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1. 发明公开

EP3081369A1 LENS AND METHOD FOR MANUFACTURING SAME 有权转让
标题翻译： LINSE UND VERFAHREN ZUR HERSTELLUNG DAVON
公开(公告)号：EP3081369A1
公开(公告)日：2016-10-19
申请号：EP16168985.6
申请日：2009-06-02
申请人： Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V.
发明人： DUPARRÉ, Jaques , WIPPERMANN, Frank , DANNBERG, Peter , BRÄUER, Andreas
IPC分类号： B29D11/00 , B29C33/52
CPC分类号： B29D11/00375 , B29C33/52
摘要： A method for manufacturing a lens includes (a) providing a substrate (100) comprising a recess (106) in a first surface (102) of the substrate (100), and (b) forming in or above the recess (106) of the substrate (100) a lens structure (108) having a first desired lens surface and a second desired lens surface. Step (b) includes providing a sacrificial material (206) having a shape in accordance with a first desired lens surface, applying the lens material (212) to the sacrificial material (206) to define the lens structure (108), shaping a side of the lens material (212) facing away from the sacrificial material (206) in accordance with a second desired lens surface, mounting the structure comprising the sacrificial material (206) and the lens material (212) to the substrate (100) such that the lens structure (108) is arranged in or above the recess (108), and removing the sacrificial material.
摘要翻译：一种用于制造透镜的方法包括（a）在基底（100）的第一表面（102）中提供包括凹部（106）的基底（100），和（b）在凹部（106）中或上方形成所述基板（100）具有第一所需透镜表面和第二所需透镜表面的透镜结构（108）。步骤（b）包括提供具有根据第一期望透镜表面的形状的牺牲材料（206），将透镜材料（212）施加到牺牲材料（206）以限定透镜结构（108），使侧面成形根据第二所需透镜表面离开牺牲材料（206）的透镜材料（212），将包括牺牲材料（206）和透镜材料（212）的结构安装到基底（100），使得透镜结构（108）布置在凹部（108）中或上方，并且去除牺牲材料。

2. 发明公开

EP2598920A1 DISPOSITIF OPTIQUE, BOITIER A L'ECHELLE D'UNE TRANCHE POUR UN TEL DISPOSITIF OPTIQUE ET PROCEDE CORRESPONDANT 审中-公开
标题翻译：光学器件，封装晶片级FOR这种光学设备和相关方法
公开(公告)号：EP2598920A1
公开(公告)日：2013-06-05
申请号：EP11749538.2
申请日：2011-07-26
申请人： Commissariat à l'Énergie Atomique et aux Énergies Alternatives
发明人： ANDRE, Luc
IPC分类号： G02B3/00 , H01L27/146
CPC分类号： G02B1/11 , B29D11/00375 , G02B1/10 , G02B3/00 , G02B3/0012 , G02B3/0037 , G02B3/0062 , G02B3/04 , G02B13/14 , H01L27/146 , H01L27/14618 , H01L27/14625 , H01L2924/0002 , H04N5/2254 , H01L2924/00
摘要： The invention relates to an optical device produced by cutting a wafer-scale package comprising at least one optical module formed from a substrate (1) pierced with a plurality of through-holes (2) and optical elements disposed in the holes. According to the invention, at least one of the holes receives two lenses (3, 4) made from at least one polymer material transparent in the 400nm-700nm range, each of the lenses being defined by an external diopter and an internal diopter. The invention is characterised in that a space is formed between the internal diopters of two lenses and in that the substrate contains no polymer material between two adjacent through-holes.

3. 发明公开

EP2193911A2 Micro lens, method and apparatus for manufacturing micro lens, and camera module including micro lens 有权转让
标题翻译：用于制造使用微透镜的微透镜和相机模块的微透镜的方法和装置
公开(公告)号：EP2193911A2
公开(公告)日：2010-06-09
申请号：EP09170750.5
申请日：2009-09-18
申请人： SAMSUNG ELECTRONICS CO., LTD.
发明人： Choi, Min-seog , Lee, Eun-sung , Jung, Kyu-dong
IPC分类号： B29D11/00
CPC分类号： B29D11/00375 , B29C33/305 , B29D11/0048 , B29L2011/0016
摘要： Method of manufacturing a micro lens apparatus, and manufacturing method therefore and a camera module employing the micro lens are provided. First mold (20) is manufactured in correspondence with a first lens profile of a lens element. Second mold (30) is manufactured in correspondence with a second lens profile of the lens element. Second mold is aligned on a surface of a lens substrate (110) having a hollow hole formed thereon. Material for the lens element is supplied into the hollow hole (115) of the lens substrate (110). First mold is aligned on the other surface of the lens substrate having the hollow hole and compressed to form the first and second profiles of the lens element. Formed lens element hardened. First and second molds are separated from each other. Therefore, time and cost for manufacturing the micro lens are reduced, and the accurate alignment between the first and second lens profiles is achieved.
摘要翻译：制造微透镜装置，因此制造方法和提供一种相机模块用人微透镜的方法。第一模具（20）在对应制造的一个透镜元件的第一透镜轮廓。第二模具（30）在对应制造的与透镜元件的第二透镜轮廓。第二模具具有形成在其上的中空孔的透镜基片（110）的表面上对齐。材料用于透镜元件供给到透镜基板（110）的中空孔（115）。第一模具具有中空孔的透镜基片的另一表面上对齐，并且压缩以形成所述透镜元件的所述第一和第二简档。形成的透镜元件硬化。第一和第二模具由海誓山盟分离。因此，时间和用于制造微透镜成本的降低，和在第一和第二透镜轮廓之间的精确对准得以实现。

