专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

EP1344746B1 MEMS device and fabrication method thereof 有权
标题翻译： MEMS器件和它们的制备方法
公开(公告)号：EP1344746B1
公开(公告)日：2011-03-02
申请号：EP03251321.0
申请日：2003-03-05
申请人： SAMSUNG ELECTRONICS CO., LTD.
发明人： Lee, Eun-sung , Kim, Chung-woo, 101-705 Park Town Daelim Apt. , Song, In-sang , Kim, Jong-seok , Lee, Moon-chul
IPC分类号： B81C1/00 , B81B3/00
CPC分类号： B81B3/0078 , B81B2201/014 , B81B2203/0118 , B81B2203/0307 , B81B2203/04 , B81C2201/0107 , B81C2201/014 , H01H59/0009

2. 发明授权

EP1325884B1 MEMS structure having a blocked-sacrificial layer support/anchor and a fabrication method of the same 有权
标题翻译： MEMS结构，牺牲层封端的支柱/锚包括，和它们的制备方法
公开(公告)号：EP1325884B1
公开(公告)日：2010-02-17
申请号：EP02258592.1
申请日：2002-12-13
申请人： SAMSUNG ELECTRONICS CO., LTD.
发明人： Lee, Eun-sung , Lee, Moon-chul , Kim, Hyun-ok
IPC分类号： B81B3/00
CPC分类号： B81B3/0078 , B81B2203/0307 , B81C2201/0109

3. 发明公开

EP2259096A1 Wafer-level lens module and image pickup module including the same 审中-公开
标题翻译： Linsenmodul auf Wafer-Ebene und Bildaufnahmemodul damit
公开(公告)号：EP2259096A1
公开(公告)日：2010-12-08
申请号：EP10160047.6
申请日：2010-04-15
申请人： SAMSUNG ELECTRONICS CO., LTD.
发明人： Choi, Min-seog , Lee, Eun-sung , Jung, Kyu-dong
IPC分类号： G02B1/04 , G02B13/00 , H01L27/146 , H04N5/225
CPC分类号： G02B13/0085 , G02B3/0056 , G02B13/0035 , H01L27/14618 , H01L27/14625 , H01L27/14627 , H01L2924/0002 , H04N5/2254 , H04N5/2257 , H01L2924/00
摘要： Provided are a wafer-level lens module and an image pickup module including the same. The wafer lens module includes a plurality wafer-scale lenses. At least one of the plurality of wafer-scale lenses, such as a wafer-scale lens positioned toward an object side, includes a substrate and a glass lens element formed on one side of the substrate. The glass lens element may be a one-sided lens or a double-sided lens. When the glass lens is a double-sided lens, the substrate may have a through hole. The remaining wafer-scale lenses each include a substrate and polymer lens elements made of UV curable polymer and formed on both sides of the substrate. Also, spacers are interposed between the wafer-scale lenses, along the edge portions of the substrates, so as to maintain predetermined intervals between the wafer-scale lenses.
摘要翻译：提供了一种晶片级透镜模块和包括该晶片级透镜模块的图像拾取模块。晶片透镜模块包括多个晶片级透镜。多个晶片级透镜中的至少一个，例如朝向物体侧定位的晶片级透镜，包括形成在基板的一侧上的基板和玻璃透镜元件。玻璃透镜元件可以是单面透镜或双面透镜。当玻璃透镜是双面透镜时，基底可以具有通孔。其余的晶片级透镜各自包括基板和由UV可固化聚合物制成的聚合物透镜元件，并且形成在基板的两侧。此外，间隔物沿着基板的边缘部分插入在晶片级透镜之间，以便在晶片级透镜之间保持预定的间隔。

