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    • 1. 发明授权
    • Press control method and press apparatus
    • 按压控制方法和按压装置
    • US5587633A
    • 1996-12-24
    • US578970
    • 1995-12-27
    • Hideji AokiTakahiro TashimaSuekazu NakashimaYoshiyuki OsakoHidetaka Yamasaki
    • Hideji AokiTakahiro TashimaSuekazu NakashimaYoshiyuki OsakoHidetaka Yamasaki
    • B30B15/22B30B15/14B21D5/02
    • B30B1/181B30B15/14
    • It is an object to obtain a press apparatus and a press controlling method which apply press working to a processed object with accurate press load and is capable of press working with accurate press load without affected by variations in thickness of the processed objects and variations in shut height of molds. A servo motor (51) is connected concentrically to a rotation transmitter (52), and a screw shaft (53) is provided passing through the center of the rotation transmitter (52). The driving force of the servo motor (51) is converted into a thrusting force of a press ram (54) by combining the rotation transmitter (52) and the screw shaft (53). Correct press load is applied to the processed objects and troubles in the press processing caused by variations in thickness of the processed objects can be prevented.
    • 本发明的一个目的是获得一种压制装置和压力控制方法,该方法对具有精确的压力载荷的加工对象进行冲压加工,并且能够在精确的加压载荷下进行加压加工,而不受加工对象的厚度变化和关闭的变化的影响 模具高度 伺服电动机51同心地连接到旋转发射器52,并且穿过旋转发射器52的中心的螺杆轴53设置。 通过组合旋转变送器(52)和螺杆轴(53),将伺服电动机(51)的驱动力转换成压力冲杆(54)的推力。 对加工对象施加正确的压力负荷,并且可以防止由加工对象的厚度变化引起的冲压加工中的麻烦。
    • 2. 发明授权
    • Press machine and method of manufacturing pressed products
    • 冲压机及冲压制品的制造方法
    • US06337042B1
    • 2002-01-08
    • US09395185
    • 1999-09-14
    • Suekazu NakashimaYasuo KawanoHideji Aoki
    • Suekazu NakashimaYasuo KawanoHideji Aoki
    • B29C3322
    • B30B15/14
    • An object is to reduce mutual interference between a plurality of sets of molds coupled to a common frame stand to improve the processing accuracy. A plurality of sets (e.g. two sets) of molds are driven by servo motors (6a, 6b). The servo motors (6a, 6b) are individually controlled by servo amplifiers (8a, 8b), respectively. A control portion in the servo amplifier (8a) calculates a current (I) so that the measured value (X) of the rotating position of the servo motor (6a) follows a directing value (X0) sent from a CPU through a pulse generator (9). A torque detecting/limiting portion (25) limits the calculated current (I) so that a limit value of the torque sent from the CPU through a DA converter (12) is not exceeded and sends it to the servo motor (6a) through a current amplifier (26). When the torque of the servo motor (6a) reaches the limit value after the molds come in contact, the directing value (X0) is rapidly advanced in the mold-losing direction.
    • 目的是减少耦合到公共框架的多组模具之间的相互干扰,以提高处理精度。 由伺服电动机(6a,6b)驱动多个组(例如两组)模具。 伺服电动机(6a,6b)分别由伺服放大器(8a,8b)控制。 伺服放大器(8a)中的控制部分计算电流(I),使得伺服电机(6a)的旋转位置的测量值(X)遵循从CPU通过脉冲发生器发送的定向值(X0) (9)。 转矩检测/限制部分(25)限制计算出的电流(I),使得不经过DA转换器(12)从CPU发送的转矩的极限值被超过并且通过一个 电流放大器(26)。 当模具接触后伺服电动机(6a)的转矩达到极限值时,引导值(X0)在失模方向快速上升。
    • 6. 发明授权
    • Semiconductor manufacturing apparatus and method of manufacturing semiconductor device
    • 半导体制造装置及半导体装置的制造方法
    • US06363976B1
    • 2002-04-02
    • US09496412
    • 2000-02-02
    • Hideji AokiHidekazu ManabeKatsuhito Kamachi
    • Hideji AokiHidekazu ManabeKatsuhito Kamachi
    • B21F100
    • H01L21/4842
    • A semiconductor manufacturing apparatus and a method of manufacturing a semiconductor device are provided. A horizontal driver (111) and a vertical driver (112) are controlled to move a punch holder (110), or an end portion (101T1) of a punch (101), within a plane defined by first and second directions (D1, D2). A tip (101A) of the punch (101) is brought into contact with leads (11), with a punch-side forming surface (101S) and a die-side forming surface (151S) maintained in parallel relationship. A pressurizer (131) is controlled to move the end portion (101T1) in a fourth direction (D4) toward the die-side forming surface (151S), and the punch-side forming surface (101S) and the die-side forming surface (151S) hold the leads (11) therebetween. A pressure detector (121) detects a load placed upon the punch (101). A controller (190) receives a detection signal (S121) from the pressure detector (121) and controls the pressurizer (131) to place a predetermined load upon the lead (11) held between the punch-side forming surface (101S) and the die-side forming surface (151S). The semiconductor manufacturing apparatus is capable of accurately forming the leads of the semiconductor device without damages to the leads.
