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    • 10. 发明公开
    • Film bulk acoustic resonator having supports and manufacturing method therefor
    • Akustischer Filmresonator mitStützenund Verfahren zur Herstellung desselben
    • EP1482638A3
    • 2005-03-09
    • EP04252855.4
    • 2004-05-17
    • Samsung Electronics Co., Ltd.
    • Song, II-jongSong, In-sangKim, Duck-hwanPark, Yun-kwonHa, yeoung-ju 507-1401 Samsung 5th Apartment
    • H03H3/02
    • H03H9/172H03H3/02H03H9/0514H03H9/0547Y10T29/42
    • A film bulk acoustic resonator (FBAR) has a support structure, a piezoelectric resonator, and a signal line that is electrically connected, e.g., through a via, to the piezoelectric resonator, all on a semiconductor substrate. Support(s) and/or the via mount the piezoelectric resonator at a predetermined distance from the semiconductor substrate, allowing an ideal shape of the resonator to be realized. The signal line may include a patterned inductor. A capacitor can be formed between the via and the signal line. The resonance characteristics can be enhanced since the substrate loss caused by the driving of the resonator can be prevented due to an air gap formed by the predetermined distance. The resonance frequency can be adjusted by altering the pattern of the inductor, the capacitance of the capacitor and/or the thickness of the piezoelectric layer, also allowing Impedance matching to be readily realized.
    • 薄膜体声波谐振器(FBAR)具有支撑结构,压电谐振器和信号线,其通过通孔电连接到压电谐振器,全部在半导体衬底上。 支持和/或通孔将压电谐振器安装在离半导体衬底预定距离处,从而实现谐振器的理想形状。 信号线可以包括图案化电感器。 可以在通孔和信号线之间形成电容器。 由于由于由预定距离形成的气隙可以防止由谐振器的驱动引起的衬底损耗,所以可以提高谐振特性。 可以通过改变电感器的图案,电容器的电容和/或压电层的厚度来调节谐振频率,并且还可以容易地实现阻抗匹配。