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1. 发明授权

US5587633A Press control method and press apparatus 失效
标题翻译：按压控制方法和按压装置
公开(公告)号：US5587633A
公开(公告)日：1996-12-24
申请号：US578970
申请日：1995-12-27
申请人： Hideji Aoki , Takahiro Tashima , Suekazu Nakashima , Yoshiyuki Osako , Hidetaka Yamasaki
发明人： Hideji Aoki , Takahiro Tashima , Suekazu Nakashima , Yoshiyuki Osako , Hidetaka Yamasaki
IPC分类号： B30B15/22 , B30B15/14 , B21D5/02
CPC分类号： B30B1/181 , B30B15/14
摘要： It is an object to obtain a press apparatus and a press controlling method which apply press working to a processed object with accurate press load and is capable of press working with accurate press load without affected by variations in thickness of the processed objects and variations in shut height of molds. A servo motor (51) is connected concentrically to a rotation transmitter (52), and a screw shaft (53) is provided passing through the center of the rotation transmitter (52). The driving force of the servo motor (51) is converted into a thrusting force of a press ram (54) by combining the rotation transmitter (52) and the screw shaft (53). Correct press load is applied to the processed objects and troubles in the press processing caused by variations in thickness of the processed objects can be prevented.
摘要翻译：本发明的一个目的是获得一种压制装置和压力控制方法，该方法对具有精确的压力载荷的加工对象进行冲压加工，并且能够在精确的加压载荷下进行加压加工，而不受加工对象的厚度变化和关闭的变化的影响模具高度伺服电动机51同心地连接到旋转发射器52，并且穿过旋转发射器52的中心的螺杆轴53设置。通过组合旋转变送器（52）和螺杆轴（53），将伺服电动机（51）的驱动力转换成压力冲杆（54）的推力。对加工对象施加正确的压力负荷，并且可以防止由加工对象的厚度变化引起的冲压加工中的麻烦。

2. 发明授权

US5842257A Apparatus for and method of fabricating semiconductor devices 失效
标题翻译：用于制造半导体器件的装置和方法
公开(公告)号：US5842257A
公开(公告)日：1998-12-01
申请号：US571594
申请日：1995-12-13
申请人： Takahiro Tashima , Hideji Aoki
发明人： Takahiro Tashima , Hideji Aoki
IPC分类号： B29C45/26 , B29C43/18 , B29C43/36 , B29C43/58 , B29C45/56 , B29L31/34 , H01L23/50 , H05K13/00 , H01L21/56 , H01L21/58 , H01L21/60 , H01L21/70
CPC分类号： H05K13/0092 , B29C43/18 , B29C43/36 , B29C43/58 , B29C2043/5808 , B29C2043/5825 , B29C43/32 , H01L2924/0002 , Y10T29/41
摘要： A process wherein a lead frame into which a plurality of semiconductor devices are integrated is first supplied to a press unit (21) among three press units (21 to 23) for cutting, to be cut into the respective semiconductor devices. Thereafter the lead frame is successively fed to the press units (22, 23) in the units of the semiconductor devices due to the action of an internal conveyor (33a), thereby being subjected to cutting stepwise. Thus, the press units (21 to 23) are provided at wide spaces, whereby press motors (85a to 85c) requiring high outputs are independently set for the respective press units (21 to 23). Further, the process does not vary the space between molds with the product pitch of the lead frame. Working is enabled by the press motors which are provided for the respective press units. The process copes with various types of semiconductor devices because the space between the molds may not be changed.
摘要翻译：其中将多个半导体器件集成到其中的引线框架首先被供给到要切割成各个半导体器件的三个用于切割的压制单元（21至23）中的压制单元（21）的工艺。此后，由于内部传送器（33a）的作用，引线框以半导体器件为单位被连续地馈送到压制单元（22,23），从而进行逐步切割。因此，按压单元（21〜23）设置在宽的空间处，由此，各压制单元（21〜23）分别设置需要高输出的按压马达（85a〜85c）。此外，该过程不会改变具有引线框架的产品间距的模具之间的空间。通过为各个印刷机组提供的印刷机电机实现工作。该方法可以处理各种类型的半导体器件，因为模具之间的空间可能不会改变。

