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1. 发明授权

US4772125A Apparatus and method for inspecting soldered portions 失效
标题翻译：用于检查焊接部分的装置和方法
公开(公告)号：US4772125A
公开(公告)日：1988-09-20
申请号：US875974
申请日：1986-06-19
申请人： Kazushi Yoshimura , Takashi Hiroi , Takanori Ninomiya , Toshimitsu Hamada , Yasuo Nakagawa , Kohichi Karasaki
发明人： Kazushi Yoshimura , Takashi Hiroi , Takanori Ninomiya , Toshimitsu Hamada , Yasuo Nakagawa , Kohichi Karasaki
IPC分类号： G01B11/24 , G01N21/64 , G01N21/88 , G01N21/956 , G06T7/00
CPC分类号： G06T7/0006 , G01N21/95684 , G01N2021/95646 , G01N21/64 , G06T2207/10064 , G06T2207/30152
摘要： An apparatus for inspecting an appearance of soldered portions connected between the pads formed on a printed circuit board and leads of an electronic body part. A slit light beam is directed to portions to be inspected and scanned thereon with a light fluorescent image generated from the substrate portion of the printed circuit board and a dark fluorescent image generated from the leads, pads and soldered portions being detected with an image signal being generated in accordance therewith. The image signal is binarized and different functions are extracted from the binarized signal which functions are utilized in connection with other functions and previously obtained data to determine whether an abnormal portion is present or not in a predetermined position on the circuit board.
摘要翻译：一种用于检查连接在形成在印刷电路板上的焊盘和电子主体部分的引线之间的焊接部分的外观的装置。利用从印刷电路板的基板部分产生的荧光图像将狭缝光束引导到要检查和扫描的部分，并且从引线，焊盘和焊接部分产生的暗荧光图像被图像信号检测到根据其产生。图像信号被二值化，并且从二值化信号中提取不同的功能，该功能与其他功能相关联使用，并且先前获得的数据用于确定在电路板上的预定位置是否存在异常部分。

2. 发明授权

US5015097A Method for inspecting filled state of via-holes filled with fillers and apparatus for carrying out the method 失效
标题翻译：用于检查填充有填充物的通孔的填充状态的方法和用于执行该方法的装置
公开(公告)号：US5015097A
公开(公告)日：1991-05-14
申请号：US416934
申请日：1989-10-04
申请人： Mineo Nomoto , Takanori Ninomiya , Hiroya Koshishiba , Toshimitsu Hamada , Yasuo Nakagawa
发明人： Mineo Nomoto , Takanori Ninomiya , Hiroya Koshishiba , Toshimitsu Hamada , Yasuo Nakagawa
IPC分类号： G01N21/88 , G01N21/956 , G06T7/00 , H05K3/00 , H05K3/40
CPC分类号： G06T7/0004 , G01N21/95692 , G06T7/604 , G01N2021/95653 , G01N21/8806 , G06T2207/30141
摘要： A method for inspecting the filled state of a plurality of via-holes which pass through a non-conductive circuit board and are filled with a conductive substance and an apparatus for carrying out the method are disclosed.The surface of the circuit board is illuminated in two directions to generate shadows depending on the concave or convex state of the fillers in a plurality of via-holes. An optical image of the illuminated surface of the circuit board is detected. Each edge of the two shadow areas, which exist in the detected optical image and are generated in one via-hole by light irradiation in two directions, is detected. Whether the filler in this one via-hole is in the concave state or convex state is identified according to the mutual position relationship of the detected edges. The length of each shadow area is detected, and whether the concave state or convex state of the filler is within a predetermined allowance is decided according to the detection results. The area of the image of the filler is detected according to differences between the brightness of the board surface or of the via-hole wall and the brightness of the filler in the via-hole in the detected optical image, and whether the filler is lacking or not is decided according to the detection result.
摘要翻译：公开了一种用于检查通过非导电电路板并填充有导电物质的多个通孔的填充状态的方法和用于实施该方法的装置。电路板的表面在两个方向上被照亮，以产生取决于多个通孔中的填料的凹凸状态的阴影。检测电路板的被照射表面的光学图像。检测存在于所检测的光学图像中并且在两个方向上通过光照射在一个通孔中产生的两个阴影区域的每个边缘。根据检测到的边缘的相互位置关系来识别该通孔中的填充物是处于凹状还是凸状状态。检测每个阴影区域的长度，根据检测结果确定填料的凹状或凸状状态是否处于预定的余量内。根据检测到的光学图像中的基板表面或通孔壁的亮度与通孔中的填充物的亮度之间的差异来检测填充物的图像的面积，以及填充材料是否缺乏是否根据检测结果决定。

