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1. 发明授权

US06464790B1 Substrate support member 失效
标题翻译：基材支撑件
公开(公告)号：US06464790B1
公开(公告)日：2002-10-15
申请号：US09527341
申请日：2000-03-17
申请人： Semyon Sherstinsky , Arnold Kholodenko , Calvin Augason , Samuel Wilson , Michael Phillips , Leonel Zuniga
发明人： Semyon Sherstinsky , Arnold Kholodenko , Calvin Augason , Samuel Wilson , Michael Phillips , Leonel Zuniga
IPC分类号： C23C1600
CPC分类号： C23C16/45521 , C23C16/4585 , C23C16/4586 , C30B25/12 , H01L21/6838
摘要： The present invention generally provides a support member adapted to provide vacuum chucking. In one aspect, a support member having an upper surface having an outer, raised portion defining an inner, recessed portion is provided. The inner recessed portion is in fluid communication with a vacuum supply. The support member may include a plurality of raised support portions having one or more recessed portions adjacent thereto, the raised support portions having equal heights above the recessed portions. The transition between the raised portions and the recessed portions is gradual and the orifices formed by the holes extending through the upper surface of the substrate support are rounded to eliminate sharp edges and rapid changes in height at the upper surface.
摘要翻译：本发明通常提供适于提供真空夹紧的支撑构件。一方面，提供具有上表面的支撑构件，其具有限定内凹部的外凸起部。内凹部与真空源流体连通。支撑构件可以包括多个凸起的支撑部分，其具有与其相邻的一个或多个凹部，所述凸起支撑部分在凹部上方具有相同的高度。凸起部分和凹陷部分之间的过渡是渐进的，并且由延伸穿过衬底支撑件的上表面的孔形成的孔是圆形的，以消除上边缘处的尖锐边缘和高度的快速变化。

2. 发明授权

US06464795B1 Substrate support member for a processing chamber 失效
标题翻译：用于处理室的基板支撑构件
公开(公告)号：US06464795B1
公开(公告)日：2002-10-15
申请号：US09563573
申请日：2000-05-03
申请人： Semyon Sherstinsky , Calvin Augason , Leonel A. Zuniga , Jun Zhao , Talex Sajoto , Leonid Selyutin , Joseph Yudovsky , Maitreyee Mahajani , Steve G. Ghanayem , Tai T. Ngo , Arnold Kholodenko
发明人： Semyon Sherstinsky , Calvin Augason , Leonel A. Zuniga , Jun Zhao , Talex Sajoto , Leonid Selyutin , Joseph Yudovsky , Maitreyee Mahajani , Steve G. Ghanayem , Tai T. Ngo , Arnold Kholodenko
IPC分类号： G23C1600
CPC分类号： C23C16/45521 , C23C16/4586 , H01L21/67109 , H01L21/6838 , H01L21/68785
摘要： A support member for supporting a substrate in a process chamber, the support member having a substrate support surface with one or more isolated recessed areas. A vacuum channel and a gas channel are formed in the support member along a common plane and are coupled to a vacuum source and gas source respectively. The gas channel comprises two or more concentrically disposed annular gas channels encompassing the vacuum channel. The vacuum channel is coupled to the support surface, and in particular to the one or more recessed areas, by a plurality of conduits. A portion of the conduits is disposed diametrically exterior to at least one of the annular gas channels and communicates with the vacuum channel via bypass channels.
摘要翻译：一种用于在处理室中支撑衬底的支撑构件，所述支撑构件具有具有一个或多个隔离的凹陷区域的衬底支撑表面。真空通道和气体通道沿着公共平面形成在支撑构件中，并且分别耦合到真空源和气体源。气体通道包括包围真空通道的两个或更多个同心设置的环形气体通道。真空通道由多个管道联接到支撑表面，特别是连接到一个或多个凹陷区域。导管的一部分沿直径设置在至少一个环形气体通道的外部，并通过旁通通道与真空通道连通。

