专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明公开

EP2239127A4 IMPRINTING DEVICE AND IMPRINTING METHOD 有权
公开(公告)号：EP2239127A4
公开(公告)日：2011-06-22
申请号：EP08863432
申请日：2008-12-25
申请人： SCIVAX CORP
发明人： TAKAYA YOSHIAKI , HASHIMA YUJI , HAYASHIDA YOSHIHISA , KAWAGUCHI HIROSUKE , TANAKA SATORU , KANAI AKIHIKO , UEHARA KAZUAKI
IPC分类号： B29C59/02 , B29C33/40 , B81C99/00 , H01L21/027 , B81C5/00
CPC分类号： B29C59/022 , B29C33/42 , B29C2035/0822 , B29C2059/023 , B82Y10/00 , B82Y40/00 , G03F7/0002

2. 发明公开

EP2262722A1 INTEGRATED MICRONEEDLE ARRAY AND A METHOD FOR MANUFACTURING THEREOF 有权转让
标题翻译：积微针结构及其制造方法
公开(公告)号：EP2262722A1
公开(公告)日：2010-12-22
申请号：EP09719983.0
申请日：2009-03-11
申请人： STW (Stichting voor de Technische Wetenschappen) , Universiteit Twente
发明人： LÜTTGE, Regina , BYSTROVA, Svetlana Nikolajevna , VAN BENNEKOM, Joost Gerardus , DOMANSKI, Maciej , LOETERS, Patrick Wilhelmus Hendrikus , LAMMERTINK, Rob Gerhardus Hendrikus , WINNUBST, Aloysius Johannes Antonius
IPC分类号： B81C5/00 , A61M37/00
CPC分类号： A61M37/0015 , A61M2037/0023 , A61M2037/0046 , A61M2037/0053 , B81B2201/055 , B81B2203/0361 , B81C99/0085 , B81C2201/034
摘要： The invention relates to a method of manufacturing of a microneedle array comprising the steps of selecting a soft production mold comprising a set of microscopic incisions defining geometry of the microneedles, said soft production mold being capable of providing the microneedle array integrated into a base plate; using a filler material for abundantly filling the microscopic incisions of the soft production mold thereby producing the microneedle array with pre-defined geometry integrated into the base plate; wherein for the filler material a water or alcohol based ceramic or polymer-ceramic slurry is selected. The invention further relates to a microneedle array 16, a composition comprising a microneedle array, a system for enabling transport of a substance through a barrier and a systemfor measuring an electric signal using an electrode.

3. 发明公开

EP2246177A1 ROLLER TYPE NANO-IMPRINT DEVICE, MOLD ROLL FOR THE ROLLER TYPE NANO-IMPRINT DEVICE, FIXED ROLL FOR THE ROLLER TYPE NANO-IMPRINT DEVICE, AND NANO-IMPRINT SHEET MANUFACTURING METHOD 失效
标题翻译：辊式纳米压印装置，用于辊式纳米压印装置的模压辊，用于辊式纳米压印装置的固定辊以及纳米压印片制造方法
公开(公告)号：EP2246177A1
公开(公告)日：2010-11-03
申请号：EP08872863.9
申请日：2008-11-19
申请人： Sharp Kabushiki Kaisha
发明人： YAMADA, Nobuaki , FUJII, Akiyoshi , HAYASHI, Hidekazu , TAGUCHI, Tokio
IPC分类号： B29C59/04 , B29C33/30 , B29C33/38 , B29C33/42 , B81C5/00 , G02B1/11 , H01L21/027 , B29L11/00
CPC分类号： B29C59/04 , B29C2059/023 , B29D11/00346 , B82Y10/00 , B82Y40/00 , G03F7/0002
摘要： The present invention provides a roller nanoimprint apparatus capable of preventing a workpiece film with nanostructures having been transferred from the mold roller from being uneven in thickness and allowing easy replacement of the mold roller. The present invention is a roller nanoimprint apparatus including a mold roller and continuously transferring nanosizedprotrusions to a surface of a workpiece film by rotating the mold roller,
wherein the mold roller is a cylindrical body having an outer circumference surface with nanosized recesses formed thereon,
the roller nanoimprint apparatus further includes a fluid container having an elastic film inflatable by injecting fluid into the container, the fluid container being arranged in a region defined by an inner circumference surface of the mold roller,
the mold roller is mounted or demounted when the elastic film is shrunken, and
the mold roller is supported from the inside when the elastic film is inflated.
摘要翻译：本发明提供一种辊纳米压印装置，其能够防止已经从模辊转印的具有纳米结构的工件膜的厚度不均匀并且允许易于更换模辊。本发明是一种滚轮纳米压印装置，其包括模具辊，并且通过使模具辊旋转而将纳米尺寸的突起连续地转印到工件薄膜的表面，其中模具辊是具有形成有纳米尺寸凹槽的外周表面的圆柱体，辊纳米压印装置还包括流体容器，该流体容器具有通过将流体注入容器而膨胀的弹性膜，流体容器布置在由模具辊的内周表面限定的区域中，当弹性膜为收缩，当弹性膜充气时，模具辊从内侧被支撑。