3. 发明授权

US5463667A Inspection method for soldered joints using x-ray imaging and apparatus therefor 失效
标题翻译：使用X射线成像的焊接接头的检查方法及其设备
公开(公告)号：US5463667A
公开(公告)日：1995-10-31
申请号：US53240
申请日：1993-04-28
申请人： Toshiaki Ichinose , Takanori Ninomiya , Asahiro Kuni , Kozo Nakahata , Toshimitsu Hamada , Toshihiko Ayabe
发明人： Toshiaki Ichinose , Takanori Ninomiya , Asahiro Kuni , Kozo Nakahata , Toshimitsu Hamada , Toshihiko Ayabe
IPC分类号： G01N23/04 , H01L21/66 , H01L23/50 , H05K3/34 , H05K13/08
CPC分类号： H05K13/08 , G01N23/04
摘要： A method and an apparatus for inspecting a soldered joint with an X-ray, the soldered joint being formed by soldering a lead to a surface of a substrate. The method may include moving the substrate so as to move the surface of the substrate in an XY plane to position the soldered joint at a desired position in the XY plane, rotating the substrate so as to rotate the surface of the substrate in the XY plane to position the soldered joint at a desired orientation in the XY plane, rotating an X-ray source and a detector about the soldered joint in both of two mutually perpendicular planes perpendicular to the XY plane while maintaining the X-ray source and the detector at fixed positions relative to each other to establish a desired oblique irradiation angle between an X-ray from the X-ray source and the lead on the surface of the substrate, irradiating the soldered joint with the X-ray from the X-ray source at the desired oblique irradiation angle such that the X-ray is transmitted through the soldered joint and the substrate, detecting the X-ray transmitted through the soldered joint and the substrate with the detector, the detector producing an output signal indicative of the detected X-ray, and determining a condition of the soldered joint based on the output signal of the detector. The apparatus may operate in the same fashion.
摘要翻译：一种用X射线检测焊接接头的方法和装置，所述焊接接头通过将引线焊接到基板的表面而形成。该方法可以包括移动基板以使基板的表面在XY平面中移动，以将焊接接头定位在XY平面中的期望位置，旋转基板以使基板的表面在XY平面中旋转将焊接接头定位在XY平面中所需的取向上，使X射线源和检测器围绕焊接接头在与XY平面垂直的两个相互垂直的平面中旋转，同时将X射线源和检测器保持在固定位置，以建立来自X射线源的X射线与衬底表面上的铅之间的期望的倾斜照射角度，用X射线源的X射线照射焊接接头所需的倾斜照射角度，使得X射线透射通过焊接接头和基板，通过检测器检测透过焊接接头和基板的X射线，检测器产品选择表示检测到的X射线的输出信号，以及基于检测器的输出信号确定焊接接头的状态。该装置可以以相同的方式操作。

4. 发明授权

US4556797A Method and apparatus for detecting edge of fine pattern on specimen 失效
标题翻译：用于检测样品上精细图案边缘的方法和装置
公开(公告)号：US4556797A
公开(公告)日：1985-12-03
申请号：US530044
申请日：1983-09-07
申请人： Asahiro Kuni , Toshimitsu Hamada , Hiroshi Makihira , Kazushi Yoshimura
发明人： Asahiro Kuni , Toshimitsu Hamada , Hiroshi Makihira , Kazushi Yoshimura
IPC分类号： H01L21/66 , G01B7/00 , G01B15/04 , H01J37/28 , H01L21/027 , H01J37/00
CPC分类号： G01B15/04 , H01J37/28
摘要： In a method and apparatus for detecting the edge of a fine pattern formed on a specimen such as a fine circuit pattern formed on a semiconductor element or the like, there is prepared a predetermined model waveform based on theoretical secondary electron emission from the edge portion. Secondary electrons emitted from successive scanning points across the pattern edge portion through the irradiation of a scanning electron beam thereonto are detected to produce an actual signal waveform reflecting the secondary electron emission from the pattern edge portion. The actual signal waveform is compared with the model waveform, and one of the scanning points at which the highest coincidence exists between both the actual and model waveforms, is determined as a position of the pattern edge.
摘要翻译：在形成在半导体元件等上形成的精细电路图案的试样上形成的精细图案的边缘的方法和装置中，根据来自边缘部分的理论二次电子发射，制备预定的模型波形。检测从连续的扫描点通过扫描电子束照射到图案边缘部分的二次电子，以产生反映来自图案边缘部分的二次电子发射的实际信号波形。将实际信号波形与模型波形进行比较，确定实际波形和模型波形之间存在最高一致性的扫描点之一，作为图形边缘的位置。

