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1. 发明申请

US20070235810A1 POWER SEMICONDUCTOR MODULE AND FABRICATION METHOD 有权
标题翻译：功率半导体模块和制造方法
公开(公告)号：US20070235810A1
公开(公告)日：2007-10-11
申请号：US11279011
申请日：2006-04-07
申请人： Eladio Delgado , Richard Beaupre , Stephen Arthur , Ernest Balch , Kevin Durocher , Paul McConnelee , Raymond Fillion
发明人： Eladio Delgado , Richard Beaupre , Stephen Arthur , Ernest Balch , Kevin Durocher , Paul McConnelee , Raymond Fillion
IPC分类号： H01L23/62
CPC分类号： H01L25/50 , H01L23/5389 , H01L24/24 , H01L24/29 , H01L24/82 , H01L24/83 , H01L25/072 , H01L25/16 , H01L2224/04105 , H01L2224/2413 , H01L2224/24137 , H01L2224/2518 , H01L2224/2919 , H01L2224/73267 , H01L2224/82039 , H01L2224/82047 , H01L2224/83192 , H01L2224/83801 , H01L2224/8385 , H01L2224/92144 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/0132 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/12044 , H01L2924/1301 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/15153 , H01L2924/1517 , H01L2924/15192 , H01L2924/1532 , H01L2924/18162 , H01L2924/00 , H01L2924/01014
摘要： A power semiconductor module includes: an interconnect layer including an electrical conductor patterned on a dielectric layer, the electrical conductor including a power coupling portion having a thickness sufficient to carry power currents and a control coupling portion having a thickness thinner than that of the power coupling portion; and a semiconductor power device physically coupled to the interconnect layer and electrically coupled to the power coupling portion of the electrical conductor.
摘要翻译：功率半导体模块包括：互连层，其包括在电介质层上图案化的电导体，所述电导体包括具有足以承载电力电流的厚度的功率耦合部分和具有比功率耦合的厚度更薄的厚度的控制耦合部分一部分; 以及物理耦合到所述互连层并且电耦合到所述电导体的功率耦合部分的半导体功率器件。

2. 发明申请

US20060108684A1 Power module, phase leg, and three-phase inverter 有权
标题翻译：电源模块，相桥和三相变频器
公开(公告)号：US20060108684A1
公开(公告)日：2006-05-25
申请号：US10998798
申请日：2004-11-24
申请人： Ljubisa Stevanovic , Eladio Delgado , Michael Schutten , Richard Beaupre , Michael De Rooij
发明人： Ljubisa Stevanovic , Eladio Delgado , Michael Schutten , Richard Beaupre , Michael De Rooij
IPC分类号： H01L23/34
CPC分类号： H01L24/49 , H01L23/3735 , H01L24/45 , H01L24/48 , H01L25/071 , H01L25/072 , H01L2224/45014 , H01L2224/45015 , H01L2224/45124 , H01L2224/48091 , H01L2224/48137 , H01L2224/48139 , H01L2224/48472 , H01L2224/49109 , H01L2224/49111 , H01L2224/49113 , H01L2224/49175 , H01L2224/73265 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01068 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12032 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13063 , H01L2924/13064 , H01L2924/13091 , H01L2924/15787 , H01L2924/19041 , H01L2924/2076 , H01L2924/30107 , H01L2924/3011 , H05K1/0306 , H05K1/147 , H05K3/0061 , H05K3/361 , H05K2201/044 , H05K2201/0715 , H05K2201/10189 , H05K2201/10287 , H01L2924/00014 , H01L2924/00
摘要： A power module includes a substrate that includes an upper layer, an electrical insulator and a thermal coupling layer. The upper layer includes an electrically conductive pattern and is configured for receiving power devices. The electrical insulator is disposed between the upper layer and the thermal coupling layer. The thermal coupling layer is configured for thermal coupling to a heat sink. The power module further includes at least one laminar interconnect that includes first and second electrically conductive layers and an insulating layer disposed between the first and second electrically conductive layers. The first electrically conductive layer of the laminar interconnect is electrically connected to the upper layer of the substrate. Electrical connections connect a top side of the power devices to the second electrically conductive layer of the laminar interconnect.
摘要翻译：功率模块包括包括上层，电绝缘体和热耦合层的衬底。上层包括导电图案，并且被配置为用于接收功率器件。电绝缘体设置在上层和热耦合层之间。热耦合层被配置为热耦合到散热器。功率模块还包括至少一个层状互连，其包括第一和第二导电层以及设置在第一和第二导电层之间的绝缘层。层状互连的第一导电层电连接到衬底的上层。电连接将功率器件的顶侧连接到层状互连的第二导电层。