3. 发明授权

US06278600B1 Electrostatic chuck with improved temperature control and puncture resistance 有权
标题翻译：静电吸盘具有改善的温度控制和抗穿刺性
公开(公告)号：US06278600B1
公开(公告)日：2001-08-21
申请号：US09231318
申请日：1999-01-13
申请人： Shamouil Shamouilian , Arnold Kholodenko , Semyon Kats , Semyon Sherstinsky , Jon Clinton , Surinder Bedi
发明人： Shamouil Shamouilian , Arnold Kholodenko , Semyon Kats , Semyon Sherstinsky , Jon Clinton , Surinder Bedi
IPC分类号： H01G2300
CPC分类号： H02N13/00 , H01L21/6831 , H01L21/6833
摘要： Apparatus for supporting a workpiece and method of making same. The apparatus comprises a flex circuit laminated to a contoured support pedestal. The flex circuit includes a reinforced layer to improve puncture resistance of the flex circuit. The top surface of the chuck has a contoured topography that is achieved by machining the upper surface of the pedestal prior to lamination of the flex circuit to the pedestal. The contoured topography improves the flow of backside cooling gas resulting in a more uniform wafer temperature profile.
摘要翻译：用于支撑工件的装置及其制造方法。该装置包括层压到轮廓支撑基座上的柔性电路。柔性电路包括增强层，以提高柔性电路的抗穿刺性。卡盘的顶表面具有轮廓的形貌，其通过在将柔性电路层压到基座之前加工基座的上表面来实现。轮廓形状改善了背面冷却气体的流动，导致更均匀的晶片温度分布。

4. 发明授权

US06557248B1 Method of fabricating an electrostatic chuck 失效
标题翻译：制造静电卡盘的方法
公开(公告)号：US06557248B1
公开(公告)日：2003-05-06
申请号：US09087332
申请日：1998-05-29
申请人： Shamouil Shamouilian , Manoocher Birang , John F. Cameron , Chandra Deshpandey , Alfred Goldspeil , Ron Northrup , Semyon Sherstinsky , Sasson Someth
发明人： Shamouil Shamouilian , Manoocher Birang , John F. Cameron , Chandra Deshpandey , Alfred Goldspeil , Ron Northrup , Semyon Sherstinsky , Sasson Someth
IPC分类号： H01R4300
CPC分类号： C23C16/45521 , C23C16/4586 , H01L21/67103 , H01L21/6831 , H01L21/6833 , H02N13/00 , Y10T29/49117 , Y10T279/23
摘要： A method of fabricating an electrostatic member 33 for holding a substrate 45 in a process chamber 80 containing erosive process gas. The method comprises the steps of forming an electrostatic member 33 comprising an insulator or dielectric layer 35 covering an electrically conductive layer, and shaping the electrostatic member 33 to form a dielectric covered electrode and an electrical connector 55 attached to the dielectric covered electrode 50 to conduct charge to the dielectric covered electrode 50.
摘要翻译：一种制造静电部件33的方法，用于将基板45保持在包含腐蚀性处理气体的处理室80中。该方法包括以下步骤：形成包括覆盖导电层的绝缘体或电介质层35的静电部件33，并且使静电部件33成形以形成介电覆盖电极和连接到电介质被覆电极50的电连接器55 充电到介电覆盖电极50。

