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1. 发明授权

US07207868B2 Cutting apparatus 失效
标题翻译：切割设备
公开(公告)号：US07207868B2
公开(公告)日：2007-04-24
申请号：US11522447
申请日：2006-09-18
申请人： Masataka Takehara , Masaharu Yoshida , Yasuyuki Kitagawa , Kazuyuki Kishimoto , Kiyoharu Kato
发明人： Masataka Takehara , Masaharu Yoshida , Yasuyuki Kitagawa , Kazuyuki Kishimoto , Kiyoharu Kato
IPC分类号： B24B1/00
CPC分类号： B24C1/045 , B24C3/04
摘要： A cutting apparatus jets, at a high pressure, water containing abrasive grains to cut a workpiece along cutting lines extending in intersecting directions. The cutting apparatus includes: a fixing table fixing the workpiece; groove portions provided in the fixing table at respective positions below the cutting lines; protruded portions provided in regions of the fixing table other than regions where the groove portions are provided, in a manner that the workpiece contacts the protruded portions; support portions provided to connect the protruded portions substantially in parallel with cutting lines extending the Y direction along the groove portions; a frame portion provided to connect the support portions to each other in at least a part of an outer periphery of the fixing table; and protection members attachably and detachably provided to cover the support portions. Thus, in the case where the workpiece is cut along the intersecting cutting lines, replacement of the fixing table fixing the workpiece is unnecessary and wear of the fixing table is prevented.
摘要翻译：切割装置在高压下喷射含有磨粒的水，以沿相交方向延伸的切割线切割工件。切割装置包括：固定工件的固定台; 在切割线下方的各个位置设置在固定台中的槽部; 设置在固定台的除了设置槽部的区域以外的区域的突出部分以工件与突出部分接触的方式; 支撑部分，用于将所述突出部分基本上平行于沿着所述凹槽部分延伸Y方向的切割线; 框架部分，其设置成在固定台的外周的至少一部分中将支撑部彼此连接; 以及可附接和可拆卸地设置以覆盖支撑部分的保护构件。因此，在沿着相交的切割线切割工件的情况下，不需要更换固定工件的固定台，并且防止了固定台的磨损。

2. 发明申请

US20070066190A1 CUTTING APPARATUS 失效
标题翻译：切割装置
公开(公告)号：US20070066190A1
公开(公告)日：2007-03-22
申请号：US11522447
申请日：2006-09-18
申请人： Masataka Takehara , Masaharu Yoshida , Yasuyuki Kitagawa , Kiyoharu Kato
发明人： Masataka Takehara , Masaharu Yoshida , Yasuyuki Kitagawa , Kiyoharu Kato
IPC分类号： B24C3/00
CPC分类号： B24C1/045 , B24C3/04
摘要： A cutting apparatus jets, at a high pressure, water containing abrasive grains to cut a workpiece along cutting lines extending in intersecting directions. The cutting apparatus includes: a fixing table fixing the workpiece; groove portions provided in the fixing table at respective positions below the cutting lines; protruded portions provided in regions of the fixing table other than regions where the groove portions are provided, in a manner that the workpiece contacts the protruded portions; support portions provided to connect the protruded portions substantially in parallel with cutting lines extending the Y direction along the groove portions; a frame portion provided to connect the support portions to each other in at least a part of an outer periphery of the fixing table; and protection members attachably and detachably provided to cover the support portions. Thus, in the case where the workpiece is cut along the intersecting cutting lines, replacement of the fixing table fixing the workpiece is unnecessary and wear of the fixing table is prevented.
摘要翻译：切割装置在高压下喷射含有磨粒的水，以沿相交方向延伸的切割线切割工件。切割装置包括：固定工件的固定台; 在切割线下方的各个位置设置在固定台中的槽部; 设置在固定台的除了设置槽部的区域以外的区域的突出部分以工件与突出部分接触的方式; 支撑部分，用于将所述突出部分基本上平行于沿着所述凹槽部分延伸Y方向的切割线; 框架部分，其设置成在固定台的外周的至少一部分中将支撑部彼此连接; 以及可附接和可拆卸地设置以覆盖支撑部分的保护构件。因此，在沿着相交的切割线切割工件的情况下，不需要更换固定工件的固定台，并且防止了固定台的磨损。

3. 发明授权

US06530764B2 Mold for resin-sealing of semiconductor devices 失效
标题翻译：半导体器件树脂密封用模具
公开(公告)号：US06530764B2
公开(公告)日：2003-03-11
申请号：US09770666
申请日：2001-01-29
申请人： Yoshiyuki Mishima , Tetsuya Hirose , Hideji Aoki , Hiromichi Yamada , Toru Ueno , Kiyoharu Kato
发明人： Yoshiyuki Mishima , Tetsuya Hirose , Hideji Aoki , Hiromichi Yamada , Toru Ueno , Kiyoharu Kato
IPC分类号： B29C4514
CPC分类号： H01L21/565 , B29C45/14655 , H01L2224/48091 , H01L2224/48227 , H01L2924/00014
摘要： A resin-sealing mold for encapsulating a semiconductor device includes upper and lower molds with a first cavity insert forming a cavity side face portion; a first elastic post supporting the first cavity insert; an elastic plate, built in the first cavity insert, forming a cavity bottom portion; a second cavity insert embedded at a position adjacent to the elastic plate on the side opposite to the cavity; a second elastic post supporting the second cavity insert; a retainer including the first cavity insert and the second cavity insert; and a backing plate to which the first elastic post, the second elastic post and the retainer are attached. Generation of thin burrs that tend to appear on the periphery of the package and in the vicinity of the cull section is prevented, and, consequently, a resin-sealing mold with high reliability is produced.
摘要翻译：用于封装半导体器件的树脂密封模具包括具有形成腔侧面部分的第一腔插入件的上模和下模; 支撑第一腔插入件的第一弹性柱; 内置在第一腔插入件中的弹性板，形成空腔底部; 第二空腔插入件嵌入在与所述空腔相对的一侧上邻近所述弹性板的位置; 支撑所述第二腔插入物的第二弹性柱; 包括所述第一腔插入件和所述第二腔插入物的保持器; 以及背板，第一弹性柱，第二弹性柱和保持器附接到该背板。产生容易出现在包装周边和剔除部分附近的细毛刺，从而产生可靠性高的树脂密封模。

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