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1. 发明授权

US4772125A Apparatus and method for inspecting soldered portions 失效
标题翻译：用于检查焊接部分的装置和方法
公开(公告)号：US4772125A
公开(公告)日：1988-09-20
申请号：US875974
申请日：1986-06-19
申请人： Kazushi Yoshimura , Takashi Hiroi , Takanori Ninomiya , Toshimitsu Hamada , Yasuo Nakagawa , Kohichi Karasaki
发明人： Kazushi Yoshimura , Takashi Hiroi , Takanori Ninomiya , Toshimitsu Hamada , Yasuo Nakagawa , Kohichi Karasaki
IPC分类号： G01B11/24 , G01N21/64 , G01N21/88 , G01N21/956 , G06T7/00
CPC分类号： G06T7/0006 , G01N21/95684 , G01N2021/95646 , G01N21/64 , G06T2207/10064 , G06T2207/30152
摘要： An apparatus for inspecting an appearance of soldered portions connected between the pads formed on a printed circuit board and leads of an electronic body part. A slit light beam is directed to portions to be inspected and scanned thereon with a light fluorescent image generated from the substrate portion of the printed circuit board and a dark fluorescent image generated from the leads, pads and soldered portions being detected with an image signal being generated in accordance therewith. The image signal is binarized and different functions are extracted from the binarized signal which functions are utilized in connection with other functions and previously obtained data to determine whether an abnormal portion is present or not in a predetermined position on the circuit board.
摘要翻译：一种用于检查连接在形成在印刷电路板上的焊盘和电子主体部分的引线之间的焊接部分的外观的装置。利用从印刷电路板的基板部分产生的荧光图像将狭缝光束引导到要检查和扫描的部分，并且从引线，焊盘和焊接部分产生的暗荧光图像被图像信号检测到根据其产生。图像信号被二值化，并且从二值化信号中提取不同的功能，该功能与其他功能相关联使用，并且先前获得的数据用于确定在电路板上的预定位置是否存在异常部分。

2. 发明授权

US5015097A Method for inspecting filled state of via-holes filled with fillers and apparatus for carrying out the method 失效
标题翻译：用于检查填充有填充物的通孔的填充状态的方法和用于执行该方法的装置
公开(公告)号：US5015097A
公开(公告)日：1991-05-14
申请号：US416934
申请日：1989-10-04
申请人： Mineo Nomoto , Takanori Ninomiya , Hiroya Koshishiba , Toshimitsu Hamada , Yasuo Nakagawa
发明人： Mineo Nomoto , Takanori Ninomiya , Hiroya Koshishiba , Toshimitsu Hamada , Yasuo Nakagawa
IPC分类号： G01N21/88 , G01N21/956 , G06T7/00 , H05K3/00 , H05K3/40
CPC分类号： G06T7/0004 , G01N21/95692 , G06T7/604 , G01N2021/95653 , G01N21/8806 , G06T2207/30141
摘要： A method for inspecting the filled state of a plurality of via-holes which pass through a non-conductive circuit board and are filled with a conductive substance and an apparatus for carrying out the method are disclosed.The surface of the circuit board is illuminated in two directions to generate shadows depending on the concave or convex state of the fillers in a plurality of via-holes. An optical image of the illuminated surface of the circuit board is detected. Each edge of the two shadow areas, which exist in the detected optical image and are generated in one via-hole by light irradiation in two directions, is detected. Whether the filler in this one via-hole is in the concave state or convex state is identified according to the mutual position relationship of the detected edges. The length of each shadow area is detected, and whether the concave state or convex state of the filler is within a predetermined allowance is decided according to the detection results. The area of the image of the filler is detected according to differences between the brightness of the board surface or of the via-hole wall and the brightness of the filler in the via-hole in the detected optical image, and whether the filler is lacking or not is decided according to the detection result.
摘要翻译：公开了一种用于检查通过非导电电路板并填充有导电物质的多个通孔的填充状态的方法和用于实施该方法的装置。电路板的表面在两个方向上被照亮，以产生取决于多个通孔中的填料的凹凸状态的阴影。检测电路板的被照射表面的光学图像。检测存在于所检测的光学图像中并且在两个方向上通过光照射在一个通孔中产生的两个阴影区域的每个边缘。根据检测到的边缘的相互位置关系来识别该通孔中的填充物是处于凹状还是凸状状态。检测每个阴影区域的长度，根据检测结果确定填料的凹状或凸状状态是否处于预定的余量内。根据检测到的光学图像中的基板表面或通孔壁的亮度与通孔中的填充物的亮度之间的差异来检测填充物的图像的面积，以及填充材料是否缺乏是否根据检测结果决定。

