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1. 发明授权

EP2665103B1 Light emitting device 有权转让
公开(公告)号：EP2665103B1
公开(公告)日：2018-12-26
申请号：EP13167635.5
申请日：2013-05-14
申请人： LG Innotek Co., Ltd.
发明人： Lee, Kwang Hee , Kim, Gam Gon
IPC分类号： H01L33/48 , H01L33/62 , H01L25/075
CPC分类号： H01L33/62 , H01L25/0753 , H01L33/486 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/49113 , H01L2224/73265 , H01L2224/92247 , H01L2924/1301 , H01L2924/00014 , H01L2924/00
摘要： A light emitting device according to an embodiment includes a body including first and second side walls which correspond to each other, third and fourth side walls which have lengths longer than lengths of the first and second side walls, and a concave portion; a first lead frame under the concave portion and the third side wall; a second lead frame under the concave portion and the fourth side wall; a light emitting chip on at least one of the first and second lead frames; a molding member on the concave portion; a first recess portion recessed from the first side wall toward the second side wall and connected to a bottom of the body; and a second recess portion recessed from the second side wall toward the first side wall and connected to the bottom of the body.

2. 发明授权

EP2838195B1 Combiner circuit for a class-e outphasing power amplifier 有权转让
公开(公告)号：EP2838195B1
公开(公告)日：2018-10-03
申请号：EP13180416.3
申请日：2013-08-14
申请人： Ampleon Netherlands B.V.
发明人： van der Heijden, Mark
IPC分类号： H03F3/217 , H03F1/02 , H03F1/56
CPC分类号： H03F3/68 , H01L2224/49113 , H01L2224/49175 , H03F1/0294 , H03F1/565 , H03F3/2176 , H03F2200/387 , H03F2200/391 , H03F2203/21139 , H03H7/463
摘要： Lumped-element (L E , C E , L CHIR , C CHIR ) based class-E Chireix combiners are disclosed that are equivalents of a quarter-wave transmission line combiner. The proposed class-E equivalent power amplifier circuits that are used can be derived from a parallel tuned class-E implementation. The proposed low-pass equivalents can behave similarly in terms of class-E performance, but absorb the 90 degree transmission line.

3. 发明授权

EP2147468B1 SEMICONDUCTOR LIGHT EMITTING DEVICE PACKAGES AND METHODS 有权转让
标题翻译：半导体发光器件封装和方法
公开(公告)号：EP2147468B1
公开(公告)日：2018-02-28
申请号：EP08742905.6
申请日：2008-04-15
申请人： Cree, Inc.
发明人： LOH, Ban P. , CANNON, Nathaniel O. , HILLER, Norbert , EDMOND, John , JACKSON, Mitch , MENDENDORP, JR., Nicholas W.
IPC分类号： H01L33/48 , H01L33/62 , H01L33/52 , H01L33/54 , H01L25/16
CPC分类号： H01L33/52 , H01L24/97 , H01L25/167 , H01L33/486 , H01L33/54 , H01L33/62 , H01L2224/32245 , H01L2224/32257 , H01L2224/45124 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/48471 , H01L2224/49113 , H01L2224/73265 , H01L2224/97 , H01L2924/00014 , H01L2924/01322 , H01L2924/12041 , H01L2924/12042 , H01L2924/14 , H01L2924/181 , H01L2924/1815 , H01L2924/00 , H01L2224/4554
摘要： A submount for a light emitting device package includes a rectangular substrate. A first bond pad and a second bond pad are on a first surface of the substrate. The first bond pad includes a die attach region offset toward a first end of the substrate and configured to receive a light emitting diode thereon. The second bond pad includes a bonding region between the first bond pad and the second end of the substrate and a second bond pad extension that extends from the bonding region along a side of the substrate toward a corner of the substrate at the first end of the substrate. First and second solder pads are a the second surface of the substrate. The first solder pad is adjacent the first end of the substrate and contacts the second bond pad. The second solder pad is adjacent the second end of the substrate and contacts the first bond pad. Related LED packages and methods of forming LED packages are disclosed.