4. 发明公开

EP1418154A3 Method and apparatus for vacuum-mounting a micro electro mechanical system on a substrate 审中-公开
标题翻译：对方法和装置真空安装在衬底上的微机电系统
公开(公告)号：EP1418154A3
公开(公告)日：2005-08-31
申请号：EP03256889.1
申请日：2003-10-30
申请人： SAMSUNG ELECTRONICS CO., LTD.
发明人： Jung, Kyu-dong, 662-1701 Sinnamusil , Choi, Hyung , Jun, Chan-bong , Kang, Seok-jin , Hong, Seog-woo , Chung, Seok-whan , Lee, Moon-chul , Lee, Eun-sung
IPC分类号： B81C5/00 , B81C1/00
CPC分类号： B81C1/00285
摘要： A method and apparatus for vacuum-mounting at least one micro electro mechanical system (MEMS) on a substrate includes a gas injecting section for injecting an inert gas into a vacuum chamber; a substrate aligning section for aligning a semiconductor substrate and a cover, the cover having a cavity formed therein and a getter attached to an interior surface of the cavity; a bonding section for bonding the semiconductor substrate and the cover together; and a controlling section for controlling the substrate aligning section to align the semiconductor and the cover, for controlling the gas injecting section to inject the inert gas into the vacuum chamber, and for controlling the bonding section to bond the semiconductor substrate and the cover together after the inert gas is injected.

5. 发明公开

EP1344746A2 MEMS device and fabrication method thereof 有权
标题翻译： MEMS-Bauelemente und Verfahren zu deren Herstellung
公开(公告)号：EP1344746A2
公开(公告)日：2003-09-17
申请号：EP03251321.0
申请日：2003-03-05
申请人： SAMSUNG ELECTRONICS CO., LTD.
发明人： Lee, Eun-sung , Kim, Chung-woo , Song, In-sang , Kim, Jong-seok , Lee, Moon-chul
IPC分类号： B81C1/00 , B81B3/00
CPC分类号： B81B3/0078 , B81B2201/014 , B81B2203/0118 , B81B2203/0307 , B81B2203/04 , B81C2201/0107 , B81C2201/014 , H01H59/0009
摘要： A method for fabricating a MEMS device having a fixing part, driving part, electrode part, and contact parts on a substrate. A driving electrode is formed on the substrate, and then an insulation layer is formed thereon. The insulation layer is patterned, and the regions of the insulation layer in which the fixing part and the contact parts are formed are etched. A metal layer is formed on the substrate. The metal layer is planarized down to the insulation layer, and the driving electrode is formed. A sacrificial layer is formed on the substrate, and a groove-shaped space is formed in a region in which the fixing part is formed. A MEMS structure layer is formed on the sacrificial layer. Sidewalls are formed in the groove-shaped space, and the fixing part and driving part are formed, leaving the sacrificial layer underneath the fixing part.
摘要翻译：一种用于制造在基板上具有固定部分，驱动部分，电极部分和接触部分的MEMS器件的方法。在基板上形成驱动电极，然后在其上形成绝缘层。对绝缘层进行图案化，并且蚀刻形成有固定部和接触部的绝缘层的区域。在基板上形成金属层。金属层被平坦化到绝缘层，并且形成驱动电极。在基板上形成牺牲层，在形成固定部的区域形成有槽状的空间。在牺牲层上形成MEMS结构层。侧壁形成在槽形空间中，并且形成固定部分和驱动部分，在牺牲层之下留下固定部分。

6. 发明授权

EP2193911B1 Micro lens, method and apparatus for manufacturing micro lens, and camera module including micro lens 失效转让
标题翻译：微透镜，制造微透镜的方法和设备以及包括微透镜的照相机模块
公开(公告)号：EP2193911B1
公开(公告)日：2018-05-09
申请号：EP09170750.5
申请日：2009-09-18
申请人： Samsung Electronics Co., Ltd.
发明人： Choi, Min-seog , Lee, Eun-sung , Jung, Kyu-dong
IPC分类号： B29D11/00 , B29C33/30
CPC分类号： B29D11/00375 , B29C33/305 , B29D11/0048 , B29L2011/0016
摘要： Method of manufacturing a micro lens apparatus, and manufacturing method therefore and a camera module employing the micro lens are provided. First mold (20) is manufactured in correspondence with a first lens profile of a lens element. Second mold (30) is manufactured in correspondence with a second lens profile of the lens element. Second mold is aligned on a surface of a lens substrate (110) having a hollow hole formed thereon. Material for the lens element is supplied into the hollow hole (115) of the lens substrate (110). First mold is aligned on the other surface of the lens substrate having the hollow hole and compressed to form the first and second profiles of the lens element. Formed lens element hardened. First and second molds are separated from each other. Therefore, time and cost for manufacturing the micro lens are reduced, and the accurate alignment between the first and second lens profiles is achieved.