3. 发明授权

US4641527A Inspection method and apparatus for joint junction states 失效
标题翻译：连接状态检查方法及装置
公开(公告)号：US4641527A
公开(公告)日：1987-02-10
申请号：US707501
申请日：1985-03-04
申请人： Takashi Hiroi , Takanori Ninomiya , Yasuo Nakagawa
发明人： Takashi Hiroi , Takanori Ninomiya , Yasuo Nakagawa
IPC分类号： G01N21/956 , G01R31/02 , G01N29/04
CPC分类号： G01R31/026 , G01N21/956 , G01N2021/479
摘要： An object to be inspected which is jointed to a circuit board is vibrated in a contactless manner by applying a gas jet or a magnetic force to the object, a laser beam is irradiated on the object, and a laser beam reflected from the object is detected by a linear sensor to observe a laser speckle pattern for the object. Quality of a joint junction state of the object is judged from the laser speckle pattern.
摘要翻译：通过对物体施加气体射流或磁力，将被检查物体接触电路板以非接触的方式振动，激光束被照射在物体上，检测从物体反射的激光束通过线性传感器观察物体的激光散斑图案。从激光斑纹图案判断物体的接合连接状态的质量。

4. 发明授权

US5781294A Method and apparatus for detecting photoacoustic signal to detect surface and subsurface information of the specimen 失效
标题翻译：用于检测光声信号以检测样品的表面和地下信息的方法和装置
公开(公告)号：US5781294A
公开(公告)日：1998-07-14
申请号：US548015
申请日：1995-10-25
申请人： Toshihiko Nakata , Takanori Ninomiya , Hilario Haruomi Kobayashi , Kazushi Yoshimura
发明人： Toshihiko Nakata , Takanori Ninomiya , Hilario Haruomi Kobayashi , Kazushi Yoshimura
IPC分类号： G01N21/17 , G01N29/06 , G01N29/24 , G01N29/34 , G01B9/02
CPC分类号： G01N29/346 , G01N21/1702 , G01N29/0609 , G01N29/2418 , G01N2291/012
摘要： A method and an apparatus for detecting a photoacoustic signal are provided which irradiate an excitation light beam, modulated by a desired frequency, simultaneously to a plurality of points being measured on a surface of a sample, irradiate the excitation light and a probe light simultaneously to the plurality of the points being measured, detect an interference light of a reflected light beam of the probe light and a specified reference light with a detector made up of a plurality of photoelectric converting elements corresponding to the respective points being measured, the detector being in conjugate relation with the surface of the sample, detect a thermal distortion of the frequency component equal to the intensity-modulated frequency at the plurality of the points being measured from the interference light intensity signal detected by the detector, and detect information relative to the surface and the subsurface of the measuring points on the sample from the thermal distortion of the frequency component. A plurality of measuring points on a specimen are excited simultaneously with an intensity-modulated flat light beam and the thermal expansion displacements of the measuring points are detected simultaneously by interference between a flat probe light beam and a flat reference light beam to detect photothermal displacement signals representing the photothermal displacements of the plurality of measuring points simultaneously.
摘要翻译：提供了一种用于检测光声信号的方法和装置，其将在期望频率下调制的激发光束同时照射到在样品表面上测量的多个点，同时将激发光和探针光照射到测量的多个点，利用由与被测量的各个点相对应的多个光电转换元件组成的检测器检测探测光的反射光束和指定参考光的干涉光，检测器处于与样品表面的共轭关系，根据由检测器检测到的干涉光强度信号测量的多个点处，检测与等于强度调制频率的频率成分的热失真，并检测相对于表面的信息和样品上的测量点的地表从热失真的频率分量。试样上的多个测量点与强度调制的平坦光束同时激发，并且通过平坦探测光束和平坦参考光束之间的干涉同时检测测量点的热膨胀位移，以检测光热位移信号同时表示多个测量点的光热位移。