3. 发明申请

US20080054298A1 POWER MODULE WITH LAMINAR INTERCONNECT 审中-公开
标题翻译：具有层间互连的功率模块
公开(公告)号：US20080054298A1
公开(公告)日：2008-03-06
申请号：US11933744
申请日：2007-11-01
申请人： Ljubisa Stevanovic , Eladio Delgado , Michael Schutten , Richard Beaupre , Michael De Rooij
发明人： Ljubisa Stevanovic , Eladio Delgado , Michael Schutten , Richard Beaupre , Michael De Rooij
IPC分类号： H01L31/111
CPC分类号： H01L24/49 , H01L23/3735 , H01L24/45 , H01L24/48 , H01L25/071 , H01L25/072 , H01L2224/45014 , H01L2224/45015 , H01L2224/45124 , H01L2224/48091 , H01L2224/48137 , H01L2224/48139 , H01L2224/48472 , H01L2224/49109 , H01L2224/49111 , H01L2224/49113 , H01L2224/49175 , H01L2224/73265 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01068 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12032 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13063 , H01L2924/13064 , H01L2924/13091 , H01L2924/15787 , H01L2924/19041 , H01L2924/2076 , H01L2924/30107 , H01L2924/3011 , H05K1/0306 , H05K1/147 , H05K3/0061 , H05K3/361 , H05K2201/044 , H05K2201/0715 , H05K2201/10189 , H05K2201/10287 , H01L2924/00 , H01L2924/206
摘要： A power module includes a substrate that includes an upper layer, an electrical insulator and a thermal coupling layer. The upper layer includes an electrically conductive pattern and is configured for receiving power devices. The electrical insulator is disposed between the upper layer and the thermal coupling layer. The thermal coupling layer is configured for thermal coupling to a heat sink. The power module further includes at least one laminar interconnect that includes first and second electrically conductive layers and an insulating layer disposed between the first and second electrically conductive layers. The first electrically conductive layer of the laminar interconnect is electrically connected to the upper layer of the substrate. Electrical connections connect a top side of the power devices to the second electrically conductive layer of the laminar interconnect.
摘要翻译：功率模块包括包括上层，电绝缘体和热耦合层的衬底。上层包括导电图案，并且被配置为用于接收功率器件。电绝缘体设置在上层和热耦合层之间。热耦合层被配置为热耦合到散热器。功率模块还包括至少一个层状互连，其包括第一和第二导电层以及设置在第一和第二导电层之间的绝缘层。层状互连的第一导电层电连接到衬底的上层。电连接将功率器件的顶侧连接到层状互连的第二导电层。

4. 发明申请

US20070090464A1 Power circuit package and fabrication method 有权
标题翻译：电源电路封装及制作方法
公开(公告)号：US20070090464A1
公开(公告)日：2007-04-26
申请号：US11259992
申请日：2005-10-26
申请人： Eladio Delgado , Richard Beaupre
发明人： Eladio Delgado , Richard Beaupre
IPC分类号： H01L29/94
CPC分类号： H01L23/057 , H01L23/24 , H01L23/49811 , H01L23/49822 , H01L24/24 , H01L25/072 , H01L25/162 , H01L2224/24137 , H01L2224/32225 , H01L2224/73267 , H01L2224/92144 , H01L2924/01079 , H01L2924/12044 , H01L2924/1305 , H01L2924/15747 , H01L2924/15787 , H01L2924/3011 , H05K1/141 , H05K1/145 , H05K1/147 , H01L2924/00
摘要： A power circuit package includes a base including a substrate, a plurality of interconnect circuit layers over the substrate with each including a substrate insulating layer patterned with substrate electrical interconnects, and via connections extending from a top surface of the substrate to at least one of the substrate electrical interconnects; and a power semiconductor module including power semiconductor devices each including device pads on a top surface of the respective power semiconductor device and backside contacts on a bottom surface of the respective power semiconductor device, the power semiconductor devices being coupled to a membrane structure, the membrane structure including a membrane insulating layer and membrane electrical interconnects over the membrane insulating layer and selectively extending to the device pads, wherein the backside contacts are coupled to selected substrate electrical interconnects or via connections.
摘要翻译：功率电路封装包括基底，其包括基底，在基底上的多个互连电路层，每个包括用衬底电互连图案化的衬底绝缘层，以及经由从衬底的顶表面延伸到至少一个基板电气互连; 以及功率半导体模块，其包括功率半导体器件，每个功率半导体器件在各个功率半导体器件的顶表面上包括器件焊盘，并且在各个功率半导体器件的底表面上具有背面触点，所述功率半导体器件耦合到膜结构，所述膜包括膜绝缘层和膜电绝缘层上的薄膜电互连并且选择性地延伸到器件焊盘的结构，其中背面触点耦合到所选择的衬底电互连或经由连接。