4. 发明公开

EP1922198A1 MINIATURE CELL ARRAY STRUCTURE AND MANUFACTURING METHOD OF MINIATURIZED COMPOSITE COMPONENT USING SUCH A MINIATURE CELL ARRAY STRUCTURE 审中-公开
标题翻译：微型电池小型化的复合材料部件的阵列结构和方法使用这种微型电池阵列结构
公开(公告)号：EP1922198A1
公开(公告)日：2008-05-21
申请号：EP06797888.2
申请日：2006-09-06
申请人： Ricoh Company, Ltd.
发明人： KANEMATSU, Toshihiro , SUTO, Katsunori , HARADA, Tomohiro
IPC分类号： B29C44/00 , B29D11/00 , B32B3/12 , C08J9/12
CPC分类号： B32B3/12 , B29D11/00365 , B29D11/00375 , B32B3/263 , B32B3/30 , B32B27/08 , B32B27/302 , B32B27/308 , B32B2307/41 , B32B2307/412 , B32B2307/42 , B32B2457/00 , Y10T156/1003
摘要： A method of manufacturing a cell array structure includes a first step of laminating a deformable layer capable of causing plastic deformation on a substrate, the substrate being formed with plural, mutually separated depressions on a top surface thereof, such that the deformable layer forms a mutually isolated space in each of the plural depressions; and a second step of extending the space in each of the plural depressions by causing plastic deformation in the deformable layer, such that there are formed plural columnar cells respectively in correspondence to the plural depressions.

5. 发明公开

EP1251365A1 Microlens array and method of its manufacturing 有权
标题翻译： Mikrolinsen-Array und Methodefürseine Herstellung
公开(公告)号：EP1251365A1
公开(公告)日：2002-10-23
申请号：EP02008858.9
申请日：2002-04-19
申请人： MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
发明人： Itoh, Nobuki
IPC分类号： G02B3/00
CPC分类号： G02B3/0056 , B29D11/00375 , G02B3/0018 , G02B3/0068 , H01L27/14627 , H01L27/14685
摘要： A method of manufacturing a microlens array comprising forming microlenses by dropping or injecting to a plurality of through holes formed on a substrate a liquefied lens material so as to dispose the lens material at each of the through holes, the lens material being curable and has a predetermined transmittivity and a predetermined viscosity.
摘要翻译：一种制造微透镜阵列的方法，包括通过滴落或注入形成在基底上的液晶透镜材料的多个通孔来形成微透镜，以便将透镜材料设置在每个通孔处，透镜材料可固化并具有预定的透射率和预定的粘度。

6. 发明公开

EP3396716A1 FABRICATION OF OPTICS WAFER 有权
公开(公告)号：EP3396716A1
公开(公告)日：2018-10-31
申请号：EP18167684.2
申请日：2013-08-19
申请人： Heptagon Micro Optics Pte. Ltd.
发明人： RUDMANN, Hartmut
IPC分类号： H01L27/146 , H01L31/0232 , B29D11/00
CPC分类号： H01L25/165 , B29D11/00307 , B29D11/00375 , H01L25/167 , H01L27/14625 , H01L27/14632 , H01L27/14683 , H01L27/14685 , H01L27/14687 , H01L31/02325 , H01L31/167 , H01L31/18 , H01L31/1876 , H01L33/58 , H01L2924/0002 , H01L2933/0058 , H01L2924/00
摘要： Fabricating an optics wafer includes providing a wafer (8) comprising a core region (9) composed of a glass-reinforced epoxy, the wafer (8) further comprising a first resin layer (10A) on a top surface of the core region (9) and a second resin layer (10B) on a bottom surface of the core region (9). The core region (9) and first and second resin layers (10A,10B) are substantially non-transparent for a specific range of the electromagnetic spectrum. The wafer (8) further includes vertical transparent regions (6) that extend through the core region (9) and the first and second resin layers (10A,10B) and are composed of a material that is substantially transparent for the specific range of the electromagnetic spectrum. The wafer (8) is thinned, for example by polishing, from its top surface and its bottom surface so that a resulting thickness is within a predetermined range without causing glass fibers of the core region (9) to become exposed. Respective optical structures are provided on one or more exposed surfaces of at least some of the transparent regions (6).

