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1. 发明授权

US5587633A Press control method and press apparatus 失效
标题翻译：按压控制方法和按压装置
公开(公告)号：US5587633A
公开(公告)日：1996-12-24
申请号：US578970
申请日：1995-12-27
申请人： Hideji Aoki , Takahiro Tashima , Suekazu Nakashima , Yoshiyuki Osako , Hidetaka Yamasaki
发明人： Hideji Aoki , Takahiro Tashima , Suekazu Nakashima , Yoshiyuki Osako , Hidetaka Yamasaki
IPC分类号： B30B15/22 , B30B15/14 , B21D5/02
CPC分类号： B30B1/181 , B30B15/14
摘要： It is an object to obtain a press apparatus and a press controlling method which apply press working to a processed object with accurate press load and is capable of press working with accurate press load without affected by variations in thickness of the processed objects and variations in shut height of molds. A servo motor (51) is connected concentrically to a rotation transmitter (52), and a screw shaft (53) is provided passing through the center of the rotation transmitter (52). The driving force of the servo motor (51) is converted into a thrusting force of a press ram (54) by combining the rotation transmitter (52) and the screw shaft (53). Correct press load is applied to the processed objects and troubles in the press processing caused by variations in thickness of the processed objects can be prevented.
摘要翻译：本发明的一个目的是获得一种压制装置和压力控制方法，该方法对具有精确的压力载荷的加工对象进行冲压加工，并且能够在精确的加压载荷下进行加压加工，而不受加工对象的厚度变化和关闭的变化的影响模具高度伺服电动机51同心地连接到旋转发射器52，并且穿过旋转发射器52的中心的螺杆轴53设置。通过组合旋转变送器（52）和螺杆轴（53），将伺服电动机（51）的驱动力转换成压力冲杆（54）的推力。对加工对象施加正确的压力负荷，并且可以防止由加工对象的厚度变化引起的冲压加工中的麻烦。

2. 发明授权

US5520276A Method and apparatus for carrying and locating sheet frame 失效
标题翻译：用于承载和定位片材框架的方法和装置
公开(公告)号：US5520276A
公开(公告)日：1996-05-28
申请号：US44501
申请日：1993-04-09
申请人： Hideji Aoki , Hidetaka Yamasaki , Kazuhisa Hiroshige
发明人： Hideji Aoki , Hidetaka Yamasaki , Kazuhisa Hiroshige
IPC分类号： B65H9/00 , H01L21/50 , H05K13/00 , H05K13/04 , B65G35/00
CPC分类号： H05K13/0417 , H05K13/0061
摘要： In order to efficiently carry and locate a plurality of types of sheet frames having different dimensions, it is possible to change and adjust positions of lower guide rails in response to a width of a supplied lead frame in a shorter-side direction (X). A carrier device and a stop device can adjust and change a carriage distance in a carriage direction and a stop position in response to a longitudinal width of the lead frame respectively. Thus, it is possible to carry and locate sheet frames in response to various dimensions thereof.
摘要翻译：为了有效地携带和定位具有不同尺寸的多种类型的片材框架，可以响应于沿短边方向（X）的供应引线框架的宽度来改变和调整下导轨的位置。载体装置和停止装置可以分别响应于引线框架的纵向宽度来调节和改变在滑架方向和停止位置上的滑架距离。因此，可以响应于其各种尺寸来携带和定位片材框架。

3. 发明授权

US5636127A Method and apparatus for carrying and locating sheet frame 失效
标题翻译：用于承载和定位片材框架的方法和装置
公开(公告)号：US5636127A
公开(公告)日：1997-06-03
申请号：US607355
申请日：1996-02-26
申请人： Hideji Aoki , Hidetaka Yamasaki , Kazuhisa Hiroshige
发明人： Hideji Aoki , Hidetaka Yamasaki , Kazuhisa Hiroshige
IPC分类号： B65H9/00 , H01L21/50 , H05K13/00 , H05K13/04 , G06F19/00 , B65G35/00
CPC分类号： H05K13/0417 , H05K13/0061
摘要： In order to efficiently carry and locate a plurality of types of sheet frames having different dimensions, it is possible to change and adjust positions of lower guide rails in response to a width of a supplied lead frame in a shorter-side direction (X). A carrier device and a stop device can adjust and change a carriage distance in a carriage direction and a stop position in response to a longitudinal width of the lead frame respectively. Thus, it is possible to carry and locate sheet frames in response to various dimensions thereof.
摘要翻译：为了有效地携带和定位具有不同尺寸的多种类型的片材框架，可以响应于沿短边方向（X）的供应引线框架的宽度来改变和调整下导轨的位置。载体装置和停止装置可以分别响应于引线框架的纵向宽度来调节和改变在滑架方向和停止位置上的滑架距离。因此，可以响应于其各种尺寸来携带和定位片材框架。

