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1. 发明授权

US06363976B1 Semiconductor manufacturing apparatus and method of manufacturing semiconductor device 失效
标题翻译：半导体制造装置及半导体装置的制造方法
公开(公告)号：US06363976B1
公开(公告)日：2002-04-02
申请号：US09496412
申请日：2000-02-02
申请人： Hideji Aoki , Hidekazu Manabe , Katsuhito Kamachi
发明人： Hideji Aoki , Hidekazu Manabe , Katsuhito Kamachi
IPC分类号： B21F100
CPC分类号： H01L21/4842
摘要： A semiconductor manufacturing apparatus and a method of manufacturing a semiconductor device are provided. A horizontal driver (111) and a vertical driver (112) are controlled to move a punch holder (110), or an end portion (101T1) of a punch (101), within a plane defined by first and second directions (D1, D2). A tip (101A) of the punch (101) is brought into contact with leads (11), with a punch-side forming surface (101S) and a die-side forming surface (151S) maintained in parallel relationship. A pressurizer (131) is controlled to move the end portion (101T1) in a fourth direction (D4) toward the die-side forming surface (151S), and the punch-side forming surface (101S) and the die-side forming surface (151S) hold the leads (11) therebetween. A pressure detector (121) detects a load placed upon the punch (101). A controller (190) receives a detection signal (S121) from the pressure detector (121) and controls the pressurizer (131) to place a predetermined load upon the lead (11) held between the punch-side forming surface (101S) and the die-side forming surface (151S). The semiconductor manufacturing apparatus is capable of accurately forming the leads of the semiconductor device without damages to the leads.
摘要翻译：提供半导体制造装置和半导体装置的制造方法。控制水平驱动器（111）和垂直驱动器（112），以在由第一和第二方向（D1，D2）限定的平面内移动冲头保持器（110）或冲头（101）的端部（101T1） D2）。冲头（101）的尖端（101A）与引线（11）接触，冲头侧形成表面（101S）和冲模侧形成表面（151S）保持平行关系。控制加压器（131）使端部（101T1）向第四方向（D4）朝向模侧形成面（151S）移动，冲头侧形成面（101S）和模侧形成面（151S）在其间保持引线（11）。压力检测器（121）检测放置在冲头（101）上的负载。控制器（190）从压力检测器（121）接收检测信号（S121），并控制加压器（131）将预定负荷放置在保持在冲压侧形成表面（101S）和模侧形成面（151S）。半导体制造装置能够精确地形成半导体器件的引线而不损害引线。

2. 发明申请

US20050076967A1 Lead forming for a semiconductor device 失效
标题翻译：半导体器件的引线形成
公开(公告)号：US20050076967A1
公开(公告)日：2005-04-14
申请号：US10613989
申请日：2003-07-08
申请人： Hidetaka Yamasaki , Itaru Matsuo , Hidekazu Manabe , Kenji Imamura , Kenichirou Katou , Mitsutaka Matsuo
发明人： Hidetaka Yamasaki , Itaru Matsuo , Hidekazu Manabe , Kenji Imamura , Kenichirou Katou , Mitsutaka Matsuo
IPC分类号： H01L23/50 , B21F1/00 , H01L21/60 , H01L23/48 , H05K13/00
CPC分类号： H05K13/0092
摘要： In a lead forming apparatus for a semiconductor device, a holder holds a semiconductor device with leads to be formed, the semiconductor device having leads extending from a package. Two die assemblies (for bending, for cutting, or the like) are set in parallel, each including top and bottom dies matched with each other. A mover changes relative distance between the two die assemblies. The top and bottom dies in the two die assemblies are positioned so the leads of the semiconductor device held on the holder are between the dies.
摘要翻译：在用于半导体器件的引线形成装置中，保持器保持具有要形成的引线的半导体器件，该半导体器件具有从封装延伸的引线。两个模具组件（用于弯曲，切割等）平行设置，每个模具组件包括彼此匹配的顶部和底部模具。移动器改变两个模具组件之间的相对距离。两个模具组件中的顶部和底部模具被定位成使得保持在保持器上的半导体器件的引线位于模具之间。

3. 发明申请

US20050230789A1 Method for removing tiebars after molding of semiconductor chip 审中-公开
标题翻译：半导体芯片成型后取下拉杆的方法
公开(公告)号：US20050230789A1
公开(公告)日：2005-10-20
申请号：US11156556
申请日：2005-06-21
申请人： Hidekazu Manabe , Kenta Matsunaga
发明人： Hidekazu Manabe , Kenta Matsunaga
IPC分类号： H01L21/56 , H01L21/48 , H01L23/50 , H01L23/495
CPC分类号： H01L21/4842 , Y10T83/9447 , Y10T83/9449 , Y10T225/329
摘要： A method for removing tiebars of a lead frame after one or more semiconductor components have been encapsulated in a resin to form a package body attached to the lead frame, includes preparing a support member and cutters, the support member including holes engageable with the cutters, positioning the lead frame in place on the support member, moving the cutters relative to the support member so that the cutters are fitted into corresponding holes of the support member, punching out tiebars of the lead frame, and thereafter, removing any scraps left between leads of the lead frame.
摘要翻译：一种用于在将一个或多个半导体部件封装在树脂中以形成附接到引线框架上的封装体之后移除引线框架的拉杆的方法包括制备支撑部件和切割器，所述支撑部件包括可与刀具接合的孔，将引导框架定位在支撑构件上的适当位置，相对于支撑构件移动切割器，使得切割器被装配到支撑构件的对应的孔中，冲出引线框架的拉杆，此后，除去引线之间留下的任何废料的引线框架。