5. 发明授权

US4403294A Surface defect inspection system 失效
标题翻译：表面缺陷检查系统
公开(公告)号：US4403294A
公开(公告)日：1983-09-06
申请号：US211113
申请日：1980-11-28
申请人： Toshimitsu Hamada , Hiroshi Makihira , Yasuo Nakagawa , Makoto Udaka
发明人： Toshimitsu Hamada , Hiroshi Makihira , Yasuo Nakagawa , Makoto Udaka
IPC分类号： G01B11/00 , G01B11/24 , G01B11/30 , G01N21/88 , G06T1/00 , G06T7/00 , G01N21/48
CPC分类号： G01N21/88 , G06T7/001 , G06T2207/30164
摘要： A surface defect inspection system comprises an image pick-up device for picking up an image by sequentially scanning the surface of an object two-dimensionally, a threshold circuit for quantizing the image signal produced from the image pick-up device as a binary code, a pattern feature extracting device for making calculations for extracting the features of image patterns from the quantized signal in synchronism with the scanning, and for temporarily storing the result of the calculations, a pattern region end decision device for deciding that individual pattern regions have ended in one direction, and a defect decision device for reading out from the pattern feature extracting device the result of the calculations on the pattern features corresponding to the positions each of the patterns in the direction perpendicular to the one direction each time of the decision that each pattern region has ended, so that the feature of each pattern scanned is compared with a predetermined reference, thus deciding and an indication of producing the presence or absence of a defect.
摘要翻译：表面缺陷检查系统包括用于通过二维顺序地扫描对象的表面来拾取图像的图像拾取装置，用于量化由图像拾取装置产生的图像信号作为二进制代码的阈值电路，图案特征提取装置，用于进行与扫描同步地从量化信号中提取图像图案的特征的计算，并且用于临时存储计算结果;图案区域结束判定装置，用于决定各个图案区域已经结束一个方向，以及缺陷判定装置，用于从每个图案特征提取装置的每个图案每次都从与图形特征相对应的图案特征相对应的图案特征提取装置读出与每个方向垂直的方向上的位置的计算结果区域已经结束，使得所扫描的每个图案的特征与预定的裁剪进行比较因此，决定和产生缺陷的存在或缺失的指示。

6. 发明授权

US5059559A Method of aligning and bonding tab inner leads 失效
标题翻译：对准和粘接标签内引线的方法
公开(公告)号：US5059559A
公开(公告)日：1991-10-22
申请号：US265704
申请日：1988-11-01
申请人： Michio Takahashi , Tooru Mita , Yasuo Nakagawa , Toshimitsu Hamada , Hisafumi Iwata , Aizo Kaneda , Kouji Serizawa , Hiroyuki Tanaka , Koichi Sugimoto , Toshihiko Sakai , Keizo Matsukawa , Tsutomu Mimata
发明人： Michio Takahashi , Tooru Mita , Yasuo Nakagawa , Toshimitsu Hamada , Hisafumi Iwata , Aizo Kaneda , Kouji Serizawa , Hiroyuki Tanaka , Koichi Sugimoto , Toshihiko Sakai , Keizo Matsukawa , Tsutomu Mimata
IPC分类号： H01L21/00 , H01L21/603
CPC分类号： H01L21/67144 , H01L24/50 , Y10T29/49121
摘要： The present invention relates to a multi-pin chip mounting method and apparatus based on a TAB (Tape Automated Bonding) system in which leads formed on a tape and bumps formed an IC chip are aligned with each other and compress-bonded to each other. An IC chip having bumps formed on a surface thereof and inner leads formed on a carrier tape are disposed opposite to each other at a bonding station. A position of the IC chip on a stage is detected through the inner leads at the bonding station to determine the amount of correction of position of the stage. The inner leads and the IC chip are aligned with each other on the basis of the determined correction amount and are thereafter bonded to each other.
摘要翻译：本发明涉及一种基于TAB（磁带自动接合）系统的多针芯片安装方法和装置，其中形成在磁带上的引线和形成IC芯片的凸起彼此对准并且彼此压接。在其表面形成有凸起的IC芯片和形成在载带上的内部引线在接合台处彼此相对设置。通过焊接台的内部引线检测台架上的IC芯片的位置，以确定台阶位置的校正量。内部引线和IC芯片基于确定的校正量彼此对准，然后彼此结合。