3. 发明授权

US06363976B1 Semiconductor manufacturing apparatus and method of manufacturing semiconductor device 失效
标题翻译：半导体制造装置及半导体装置的制造方法
公开(公告)号：US06363976B1
公开(公告)日：2002-04-02
申请号：US09496412
申请日：2000-02-02
申请人： Hideji Aoki , Hidekazu Manabe , Katsuhito Kamachi
发明人： Hideji Aoki , Hidekazu Manabe , Katsuhito Kamachi
IPC分类号： B21F100
CPC分类号： H01L21/4842
摘要： A semiconductor manufacturing apparatus and a method of manufacturing a semiconductor device are provided. A horizontal driver (111) and a vertical driver (112) are controlled to move a punch holder (110), or an end portion (101T1) of a punch (101), within a plane defined by first and second directions (D1, D2). A tip (101A) of the punch (101) is brought into contact with leads (11), with a punch-side forming surface (101S) and a die-side forming surface (151S) maintained in parallel relationship. A pressurizer (131) is controlled to move the end portion (101T1) in a fourth direction (D4) toward the die-side forming surface (151S), and the punch-side forming surface (101S) and the die-side forming surface (151S) hold the leads (11) therebetween. A pressure detector (121) detects a load placed upon the punch (101). A controller (190) receives a detection signal (S121) from the pressure detector (121) and controls the pressurizer (131) to place a predetermined load upon the lead (11) held between the punch-side forming surface (101S) and the die-side forming surface (151S). The semiconductor manufacturing apparatus is capable of accurately forming the leads of the semiconductor device without damages to the leads.
摘要翻译：提供半导体制造装置和半导体装置的制造方法。控制水平驱动器（111）和垂直驱动器（112），以在由第一和第二方向（D1，D2）限定的平面内移动冲头保持器（110）或冲头（101）的端部（101T1） D2）。冲头（101）的尖端（101A）与引线（11）接触，冲头侧形成表面（101S）和冲模侧形成表面（151S）保持平行关系。控制加压器（131）使端部（101T1）向第四方向（D4）朝向模侧形成面（151S）移动，冲头侧形成面（101S）和模侧形成面（151S）在其间保持引线（11）。压力检测器（121）检测放置在冲头（101）上的负载。控制器（190）从压力检测器（121）接收检测信号（S121），并控制加压器（131）将预定负荷放置在保持在冲压侧形成表面（101S）和模侧形成面（151S）。半导体制造装置能够精确地形成半导体器件的引线而不损害引线。

4. 发明授权

US06242287B1 Semiconductor device manufacturing method, press die and guide rail including forming a crack perpendicular to an extension of the sealing resin 失效
标题翻译：半导体器件制造方法，压模和导轨包括垂直于密封树脂的延伸部分形成裂纹
公开(公告)号：US06242287B1
公开(公告)日：2001-06-05
申请号：US09044928
申请日：1998-03-20
申请人： Hideji Aoki , Hidenori Sekiya , Kenichirou Katou , Hiromu Nishitani
发明人： Hideji Aoki , Hidenori Sekiya , Kenichirou Katou , Hiromu Nishitani
IPC分类号： H01L2144
CPC分类号： H01L21/4842 , H01L2924/0002 , H01L2924/00
摘要： Provided are a method for manufacturing a semiconductor device in which a sealing resin is prevented from being damaged and generation of a resin piece is suppressed, a press die for suppressing the generation of the resin piece, and a guide rail. A frame receiving die (11) includes a cavity (11d) having a rectangular contour shape seen on a plane which serves to house a sealing resin (3) therein, and a remaining gate housing section (11c) provided on any of four corners of the cavity (11d) corresponding to a remaining gate (3b) on a lower face of a corner (2a) of a lead frame (2). A lower gate punch (11a) is provided in a boundary portion between the cavity (11d) and the remaining gate housing section (11c). When the lead frame (2) is mounted on the frame receiving die (11), the sealing resin (3) is housed in the cavity (11d) and the remaining gate (3b) is housed in the remaining gate housing section (11c).
摘要翻译：提供一种制造半导体器件的方法，其中防止密封树脂被损坏并且树脂片的产生被抑制，用于抑制树脂片的产生的压模和导轨。框架接收模具（11）包括在用于在其中容纳密封树脂（3）的平面上看到的具有矩形轮廓形状的空腔（11d），以及设置在其中的任何一个角上的剩余门容纳部分（11c）所述空腔（11d）对应于引线框架（2）的拐角（2a）的下表面上的剩余门（3b）。在所述空腔（11d）和所述剩余的门容纳部（11c）之间的边界部分设置有下门冲头（11a）。当引线框架（2）安装在框架接收模具（11）上时，密封树脂（3）容纳在空腔（11d）中，剩余的门（3b）被容纳在剩余的浇口容纳部分（11c）中，。