4. 发明授权

US07185425B2 Method for connecting printed circuit boards 有权
标题翻译：印刷电路板连接方法
公开(公告)号：US07185425B2
公开(公告)日：2007-03-06
申请号：US10681213
申请日：2003-10-09
申请人： Takashi Ohta , Kazuaki Yamada , Kiyoshi Tsujii , Hidekazu Manabe
发明人： Takashi Ohta , Kazuaki Yamada , Kiyoshi Tsujii , Hidekazu Manabe
IPC分类号： H05K3/34
CPC分类号： H05K7/142 , H01R12/52 , H01R43/0256 , H01R43/0263 , H05K3/3426 , H05K3/3447 , H05K3/368 , H05K2201/10757 , H05K2201/10924 , Y10T29/49121 , Y10T29/49128 , Y10T29/4913 , Y10T29/49135 , Y10T29/49139 , Y10T29/49144 , Y10T29/49149 , Y10T29/49151 , Y10T29/49153 , Y10T29/49789 , Y10T29/5142 , Y10T29/515 , Y10T29/53174 , Y10T29/53178 , Y10T29/53183
摘要： By forming a terminal at a tip of a lead part of a lead frame, and by fixing this terminal and a connecting pad which was formed on an upper surface of a first printed circuit board, the lead frame is attached to the first printed circuit board. By cutting off a frame part and a tie bar part from the lead frame which was attached to the first printed circuit board, the lead part is separated, and forming is applied to the lead part so as for its tip to be extended over the first printed board. After the lead part which is expanded upward is inserted into a through-hole which was opened in a second printed circuit board, by soldering the lead part and the through-hole, the first printed circuit board and the second printed circuit board are electrically connected.
摘要翻译：通过在引线框架的引线部分的尖端处形成端子，并且通过固定该端子和形成在第一印刷电路板的上表面上的连接焊盘，引线框架被附接到第一印刷电路板。通过从连接到第一印刷电路板的引线框架上切下框架部分和连接杆部分，引线部分被分离，并且成形被施加到引线部分，以使其尖端延伸到第一印刷电路板上印刷板在将向上扩展的引导部分插入到在第二印刷电路板中打开的通孔中之后，通过焊接引线部分和通孔，将第一印刷电路板和第二印刷电路板电连接。

5. 发明授权

US07077170B2 Method of forming leads of a semiconductor device 失效
标题翻译：形成半导体器件的引线的方法
公开(公告)号：US07077170B2
公开(公告)日：2006-07-18
申请号：US10613989
申请日：2003-07-08
申请人： Hidetaka Yamasaki , Itaru Matsuo , Hidekazu Manabe , Kenji Imamura , Kenichirou Katou , Mitsutaka Matsuo
发明人： Hidetaka Yamasaki , Itaru Matsuo , Hidekazu Manabe , Kenji Imamura , Kenichirou Katou , Mitsutaka Matsuo
IPC分类号： B21F1/00
CPC分类号： H05K13/0092
摘要： In a lead forming apparatus for a semiconductor device, a holder holds a semiconductor device with leads to be formed, the semiconductor device having leads extending from a package. Two die assemblies (for bending, for cutting, or the like) are set in parallel, each including top and bottom dies matched with each other. A mover changes relative distance between the two die assemblies. The top and bottom dies in the two die assemblies are positioned so the leads of the semiconductor device held on the holder are between the dies.
摘要翻译：在用于半导体器件的引线形成装置中，保持器保持具有要形成的引线的半导体器件，该半导体器件具有从封装延伸的引线。两个模具组件（用于弯曲，切割等）平行设置，每个模具组件包括彼此匹配的顶部和底部模具。移动器改变两个模具组件之间的相对距离。两个模具组件中的顶部和底部模具被定位成使得保持在保持器上的半导体器件的引线位于模具之间。

