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1. 发明授权

EP1344746B1 MEMS device and fabrication method thereof 有权
标题翻译： MEMS器件和它们的制备方法
公开(公告)号：EP1344746B1
公开(公告)日：2011-03-02
申请号：EP03251321.0
申请日：2003-03-05
申请人： SAMSUNG ELECTRONICS CO., LTD.
发明人： Lee, Eun-sung , Kim, Chung-woo, 101-705 Park Town Daelim Apt. , Song, In-sang , Kim, Jong-seok , Lee, Moon-chul
IPC分类号： B81C1/00 , B81B3/00
CPC分类号： B81B3/0078 , B81B2201/014 , B81B2203/0118 , B81B2203/0307 , B81B2203/04 , B81C2201/0107 , B81C2201/014 , H01H59/0009

2. 发明授权

EP1325884B1 MEMS structure having a blocked-sacrificial layer support/anchor and a fabrication method of the same 有权
标题翻译： MEMS结构，牺牲层封端的支柱/锚包括，和它们的制备方法
公开(公告)号：EP1325884B1
公开(公告)日：2010-02-17
申请号：EP02258592.1
申请日：2002-12-13
申请人： SAMSUNG ELECTRONICS CO., LTD.
发明人： Lee, Eun-sung , Lee, Moon-chul , Kim, Hyun-ok
IPC分类号： B81B3/00
CPC分类号： B81B3/0078 , B81B2203/0307 , B81C2201/0109

3. 发明公开

EP2259096A1 Wafer-level lens module and image pickup module including the same 审中-公开
标题翻译： Linsenmodul auf Wafer-Ebene und Bildaufnahmemodul damit
公开(公告)号：EP2259096A1
公开(公告)日：2010-12-08
申请号：EP10160047.6
申请日：2010-04-15
申请人： SAMSUNG ELECTRONICS CO., LTD.
发明人： Choi, Min-seog , Lee, Eun-sung , Jung, Kyu-dong
IPC分类号： G02B1/04 , G02B13/00 , H01L27/146 , H04N5/225
CPC分类号： G02B13/0085 , G02B3/0056 , G02B13/0035 , H01L27/14618 , H01L27/14625 , H01L27/14627 , H01L2924/0002 , H04N5/2254 , H04N5/2257 , H01L2924/00
摘要： Provided are a wafer-level lens module and an image pickup module including the same. The wafer lens module includes a plurality wafer-scale lenses. At least one of the plurality of wafer-scale lenses, such as a wafer-scale lens positioned toward an object side, includes a substrate and a glass lens element formed on one side of the substrate. The glass lens element may be a one-sided lens or a double-sided lens. When the glass lens is a double-sided lens, the substrate may have a through hole. The remaining wafer-scale lenses each include a substrate and polymer lens elements made of UV curable polymer and formed on both sides of the substrate. Also, spacers are interposed between the wafer-scale lenses, along the edge portions of the substrates, so as to maintain predetermined intervals between the wafer-scale lenses.
摘要翻译：提供了一种晶片级透镜模块和包括该晶片级透镜模块的图像拾取模块。晶片透镜模块包括多个晶片级透镜。多个晶片级透镜中的至少一个，例如朝向物体侧定位的晶片级透镜，包括形成在基板的一侧上的基板和玻璃透镜元件。玻璃透镜元件可以是单面透镜或双面透镜。当玻璃透镜是双面透镜时，基底可以具有通孔。其余的晶片级透镜各自包括基板和由UV可固化聚合物制成的聚合物透镜元件，并且形成在基板的两侧。此外，间隔物沿着基板的边缘部分插入在晶片级透镜之间，以便在晶片级透镜之间保持预定的间隔。

4. 发明公开

EP1418154A3 Method and apparatus for vacuum-mounting a micro electro mechanical system on a substrate 审中-公开
标题翻译：对方法和装置真空安装在衬底上的微机电系统
公开(公告)号：EP1418154A3
公开(公告)日：2005-08-31
申请号：EP03256889.1
申请日：2003-10-30
申请人： SAMSUNG ELECTRONICS CO., LTD.
发明人： Jung, Kyu-dong, 662-1701 Sinnamusil , Choi, Hyung , Jun, Chan-bong , Kang, Seok-jin , Hong, Seog-woo , Chung, Seok-whan , Lee, Moon-chul , Lee, Eun-sung
IPC分类号： B81C5/00 , B81C1/00
CPC分类号： B81C1/00285
摘要： A method and apparatus for vacuum-mounting at least one micro electro mechanical system (MEMS) on a substrate includes a gas injecting section for injecting an inert gas into a vacuum chamber; a substrate aligning section for aligning a semiconductor substrate and a cover, the cover having a cavity formed therein and a getter attached to an interior surface of the cavity; a bonding section for bonding the semiconductor substrate and the cover together; and a controlling section for controlling the substrate aligning section to align the semiconductor and the cover, for controlling the gas injecting section to inject the inert gas into the vacuum chamber, and for controlling the bonding section to bond the semiconductor substrate and the cover together after the inert gas is injected.