4. 发明公开

EP2137097A2 MOLD, MOLD PRODUCTION PROCESS, PROCESSING APPARATUS, AND PROCESSING METHOD 审中-公开
标题翻译： FORM，HERSTELLUNGSVERFAHRENFÜRDIE FORM，VERARBEITUNGSGERÄTUND VERARBEITUNGSVERFAHREN
公开(公告)号：EP2137097A2
公开(公告)日：2009-12-30
申请号：EP08722557.9
申请日：2008-03-14
申请人： Canon Kabushiki Kaisha
发明人： TERASAKI, Atsunori , SEKI, Junichi
IPC分类号： B81C5/00
CPC分类号： B82Y10/00 , B81C99/009 , B82Y40/00 , G03F7/0002 , G03F9/7084 , Y10T428/24479
摘要： A mold for imprinting a pattern onto a member to be processed. The mold includes a mold body having a front surface, at which an imprint pattern is formed, and a rear surface opposite from the front surface. A coating layer covers the front surface of the mold body, and a coating layer covers the rear surface of the mold body. An alignment mark as an object to be subjected to optical observation is provided at the front surface of the mold body. The coating layer for covering the rear surface includes (i) a hole for observation of the alignment mark and (ii) a stress adjusting pattern corresponding to a density of the imprint pattern. The hole for observation is formed at the rear surface of the mold body opposite from the alignment mark, and the stress adjusting pattern is formed at the rear surface of the mold body opposite from the imprint pattern.
摘要翻译：用于将图案压印到要加工的构件上的模具。模具包括具有形成有印模图案的前表面和与前表面相对的后表面的模具体。涂层覆盖模体的前表面，涂层覆盖模体的后表面。在模具体的前表面设置有作为光学观察对象的对准标记。用于覆盖后表面的涂层包括（i）用于观察对准标记的孔和（ii）与压印图案的密度相对应的应力调整图案。用于观察的孔形成在与对准标记相对的模具体的后表面处，并且应力调整图案形成在与压印图案相对的模具体的后表面处。

5. 发明公开

EP2091861A1 PROCEDE DE FABRICATION DE PIECES DE MICROMECANIQUE MULTINIVEAUX EN SILICIUM ET PIECES AINSI OBTENUES 有权
标题翻译：用于生产硅的微机械部件多层次和GOT PARTS
公开(公告)号：EP2091861A1
公开(公告)日：2009-08-26
申请号：EP07847092.9
申请日：2007-11-01
申请人： ETA SA Manufacture Horlogère Suisse
发明人： MARMY, Philippe , HELFER, Jean-Luc , CONUS, Thierry
IPC分类号： B81C5/00
CPC分类号： B81C99/0095 , B81B2201/035 , B81C2201/019 , B81C2201/056 , B81C2203/038 , B81C2203/051 , G04B31/004 , G04D3/0069 , Y10T29/49579
摘要： The process comprises the following steps: a) a first element (3) or a plurality of said first elements (3) is/are machined in a first silicon wafer (1) keeping said elements (3) joined together via material bridges (5); b) step a) is repeated with a second silicon wafer (2) in order to machine a second element (4), differing in shape from that of the first element (3), or a plurality of said second elements (4); c) the first and second elements (3, 4) or the first and second wafers (1, 2) are applied, face to face, with the aid of positioning means (6, 7); d) the assembly formed in step c) undergoes oxidation; and e) the parts (10) are separated from the wafers (1, 2). Micromechanical timepiece parts obtained according to the process.