5. 发明授权

US5883437A Method and apparatus for inspection and correction of wiring of electronic circuit and for manufacture thereof 失效
标题翻译：电子电路接线检查和校正方法及装置及其制造方法
公开(公告)号：US5883437A
公开(公告)日：1999-03-16
申请号：US580531
申请日：1995-12-28
申请人： Shigenobu Maruyama , Mikio Hongo , Satoru Todoroki , Masaaki Okunaka , Hideo Matsuzaki , Takanori Ninomiya , Kazushi Yoshimura , Fumikazu Ito
发明人： Shigenobu Maruyama , Mikio Hongo , Satoru Todoroki , Masaaki Okunaka , Hideo Matsuzaki , Takanori Ninomiya , Kazushi Yoshimura , Fumikazu Ito
IPC分类号： G02F1/1362 , H01L21/48 , H01L23/48 , H01L29/40 , H01L29/52
CPC分类号： G02F1/136286 , H01L21/485 , G02F2001/136254 , H01L2924/0002
摘要： A method and apparatus for inspecting wirings of an electronic circuit substrate to detect a defect in the wiring and for enabling correction thereof. The inspection method and apparatus include electrostatically coupling at least one electrode to a wiring pattern, applying a time varying voltage between the electrode and wiring pattern at different locations so as to detect a current flow and determine a defect by a variation in the detected current flow at the different locations and a portion of the defect. A defect in the form of a disconnected or half-disconnected point of the wiring may be corrected by supplying a solution of a metal complex to the disconnected or half-disconnected point, heating the solution and end point areas of the disconnected or half-disconnected point by laser light and precipitating a metal thin film establishing a connection of the wiring.
摘要翻译：一种用于检查电子电路基板的布线以检测布线中的缺陷并使其能够进行校正的方法和装置。检查方法和装置包括将至少一个电极静电耦合到布线图案，在不同位置在电极和布线图案之间施加时变电压，以便检测电流，并通过检测电流的变化来确定缺陷在不同的位置和缺陷的一部分。可以通过将金属复合物的溶液提供给断开或半断开的点来加热接头的断开或半断开点的形式的缺陷，加热解决方案和终点区域的断开或半断开通过激光点并沉淀建立连线的金属薄膜。

6. 发明授权

US5463667A Inspection method for soldered joints using x-ray imaging and apparatus therefor 失效
标题翻译：使用X射线成像的焊接接头的检查方法及其设备
公开(公告)号：US5463667A
公开(公告)日：1995-10-31
申请号：US53240
申请日：1993-04-28
申请人： Toshiaki Ichinose , Takanori Ninomiya , Asahiro Kuni , Kozo Nakahata , Toshimitsu Hamada , Toshihiko Ayabe
发明人： Toshiaki Ichinose , Takanori Ninomiya , Asahiro Kuni , Kozo Nakahata , Toshimitsu Hamada , Toshihiko Ayabe
IPC分类号： G01N23/04 , H01L21/66 , H01L23/50 , H05K3/34 , H05K13/08
CPC分类号： H05K13/08 , G01N23/04
摘要： A method and an apparatus for inspecting a soldered joint with an X-ray, the soldered joint being formed by soldering a lead to a surface of a substrate. The method may include moving the substrate so as to move the surface of the substrate in an XY plane to position the soldered joint at a desired position in the XY plane, rotating the substrate so as to rotate the surface of the substrate in the XY plane to position the soldered joint at a desired orientation in the XY plane, rotating an X-ray source and a detector about the soldered joint in both of two mutually perpendicular planes perpendicular to the XY plane while maintaining the X-ray source and the detector at fixed positions relative to each other to establish a desired oblique irradiation angle between an X-ray from the X-ray source and the lead on the surface of the substrate, irradiating the soldered joint with the X-ray from the X-ray source at the desired oblique irradiation angle such that the X-ray is transmitted through the soldered joint and the substrate, detecting the X-ray transmitted through the soldered joint and the substrate with the detector, the detector producing an output signal indicative of the detected X-ray, and determining a condition of the soldered joint based on the output signal of the detector. The apparatus may operate in the same fashion.
摘要翻译：一种用X射线检测焊接接头的方法和装置，所述焊接接头通过将引线焊接到基板的表面而形成。该方法可以包括移动基板以使基板的表面在XY平面中移动，以将焊接接头定位在XY平面中的期望位置，旋转基板以使基板的表面在XY平面中旋转将焊接接头定位在XY平面中所需的取向上，使X射线源和检测器围绕焊接接头在与XY平面垂直的两个相互垂直的平面中旋转，同时将X射线源和检测器保持在固定位置，以建立来自X射线源的X射线与衬底表面上的铅之间的期望的倾斜照射角度，用X射线源的X射线照射焊接接头所需的倾斜照射角度，使得X射线透射通过焊接接头和基板，通过检测器检测透过焊接接头和基板的X射线，检测器产品选择表示检测到的X射线的输出信号，以及基于检测器的输出信号确定焊接接头的状态。该装置可以以相同的方式操作。