5. 发明公开

EP1344746A2 MEMS device and fabrication method thereof 有权
标题翻译： MEMS-Bauelemente und Verfahren zu deren Herstellung
公开(公告)号：EP1344746A2
公开(公告)日：2003-09-17
申请号：EP03251321.0
申请日：2003-03-05
申请人： SAMSUNG ELECTRONICS CO., LTD.
发明人： Lee, Eun-sung , Kim, Chung-woo , Song, In-sang , Kim, Jong-seok , Lee, Moon-chul
IPC分类号： B81C1/00 , B81B3/00
CPC分类号： B81B3/0078 , B81B2201/014 , B81B2203/0118 , B81B2203/0307 , B81B2203/04 , B81C2201/0107 , B81C2201/014 , H01H59/0009
摘要： A method for fabricating a MEMS device having a fixing part, driving part, electrode part, and contact parts on a substrate. A driving electrode is formed on the substrate, and then an insulation layer is formed thereon. The insulation layer is patterned, and the regions of the insulation layer in which the fixing part and the contact parts are formed are etched. A metal layer is formed on the substrate. The metal layer is planarized down to the insulation layer, and the driving electrode is formed. A sacrificial layer is formed on the substrate, and a groove-shaped space is formed in a region in which the fixing part is formed. A MEMS structure layer is formed on the sacrificial layer. Sidewalls are formed in the groove-shaped space, and the fixing part and driving part are formed, leaving the sacrificial layer underneath the fixing part.
摘要翻译：一种用于制造在基板上具有固定部分，驱动部分，电极部分和接触部分的MEMS器件的方法。在基板上形成驱动电极，然后在其上形成绝缘层。对绝缘层进行图案化，并且蚀刻形成有固定部和接触部的绝缘层的区域。在基板上形成金属层。金属层被平坦化到绝缘层，并且形成驱动电极。在基板上形成牺牲层，在形成固定部的区域形成有槽状的空间。在牺牲层上形成MEMS结构层。侧壁形成在槽形空间中，并且形成固定部分和驱动部分，在牺牲层之下留下固定部分。

6. 发明公开

EP2193911A2 Micro lens, method and apparatus for manufacturing micro lens, and camera module including micro lens 有权转让
标题翻译：用于制造使用微透镜的微透镜和相机模块的微透镜的方法和装置
公开(公告)号：EP2193911A2
公开(公告)日：2010-06-09
申请号：EP09170750.5
申请日：2009-09-18
申请人： SAMSUNG ELECTRONICS CO., LTD.
发明人： Choi, Min-seog , Lee, Eun-sung , Jung, Kyu-dong
IPC分类号： B29D11/00
CPC分类号： B29D11/00375 , B29C33/305 , B29D11/0048 , B29L2011/0016
摘要： Method of manufacturing a micro lens apparatus, and manufacturing method therefore and a camera module employing the micro lens are provided. First mold (20) is manufactured in correspondence with a first lens profile of a lens element. Second mold (30) is manufactured in correspondence with a second lens profile of the lens element. Second mold is aligned on a surface of a lens substrate (110) having a hollow hole formed thereon. Material for the lens element is supplied into the hollow hole (115) of the lens substrate (110). First mold is aligned on the other surface of the lens substrate having the hollow hole and compressed to form the first and second profiles of the lens element. Formed lens element hardened. First and second molds are separated from each other. Therefore, time and cost for manufacturing the micro lens are reduced, and the accurate alignment between the first and second lens profiles is achieved.
摘要翻译：制造微透镜装置，因此制造方法和提供一种相机模块用人微透镜的方法。第一模具（20）在对应制造的一个透镜元件的第一透镜轮廓。第二模具（30）在对应制造的与透镜元件的第二透镜轮廓。第二模具具有形成在其上的中空孔的透镜基片（110）的表面上对齐。材料用于透镜元件供给到透镜基板（110）的中空孔（115）。第一模具具有中空孔的透镜基片的另一表面上对齐，并且压缩以形成所述透镜元件的所述第一和第二简档。形成的透镜元件硬化。第一和第二模具由海誓山盟分离。因此，时间和用于制造微透镜成本的降低，和在第一和第二透镜轮廓之间的精确对准得以实现。

7. 发明公开

EP1458015A3 Spin coating apparatus for coating photoresist 审中-公开
标题翻译：用于旋涂的设备用于与光致抗蚀剂涂覆，
公开(公告)号：EP1458015A3
公开(公告)日：2007-07-18
申请号：EP04251412.5
申请日：2004-03-11
申请人： SAMSUNG ELECTRONICS CO., LTD.
发明人： Lee, Eun-sung , Choa, Sung-hoon , Choi, Min-seog
IPC分类号： H01L21/00
CPC分类号： H01L21/6715
摘要： A spin coating apparatus for coating photoresist has a spin chuck and a nozzle part. The spin chuck has a mount part on which a wafer is mounted and an extended projection part on which edge-bead is formed. The nozzle part is for depositing photoresist onto the wafer mounted on the mount part of the spin chuck. By using the spin coating apparatus, edge-bead is formed on the extended projection part, and not on the wafer.

