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    • 4. 发明公开
    • Semiconductor integrated circuit device
    • 半导体集成电路器件
    • EP0459502A2
    • 1991-12-04
    • EP91108897.9
    • 1991-05-31
    • KABUSHIKI KAISHA TOSHIBATOSHIBA MICRO-ELECTRONICS CORPORATION
    • Tokonami, KatsujiOhshima, Shigeo
    • H01L23/50H01L23/485
    • H01L24/06H01L23/5286H01L24/48H01L24/49H01L2224/05554H01L2224/48227H01L2224/49113H01L2924/00014H01L2924/14H01L2224/45099H01L2224/05599
    • There is disclosed a semiconductor integrated circuit device having: external input signal leads (109A,B) provided outside a semiconductor chip (201); a power supply lead (108) provided outside the semiconductor chip (201); a first electrode (104A) connected to an internal circuit (102A) on the semiconductor chip (201), and arranged close to the external input signal lead (109A), wherein when the circuit (102A) is caused to be operative, the first electrode (104A) is connected to the external input signal lead (109A); and a second electrode (105A) connected to the first electrode (104A) on the semiconductor chip (201), and arranged close to said power supply lead (108), wherein when the circuit (102A) is not caused to be operative, the second electrode (105A) is connected to the power supply lead (108). This invention is also applicable to a device where there are provided a plurality of internal circuits (102a, 102b). In this case, a plurality of the first electrodes (104a, 104b) drawn out from the internal circuits (102A,102B) are arranged close to the external input signal lead (109A,109B), and a plurality of the second electrodes (105a, 105b) similarly drawn out from the internal circuits (102A,102B) are arranged close to the power supply lead (108).
    • 公开了一种半导体集成电路器件,其具有:设置在半导体芯片(201)外部的外部输入信号引线(109A,B); 设置在半导体芯片(201)外部的电源引线(108); 与半导体芯片(201)上的内部电路(102A)连接并靠近外部输入信号引线(109A)布置的第一电极(104A),其中当使电路(102A)工作时,第一电极 电极(104A)连接到外部输入信号引线(109A); 以及与所述半导体芯片(201)上的所述第一电极(104A)连接并靠近所述电源引线(108)设置的第二电极(105A),其中,当所述电路(102A)未被致动时,所述 第二电极(105A)连接到电源引线(108)。 本发明也适用于提供多个内部电路(102a,102b)的设备。 在这种情况下,从内部电路(102A,102B)引出的多个第一电极(104a,104b)被布置为靠近外部输入信号引线(109A,109B),并且多个第二电极 ,105b)从内部电路(102A,102B)类似地引出靠近电源引线(108)布置。
    • 9. 发明公开
    • Semiconductor memory device
    • Halbleiterspeicheranordnung。
    • EP0432509A2
    • 1991-06-19
    • EP90121917.0
    • 1990-11-15
    • KABUSHIKI KAISHA TOSHIBATOSHIBA MICRO-ELECTRONICS CORPORATION
    • Kiryu, MasakazuOhshima, Shigeo
    • G11C7/00G11C11/409
    • G11C7/00G11C11/4096
    • A semiconductor memory device comprises a memory cell array, a row decoder (RD), a column decoder (CP1), registers (CR) and a control unit (BLW). The control unit (BLW) allows the write operational mode of the column decoder (CD1) to switch. In the ordinary write operational mode, data in the n registers (CR) are written into the active memory cells of the n memory cell columns in one column block (CB) selected by the column decoder, respectively. In the block write mode, data in the n registers are written into active memory cells of the n memory cell columns in the 2 N column blocks selected by the column decoder, respectively.
      Another semiconductor memory device comprises N memory units (UNT). Each memory unit (UNT) comprises a memory cell array, a row decoder (RD), a first column decoder (CP1), a second column decoder (CD2), a data input terminal (WI/O), registers (CR) and a control circuit. The control circuit is operative to allow the operational mode. When the device is in the ordinary mode, data latched in the register (CR) is written into one memory cell (MC) connected to one word line (WL) selected by the row decoder (RD) of one column selected by the first column decoder (CD1) of column blocks (CB) selected by the second decoder (CD2). While when the device is in the block write mode, data latched in the register (CR) is written at the same time into j memory cells (MC) connected to one word line (WL) selected by the row decoder (RD) of column blocks (CB) selected by the second column decoder (CD2).
    • 半导体存储器件包括存储单元阵列,行解码器(RD),列解码器(CP1),寄存器(CR)和控制单元(BLW)。 控制单元(BLW)允许列解码器(CD1)的写操作模式切换。 在普通写操作模式中,n个寄存器(CR)中的数据分别被写入由列解码器选择的一个列块(CB)中的n个存储单元列的有效存储单元中。 在块写入模式中,n个寄存器中的数据分别被写入由列解码器选择的2 列中的n个存储单元列的有效存储单元。 另一半导体存储器件包括N个存储单元(UNT)。 每个存储器单元(UNT)包括存储单元阵列,行解码器(RD),第一列解码器(CP1),第二列解码器(CD2),数据输入端(WI / O),寄存器(CR)和 一个控制电路。 控制电路可操作以允许操作模式。 当设备处于普通模式时,锁存在寄存器(CR)中的数据被写入连接到由第一列选择的一列的行解码器(RD)选择的一个字线(WL)的一个存储单元(MC) 由第二解码器(CD2)选择的列块(CB)的解码器(CD1)。 当器件处于写入模式时,寄存器(CR)中锁存的数据被同时写入连接到由行解码器(RD)的列选择的一个字线(WL)的j个存储器单元(MC) 块(CB)由第二列解码器(CD2)选择。