7. 发明授权

US06614923B1 Pattern inspecting method and apparatus thereof, and pattern inspecting method on basis of electron beam images and apparatus thereof 失效
标题翻译：图案检查方法和装置，以及基于电子束图像的图案检查方法及其装置
公开(公告)号：US06614923B1
公开(公告)日：2003-09-02
申请号：US09225512
申请日：1999-01-06
申请人： Chie Shishido , Yuji Takagi , Shuji Maeda , Takanori Ninomiya , Takashi Hiroi , Masahiro Watanabe , Hideaki Doi
发明人： Chie Shishido , Yuji Takagi , Shuji Maeda , Takanori Ninomiya , Takashi Hiroi , Masahiro Watanabe , Hideaki Doi
IPC分类号： G06K932
CPC分类号： G06T7/001 , G06T5/006 , G06T2207/10061 , G06T2207/30148 , H01J37/226 , H01J37/28 , H01J2237/2448 , H01J2237/24592 , H01J2237/2482 , H01J2237/2806 , H01J2237/2817
摘要： For purpose of providing a defect inspecting method and an apparatus thereof and a defect inspecting method on basis of electron beam image and an apparatus thereof, reducing possibility of bringing erroneous or false reports due to the test objection side and the inspecting apparatus side, being caused by discrepancies, such as the minute difference in pattern shapes, the difference in gradation values, the distortion or deformation of the patterns, the position shift, thereby enabling the detection of the defects or the defective candidates in more details, wherein an image which is small in distortion by controlling the electron beam scanning is detected and divided into a size so as to be able to neglect therefrom, and then position shift detection and defect decision are carried out in an accuracy less or finer than pixel for each division unit. In the defect decision, a desired tolerance can be set up depending upon changes in gradation values and the position shift.
摘要翻译：为了提供基于电子束图像的缺陷检查方法及其装置和缺陷检查方法及其装置，减少由于检测对象侧和检查装置侧引起错误或错误的报告的可能性通过差异，例如图案形状的微小差异，灰度值的差异，图案的变形或变形，位置偏移，从而能够更详细地检测缺陷或缺陷候选物，其中，图像是检测出通过控制电子束扫描而具有较小的失真，并将其分割成能够忽略的尺寸，然后针对每个分割单元以比像素少的精度执行位移检测和缺陷判定。在缺陷判定中，可以根据灰度值和位置偏移的变化来建立期望的公差。

8. 发明授权

US06376854B2 Method of inspecting a pattern on a substrate 有权
标题翻译：检查基板上的图案的方法
公开(公告)号：US06376854B2
公开(公告)日：2002-04-23
申请号：US09848422
申请日：2001-05-04
申请人： Chie Shishido , Takashi Hiroi , Haruo Yoda , Masahiro Watanabe , Asahiro Kuni , Maki Tanaka , Takanori Ninomiya , Hideaki Doi , Shunji Maeda , Mari Nozoe , Hiroyuki Shinoda , Atsuko Takafuji , Aritoshi Sugimoto , Yasutsugu Usami
发明人： Chie Shishido , Takashi Hiroi , Haruo Yoda , Masahiro Watanabe , Asahiro Kuni , Maki Tanaka , Takanori Ninomiya , Hideaki Doi , Shunji Maeda , Mari Nozoe , Hiroyuki Shinoda , Atsuko Takafuji , Aritoshi Sugimoto , Yasutsugu Usami
IPC分类号： G01N2188
CPC分类号： G01N21/95607
摘要： A method for inspecting a pattern formed on a substrate, includes the steps of moving a table along a first direction on which a substrate to be inspected is mounted, irradiating a converged electron beam on the substrate by scanning the converged electron beam along a second direction which is perpendicular to the first direction; detecting an electron radiated from the substrate by the irradiation of the converged electron beam in which the movement of the table and the scanning of the converged electron beam are synchronized; forming a digital image of the substrate from the detected electron; improving a quality of the digital image by filtering the digital image; and detecting a defect of a pattern formed on the substrate by using the improved quality digital image.
摘要翻译：一种用于检查形成在基板上的图案的方法，包括以下步骤：沿着安装有待检查的基板的第一方向移动工作台，通过沿第二方向扫描会聚的电子束将会聚的电子束照射在基板上其垂直于第一方向; 通过会聚电子束的照射来检测从基板辐射的电子，其中台的移动和会聚电子束的扫描同步; 从检测到的电子形成衬底的数字图像; 通过过滤数字图像来提高数字图像的质量; 以及通过使用改进的质量数字图像来检测在基板上形成的图案的缺陷。

