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    • 5. 发明申请
    • Semiconductor devices and methods of manufacture
    • 半导体器件及制造方法
    • US20070096239A1
    • 2007-05-03
    • US11263163
    • 2005-10-31
    • Xian-An CaoStephen Arthur
    • Xian-An CaoStephen Arthur
    • H01L31/00
    • H01L29/868H01L29/1608H01L29/2003H01L29/66196H01L29/66204H01L29/872
    • A semiconductor device includes a substrate comprising a material selected from the group consisting of AlN, SiC, GaN, sapphire and combinations thereof. An n+ type epitaxial layer is disposed above substrate and comprises GaN or AlGaN. An n− type epitaxial layer is disposed above substrate and comprises GaN or AlGaN. A p+-n junction grid comprising p+ GaN or p+ AlGaN is formed on selective areas of the n− type epitaxial layer. A metal layer is disposed over the p+-n junction grid and forms a Schottky contact. Another metal layer is deposited on one of the substrate and the n+ type epitaxial layer and forms a cathode electrode. A method of fabricating a semiconductor device is provided and includes forming a p+-n junction grid on a drift layer comprising GaN or AlGaN.
    • 半导体器件包括包含选自由AlN,SiC,GaN,蓝宝石及其组合组成的组的材料的衬底。 n + +型外延层设置在衬底上方并包括GaN或AlGaN。 n型外延层设置在衬底上方并且包括GaN或AlGaN。 在n型外延层的选择性区域上形成包括p + +或/或+ AlGaN的p + 金属层设置在p + n + n连接栅格上方并形成肖特基接触。 另一金属层沉积在衬底和n +型外延层中的一个上并形成阴极电极。 提供了一种制造半导体器件的方法,包括在包括GaN或AlGaN的漂移层上形成p + + n结栅格。