5. 发明授权

US5316278A Clamping ring apparatus for processing semiconductor wafers 失效
标题翻译：用于处理半导体晶圆的夹紧环装置
公开(公告)号：US5316278A
公开(公告)日：1994-05-31
申请号：US947212
申请日：1992-09-18
申请人： Semyon Sherstinsky , Mei Chang , Charles C. Harris , Alfred Mak , James F. Roberts , Simon W. Tam , Wen T. Chang
发明人： Semyon Sherstinsky , Mei Chang , Charles C. Harris , Alfred Mak , James F. Roberts , Simon W. Tam , Wen T. Chang
IPC分类号： H01L21/687 , B25B1/00
CPC分类号： H01L21/68721 , Y10S269/903
摘要： An improved clamping ring apparatus is disclosed comprising a clamping ring means for yieldably engaging a generally circular semiconductor wafer to peripherally clamp the wafer to a support pedestal to provide a peripheral seal between the wafer and the surface of the pedestal facing the wafer, adjacent the generally circular end edge of the wafer by providing a central generally circular opening in the clamping ring and a series of slots which radially extend outwardly from the central opening in the clamping ring means to thereby divide the inner portion of the clamping ring means into a series of yieldable fingers inwardly extending toward the central opening in the clamping ring means.In one embodiment, the sidewalls of the slots are slanted with respect to the planar surface of the clamping ring means at an angle sufficient, with respect to the thickness of the clamping ring means and the width of the slot,, to prevent a ray or a particle from a plasma, traveling in a direction perpendicular to the plane of the surface of the clamping ring means from striking surfaces underlying the clamping ring means, through the slot.
摘要翻译：公开了一种改进的夹紧环装置，其包括夹紧环装置，用于可屈服地接合大致圆形的半导体晶片以将晶片周边夹持到支撑基座，以在晶片与面对晶片的基座的表面之间提供周边密封，通过在夹紧环中提供中心大致圆形的开口，以及从夹紧环装置中的中心开口径向向外延伸的一系列槽，从而将夹紧环装置的内部分成一系列可伸缩的手指向内延伸朝向夹紧环装置中的中心开口。在一个实施例中，槽的侧壁相对于夹紧环装置的平坦表面以相对于夹紧环装置的厚度和槽的宽度足够的角度倾斜以防止光线或来自等离子体的颗粒通过狭槽从垂直于夹紧环装置的表面的平面的方向通过夹紧环装置下方的冲击表面行进。

6. 发明授权

US4627288A Bearing unloading mechanism for disc clamping unit 失效
标题翻译：圆盘夹紧单元的轴承卸载机构
公开(公告)号：US4627288A
公开(公告)日：1986-12-09
申请号：US764413
申请日：1985-08-12
申请人： Nahum Guzik , John L. Guerini , Semyon Sherstinsky
发明人： Nahum Guzik , John L. Guerini , Semyon Sherstinsky
IPC分类号： G11B17/028
CPC分类号： G11B17/0287
摘要： A bearing unloading mechanism for a disc clamping unit utilized in rigid disc certifiers or testers comprises a hollow spindle (12) containing a pulling rod (20) which slides in the spindle. The upper end of the pulling rod carries a clamping element (26) for clamping a disc (D) to be tested or certified. There is a first compression spring (32) arranged between a flange (30) at the lower end of rod (20) and second compression springs (56) between stationary casing (18) and a moveable casing (48) which is attached to a pneumatic cylinder (40), solenoid, or any other linear actuator. When the actuator is energized, the moveable casing moves down, compressing the second springs until the moveable casing comes into contact with an abutment flange (58) of the spindle. At this point the device continues to move the rod connected to the clamp up to the unclamped position. Since the device is applying an equal downward force, as well as an upward force, there is no force applied to the internal components of the bearings.
摘要翻译：用于刚性盘认证机或测试机中的盘夹紧单元的轴承卸载机构包括一个中空轴（12），其包含在主轴中滑动的拉杆（20）。拉杆的上端承载用于夹紧待测试或认证的盘（D）的夹紧元件（26）。第一压缩弹簧（32）设置在杆（20）的下端处的凸缘（30）和固定壳体（18）与可移动壳体（48）之间的第二压缩弹簧（56）之间，第一压缩弹簧气动缸（40），螺线管或任何其他线性执行器。当致动器通电时，可移动壳体向下移动，压缩第二弹簧，直到可动壳体与主轴的邻接凸缘（58）接触。此时，设备继续将连接到夹具的杆移动到未夹紧位置。由于装置施加相等的向下的力以及向上的力，因此不会对轴承的内部部件施加力。