5. 发明授权

US5636127A Method and apparatus for carrying and locating sheet frame 失效
标题翻译：用于承载和定位片材框架的方法和装置
公开(公告)号：US5636127A
公开(公告)日：1997-06-03
申请号：US607355
申请日：1996-02-26
申请人： Hideji Aoki , Hidetaka Yamasaki , Kazuhisa Hiroshige
发明人： Hideji Aoki , Hidetaka Yamasaki , Kazuhisa Hiroshige
IPC分类号： B65H9/00 , H01L21/50 , H05K13/00 , H05K13/04 , G06F19/00 , B65G35/00
CPC分类号： H05K13/0417 , H05K13/0061
摘要： In order to efficiently carry and locate a plurality of types of sheet frames having different dimensions, it is possible to change and adjust positions of lower guide rails in response to a width of a supplied lead frame in a shorter-side direction (X). A carrier device and a stop device can adjust and change a carriage distance in a carriage direction and a stop position in response to a longitudinal width of the lead frame respectively. Thus, it is possible to carry and locate sheet frames in response to various dimensions thereof.
摘要翻译：为了有效地携带和定位具有不同尺寸的多种类型的片材框架，可以响应于沿短边方向（X）的供应引线框架的宽度来改变和调整下导轨的位置。载体装置和停止装置可以分别响应于引线框架的纵向宽度来调节和改变在滑架方向和停止位置上的滑架距离。因此，可以响应于其各种尺寸来携带和定位片材框架。

6. 发明授权

US4558346A Highly reliable hermetically sealed package for a semiconductor device 失效
标题翻译：用于半导体器件的高度可靠的密封封装
公开(公告)号：US4558346A
公开(公告)日：1985-12-10
申请号：US477934
申请日：1983-03-23
申请人： Susumu Kida , Hayato Usami , Hideji Aoki
发明人： Susumu Kida , Hayato Usami , Hideji Aoki
IPC分类号： H01L23/12 , H01L21/50 , H01L21/60 , H01L23/057 , H01L23/498 , H01L23/50 , H05K1/09
CPC分类号： H01L23/49866 , H01L21/50 , H01L23/057 , H01L24/28 , H01L24/49 , H01L2224/05624 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/49171 , H01L24/45 , H01L24/48 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01027 , H01L2924/01028 , H01L2924/01032 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/01327 , H01L2924/0133 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/15787 , H01L2924/16152 , H01L2924/19107 , Y10S228/904 , Y10T29/49144
摘要： A semiconductor device having a hermetically sealed package which includes a package substrate having a gold layer, an integrated-circuit chip attached to the gold layer, a terminal metal chip attached to the gold layer so as to ground the terminal metal chips leads, bonding wires, a cap, and glass layers for sealing the device. The terminal metal chip has a lower coating layer made of a gold-silicon type of alloy for attachment. The bond strength of the terminal metal chip is not decreased although a heat treatment is carried out to seal the glass.
摘要翻译：一种具有密封封装的半导体器件，其包括具有金层的封装基板，附着在金层的集成电路芯片，附着在金层上的端子金属芯片以使端子金属芯片接地，接合线，盖子和用于密封装置的玻璃层。端子金属芯片具有由用于附接的金 - 硅型合金制成的下部涂层。尽管进行热处理以密封玻璃，端子金属芯片的结合强度也没有降低。