7. 发明授权

US4226539A Cylindrical body appearance inspection apparatus 失效
标题翻译：圆柱体外观检查装置
公开(公告)号：US4226539A
公开(公告)日：1980-10-07
申请号：US863345
申请日：1977-12-22
申请人： Yasuo Nakagawa , Hiroshi Makihira , Toshimitsu Hamada
发明人： Yasuo Nakagawa , Hiroshi Makihira , Toshimitsu Hamada
IPC分类号： G01N21/952 , G06G7/186 , G06G7/48 , G01N21/48
CPC分类号： G01N21/952 , G06G7/1865 , G06G7/48
摘要： An automatic cylindrical body appearance inspection apparatus comprises a cylindrical body appearance detecting device including rotating means for rotating the cylindrical body around its axis at a constant speed and detecting means for optically picking up an image of a cylindrical surface of the cylindrical body rotated by the rotating means and one-dimensionally scanning the image on a plane of real image thereof in a predetermined direction to extract a base line of the cylindrical surface of the cylindrical body as an image signal, an end surface appearance detecting device including a pair of detecting means each for optically picking up an image of each of opposite end surfaces of the cylindrical body and one-dimensionally scanning the image on a plane of real image thereof in a direction transverse to the predetermined direction to extract an image signal, transporting means for transporting the cylindrical body while it is positioned, from the cylindrical surface appearance detecting means to the end surface appearance detecting means and determining means for determining pass or fail or grade of a defect pattern on the surfaces of the cylindrical body based on the image signals derived from the cylindrical surface appearance detecting device and the end surface appearance detecting device, whereby the appearance of the cylindrical surface and the end surfaces of the cylindrical body under test is automatically inspected.
摘要翻译：一种自动圆柱体外观检查装置，包括：圆筒体外观检测装置，包括用于以恒定速度旋转圆筒体绕其轴线的旋转装置;以及检测装置，用于光学地拾取由旋转的旋转体旋转的圆筒体的圆柱形表面的图像在预定方向上对其图像的平面进行一维扫描，提取圆筒体的圆筒形表面的基线作为图像信号;端面外观检测装置，其包括一对检测装置用于光学拾取圆柱体的每个相对端面的图像，并在垂直于预定方向的方向上在其实像平面上一维扫描图像以提取图像信号;传送装置，用于传送圆柱形身体定位时，从圆柱形表面外观d 基于来自圆筒形外观检测装置和端面外观检测装置的图像信号，确定装置，用于确定圆筒体的表面上的缺陷图形的通过或失败或等级由此自动检查圆柱形表面和待测筒状体的端面的外观。

8. 发明授权

US4872187A X-ray tomographic imaging system and method 失效
标题翻译： X射线断层成像系统及方法
公开(公告)号：US4872187A
公开(公告)日：1989-10-03
申请号：US156179
申请日：1988-02-16
申请人： Kozo Nakahata , Toshimitsu Hamada , Yasuo Nakagawa , Mineo Nomoto
发明人： Kozo Nakahata , Toshimitsu Hamada , Yasuo Nakagawa , Mineo Nomoto
IPC分类号： G01N23/04 , G01N23/18
CPC分类号： G01N23/18 , G01N23/046 , G01N2223/419
摘要： In an X-ray tomographic imaging system and method, an object to be inspected is irradiated with X-rays from an X-ray source to obtain an X-ray transmission image of the object. The X-ray transmission image is converted by an X-ray fluorescence image intensifier into a detection image. The intensity of the detection image is also intensified by the X-ray fluorescence image intensifier. A photo-electric converter converts the intensified detection image from the X-ray fluorescence image intensifier into an electrical signal. The object to be inspected is held by an object holder rotatably at a position in proximity to the X-ray source and movably in a direction of the axis of rotation of the object and a direction perpendicular to the rotation axis. The electrical signal from the photo-electric converter is processed to a cross-sectional image.
摘要翻译：在X射线层析成像系统和方法中，从X射线源照射X射线检查对象物，得到被检体的X射线透过图像。通过X射线荧光图像增强器将X射线透射图像转换成检测图像。 X射线荧光图像增强器也增强了检测图像的强度。光电转换器将强化的检测图像从X射线荧光图像增强器转换成电信号。待检查对象由物体保持器可旋转地保持在靠近X射线源的位置，并且可沿物体的旋转轴线和垂直于旋转轴线的方向移动。来自光电转换器的电信号被处理成横截面图像。