7. 发明公开

EP1344746A3 MEMS device and fabrication method thereof 有权
标题翻译： MEMS器件和它们的制备方法
公开(公告)号：EP1344746A3
公开(公告)日：2005-03-02
申请号：EP03251321.0
申请日：2003-03-05
申请人： SAMSUNG ELECTRONICS CO., LTD.
发明人： Lee, Eun-sung , Kim, Chung-woo, 101-705 Park Town Daelim Apt. , Song, In-sang , Kim, Jong-seok , Lee, Moon-chul
IPC分类号： B81C1/00 , B81B3/00
CPC分类号： B81B3/0078 , B81B2201/014 , B81B2203/0118 , B81B2203/0307 , B81B2203/04 , B81C2201/0107 , B81C2201/014 , H01H59/0009
摘要： A method for fabricating a MEMS device having a fixing part, driving part, electrode part, and contact parts on a substrate. A driving electrode is formed on the substrate, and then an insulation layer is formed thereon. The insulation layer is patterned, and the regions of the insulation layer in which the fixing part and the contact parts are formed are etched. A metal layer is formed on the substrate. The metal layer is planarized down to the insulation layer, and the driving electrode is formed. A sacrificial layer is formed on the substrate, and a groove-shaped space is formed in a region in which the fixing part is formed. A MEMS structure layer is formed on the sacrificial layer. Sidewalls are formed in the groove-shaped space, and the fixing part and driving part are formed, leaving the sacrificial layer underneath the fixing part.

8. 发明公开

EP1418154A2 Method and apparatus for vacuum-mounting a micro electro mechanical system on a substrate 审中-公开
标题翻译：对方法和装置真空安装在衬底上的微机电系统
公开(公告)号：EP1418154A2
公开(公告)日：2004-05-12
申请号：EP03256889.1
申请日：2003-10-30
申请人： Samsung Electronics Co., Ltd.
发明人： Jung, Kyu-dong , Choi, Hyung , Jun, Chan-bong , Kang, Seok-jin , Hong, Seog-woo , Chung, Seok-whan , Lee, Moon-chul , Lee, Eun-sung
IPC分类号： B81C5/00 , B81C1/00
CPC分类号： B81C1/00285
摘要： A method and apparatus for vacuum-mounting at least one micro electro mechanical system (MEMS) on a substrate includes a gas injecting section for injecting an inert gas into a vacuum chamber; a substrate aligning section for aligning a semiconductor substrate and a cover, the cover having a cavity formed therein and a getter attached to an interior surface of the cavity; a bonding section for bonding the semiconductor substrate and the cover together; and a controlling section for controlling the substrate aligning section to align the semiconductor and the cover, for controlling the gas injecting section to inject the inert gas into the vacuum chamber, and for controlling the bonding section to bond the semiconductor substrate and the cover together after the inert gas is injected.
摘要翻译：上的基片用于真空安装至少一个微机电系统的方法和装置（MEMS）包括用于惰性气体注入到真空室中注入部的气体; 用于对准半导体衬底和盖对准部一基底，具有空腔形成于其中盖和吸气剂附着于所述空腔的内表面上; 用于粘结半导体衬底和盖一起的接合部分; 以及控制部分，用于控制对准部以对准半导体和盖，用于控制注入部至所述惰性气体注入到真空室中的气体底物，以及用于控制所述接合部分接合所述半导体衬底和盖一起后该惰性气体被注入。