4. 发明申请

US20060237087A1 Method of forming leads of a packaged semiconductor device 审中-公开
标题翻译：形成封装半导体器件的引线的方法
公开(公告)号：US20060237087A1
公开(公告)日：2006-10-26
申请号：US11445180
申请日：2006-06-02
申请人： Hidetaka Yamasaki , Itaru Matsuo , Hidekazu Manabe , Kenji Imamura , Kenichirou Katou , Mitsutaka Matsuo
发明人： Hidetaka Yamasaki , Itaru Matsuo , Hidekazu Manabe , Kenji Imamura , Kenichirou Katou , Mitsutaka Matsuo
IPC分类号： B21F1/00
CPC分类号： H05K13/0092
摘要： In lead forming of a packaged semiconductor device having sides and leads extending outwardly from the sides of a package, separation between first and second bottom dies is adjusted to receive the package. The first and second bottom dies have top surfaces that include oblique portions. The package is placed between the first and second bottom dies with the leads proximate the top surfaces of the first and second bottom dies. At least one of (i) the first and second bottom dies and (ii) first and second top dies having respective bottom surfaces with oblique portions complementary to the top surfaces of the first and second bottom dies are moved toward each other. The leads are clamped between the top and bottom dies and are formed. Simultaneously, lateral forces, produced through contact of the complementary top and bottom surfaces and the leads, move the first and second top dies laterally, changing separation between the first and second top dies.
摘要翻译：在具有从封装的侧面向外延伸的侧面和引线的封装半导体器件的引线形成中，调节第一和第二底部模具之间的间隔以接收封装。第一和第二底模具有包括倾斜部分的顶表面。包装被放置在第一和第二底模之间，引线靠近第一和第二底模的顶表面。（i）第一和第二底部模具中的至少一个和（ii）具有与第一和第二底部模具的顶表面互补的倾斜部分的相应底部表面的第一和第二顶部模具朝向彼此移动。引线夹在顶部和底部模具之间并形成。同时，通过互补的顶部和底部表面和引线的接触产生的侧向力横向移动第一和第二顶部模具，改变了第一和第二顶部模具之间的分离。

5. 发明授权

US07077170B2 Method of forming leads of a semiconductor device 失效
标题翻译：形成半导体器件的引线的方法
公开(公告)号：US07077170B2
公开(公告)日：2006-07-18
申请号：US10613989
申请日：2003-07-08
申请人： Hidetaka Yamasaki , Itaru Matsuo , Hidekazu Manabe , Kenji Imamura , Kenichirou Katou , Mitsutaka Matsuo
发明人： Hidetaka Yamasaki , Itaru Matsuo , Hidekazu Manabe , Kenji Imamura , Kenichirou Katou , Mitsutaka Matsuo
IPC分类号： B21F1/00
CPC分类号： H05K13/0092
摘要： In a lead forming apparatus for a semiconductor device, a holder holds a semiconductor device with leads to be formed, the semiconductor device having leads extending from a package. Two die assemblies (for bending, for cutting, or the like) are set in parallel, each including top and bottom dies matched with each other. A mover changes relative distance between the two die assemblies. The top and bottom dies in the two die assemblies are positioned so the leads of the semiconductor device held on the holder are between the dies.
摘要翻译：在用于半导体器件的引线形成装置中，保持器保持具有要形成的引线的半导体器件，该半导体器件具有从封装延伸的引线。两个模具组件（用于弯曲，切割等）平行设置，每个模具组件包括彼此匹配的顶部和底部模具。移动器改变两个模具组件之间的相对距离。两个模具组件中的顶部和底部模具被定位成使得保持在保持器上的半导体器件的引线位于模具之间。

6. 发明申请

US20050076967A1 Lead forming for a semiconductor device 失效
标题翻译：半导体器件的引线形成
公开(公告)号：US20050076967A1
公开(公告)日：2005-04-14
申请号：US10613989
申请日：2003-07-08
申请人： Hidetaka Yamasaki , Itaru Matsuo , Hidekazu Manabe , Kenji Imamura , Kenichirou Katou , Mitsutaka Matsuo
发明人： Hidetaka Yamasaki , Itaru Matsuo , Hidekazu Manabe , Kenji Imamura , Kenichirou Katou , Mitsutaka Matsuo
IPC分类号： H01L23/50 , B21F1/00 , H01L21/60 , H01L23/48 , H05K13/00
CPC分类号： H05K13/0092
摘要： In a lead forming apparatus for a semiconductor device, a holder holds a semiconductor device with leads to be formed, the semiconductor device having leads extending from a package. Two die assemblies (for bending, for cutting, or the like) are set in parallel, each including top and bottom dies matched with each other. A mover changes relative distance between the two die assemblies. The top and bottom dies in the two die assemblies are positioned so the leads of the semiconductor device held on the holder are between the dies.
摘要翻译：在用于半导体器件的引线形成装置中，保持器保持具有要形成的引线的半导体器件，该半导体器件具有从封装延伸的引线。两个模具组件（用于弯曲，切割等）平行设置，每个模具组件包括彼此匹配的顶部和底部模具。移动器改变两个模具组件之间的相对距离。两个模具组件中的顶部和底部模具被定位成使得保持在保持器上的半导体器件的引线位于模具之间。

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