7. 发明授权

US06726805B2 Pedestal with integral shield 有权
标题翻译：带整体护罩的基座
公开(公告)号：US06726805B2
公开(公告)日：2004-04-27
申请号：US10128983
申请日：2002-04-24
申请人： Karl Brown , Vineet Mehta , See-Eng Phan , Semyon Sherstinsky , Allen Lau
发明人： Karl Brown , Vineet Mehta , See-Eng Phan , Semyon Sherstinsky , Allen Lau
IPC分类号： H05H100
CPC分类号： H01L21/67069 , H01J37/321 , H01J37/32623
摘要： Generally, a substrate support member for supporting a substrate is provided. In one embodiment, a substrate support member for supporting a substrate includes a body coupled to a lower shield. The body has an upper surface adapted to support the substrate and a lower surface. The lower shield has a center portion and a lip. The lip is disposed radially outward of the body and projects towards a plane defined by the first surface. The lip is disposed in a spaced-apart relation from the body. The lower shield is adapted to interface with an upper shield disposed in a processing chamber to define a labyrinth gap that substantially prevents plasma from migrating below the member. The lower shield, in another embodiment, provides the plasma with a short RF ground return path.
摘要翻译：通常，提供了用于支撑衬底的衬底支撑构件。在一个实施例中，用于支撑衬底的衬底支撑构件包括联接到下屏蔽的主体。主体具有适于支撑基板和下表面的上表面。下屏蔽件具有中心部分和唇部。唇缘设置在身体的径向外侧并朝向由第一表面限定的平面突出。唇缘与身体间隔开设置。下屏蔽适于与设置在处理室中的上屏蔽接口以限定基本上防止等离子体迁移到构件下方的迷宫间隙。在另一个实施例中，下屏蔽为等离子体提供短的RF接地返回路径。

8. 发明授权

US5671117A Electrostatic chuck 失效
标题翻译：静电吸盘
公开(公告)号：US5671117A
公开(公告)日：1997-09-23
申请号：US626667
申请日：1996-03-27
申请人： Semyon Sherstinsky , Shamouil Shamouilian , Manoocher Birang , Alfred Mak , Simon W. Tam
发明人： Semyon Sherstinsky , Shamouil Shamouilian , Manoocher Birang , Alfred Mak , Simon W. Tam
IPC分类号： B23Q3/15 , C23C16/458 , H01L21/00 , H01L21/683 , H02N13/00
CPC分类号： H02N13/00 , C23C16/4586 , H01L21/67109 , H01L21/6831 , H01L21/6833 , Y10T279/23 , Y10T29/49117
摘要： An electrostatic chuck for securing a semiconductor wafer on a pedestal having multiple apertures for the introduction of cooling gas beneath the wafer. The multiple apertures reduce overheating near the wafer edge and provide lower temperature gradients across the wafer. The wafer is held by electrostatic force against a laminate of an electrode layer sandwiched between two dielectric layers in such a way that the laminate presents a planar surface to the wafer for a substantial distance beyond the outer edge of the electrode layer. The laminate construction ensures that a large wafer area beyond the outer edge of the electrode is in contact with the laminate, to minimize cooling gas leakage near the edge, and provides a longer useful life by increasing the path length of dielectric material between the electrode layer and potentially damaging plasma material surrounding the chuck.
摘要翻译：一种用于将半导体晶片固定在具有多个孔的基座上以在晶片下方引入冷却气体的静电卡盘。多个孔径减小晶片边缘附近的过热，并在晶片上提供较低的温度梯度。晶片通过静电力抵抗夹在两个电介质层之间的电极层的层压体，使得层压体在晶片上呈现超过电极层的外边缘相当长的平面。层压结构确保了超过电极外边缘的大的晶片区域与层压体接触，以使边缘附近的冷却气体泄漏最小化，并且通过增加电极层之间的电介质材料的路径长度来提供更长的使用寿命并可能损坏卡盘周围的等离子体材料。