9. 发明公开

EP1325884A2 MEMS structure having a blocked-sacrificial layer support/anchor and a fabrication method of the same 有权
标题翻译： MEMS-Struktur，eine verkappteOpferschichtstütze/ Anker enthaltend，und Verfahren zu deren Herstellung
公开(公告)号：EP1325884A2
公开(公告)日：2003-07-09
申请号：EP02258592.1
申请日：2002-12-13
申请人： SAMSUNG ELECTRONICS CO., LTD.
发明人： Lee, Eun-sung , Lee, Moon-chul , Kim, Hyun-ok
IPC分类号： B81B3/00
CPC分类号： B81B3/0078 , B81B2203/0307 , B81C2201/0109
摘要： A fabrication method for a MEMS structure, the MEMS structure including a fixing portion fixed to the substrate and a floating portion floating above the substrate. A sacrificial layer deposited on the substrate is patterned to have a groove forming a space surrounding the area corresponding to the area in which the fixing portion is to be formed. If the MEMS structure is deposited on the sacrificial layer, a sidewall is formed inside the space and the fixing portion and the floating portion are formed on the sacrificial layer. If the sacrificial layer is removed using an etchant, the sacrificial layer at the bottom of the fixing portion is protected from the etchant by the sidewall and accordingly, the sacrificial layer except the area surrounded by the sidewall is removed. Therefore, only the sacrificial layer under the floating portion is removed. Because the connecting portion is fabricated to have the same thickness as the fixing portion and the floating portion, a strong/durable MEMS structure is provided. Additionally, the boundary between the fixing portion and the floating portion can be precisely determined, and adjustment of the length of the floating portion can be precisely controlled.
摘要翻译：一种用于MEMS结构的制造方法，所述MEMS结构包括固定到所述基板的固定部分和浮置在所述基板上方的浮动部分。沉积在基板上的牺牲层被图案化成具有形成围绕与要形成固定部分的区域相对应的区域的空间的凹槽。如果MEMS结构沉积在牺牲层上，则在空间内形成侧壁，并且在牺牲层上形成固定部分和浮动部分。如果使用蚀刻剂去除牺牲层，则固定部分底部的牺牲层被侧壁保护而不受蚀刻剂的影响，因此除去由侧壁包围的区域之外的牺牲层。因此，只有在浮动部分下面的牺牲层被去除。由于连接部分被制造成具有与固定部分和浮动部分相同的厚度，所以提供了强/耐久的MEMS结构。此外，可以精确地确定固定部分和浮动部分之间的边界，并且可以精确地控制浮动部分的长度的调节。

10. 发明公开

EP2193911A2 Micro lens, method and apparatus for manufacturing micro lens, and camera module including micro lens 失效转让
标题翻译：用于制造使用微透镜的微透镜和相机模块的微透镜的方法和装置
公开(公告)号：EP2193911A2
公开(公告)日：2010-06-09
申请号：EP09170750.5
申请日：2009-09-18
申请人： SAMSUNG ELECTRONICS CO., LTD.
发明人： Choi, Min-seog , Lee, Eun-sung , Jung, Kyu-dong
IPC分类号： B29D11/00
CPC分类号： B29D11/00375 , B29C33/305 , B29D11/0048 , B29L2011/0016
摘要： Method of manufacturing a micro lens apparatus, and manufacturing method therefore and a camera module employing the micro lens are provided. First mold (20) is manufactured in correspondence with a first lens profile of a lens element. Second mold (30) is manufactured in correspondence with a second lens profile of the lens element. Second mold is aligned on a surface of a lens substrate (110) having a hollow hole formed thereon. Material for the lens element is supplied into the hollow hole (115) of the lens substrate (110). First mold is aligned on the other surface of the lens substrate having the hollow hole and compressed to form the first and second profiles of the lens element. Formed lens element hardened. First and second molds are separated from each other. Therefore, time and cost for manufacturing the micro lens are reduced, and the accurate alignment between the first and second lens profiles is achieved.
摘要翻译：制造微透镜装置，因此制造方法和提供一种相机模块用人微透镜的方法。第一模具（20）在对应制造的一个透镜元件的第一透镜轮廓。第二模具（30）在对应制造的与透镜元件的第二透镜轮廓。第二模具具有形成在其上的中空孔的透镜基片（110）的表面上对齐。材料用于透镜元件供给到透镜基板（110）的中空孔（115）。第一模具具有中空孔的透镜基片的另一表面上对齐，并且压缩以形成所述透镜元件的所述第一和第二简档。形成的透镜元件硬化。第一和第二模具由海誓山盟分离。因此，时间和用于制造微透镜成本的降低，和在第一和第二透镜轮廓之间的精确对准得以实现。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式