 有权
标题翻译： MEMS-Struktur，eine verkappteOpferschichtstütze/ Anker enthaltend，und Verfahren zu deren Herstellung
公开(公告)号：EP1325884A2
公开(公告)日：2003-07-09
申请号：EP02258592.1
申请日：2002-12-13
申请人： SAMSUNG ELECTRONICS CO., LTD.
发明人： Lee, Eun-sung , Lee, Moon-chul , Kim, Hyun-ok
IPC分类号： B81B3/00
CPC分类号： B81B3/0078 , B81B2203/0307 , B81C2201/0109
摘要： A fabrication method for a MEMS structure, the MEMS structure including a fixing portion fixed to the substrate and a floating portion floating above the substrate. A sacrificial layer deposited on the substrate is patterned to have a groove forming a space surrounding the area corresponding to the area in which the fixing portion is to be formed. If the MEMS structure is deposited on the sacrificial layer, a sidewall is formed inside the space and the fixing portion and the floating portion are formed on the sacrificial layer. If the sacrificial layer is removed using an etchant, the sacrificial layer at the bottom of the fixing portion is protected from the etchant by the sidewall and accordingly, the sacrificial layer except the area surrounded by the sidewall is removed. Therefore, only the sacrificial layer under the floating portion is removed. Because the connecting portion is fabricated to have the same thickness as the fixing portion and the floating portion, a strong/durable MEMS structure is provided. Additionally, the boundary between the fixing portion and the floating portion can be precisely determined, and adjustment of the length of the floating portion can be precisely controlled.
摘要翻译：一种用于MEMS结构的制造方法，所述MEMS结构包括固定到所述基板的固定部分和浮置在所述基板上方的浮动部分。沉积在基板上的牺牲层被图案化成具有形成围绕与要形成固定部分的区域相对应的区域的空间的凹槽。如果MEMS结构沉积在牺牲层上，则在空间内形成侧壁，并且在牺牲层上形成固定部分和浮动部分。如果使用蚀刻剂去除牺牲层，则固定部分底部的牺牲层被侧壁保护而不受蚀刻剂的影响，因此除去由侧壁包围的区域之外的牺牲层。因此，只有在浮动部分下面的牺牲层被去除。由于连接部分被制造成具有与固定部分和浮动部分相同的厚度，所以提供了强/耐久的MEMS结构。此外，可以精确地确定固定部分和浮动部分之间的边界，并且可以精确地控制浮动部分的长度的调节。

10. 发明公开

EP2343959A2 Cooler and display device having the same 有权转让
标题翻译：冷却器和显示设备具有相同的功能
公开(公告)号：EP2343959A2
公开(公告)日：2011-07-13
申请号：EP10177476.8
申请日：2010-09-17
申请人： SAMSUNG ELECTRONICS CO., LTD.
发明人： Lee, Moon-chul , Kim, Min-soo , Lee, Yong-soo , Kim, Sru
IPC分类号： H05K7/20
CPC分类号： H05K7/20972 , F04D25/166 , F04D29/441 , F04D29/444 , F05D2250/52 , H05K7/20172
摘要： A cooler and a display device including the cooler. The cooler includes: a housing; an air blowing unit disposed inside the housing and sucking external air and blowing the external air in the housing, wherein the air blowing unit includes a plurality of groups each including two air blowers; a guide vane disposed above the air blowing unit and to guide air flowed out from the air blowing unit to flow in different directions; and a plurality of auxiliary guide vanes disposed between the air blowing unit and the guide vane, and each disposed in each of the groups each including two air blowers, so as to guide air flowing below the air blowing unit to flow toward the guide vane.
摘要翻译：冷却器和包括该冷却器的显示装置。该冷却器包括：壳体; 设置在所述壳体内并且吸入外部空气并将所述外部空气吹入所述壳体内的鼓风单元，其中所述鼓风单元包括多个组，每个组包括两个鼓风机; 引导叶片，所述引导叶片设置在所述鼓风单元上方并且引导从所述鼓风单元流出的空气沿不同的方向流动; 以及多个辅助导向叶片，设置在所述鼓风单元和所述导向叶片之间，并且每个辅助导向叶片设置在每个包括两个鼓风机的组中，以引导在所述鼓风单元下方流动的空气流向所述导向叶片。

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