9. 发明授权

US06236057B1 Method of inspecting pattern and apparatus thereof with a differential brightness image detection 有权
标题翻译：用差分亮度图像检测来检查图案及其装置的方法
公开(公告)号：US06236057B1
公开(公告)日：2001-05-22
申请号：US09610954
申请日：2000-07-06
申请人： Chie Shishido , Takashi Hiroi , Haruo Yoda , Masahiro Watanabe , Asahiro Kuni , Maki Tanaka , Takanori Ninomiya , Hideaki Doi , Shunji Maeda , Mari Nozoe , Hiroyuki Shinoda , Atsuko Takafuji , Aritoshi Sugimoto , Yasutsugu Usami
发明人： Chie Shishido , Takashi Hiroi , Haruo Yoda , Masahiro Watanabe , Asahiro Kuni , Maki Tanaka , Takanori Ninomiya , Hideaki Doi , Shunji Maeda , Mari Nozoe , Hiroyuki Shinoda , Atsuko Takafuji , Aritoshi Sugimoto , Yasutsugu Usami
IPC分类号： G01N2188
CPC分类号： G01N21/95607
摘要： A method and apparatus for inspecting a pattern, a first image of a first area on a sample is acquired by imaging the first area formed as a first pattern, and the first image is memorized. A second image of a second area on the sample is acquired by imaging the second area formed as a second pattern which is to be the same as the first pattern. A defect of the first pattern is detected by acquiring a differential image between the first image and the second image. The detection of the defect includes processing the differential image by using information of brightness corresponding to both of the first image and the second image.
摘要翻译：通过对形成为第一图案的第一区域进行成像，并记录第一图像来获取用于检查图案的样品的第一区域的第一图像的方法和装置。通过对形成为与第一图案相同的第二图案的第二区域成像来获取样品上的第二区域的第二图像。通过获取第一图像和第二图像之间的差分图像来检测第一图案的缺陷。缺陷的检测包括通过使用与第一图像和第二图像两者相对应的亮度的信息来处理差分图像。

10. 发明授权

US6087673A Method of inspecting pattern and apparatus thereof 失效
标题翻译：检查图案及其装置的方法
公开(公告)号：US6087673A
公开(公告)日：2000-07-11
申请号：US81636
申请日：1998-05-20
申请人： Chie Shishido , Takashi Hiroi , Haruo Yoda , Masahiro Watanabe , Asahiro Kuni , Maki Tanaka , Takanori Ninomiya , Hideaki Doi , Shunji Maeda , Mari Nozoe , Hiroyuki Shinoda , Atsuko Takafuji , Aritoshi Sugimoto , Yasutsugu Usami
发明人： Chie Shishido , Takashi Hiroi , Haruo Yoda , Masahiro Watanabe , Asahiro Kuni , Maki Tanaka , Takanori Ninomiya , Hideaki Doi , Shunji Maeda , Mari Nozoe , Hiroyuki Shinoda , Atsuko Takafuji , Aritoshi Sugimoto , Yasutsugu Usami
IPC分类号： G01N23/20 , G01N21/88 , G01N21/956 , G01N23/225 , G06T1/00 , H01L21/66
CPC分类号： G01N21/95607
摘要： In a method of inspecting a defect and an apparatus thereof, an allowable range for a gradation value of a difference image is determined for each pixel from one pixel or less of position shift quantity between two images to be compared, a variation rate in a local gradation value of an image, and a representative value of the local gradation value. Then, by comparing the gradation value of the difference image with the allowable range determined for each pixel, a pixel, on which the gradation value of the difference image is within the allowable range, is judged to be an non-defective candidate and a pixel, on which the gradation value of the difference image is beyond the allowable range, is judged to be a defective candidate. This reduces the number of false information caused by mismatches attributed to an object to be inspected and an image detecting system, such as an infinitesimal difference in pattern configuration, a difference in the gradation value, a distortion of a pattern, and a position shift, thus making it possible to detect a more minute defect.
摘要翻译：在检查缺陷的方法和装置中，针对要比较的两个图像之间的位置偏移量的一个像素或更少的像素，针对每个像素确定差分图像的灰度值的允许范围，局部变化率图像的灰度值和局部灰度值的代表值。然后，通过将差分图像的灰度值与对于每个像素确定的容许范围进行比较，将差分图像的灰度值在允许范围内的像素判断为无缺陷候选和像素，其中差分图像的灰度值超出允许范围，被判断为缺陷候选。这减少了归因于待检查对象的失配和图像检测系统引起的错误信息的数量，例如图案配置中的无穷小差异，灰度值的差异，图案的失真和位置偏移，从而可以检测到更小的缺陷。

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