6. 发明申请

US20060237087A1 Method of forming leads of a packaged semiconductor device 审中-公开
标题翻译：形成封装半导体器件的引线的方法
公开(公告)号：US20060237087A1
公开(公告)日：2006-10-26
申请号：US11445180
申请日：2006-06-02
申请人： Hidetaka Yamasaki , Itaru Matsuo , Hidekazu Manabe , Kenji Imamura , Kenichirou Katou , Mitsutaka Matsuo
发明人： Hidetaka Yamasaki , Itaru Matsuo , Hidekazu Manabe , Kenji Imamura , Kenichirou Katou , Mitsutaka Matsuo
IPC分类号： B21F1/00
CPC分类号： H05K13/0092
摘要： In lead forming of a packaged semiconductor device having sides and leads extending outwardly from the sides of a package, separation between first and second bottom dies is adjusted to receive the package. The first and second bottom dies have top surfaces that include oblique portions. The package is placed between the first and second bottom dies with the leads proximate the top surfaces of the first and second bottom dies. At least one of (i) the first and second bottom dies and (ii) first and second top dies having respective bottom surfaces with oblique portions complementary to the top surfaces of the first and second bottom dies are moved toward each other. The leads are clamped between the top and bottom dies and are formed. Simultaneously, lateral forces, produced through contact of the complementary top and bottom surfaces and the leads, move the first and second top dies laterally, changing separation between the first and second top dies.
摘要翻译：在具有从封装的侧面向外延伸的侧面和引线的封装半导体器件的引线形成中，调节第一和第二底部模具之间的间隔以接收封装。第一和第二底模具有包括倾斜部分的顶表面。包装被放置在第一和第二底模之间，引线靠近第一和第二底模的顶表面。（i）第一和第二底部模具中的至少一个和（ii）具有与第一和第二底部模具的顶表面互补的倾斜部分的相应底部表面的第一和第二顶部模具朝向彼此移动。引线夹在顶部和底部模具之间并形成。同时，通过互补的顶部和底部表面和引线的接触产生的侧向力横向移动第一和第二顶部模具，改变了第一和第二顶部模具之间的分离。

7. 发明授权

US06925922B2 Apparatus for removing tiebars after molding of semiconductor chip 有权
标题翻译：用于在半导体芯片成型后移除导杆的装置
公开(公告)号：US06925922B2
公开(公告)日：2005-08-09
申请号：US10281045
申请日：2002-10-25
申请人： Hidekazu Manabe , Kenta Matsunaga
发明人： Hidekazu Manabe , Kenta Matsunaga
IPC分类号： H01L21/56 , H01L21/48 , H01L23/50 , B26D7/18
CPC分类号： H01L21/4842 , Y10T83/9447 , Y10T83/9449 , Y10T225/329
摘要： An apparatus for removing tiebars of a lead frame after one or more semiconductor components have been encapsulated in a resin to form a package body includes first and second removing stations. The second removing station is provided for removing scraps that may be left between leads of the lead frame after the tiebars have been removed in the first removing station. In the second removing station, the lead frame is positioned on a die. A scrap-cutting punch is moved relative to the die so that projections of the punch are fitted into corresponding holes of the die, thereby pushing the scraps out of the leads and into the holes.
摘要翻译：一种用于在将一个或多个半导体部件封装在树脂中以形成封装体之后去除引线框架的拉杆的装置包括第一和第二移除台。第二移除站设置用于在第一移除站中的连杆被移除之后，去除可能留在引线框架的引线之间的废料。在第二移除站中，引线框架位于模具上。切屑冲头相对于模具移动，使得冲头的凸起装配到模具的相应的孔中，从而将废料推出引线并进入孔中。

8. 发明授权

US5950687A Lead forming apparatus and lead forming method 失效
标题翻译：铅成型装置和铅成型方法
公开(公告)号：US5950687A
公开(公告)日：1999-09-14
申请号：US739286
申请日：1996-10-29
申请人： Hidekazu Manabe , Kaoru Ishihara
发明人： Hidekazu Manabe , Kaoru Ishihara
IPC分类号： H01L23/50 , H01L21/48 , H05K13/00 , B21F45/00
CPC分类号： H05K13/0092 , H01L21/4842 , H01L2924/181
摘要： Four lead bending devices (40) are so disposed as to surround the forming die (31). In each of the lead bending devices (40), a rotary lever (41) extends from a rotary strut (43) and a lever guide (42) disposed therebelow holds the rotary lever (41) to prevent deflection of the rotary lever (41). The rotary strut (43) is connected to a driving unit (44). Thus, a lead forming apparatus and a lead forming method are provided to achieve improvement in flatness of end portions of leads, reduction of generation of solder-plating residues by preventing a removal of solder-plate from surfaces of the leads, and easy change of an angle of the end portions of the leads to be formed.
摘要翻译：四个引线弯曲装置（40）被布置为围绕成形模具（31）。在每个引线弯曲装置（40）中，旋转杆（41）从旋转支柱（43）延伸，并且设置在其下方的杠杆引导件（42）保持旋转杆（41），以防止旋转杆（41））。旋转支柱（43）连接到驱动单元（44）。因此，提供引线形成装置和引线形成方法以实现引线端部的平坦度的提高，通过防止焊接板从引线的表面去除而减少焊接电镀残余物的产生，并且容易地改变要形成的引线的端部的角度。

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