5. 发明申请

US20060180197A1 Layer-to-layer interconnects for photoelectric devices and methods of fabricating the same 有权
标题翻译：用于光电器件的层间互连及其制造方法
公开(公告)号：US20060180197A1
公开(公告)日：2006-08-17
申请号：US11058850
申请日：2005-02-15
申请人： John Gui , Eladio Delgado
发明人： John Gui , Eladio Delgado
IPC分类号： H01L31/042
CPC分类号： H01L31/043 , H01G9/2031 , H01G9/2072 , H01G9/2095 , H01L27/301 , H01L31/02008 , H01L31/0504 , Y02E10/542 , Y02P70/521
摘要： Interconnects for electronic devices. More specifically, stacked photoelectric devices, such as parallel tandem photovoltaic devices are provided. Each of the photovoltaic devices comprises photovoltaic cells formed between two substrates. Each of the substrates may include one or more interconnects to route a voltage from one side of the substrate to another. Each substrate includes an edge portion extending beyond the edge portion of an immediately adjacent substrate. All interconnects are exposed to one side of the device for easy and flexible electric connectivity and fabrication. The interconnects, which may include conductive vias or conductive edge wraps, are formed in the edge portion of the substrates.
摘要翻译：电子设备互连。更具体地，提供了诸如并联串联光伏器件的堆叠光电器件。每个光伏器件包括在两个衬底之间形成的光伏电池。每个基板可以包括一个或多个互连件，以将电压从基板的一侧传送到另一侧。每个基板包括延伸超过紧邻基板的边缘部分的边缘部分。所有互连件都暴露在设备的一侧，便于电气连接和制造。可以在基板的边缘部分中形成可以包括导电通孔或导电边缘包层的互连。

6. 发明申请

US20100141377A1 Power Aware Techniques For Energy Harvesting Remote Sensor System 有权
标题翻译：电力感知技术用于能量收集远程传感器系统
公开(公告)号：US20100141377A1
公开(公告)日：2010-06-10
申请号：US12331908
申请日：2008-12-10
申请人： Emad Andarawis , Ertugrul Berkcan , C. Scott Sealing , Robert Wojnarowski , Eladio Delgado , Richard H. Coulter
发明人： Emad Andarawis , Ertugrul Berkcan , C. Scott Sealing , Robert Wojnarowski , Eladio Delgado , Richard H. Coulter
IPC分类号： G05B23/02
CPC分类号： H04L12/40045 , G01D5/48 , G01M5/00 , H04L12/12 , H04L12/40039 , H04L67/12 , H04L2012/4028 , H04W52/0261 , H04W84/18 , Y02D50/40
摘要： A distributed monitoring system for a structure.
摘要翻译：一种用于结构的分布式监控系统。

7. 发明授权

US07667375B2 Broad band energy harvesting system and related methods 有权
标题翻译：宽带能量采集系统及相关方法
公开(公告)号：US07667375B2
公开(公告)日：2010-02-23
申请号：US11398840
申请日：2006-04-06
申请人： Ertugrul Berkcan , Robert John Wojnarowski , Emad Andarawis Andarawis , Samantha Rao , Eladio Delgado
发明人： Ertugrul Berkcan , Robert John Wojnarowski , Emad Andarawis Andarawis , Samantha Rao , Eladio Delgado
IPC分类号： H01L41/08 , H01L41/083
CPC分类号： H01L41/1136 , H02N2/188
摘要： A broad band energy harvesting system to harvest energy from a structure and associated methods are provided. The system includes a structure carrying a plurality of environmentally produced vibration frequencies extending over a frequency range and an energy harvesting apparatus positioned in vibration receiving communication with the structure to harvest energy from the structure. Each energy harvesting apparatus includes broadly tuned energy harvesting generators having relatively low quality factor and corresponding relatively wide bandwidth. The energy harvesting generators collectively provide energy harvesting over multiple modes to thereby provide energy harvesting over a substantial portion of the frequency range. Each energy harvesting generator can include a cantilevered beam connected to a common backbone comprised of a resilient material configured to transfer energy between adjacent generators to further enhance energy harvesting.
摘要翻译：提供了一种从结构和相关方法收集能量的宽带能量收集系统。该系统包括承载在频率范围上延伸的多个环境产生的振动频率的结构，以及定位在振动中的能量收集装置，该振动接收与结构的通信以从结构收集能量。每个能量收集装置包括具有相对较低质量因素和相应较宽带宽的广泛调谐的能量采集发生器。能量收集发电机在多种模式下共同提供能量收集，从而在频率范围的大部分内提供能量收集。每个能量收集发生器可以包括连接到公共骨架的悬臂梁，弹性材料构造成在相邻发电机之间传递能量以进一步增强能量收集。