4. 发明公开

EP2645413A3 Integrated dual power converter package having internal driver IC 有权转让
标题翻译：集成双电源转换器封装，内置驱动器IC
公开(公告)号：EP2645413A3
公开(公告)日：2017-12-13
申请号：EP13155568.2
申请日：2013-02-18
申请人： International Rectifier Corporation
发明人： Cho, Eung San , Clavette, Dan
IPC分类号： H01L23/495
CPC分类号： H01L23/49562 , H01L23/49524 , H01L23/49575 , H01L25/16 , H01L2224/40137 , H01L2224/48247 , H01L2224/49113 , H01L2224/49171 , H01L2924/13091 , H01L2924/30107 , H01L2924/00
摘要： An integrated dual power converter package is disclosed. The package includes a leadframe having a first control FET paddle configured to support a drain of a first control FET, and a second control FET paddle configured to support a drain of a second control FET. The leadframe further includes a sync FET paddle configured to support a source of a first sync FET and a source of a second sync FET, and a driver integrated circuit (IC) paddle configured to support a driver IC for controlling each of the control FETs and each of the sync FETs. The leadframe may additionally include first and second switched nodes, configured for electrical connection to the first control FET and the first sync FET via a first clip, and to the second control FET and the second sync FET via a second clip, respectively.
摘要翻译：公开了一种集成双电源转换器封装。该封装包括具有被配置为支持第一控制FET的漏极的第一控制FET桨和被配置为支持第二控制FET的漏极的第二控制FET桨的引线框架。引线框还包括配置为支持第一同步FET的源极和第二同步FET的源极的同步FET桨，以及配置为支持用于控制每个控制FET的驱动器IC的驱动器集成电路（IC）桨和每个同步FET。引线框可以另外包括第一和第二开关节点，其被配置为分别经由第一片段电连接到第一控制FET和第一同步FET，并且经由第二片段电连接到第二控制FET和第二同步FET。

5. 发明授权

EP2137764B1 Semiconductor body and method for voltage regulation 有权
标题翻译：半导体本体和用于电压调节的方法
公开(公告)号：EP2137764B1
公开(公告)日：2017-11-01
申请号：EP08749608.9
申请日：2008-04-18
申请人： ams AG
发明人： COLOMBO, Matteo
IPC分类号： H01L23/495 , H01L23/50 , H03K5/08
CPC分类号： H01L23/4952 , H01L23/50 , H01L23/5228 , H01L23/525 , H01L24/02 , H01L24/16 , H01L24/48 , H01L24/49 , H01L2224/0401 , H01L2224/04073 , H01L2224/16 , H01L2224/48091 , H01L2224/48247 , H01L2224/49113 , H01L2224/85447 , H01L2924/00014 , H01L2924/01014 , H01L2924/01015 , H01L2924/01029 , H01L2924/01037 , H01L2924/01074 , H01L2924/01082 , H01L2924/01088 , H01L2924/12042 , H01L2924/1306 , H01L2924/14 , H01L2924/19041 , H01L2924/19043 , H01L2924/30107 , H01L2924/3011 , H03K5/08 , Y10T307/50 , H01L2924/00 , H01L2224/45099

6. 发明公开

EP2603929A4 STITCH BUMP STACKING DESIGN FOR OVERALL PACKAGE SIZE REDUCTION FOR MULTIPLE STACK 无效转让
标题翻译： GARNROLLENSTAPELENTWURF ZURGESAMTPAKETGRÖSSENREDUZIERUNGFÜRMEHRERE STAPEL
公开(公告)号：EP2603929A4
公开(公告)日：2017-05-03
申请号：EP11816997
申请日：2011-08-10
申请人： CYPRESS SEMICONDUCTOR CORP
发明人： CHIN LAI NGUK , HO FOONG YUE , NAM WONG KWET , LUON KOO ENG , FOONG SALLY , GUAN KEVIN
IPC分类号： H01L23/49 , H01L25/065
CPC分类号： H01L24/49 , H01L24/27 , H01L24/32 , H01L24/33 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/83 , H01L24/85 , H01L24/92 , H01L25/0657 , H01L25/50 , H01L2224/27436 , H01L2224/2919 , H01L2224/32014 , H01L2224/32145 , H01L2224/32225 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/48456 , H01L2224/48465 , H01L2224/4848 , H01L2224/48599 , H01L2224/48699 , H01L2224/48997 , H01L2224/49112 , H01L2224/49113 , H01L2224/49427 , H01L2224/73265 , H01L2224/83191 , H01L2224/838 , H01L2224/8503 , H01L2224/85051 , H01L2224/85181 , H01L2224/85203 , H01L2224/85205 , H01L2224/85207 , H01L2224/85951 , H01L2224/85986 , H01L2224/92247 , H01L2225/0651 , H01L2225/06562 , H01L2924/01014 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01057 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/0665 , H01L2924/14 , H01L2924/00014 , H01L2924/00 , H01L2924/00012 , H01L2224/48455
摘要： A method for die stacking is disclosed. In one embodiment a first die is formed overlying a substrate. A first wire is bonded to the first die and to a bond finger of the substrate, wherein the first wire is bonded to the bond finger with a first bond. A first stitch bump is formed overlying the first stitch bond, wherein the first stitch bump is formed from a molten ball of conductive material. A second die is formed overlying the first die. A second wire is bonded to the second die and to the first stitch bump, wherein the second wire is bonded to the first stitch bump with a second bond.
摘要翻译：公开了一种用于芯片堆叠的方法。在一个实施例中，第一管芯形成为覆盖衬底。第一导线被结合到第一管芯并被结合到衬底的结合指，其中第一导线通过第一结合被结合到结合指。第一线圈凸点形成为覆盖第一线迹结合，其中第一线圈凸点由导电材料的熔融球形成。形成覆盖第一模具的第二模具。第二导线结合到第二管芯和第一线圈凸点，其中第二导线通过第二键合结合到第一线圈凸点。