7. 发明授权

US5520276A Method and apparatus for carrying and locating sheet frame 失效
标题翻译：用于承载和定位片材框架的方法和装置
公开(公告)号：US5520276A
公开(公告)日：1996-05-28
申请号：US44501
申请日：1993-04-09
申请人： Hideji Aoki , Hidetaka Yamasaki , Kazuhisa Hiroshige
发明人： Hideji Aoki , Hidetaka Yamasaki , Kazuhisa Hiroshige
IPC分类号： B65H9/00 , H01L21/50 , H05K13/00 , H05K13/04 , B65G35/00
CPC分类号： H05K13/0417 , H05K13/0061
摘要： In order to efficiently carry and locate a plurality of types of sheet frames having different dimensions, it is possible to change and adjust positions of lower guide rails in response to a width of a supplied lead frame in a shorter-side direction (X). A carrier device and a stop device can adjust and change a carriage distance in a carriage direction and a stop position in response to a longitudinal width of the lead frame respectively. Thus, it is possible to carry and locate sheet frames in response to various dimensions thereof.
摘要翻译：为了有效地携带和定位具有不同尺寸的多种类型的片材框架，可以响应于沿短边方向（X）的供应引线框架的宽度来改变和调整下导轨的位置。载体装置和停止装置可以分别响应于引线框架的纵向宽度来调节和改变在滑架方向和停止位置上的滑架距离。因此，可以响应于其各种尺寸来携带和定位片材框架。

8. 发明授权

US4626960A Semiconductor device having soldered bond between base and cap thereof 失效
标题翻译：半导体器件具有在基底和盖之间的焊接接合
公开(公告)号：US4626960A
公开(公告)日：1986-12-02
申请号：US675795
申请日：1984-11-28
申请人： Toshio Hamano , Kaoru Tachibana , Hideji Aoki
发明人： Toshio Hamano , Kaoru Tachibana , Hideji Aoki
IPC分类号： H01L23/02 , H01L23/10 , H01L23/13 , H01L23/498 , H05K7/20
CPC分类号： H01L23/498 , H01L23/10 , H01L23/13 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L24/45 , H01L24/48 , H01L2924/01004 , H01L2924/01078 , H01L2924/01079 , H01L2924/15157 , H01L2924/15312 , H01L2924/1532 , H01L2924/15787 , H01L2924/16195 , H01L2924/16787
摘要： A semiconductor device including a ceramic base having a cavity carrying a semiconductor chip, and a ceramic cap covering and sealing the ceramic base. The cap has a metallization pattern covering not only a region where it contacts the base but also the four side surfaces of the cap, which is provided in order to prevent flow or flying out of excess solder toward the outside of the cap and the base and into the cavity.
摘要翻译：一种半导体器件，包括具有承载半导体芯片的空腔的陶瓷基体和覆盖并密封陶瓷基底的陶瓷帽。盖具有金属化图案，其不仅覆盖其接触基底的区域，而且覆盖盖的四个侧表面，其被设置用于防止多余焊料朝向盖和基部的外部流动或飞出，进入腔。