9. 发明授权

US4410278A Method and apparatus for appearance inspection 失效
标题翻译：外观检查方法和装置
公开(公告)号：US4410278A
公开(公告)日：1983-10-18
申请号：US170181
申请日：1980-07-18
申请人： Hiroshi Makihira , Yasuo Nakagawa , Toshimitsu Hamada , Makoto Udaka
发明人： Hiroshi Makihira , Yasuo Nakagawa , Toshimitsu Hamada , Makoto Udaka
IPC分类号： G01N21/952 , G01N21/55 , G01N21/88
CPC分类号： G01N21/952
摘要： An apparatus for inspecting the outer peripheral surface of a cylindrical object is disclosed, in which the light in slit form is radiated on the surface of an object such as a nuclear fuel pellet at an angle thereto, the light regularly reflected on the surface is detected by a detector, the detected image signal is quantized at threshold values higher and lower than an average level, and the binary signals are used to detect surface losses separately from an unground part and a metal inclusion as a first detection process. The diffused light is radiated onto the surface of the nuclear fuel pellet at an angle thereto, parallel light rays are radiated onto the surface from the direction perpendicular thereto, the light reflected from the surface of the object is detected by a detector from the direction perpendicular to the surface, the detected image signal is quantized at a threshold level lower than an average level of the image signal for the normal surface, and the binary signal is used to detect, as a second detection process, a crack and a pit separately from a chip, said crack, pit or chip included in surface missing defects detected in said first detection process. The surface defects of the nuclear fuel pellet or the like are thus detected by separating them into at least three types including a chip, an unground part and a metal inclusion, and a crack and a pit.
摘要翻译：公开了一种用于检查圆柱形物体的外周表面的装置，其中狭缝形式的光以与其成角度的核燃料芯片的物体的表面上辐射，检测到表面上规则反射的光通过检测器，检测到的图像信号在高于和低于平均电平的阈值处被量化，并且二进制信号用于与未接地部分和金属夹杂物分开地检测表面损耗作为第一检测处理。散射光与核燃料芯块的表面成角度地辐射，平行的光线从与其垂直的方向辐射到表面上，从物体的表面反射的光由检测器从垂直的方向检测到的图像信号在比正常表面的图像信号的平均电平低的阈值处被量化，并且二进制信号用于作为第二检测处理分别检测裂纹和凹坑在所述第一检测过程中检测到的表面缺失缺陷中包含的裂纹，凹坑或芯片的芯片。因此，通过将核燃料粒子等的表面缺陷分离为包括芯片，未研磨部分和金属夹杂物以及裂纹和凹坑中的至少三种类型来检测。

10. 发明授权

US4162126A Surface detect test apparatus 失效
标题翻译：表面检测试验装置
公开(公告)号：US4162126A
公开(公告)日：1979-07-24
申请号：US859206
申请日：1977-12-09
申请人： Yasuo Nakagawa , Toshimitsu Hamada
发明人： Yasuo Nakagawa , Toshimitsu Hamada
IPC分类号： G01N21/952 , G01N21/48
CPC分类号： G01N21/952
摘要： Apparatus and method for testing surface defect on an object are disclosed, which comprise an illumination means for illuminating collimated lights onto a surface of the object obliquely to the surface and from two symmetrical directions, a sensor composed of a TV camera or a linear image sensor for sensing diffused reflected lights from the surface of the object in the direction perpendicular to the surface, a classification means for discriminating the sensed image signal by a threshold level which is higher than an average level of the image signal and a threshold level which is lower than the average level to determine the surface defect pattern as a broken cavity pattern or a pit or crack pattern by the discriminated signals, and a discrimination means for calculating L.sup.2 -4.pi.S, where S is an area of the defect and L is a length of the contour, when signal discriminated by the lower threshold level is produced to discriminate the pit pattern and the crack pattern by determining whether L.sup.2 -4.pi.S exceeds a predetermined value or not. In this manner, the defects that exist on the surface of the object can be classified and evaluated.
摘要翻译：公开了一种用于测试物体上的表面缺陷的装置和方法，该装置和方法包括用于将准直光照射到物体表面上的表面和两个对称方向的照明装置，由TV照相机或线性图像传感器用于在垂直于表面的方向上感测来自物体表面的漫反射光;分类装置，用于将感测到的图像信号鉴别出高于图像信号的平均电平的阈值电平和较低的阈值电平比通过鉴别信号确定表面缺陷图案为断裂图案或凹坑或裂纹图案的平均水平，以及用于计算L2-4 pi S的鉴别装置，其中S是缺陷的面积，L是当产生由较低阈值电平鉴别的信号时，轮廓的长度可通过确定wh来区分凹坑图案和裂纹图案醚L2-4 pi S超过预定值。以这种方式，可以分类和评估存在于物体表面上的缺陷。

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