7. 发明授权

EP1843403B1 Light emitting unit and lighting apparatus 有权
标题翻译：发光装置和照明装置
公开(公告)号：EP1843403B1
公开(公告)日：2016-12-28
申请号：EP07105251.8
申请日：2007-03-29
申请人： Nichia Corporation
发明人： Sumitani, Naofumi
IPC分类号： H01L33/00 , G02B6/42 , H01L25/075 , H04N1/028 , H05K1/18 , H05K3/30
CPC分类号： H05K1/18 , H01L2224/48247 , H01L2224/48257 , H01L2224/49113 , H04N1/0083 , H04N1/02815 , H04N1/0282 , H05K3/308 , H05K2201/10106 , H05K2201/10484

9. 发明公开

EP3086472A1 SEMICONDUCTOR DEVICE 审中-公开
标题翻译：半导体器件
公开(公告)号：EP3086472A1
公开(公告)日：2016-10-26
申请号：EP16164852.2
申请日：2016-04-12
申请人： Renesas Electronics Corporation
发明人： TOYODA, Hisashi , YAMAZAKI, Koichi , ARAI, Koichi , SEKI, Tatsuhiro
IPC分类号： H03K17/687 , H03K17/74 , H03K17/10
CPC分类号： H01L25/18 , H01L24/48 , H01L24/49 , H01L25/072 , H01L29/1095 , H01L2224/0603 , H01L2224/48137 , H01L2224/48225 , H01L2224/49113 , H01L2924/00014 , H01L2924/10253 , H01L2924/10272 , H01L2924/1203 , H01L2924/1207 , H01L2924/13062 , H01L2924/13091 , H02P27/06 , H03K17/102 , H03K17/6871 , H03K17/74 , H03K2017/6875 , H01L2224/45015 , H01L2924/207 , H01L2224/45099
摘要： A semiconductor device includes a normally-on junction FET having a gate electrode, a source electrode and a drain electrode and a normally-off MOSFET having a gate electrode, a source electrode and a drain electrode. The source electrode of the junction FET is electrically connected to the drain electrode of the MOSFET, and the junction FET is thus connected to the MOSFET in series. The gate electrode of the junction FET is electrically connected to the gate electrode of the MOSFET.
摘要翻译：一种半导体器件包括具有栅电极，源电极和漏电极的常导通结型FET以及具有栅电极，源电极和漏电极的常关MOSFET。结型FET的源电极电连接到MOSFET的漏电极，因此结型FET串联连接到MOSFET。结型FET的栅极电连接到MOSFET的栅极。

10. 发明公开

EP2980473A4 LIGHTING APPARATUS 有权
标题翻译： BELEUCHTUNGSVORRICHTUNG
公开(公告)号：EP2980473A4
公开(公告)日：2016-10-19
申请号：EP13879893
申请日：2013-08-22
申请人： TOSHIBA LIGHTING & TECHNOLOGY
发明人： SHIRAISHI HIROMITSU
IPC分类号： F21V19/00 , F21V23/00
CPC分类号： H01L33/54 , F21K9/00 , F21Y2101/00 , F21Y2105/10 , F21Y2115/10 , H01L25/0753 , H01L33/486 , H01L33/52 , H01L33/60 , H01L33/62 , H01L33/641 , H01L2224/48247 , H01L2224/49113 , H01L2924/0002 , H05B33/04 , H05B33/06 , H01L2924/00
摘要： A lighting device according to an embodiment includes a body section; a substrate that is provided in the body section; a wiring pattern that is provided on a surface of the substrate and has a plurality of wiring pads; a plurality of light emitting elements that are provided on the wiring pattern and have electrodes in the vicinity of a the circumference edge of a surface opposite to a side on which the wiring pattern is provided; a plurality of wirings that respectively connect the plurality of wiring pads and a plurality of electrodes; a surrounding wall member that is provided so as to surround the plurality of light emitting elements and has an annular shape; and a sealing section that is provided so as to cover the inside of the surrounding wall member. Then, at least a part of the plurality of light emitting elements is connected in series. The plurality of electrodes are respectively positioned on or inside a circumference passing through centers of the plurality of light emitting elements which are connected in series centered on a first position in electric connection between the light emitting element and the light emitting element in the plurality of light emitting elements connected in series.
摘要翻译：根据实施例的照明装置包括主体部分; 设置在所述主体部中的基板; 布线图案，其设置在所述基板的表面上并具有多个布线板; 多个发光元件，其设置在所述布线图案上，并且在与设置有所述布线图案的一侧相反的表面的周边的周边附近具有电极; 分别连接多个布线焊盘和多个电极的多个布线; 设置为围绕多个发光元件并具有环状的周壁构件; 以及密封部，其设置成覆盖所述周围壁部件的内部。然后，多个发光元件的至少一部分串联连接。多个电极分别位于通过多个发光元件的中心的圆周上或内侧，多个发光元件的中心以多个光的发光元件和发光元件之间的电连接的第一位置为中心串联连接串联连接的发光元件。

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