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    • 13. 发明公开
    • Semiconductor integrated circuit device
    • 半导体集成电路设备
    • EP0459502A3
    • 1993-01-13
    • EP91108897.9
    • 1991-05-31
    • KABUSHIKI KAISHA TOSHIBATOSHIBA MICRO-ELECTRONICS CORPORATION
    • Tokonami, KatsujiOhshima, Shigeo
    • H01L23/50H01L23/485
    • H01L24/06H01L23/5286H01L24/48H01L24/49H01L2224/05554H01L2224/48227H01L2224/49113H01L2924/00014H01L2924/14H01L2224/45099H01L2224/05599
    • There is disclosed a semiconductor integrated circuit device having: external input signal leads (109A,B) provided outside a semiconductor chip (201); a power supply lead (108) provided outside the semiconductor chip (201); a first electrode (104A) connected to an internal circuit (102A) on the semiconductor chip (201), and arranged close to the external input signal lead (109A), wherein when the circuit (102A) is caused to be operative, the first electrode (104A) is connected to the external input signal lead (109A); and a second electrode (105A) connected to the first electrode (104A) on the semiconductor chip (201), and arranged close to said power supply lead (108), wherein when the circuit (102A) is not caused to be operative, the second electrode (105A) is connected to the power supply lead (108). This invention is also applicable to a device where there are provided a plurality of internal circuits (102a, 102b). In this case, a plurality of the first electrodes (104a, 104b) drawn out from the internal circuits (102A,102B) are arranged close to the external input signal lead (109A,109B), and a plurality of the second electrodes (105a, 105b) similarly drawn out from the internal circuits (102A,102B) are arranged close to the power supply lead (108).
    • 公开了一种半导体集成电路器件,其具有设置在半导体芯片的外部的外部输入信号引线(109) 设置在所述半导体芯片外部的电源引线(108) 连接到半导体芯片上的内部电路(102)并且靠近外部输入信号引线设置的第一电极(104),其中当使电路工作时,第一电极连接到外部输入信号引线 ; 以及连接到半导体芯片上的第一电极并且靠近所述电源引线设置的第二电极(105),其中当不使电路工作时,第二电极连接到电源引线。 本发明适用于设置有多个内部电路(102a,102b)的装置。 在这种情况下,从内部电路引出的多个第一电极(104a,104b)布置成靠近外部输入信号引线,并且多个第二电极(105a,105b)类似地从内部电路中抽出 靠近电源线安排。
    • 15. 发明公开
    • Semiconductor memory device
    • 半导体存储器件
    • EP0432509A3
    • 1992-09-30
    • EP90121917.0
    • 1990-11-15
    • KABUSHIKI KAISHA TOSHIBATOSHIBA MICRO-ELECTRONICS CORPORATION
    • Kiryu, MasakazuOhshima, Shigeo
    • G11C7/00G11C11/409
    • G11C7/00G11C11/4096
    • A semiconductor memory device comprises a memory cell array, a row decoder (RD), a column decoder (CP1), registers (CR) and a control unit (BLW). The control unit (BLW) allows the write operational mode of the column decoder (CD1) to switch. In the ordinary write operational mode, data in the n registers (CR) are written into the active memory cells of the n memory cell columns in one column block (CB) selected by the column decoder, respectively. In the block write mode, data in the n registers are written into active memory cells of the n memory cell columns in the 2 N column blocks selected by the column decoder, respectively. Another semiconductor memory device comprises N memory units (UNT). Each memory unit (UNT) comprises a memory cell array, a row decoder (RD), a first column decoder (CP1), a second column decoder (CD2), a data input terminal (WI/O), registers (CR) and a control circuit. The control circuit is operative to allow the operational mode. When the device is in the ordinary mode, data latched in the register (CR) is written into one memory cell (MC) connected to one word line (WL) selected by the row decoder (RD) of one column selected by the first column decoder (CD1) of column blocks (CB) selected by the second decoder (CD2). While when the device is in the block write mode, data latched in the register (CR) is written at the same time into j memory cells (MC) connected to one word line (WL) selected by the row decoder (RD) of column blocks (CB) selected by the second column decoder (CD2).
    • 半导体存储器件包括存储单元阵列,行解码器(RD),列解码器(CP1),寄存器(CR)和控制单元(BLW)。 控制单元(BLW)允许列解码器(CD1)的写操作模式切换。 在普通写入操作模式中,n个寄存器(CR)中的数据分别被写入由列解码器选择的一个列块(CB)中的n个存储器单元列的活动存储器单元中。 在块写入模式中,将n个寄存器中的数据分别写入由列解码器选择的2N个列块中的n个存储器单元列中的有效存储器单元。 另一种半导体存储器件包括N个存储单元(UNT)。 每个存储单元(UNT)包括存储单元阵列,行解码器(RD),第一列解码器(CP1),第二列解码器(CD2),数据输入端子(WI / O),寄存器(CR)和 一个控制电路。 控制电路可操作以允许操作模式。 当器件处于普通模式时,锁存在寄存器(CR)中的数据被写入连接到由第一列选择的一列的行解码器(RD)选择的一个字线(WL)的一个存储器单元(MC) 由第二解码器(CD2)选择的列块(CB)的解码器(CD1)。 而当器件处于块写入模式时,锁存在寄存器(CR)中的数据同时写入连接到由列的行解码器(RD)选择的一个字线(WL)的j个存储器单元(MC) 由第二列解码器(CD2)选择的块(CB)。
    • 19. 发明公开
    • Semiconductor memory device
    • 半导体存储器件
    • EP0788107A3
    • 1999-06-02
    • EP97101347.9
    • 1997-01-29
    • KABUSHIKI KAISHA TOSHIBA
    • Kai, YasuyukiNagaba, KatsushiOhshima, Shigeo
    • G11C7/00
    • G11C7/1048G11C7/1078
    • A semiconductor memory device capable of shortening data reading time in a first read cycle after the mode has been changed from a write mode to a read mode while maintaining high-speed cycle time when data is written despite simple structure, the semiconductor memory device having a memory cell array (11) having a plurality of dynamic memory cells, to which data can be written, data line pairs (DQ0, BDQ0 to DQN, BDQN) to which data read from the memory cells and data which must be written on the memory cells are transferred, a write driver (17) for driving the data line pairs in accordance with write data supplied from outside when data is written to the memory cells and an equalizing circuit (18) for setting the data line pairs to an intermediate potential whenever the data line pairs are operated by the write driver.
    • 本发明公开了一种半导体存储装置,该半导体存储装置能够缩短从写入模式向读取模式变更模式后的第一读取周期的数据读取时间,并且即使简单地构成写入数据也能够维持高速的周期时间, 具有可向其写入数据的多个动态存储单元的存储单元阵列(11),从存储单元读取数据的数据线对(DQ0,BDQ0至DQN,BDQN)以及必须写入存储单元的数据 当数据被写入存储器单元时,用于驱动数据线对的写入驱动器(17)根据外部提供的写入数据来驱动数据线对,以及均衡电路(18),用于无论何时将数据线对设置为中间电位 数据线对由写入驱动器操作。