6. 发明公开

EP1970347A1 Process to manufacture micro- or nanometric particles 审中-公开
标题翻译： Herstellungsverfahren mikro-oder nanometrischer Partikel
公开(公告)号：EP1970347A1
公开(公告)日：2008-09-17
申请号：EP07425151.3
申请日：2007-03-16
申请人： C.R.F. Società Consortile per Azioni
发明人： Lambertini, Vito Guido, c/o C.R.F. Società , Pizzi, Marco, c/o C.R.F. Società , Valerio, Federica, c/o C.R.F. Società , Grasso, Valentina, c/o C.R.F. Società , Alacqua, Stefano, c/o C.R.F. Società
IPC分类号： B81C5/00 , B22F1/00 , C25D11/02
CPC分类号： B22F1/0007 , B22F1/0018 , B22F9/16 , B22F2999/00 , B81C99/0085 , B81C2201/034 , B82Y30/00 , C25D1/006 , C25D5/022 , C25D5/54 , C25D11/022 , C25D11/045 , C25D11/04
摘要： A process is described, for the production of particles of micrometric or nanometric dimensions. The process provides for the use of a sacrificial element defining a series of cavities of nanometric dimensions for the purposes of structuring a portion of the particles.
摘要翻译：描述了用于生产微米或纳米尺寸的颗粒的方法。该方法提供了使用限定一系列纳米尺寸的空腔的牺牲元件，用于构造颗粒的一部分。

7. 发明公开

EP1932804A2 Pièces mixtes silicium/métal et méthodes de fabrication s'y référant 有权
标题翻译：硅 - 金属混合的组分和相关的生产方法
公开(公告)号：EP1932804A2
公开(公告)日：2008-06-18
申请号：EP07122526.2
申请日：2007-12-06
申请人： Mimotec S.A.
发明人： Lorenz, Hubert , Genolet, Grégoire , Glassey, Marc-André
IPC分类号： B81C5/00
CPC分类号： G04D3/0069 , B81B2201/035 , B81C99/008 , G04B13/022
摘要： Le but de la présente invention est de produire des pièces en silicium par gravure du silicium comportant une ou des parties métalliques.
Ce but est atteint par l'obtention d'une pièce mixte comprenant une partie métallique et une partie en silicium, caractérisée en ce que la partie en silicium comprend au moins une cavité traversante dans laquelle la partie métallique est électroformée

8. 发明公开

EP1919822A1 PROCÈDE DE SCELLEMENT OU DE SOUDURE DE DEUX ÉLÉMENTS ENTRE EUX. 审中-公开
标题翻译：方法共享或焊接密封两种元素
公开(公告)号：EP1919822A1
公开(公告)日：2008-05-14
申请号：EP06808248.6
申请日：2006-08-21
申请人： COMMISSARIAT A L'ENERGIE ATOMIQUE
发明人： MARION, François
IPC分类号： B81C5/00
CPC分类号： B81C1/00269 , B81C3/002 , B81C2203/019 , B81C2203/032 , H01L24/10 , H01L24/13 , H01L24/81 , H01L2224/05001 , H01L2224/05644 , H01L2224/13 , H01L2224/13099 , H01L2224/13109 , H01L2224/29011 , H01L2224/29013 , H01L2224/73103 , H01L2224/73203 , H01L2224/81054 , H01L2224/81801 , H01L2924/01006 , H01L2924/01022 , H01L2924/01033 , H01L2924/01049 , H01L2924/0105 , H01L2924/01057 , H01L2924/01058 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/014 , H01L2924/14 , H01L2924/1461 , H01L2924/16235 , Y10T29/49002 , H01L2924/00012 , H01L2924/00 , H01L2924/00014
摘要： The invention relates to a method of sealing or welding two elements to one another in a chamber under vacuum or controlled atmosphere. The inventive method comprises the following steps consisting in: producing a wettability area (10, 11) on the opposing faces of the elements to be welded, one of said areas (11) comprising a layer of gold and having a surface area (S2) greater than the surface area (S1) of the other wettability area; depositing a quantity of suitable sealing material on one (10) of the areas, said material comprising indium; bringing the wettability area (11) of the other element into contact with the material thus deposited; and raising the temperature of the chamber containing the elements to be welded or sealed to at least 250 °C in a non-oxidising atmosphere, in order to seal the two elements effectively to one another by means of remelting.