8. 发明公开

EP1458015A2 Spin coating apparatus for coating photoresist 审中-公开
标题翻译： Vorrichtung zur Schleuderbeschichtung zur Beschichtung mit einem Photolack
公开(公告)号：EP1458015A2
公开(公告)日：2004-09-15
申请号：EP04251412.5
申请日：2004-03-11
申请人： Samsung Electronics Co., Ltd.
发明人： Lee, Eun-sung , Choa, Sung-hoon , Choi, Min-seog
IPC分类号： H01L21/00
CPC分类号： H01L21/6715
摘要： A spin coating apparatus for coating photoresist has a spin chuck and a nozzle part. The spin chuck has a mount part on which a wafer is mounted and an extended projection part on which edge-bead is formed. The nozzle part is for depositing photoresist onto the wafer mounted on the mount part of the spin chuck. By using the spin coating apparatus, edge-bead is formed on the extended projection part, and not on the wafer.
摘要翻译：用于涂覆光致抗蚀剂的旋涂装置具有旋转卡盘和喷嘴部分。旋转卡盘具有安装在其上的晶片的安装部分和形成边缘珠的延伸的突出部分。喷嘴部分用于将光致抗蚀剂沉积到安装在旋转卡盘的安装部分上的晶片上。通过使用旋涂装置，在延伸的突出部分上而不是在晶片上形成边缘珠。

9. 发明公开

EP1270505A2 Anti-stiction method and apparatus for drying wafer using centrifugal force 审中-公开
标题翻译：抗逆转录病毒和Vorrichtung zum Trocknen von Wafern，死Zentrifugalkraft verwendet
公开(公告)号：EP1270505A2
公开(公告)日：2003-01-02
申请号：EP02014541.3
申请日：2002-07-01
申请人： SAMSUNG ELECTRONICS CO., LTD.
发明人： Cho, Jin-woo , Lee, Moon-chul , Lee, Eun-sung
IPC分类号： B81B3/00
CPC分类号： H01L21/67034 , B81C1/00928
摘要： An anti-stiction method and apparatus for drying a wafer using a centrifugal force is provided. The anti-stiction method includes the steps of (a) removing a sacrificial layer stacked between the wafer and the micro structure, using an etching solution, (b) rinsing the etched micro structure and the etched wafer in a rinse solution for a predetermined time so that the etching solution between the micro structure and the wafer is replaced with the rinse solution, and (c) mounting the rinsed wafer in a mounting unit connected to a rotation axis and eliminating the rinse solution left between the wafer and the micro structure by the rotation of the axis. The wafer is mounted in the mounting unit in a vertical position so that the micro structure faces outwards from the rotation axis. Accordingly, a stiction phenomenon between the micro structure manufactured by a MEMS process and the wafer in a drying process can be prevented.
摘要翻译：提供了一种使用离心力干燥晶片的防静电方法和装置。抗静电方法包括以下步骤：（a）使用蚀刻溶液去除叠置在晶片和微结构之间的牺牲层，（b）在冲洗溶液中冲洗蚀刻的微结构和蚀刻的晶片达预定时间使得微结构和晶片之间的蚀刻溶液被冲洗溶液代替，并且（c）将冲洗的晶片安装在连接到旋转轴线的安装单元中，并且通过以下步骤消除晶片和微结构之间留下的冲洗溶液：轴的旋转。晶片以垂直位置安装在安装单元中，使得微结构从旋转轴线向外。因此，可以防止由MEMS工艺制造的微结构与干燥工艺中的晶片之间的静电现象。

10. 发明授权

EP2193911B1 Micro lens, method and apparatus for manufacturing micro lens, and camera module including micro lens 有权转让
标题翻译：微透镜，制造微透镜的方法和设备以及包括微透镜的照相机模块
公开(公告)号：EP2193911B1
公开(公告)日：2018-05-09
申请号：EP09170750.5
申请日：2009-09-18
申请人： Samsung Electronics Co., Ltd.
发明人： Choi, Min-seog , Lee, Eun-sung , Jung, Kyu-dong
IPC分类号： B29D11/00 , B29C33/30
CPC分类号： B29D11/00375 , B29C33/305 , B29D11/0048 , B29L2011/0016
摘要： Method of manufacturing a micro lens apparatus, and manufacturing method therefore and a camera module employing the micro lens are provided. First mold (20) is manufactured in correspondence with a first lens profile of a lens element. Second mold (30) is manufactured in correspondence with a second lens profile of the lens element. Second mold is aligned on a surface of a lens substrate (110) having a hollow hole formed thereon. Material for the lens element is supplied into the hollow hole (115) of the lens substrate (110). First mold is aligned on the other surface of the lens substrate having the hollow hole and compressed to form the first and second profiles of the lens element. Formed lens element hardened. First and second molds are separated from each other. Therefore, time and cost for manufacturing the micro lens are reduced, and the accurate alignment between the first and second lens profiles is achieved.

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