9. 发明授权

US4590672A Package for electronic device and method for producing same 失效
标题翻译：电子装置用包装及其制造方法
公开(公告)号：US4590672A
公开(公告)日：1986-05-27
申请号：US400013
申请日：1982-07-20
申请人： Shokichi Shimizu , Hideji Aoki , Susumu Kida , Yuki Kanazawa
发明人： Shokichi Shimizu , Hideji Aoki , Susumu Kida , Yuki Kanazawa
IPC分类号： H01L23/02 , H01L21/50 , H01L23/057 , H01L23/495 , H01L23/50 , H01R43/00 , H01L23/48
CPC分类号： H01L23/057 , H01L21/50 , H01L23/49582 , H01L24/48 , H01L2224/45124 , H01L2224/48091 , H01L2224/48247 , H01L2224/484 , H01L2224/48699 , H01L2224/48739 , H01L2224/48744 , H01L2224/85439 , H01L2224/85444 , H01L24/45 , H01L2924/00014 , H01L2924/01013 , H01L2924/01028 , H01L2924/01033 , H01L2924/01039 , H01L2924/01045 , H01L2924/01047 , H01L2924/0105 , H01L2924/01058 , H01L2924/01061 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/09701 , H01L2924/15153 , H01L2924/15165 , H01L2924/15787 , H01L2924/16152 , Y10T29/49121 , Y10T428/12361 , Y10T428/12868 , Y10T428/12875 , Y10T428/12889
摘要： A package having an enclosure for accommodating an electronic device, and the process of producing same. The process comprises the steps of providing a lead frame which has at least a final layer electroplated on the outerlead area thereof; bonding an electronic device in the enclosure; connecting the electronic device with an innerlead area of the lead frame by means of wires; and, thereafter, sealing the enclosure with fused glass in such a manner that the outerlead area extends out of the glass.
摘要翻译：具有用于容纳电子设备的外壳的封装及其制造方法。该方法包括以下步骤：提供引线框架，该引线框架至少在其外缘区域上电镀最后一层; 将电子设备连接在外壳中; 通过电线将电子设备与引线框架的内衬区域连接; 然后用熔融玻璃将外壳密封，使得外部区域从玻璃板延伸出来。

10. 发明授权

US06530764B2 Mold for resin-sealing of semiconductor devices 失效
标题翻译：半导体器件树脂密封用模具
公开(公告)号：US06530764B2
公开(公告)日：2003-03-11
申请号：US09770666
申请日：2001-01-29
申请人： Yoshiyuki Mishima , Tetsuya Hirose , Hideji Aoki , Hiromichi Yamada , Toru Ueno , Kiyoharu Kato
发明人： Yoshiyuki Mishima , Tetsuya Hirose , Hideji Aoki , Hiromichi Yamada , Toru Ueno , Kiyoharu Kato
IPC分类号： B29C4514
CPC分类号： H01L21/565 , B29C45/14655 , H01L2224/48091 , H01L2224/48227 , H01L2924/00014
摘要： A resin-sealing mold for encapsulating a semiconductor device includes upper and lower molds with a first cavity insert forming a cavity side face portion; a first elastic post supporting the first cavity insert; an elastic plate, built in the first cavity insert, forming a cavity bottom portion; a second cavity insert embedded at a position adjacent to the elastic plate on the side opposite to the cavity; a second elastic post supporting the second cavity insert; a retainer including the first cavity insert and the second cavity insert; and a backing plate to which the first elastic post, the second elastic post and the retainer are attached. Generation of thin burrs that tend to appear on the periphery of the package and in the vicinity of the cull section is prevented, and, consequently, a resin-sealing mold with high reliability is produced.
摘要翻译：用于封装半导体器件的树脂密封模具包括具有形成腔侧面部分的第一腔插入件的上模和下模; 支撑第一腔插入件的第一弹性柱; 内置在第一腔插入件中的弹性板，形成空腔底部; 第二空腔插入件嵌入在与所述空腔相对的一侧上邻近所述弹性板的位置; 支撑所述第二腔插入物的第二弹性柱; 包括所述第一腔插入件和所述第二腔插入物的保持器; 以及背板，第一弹性柱，第二弹性柱和保持器附接到该背板。产生容易出现在包装周边和剔除部分附近的细毛刺，从而产生可靠性高的树脂密封模。

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