9. 发明公开

EP1918245A2 Extrusion head with planarized edge surface 审中-公开
标题翻译： Extruderkopf mit planarisierterKantenoberfläche
公开(公告)号：EP1918245A2
公开(公告)日：2008-05-07
申请号：EP07119722.2
申请日：2007-10-31
申请人： Palo Alto Research Center Incorporated
发明人： Fork, David K. , Zimmermann, Thomas Stephan
IPC分类号： B81C5/00
CPC分类号： B81C99/0015 , B29C47/0014 , B29C47/0021 , B29C47/30 , Y10T156/108
摘要： A co-extrusion head (130) for forming high-aspect ratio gridline structures in a micro extrusion apparatus includes multiple sheets (210,220,230) (e.g., metal plates) that are machined and assembled to define three-part fluidic channels having associated outlet orifice (235) disposed along an edge surface of the head. Reference surfaces are also etched in the sheets and are aligned in a straight line that intersects output junctions (237) of the three-channel cavities. After assembly (e.g., using high pressure bonding techniques), each reference surface is located inside a notch defined in the edge surface. The edge surface of the co-extrusion head is then trimmed (e.g., machined by wire EDM) using the reference surfaces as a precise guide, thereby producing uniform length outlet orifices with uniform flow impedance.
摘要翻译：用于在微挤压设备中形成高纵横比网格线结构的共挤出头（130）包括多个片材（210,220,230）（例如，金属板），其被加工和组装以限定具有相关联的出口孔口的三部分流体通道 235）沿着头部的边缘表面设置。参考表面也被蚀刻在片材中并且与三通道空腔的输出结（237）相交的直线排列。在组装之后（例如，使用高压粘合技术），每个参考表面位于限定在边缘表面中的凹口内。然后使用参考表面作为精确引导件，将共挤出头的边缘表面修整（例如，由线EDM加工），从而产生具有均匀流动阻抗的均匀长度的出口孔。

10. 发明公开

EP1893527A1 METHOD OF FABRICATING HIGH YIELD WAFER LEVEL PACKAGES INTEGRATING MMIC AND MEMS COMPONENTS 审中-公开
标题翻译：工艺生产具有集成MMIC和MEMS组件的外壳具有产量高晶圆级
公开(公告)号：EP1893527A1
公开(公告)日：2008-03-05
申请号：EP06739235.7
申请日：2006-03-22
申请人： Northrop Grumman Corporation
发明人： CHANG-CHIEN, Patty , TOMQUIST, Kelly, J. , GEIGER, Craig, B. , KONG, Alvin, M.
IPC分类号： B81C5/00
CPC分类号： B81B7/0064 , B81C2203/0118 , B81C2203/019 , H01L23/66 , H01L25/16 , H01L2223/6683 , H01L2924/0002 , H01L2924/00
摘要： Monolithic microwave integrated circuit (MMIC) components and micro electromechanical systems (MEMS) components are integrated onto a single substrate at a wafer scale, by first performing MMIC and MEMS fabrication on a front face of a thick substrate wafer, bonding the substrate wafer to a cover wafer, thinning the back face of the substrate wafer and, finally, completing MMIC and MEMS fabrication on the back face of the thinned substrate wafer. The fabrication process is facilitated by use of a guard ring between the wafers to provide additional mechanical support to the substrate wafer and to protect the devices while the MMIC/MEMS fabrication is completed, and by a low temperature bonding process to join the substrate wafer and the cover wafer at multiple device cavity seal rings.

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式