8. 发明授权

US08253587B2 Power free remote sensor system data transmissions 有权
标题翻译：无电力远程传感器系统数据传输
公开(公告)号：US08253587B2
公开(公告)日：2012-08-28
申请号：US12365407
申请日：2009-02-04
申请人： Emad Andarawis , Ertugrul Berkcan , Samantha Rao , Eladio Delgado
发明人： Emad Andarawis , Ertugrul Berkcan , Samantha Rao , Eladio Delgado
IPC分类号： G05B23/02
CPC分类号： H04Q9/00 , H04Q2209/20 , H04Q2209/886
摘要： A system and method to monitor the condition of a structure is provided. In one embodiment, a sensor node can include a power supply that can scavenge available energy, a sensor for sensing conditions in the immediate environment, and a communications interface for communicating the sensed operating conditions. Readers can be used to acquire data from the sensor nodes. In one embodiment, the readers can determine if the data from the sensor nodes is an exception and, if so, determine whether trend data is sufficient.
摘要翻译：提供了一种监视结构状况的系统和方法。在一个实施例中，传感器节点可以包括能够清除可用能量的电源，用于感测直接环境中的状况的传感器，以及用于传达感测到的操作条件的通信接口。读取器可用于从传感器节点获取数据。在一个实施例中，读取器可以确定来自传感器节点的数据是否是异常，如果是，则确定趋势数据是否足够。

9. 发明申请

US20100063777A1 Power Aware Techniques for Energy Harvesting Remote Sensor Systems 审中-公开
标题翻译：电力感知技术用于能量收集远程传感器系统
公开(公告)号：US20100063777A1
公开(公告)日：2010-03-11
申请号：US12208222
申请日：2008-09-10
申请人： Ertugrul Berkcan , Emad Andarawis , Eladio Delgado , Samantha Rao
发明人： Ertugrul Berkcan , Emad Andarawis , Eladio Delgado , Samantha Rao
IPC分类号： G06F11/30
CPC分类号： G05B19/042 , G05B2219/23316
摘要： A monitoring system for an aircraft.
摘要翻译：飞机监控系统。

10. 发明授权

US07558701B2 System to monitor the health of a structure, sensor nodes, program product, and related methods 有权
标题翻译：系统监控结构的健康状况，传感器节点，程序产品及相关方法
公开(公告)号：US07558701B2
公开(公告)日：2009-07-07
申请号：US11286795
申请日：2005-11-23
申请人： Emad Andarawis , Ertugrul Berkcan , Eladio Delgado , Robert Wojnarowski , C. Scott Sealing , Nanette Gruber , Charles Seeley , Richard H. Coulter
发明人： Emad Andarawis , Ertugrul Berkcan , Eladio Delgado , Robert Wojnarowski , C. Scott Sealing , Nanette Gruber , Charles Seeley , Richard H. Coulter
IPC分类号： G06F19/00
CPC分类号： G01M5/00 , G05B23/0221 , G05B2219/37254 , G05B2219/37494 , G05B2219/37516
摘要： A system to monitor the health of a structure, health monitoring sensor nodes, program product, and associated methods, are provided. The system includes an array of health monitoring sensor nodes connected to or embedded within a structure to monitor the health of the structure. Each health monitoring sensor node includes sensor elements positioned to sense parameters of the structure and to provide data related to the parameters to a health monitoring sensor node interrogator. Each health monitoring sensor node includes a processor or other means to reduce raw sensor data to thereby reduce communication bandwidth requirements and data collisions, and can include memory or other storage for storing the reduced data and an antenna arrangement for providing the reduced data to the health monitoring sensor node interrogator.
摘要翻译：提供了一种监测结构健康的体系，健康监测传感器节点，程序产品和相关方法。该系统包括连接到或嵌入结构内的健康监测传感器节点阵列，以监测结构的健康状况。每个健康监测传感器节点包括传感器元件，其定位成感测结构的参数，并将与参数有关的数据提供给健康监测传感器节点询问器。每个健康监测传感器节点包括处理器或其他方式来减少原始传感器数据从而减少通信带宽需求和数据冲突，并且可以包括用于存储简化数据的存储器或其它存储器以及用于将简化数据提供给健康的天线装置监控传感器节点询问器。

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