    • 提供半导体制造装置和半导体装置的制造方法。 控制水平驱动器(111)和垂直驱动器(112),以在由第一和第二方向(D1,D2)限定的平面内移动冲头保持器(110)或冲头(101)的端部(101T1) D2)。 冲头(101)的尖端(101A)与引线(11)接触,冲头侧形成表面(101S)和冲模侧形成表面(151S)保持平行关系。 控制加压器(131)使端部(101T1)向第四方向(D4)朝向模侧形成面(151S)移动,冲头侧形成面(101S)和模侧形成面 (151S)在其间保持引线(11)。 压力检测器(121)检测放置在冲头(101)上的负载。 控制器(190)从压力检测器(121)接收检测信号(S121),并控制加压器(131)将预定负荷放置在保持在冲压侧形成表面(101S)和 模侧形成面(151S)。 半导体制造装置能够精确地形成半导体器件的引线而不损害引线。
    • 7. 发明授权
    • Semiconductor device manufacturing method, press die and guide rail including forming a crack perpendicular to an extension of the sealing resin
    • 半导体器件制造方法,压模和导轨包括垂直于密封树脂的延伸部分形成裂纹
    • US06242287B1
    • 2001-06-05
    • US09044928
    • 1998-03-20
    • Hideji AokiHidenori SekiyaKenichirou KatouHiromu Nishitani
    • Hideji AokiHidenori SekiyaKenichirou KatouHiromu Nishitani
    • H01L2144
    • H01L21/4842H01L2924/0002H01L2924/00
    • Provided are a method for manufacturing a semiconductor device in which a sealing resin is prevented from being damaged and generation of a resin piece is suppressed, a press die for suppressing the generation of the resin piece, and a guide rail. A frame receiving die (11) includes a cavity (11d) having a rectangular contour shape seen on a plane which serves to house a sealing resin (3) therein, and a remaining gate housing section (11c) provided on any of four corners of the cavity (11d) corresponding to a remaining gate (3b) on a lower face of a corner (2a) of a lead frame (2). A lower gate punch (11a) is provided in a boundary portion between the cavity (11d) and the remaining gate housing section (11c). When the lead frame (2) is mounted on the frame receiving die (11), the sealing resin (3) is housed in the cavity (11d) and the remaining gate (3b) is housed in the remaining gate housing section (11c).
    • 提供一种制造半导体器件的方法,其中防止密封树脂被损坏并且树脂片的产生被抑制,用于抑制树脂片的产生的压模和导轨。 框架接收模具(11)包括在用于在其中容纳密封树脂(3)的平面上看到的具有矩形轮廓形状的空腔(11d),以及设置在其中的任何一个角上的剩余门容纳部分(11c) 所述空腔(11d)对应于引线框架(2)的拐角(2a)的下表面上的剩余门(3b)。 在所述空腔(11d)和所述剩余的门容纳部(11c)之间的边界部分设置有下门冲头(11a)。 当引线框架(2)安装在框架接收模具(11)上时,密封树脂(3)容纳在空腔(11d)中,剩余的门(3b)被容纳在剩余的浇口容纳部分(11c)中, 。