9. 发明授权

US5292399A Plasma etching apparatus with conductive means for inhibiting arcing 失效
标题翻译：具有用于抑制电弧放电的导电装置的等离子体蚀刻装置
公开(公告)号：US5292399A
公开(公告)日：1994-03-08
申请号：US819573
申请日：1992-01-08
申请人： Terrance Y. Lee , Fred C. Redeker , Petru N. Nitescu , Robert J. Steger , David W. Groechel , Semyon Sherstinsky , Maya Shendon , Samuel Luong
发明人： Terrance Y. Lee , Fred C. Redeker , Petru N. Nitescu , Robert J. Steger , David W. Groechel , Semyon Sherstinsky , Maya Shendon , Samuel Luong
IPC分类号： H01L21/00 , H01L21/687
CPC分类号： H01L21/68721 , H01L21/67069 , Y10S156/915
摘要： An improved plasma etching apparatus is disclosed for the plasma etching of semiconductor wafers. The improvement includes conductive means for inhibiting arcing from electrical charges accumulating on one or more non-conductive protective surfaces on members at rf potential within the apparatus, such as the metal pedestal which supports the wafer being etched and supplies the rf potential to it, and the clamping ring mechanism which clamps the wafer to the pedestal. The conductive means may include one or more conductive plugs extending through one or more of the protective surfaces or a conductive ring surrounding the wafer on the top surface of the metal pedestal. The conductive material is selected from the class consisting of carbon; a silicide; titanium nitride; a carbide; and a semiconductor such as silicon doped to provide a resistivity ranging from about 0.001 to about 20 ohm-cm.
摘要翻译：公开了用于半导体晶片的等离子体蚀刻的改进的等离子体蚀刻装置。该改进包括导电装置，用于抑制积聚在装置内的rf电位的构件上的一个或多个不导电保护表面上的电荷的电弧，例如支撑被蚀刻的晶片并将rf电位提供给它的金属基座，以及夹紧环机构，其将晶片夹持到基座。导电装置可以包括延伸穿过一个或多个保护表面的一个或多个导电插塞或围绕金属基座的顶表面上的晶片的导电环。导电材料选自碳; 硅化物氮化钛; 硬质合金以及掺杂硅的半导体，以提供约0.001至约20欧姆 - 厘米的电阻率。

10. 发明申请

US20060002053A1 Detachable electrostatic chuck for supporting a substrate in a process chamber 有权
公开(公告)号：US20060002053A1
公开(公告)日：2006-01-05
申请号：US11221169
申请日：2005-09-07
申请人： Karl Brown , Semyon Sherstinsky , Wei Wang , Cheng-Hsiung Tsai , Vineet Mehta , Allen Lau , Steve Sansoni
发明人： Karl Brown , Semyon Sherstinsky , Wei Wang , Cheng-Hsiung Tsai , Vineet Mehta , Allen Lau , Steve Sansoni
IPC分类号： H01T23/00
CPC分类号： H01L21/6831 , Y10T279/23
摘要： A detachable electrostatic chuck can be attached to a pedestal in a process chamber. The electrostatic chuck has an electrostatic puck comprising a dielectric covering at least one electrode and a frontside surface to receive a substrate. A backside surface of the chuck has a central protrusion that can be a D-shaped mesa to facilitate alignment with a mating cavity in the pedestal. The protrusion can also have asymmetrically offset apertures, which further assist alignment, and also serve to receive electrode terminal posts and a gas tube. A heat transfer plate having an embedded heat transfer fluid channel is spring loaded on the pedestal to press against the chuck for good heat transfer.

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