7. 发明公开

EP3329314A1 STACKED LENS STRUCTURE, METHOD OF MANUFACTURING THE SAME, AND ELECTRONIC APPARATUS 有权转让
公开(公告)号：EP3329314A1
公开(公告)日：2018-06-06
申请号：EP16751017.1
申请日：2016-07-15
申请人： Sony Corporation
发明人： MATSUGAI, Hiroyasu , ITOU, Hiroyuki , SAITO, Suguru , OHSHIMA, Keiji , IWASAKI, Masanori , HAYASHI, Toshihiko , SATO, Shuzo , FUJII, Nobutoshi , TAZAWA, Hiroshi , SHIRAIWA, Toshiaki , ISHIDA, Minoru
IPC分类号： G02B13/00 , H01L27/146 , B29D11/00 , G02B1/11
CPC分类号： H01L27/14627 , B29D11/00375 , G02B1/11 , G02B13/0085 , H01L27/14632 , H01L27/14685 , H01L27/14687
摘要： A deformation of a stacked lens is suppressed. A stacked lens structure has a configuration in which substrates with lenses having a lens disposed on an inner side of a through-hole formed in the substrate are bonded and stacked by direct bonding. The present technique can be applied to a camera module or the like in which a stacked lens structure in which at least three substrates with lenses including first to third substrates with lenses which are substrates with lenses in which a through-hole is formed in the substrate and a lens is formed on an inner side of the through-hole is integrated with a light receiving element, for example.

8. 发明公开

EP3328623A1 LENS SUBSTRATE, SEMICONDUCTOR DEVICE, AND ELECTRONIC APPARATUS 有权
公开(公告)号：EP3328623A1
公开(公告)日：2018-06-06
申请号：EP16751674.9
申请日：2016-07-19
申请人： Sony Semiconductor Solutions Corporation
发明人： SHIRAIWA, Toshiaki , OKAMOTO, Masaki , MATSUGAI, Hiroyasu , ITOU, Hiroyuki , SAITO, Suguru , OHSHIMA, Keiji , FUJII, Nobutoshi , TAZAWA, Hiroshi , ISHIDA, Minoru
IPC分类号： B29D11/00 , G02B3/00
CPC分类号： G02B3/0062 , B29D11/00009 , B29D11/00307 , B29D11/00375 , G02B3/0031 , G02B3/0068 , G02B3/0075 , G02B13/0085 , H01L27/14627 , H04N5/2254
摘要： Influence of chipping in case of dicing a plurality of stacked substrates is reduced. Provided is a semiconductor device where a substrate, in which a groove surrounding a pattern configured with a predetermined circuit or part is formed, is stacked. The present technology can be applied to, for example, a stacked lens structure where through-holes are formed in each substrate and lenses are disposed in inner sides of the through-holes, a camera module where a stacked lens structure and a light-receiving device are incorporated, a solid-state imaging device where a pixel substrate and a control substrate are stacked, and the like.

9. 发明公开

EP2553503A1 VERFAHREN UND VORRICHTUNG ZUR HERSTELLUNG EINER MIKROLINSE 有权
公开(公告)号：EP2553503A1
公开(公告)日：2013-02-06
申请号：EP10732637.3
申请日：2010-03-31
申请人： EV Group GmbH
发明人： THALLNER, Erich , WIMPLINGER, Markus , KAST, Michael
IPC分类号： G02B3/00 , B29D11/00
CPC分类号： G02B3/0031 , B29D11/00375
摘要： The invention relates to a method for producing a micro-lens using a carrier wafer, in which a lens is molded in an opening of the carrier wafer by embossing the lens in the carrier wafer, and also to a corresponding device for carrying out the method and to a micro-lens produced by the method. The invention further relates to an apparatus for producing a micro-lens and to a micro-lens.
摘要翻译：本发明涉及一种用于制造具有载体晶片的微透镜的方法，其中通过冲压透镜将载体晶片的一个开口中的透镜模制到载体晶片中以及用于执行该方法的相应装置和微透镜这是使用该方法生产的。此外，本发明涉及一种用于生产微透镜以及微透镜的装置。

10. 发明公开

EP2361755A2 Lens array 审中-公开
标题翻译：透镜阵列
公开(公告)号：EP2361755A2
公开(公告)日：2011-08-31
申请号：EP10197075.4
申请日：2010-12-27
申请人： FUJIFILM Corporation
发明人： Yamada, Daisuke , Harada, Akinori
IPC分类号： B29D11/00 , G02B3/00
CPC分类号： B29D11/00298 , B29D11/00375 , G02B3/0056 , G02B27/0018
摘要： A lens array includes: a substrate (30) in which a plurality of through holes (34) are formed; and a plurality of lenses (32) provided in the substrate by burying the plurality of through holes. A part of the through hole is different in at least one of sectional shape and opening area of the through hole, which are taken in parallel with a surface of the substrate, from another part of the through hole in a depth direction.
摘要翻译：透镜阵列包括：衬底（30），其中形成有多个通孔（34）; 以及通过埋入多个通孔而设置在基板上的多个透镜（32）。贯通孔的一部分与通孔的另一部分在深度方向上平行于基板的表面的截面形状和开口面积中的至少一个不同。

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