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1. 发明授权

US4556797A Method and apparatus for detecting edge of fine pattern on specimen 失效
标题翻译：用于检测样品上精细图案边缘的方法和装置
公开(公告)号：US4556797A
公开(公告)日：1985-12-03
申请号：US530044
申请日：1983-09-07
申请人： Asahiro Kuni , Toshimitsu Hamada , Hiroshi Makihira , Kazushi Yoshimura
发明人： Asahiro Kuni , Toshimitsu Hamada , Hiroshi Makihira , Kazushi Yoshimura
IPC分类号： H01L21/66 , G01B7/00 , G01B15/04 , H01J37/28 , H01L21/027 , H01J37/00
CPC分类号： G01B15/04 , H01J37/28
摘要： In a method and apparatus for detecting the edge of a fine pattern formed on a specimen such as a fine circuit pattern formed on a semiconductor element or the like, there is prepared a predetermined model waveform based on theoretical secondary electron emission from the edge portion. Secondary electrons emitted from successive scanning points across the pattern edge portion through the irradiation of a scanning electron beam thereonto are detected to produce an actual signal waveform reflecting the secondary electron emission from the pattern edge portion. The actual signal waveform is compared with the model waveform, and one of the scanning points at which the highest coincidence exists between both the actual and model waveforms, is determined as a position of the pattern edge.
摘要翻译：在形成在半导体元件等上形成的精细电路图案的试样上形成的精细图案的边缘的方法和装置中，根据来自边缘部分的理论二次电子发射，制备预定的模型波形。检测从连续的扫描点通过扫描电子束照射到图案边缘部分的二次电子，以产生反映来自图案边缘部分的二次电子发射的实际信号波形。将实际信号波形与模型波形进行比较，确定实际波形和模型波形之间存在最高一致性的扫描点之一，作为图形边缘的位置。

2. 发明授权

US4213117A Method and apparatus for detecting positions of chips on a semiconductor wafer 失效
标题翻译：用于检测半导体晶片上的芯片位置的方法和装置
公开(公告)号：US4213117A
公开(公告)日：1980-07-15
申请号：US964353
申请日：1978-11-28
申请人： Yukio Kembo , Asahiro Kuni , Hiroshi Makihira
发明人： Yukio Kembo , Asahiro Kuni , Hiroshi Makihira
IPC分类号： H01L23/544 , G06K9/04
CPC分类号： H01L23/544 , H01L2223/54453 , H01L2924/0002
摘要： A method and apparatus for detecting positions of chips on a semiconductor wafer. The method comprises an illuminating step for illuminating obliquely the semiconductor wafer from above including at least a position detecting direction; a totalizing step for optically totalizing, when the irregular reflecting rays reflecting at the semiconductor wafer illuminated at the illuminating step are photographed by an image pickup element or device, the irregular reflecting rays in the direction normal to the position detecting direction or for electrically totalizing the levels of a video signal produced by the image pickup element or device in the same direction; a video signal detecting step for producing a video signal with coordinates lying in the position detecting direction by photographing an image resulting from optical totalization at the totalizing step by the image pickup element or device or electrically totalizing the image; and a street position detecting step for detecting a street position between chips by extracting a specific coordinate with a wide width and a low level corresponding to dark from the video signal produced at the video signal detecting step. The apparatus executes the above-mentioned method.
摘要翻译：一种用于检测半导体晶片上的芯片位置的方法和装置。该方法包括用于从至少位置检测方向从上方倾斜地照射半导体晶片的照明步骤; 当在照明步骤照射的半导体晶片处反射的不规则反射光线被图像拾取元件或器件拍摄时，在垂直于位置检测方向的方向上的不规则反射光线或用于电气地将由图像拾取元件或装置在相同方向上产生的视频信号的电平; 视频信号检测步骤，用于通过拍摄由图像拾取元件或装置的累积步骤产生的由光学累积得到的图像，或者电子地对图像进行电积分，产生具有处于位置检测方向的坐标的视频信号; 以及街道位置检测步骤，用于通过从视频信号检测步骤中产生的视频信号提取具有与深度对应的宽宽度和低电平的特定坐标来检测码片之间的街道位置。该装置执行上述方法。

3. 发明授权

US5463667A Inspection method for soldered joints using x-ray imaging and apparatus therefor 失效
标题翻译：使用X射线成像的焊接接头的检查方法及其设备
公开(公告)号：US5463667A
公开(公告)日：1995-10-31
申请号：US53240
申请日：1993-04-28
申请人： Toshiaki Ichinose , Takanori Ninomiya , Asahiro Kuni , Kozo Nakahata , Toshimitsu Hamada , Toshihiko Ayabe
发明人： Toshiaki Ichinose , Takanori Ninomiya , Asahiro Kuni , Kozo Nakahata , Toshimitsu Hamada , Toshihiko Ayabe
IPC分类号： G01N23/04 , H01L21/66 , H01L23/50 , H05K3/34 , H05K13/08
CPC分类号： H05K13/08 , G01N23/04
摘要： A method and an apparatus for inspecting a soldered joint with an X-ray, the soldered joint being formed by soldering a lead to a surface of a substrate. The method may include moving the substrate so as to move the surface of the substrate in an XY plane to position the soldered joint at a desired position in the XY plane, rotating the substrate so as to rotate the surface of the substrate in the XY plane to position the soldered joint at a desired orientation in the XY plane, rotating an X-ray source and a detector about the soldered joint in both of two mutually perpendicular planes perpendicular to the XY plane while maintaining the X-ray source and the detector at fixed positions relative to each other to establish a desired oblique irradiation angle between an X-ray from the X-ray source and the lead on the surface of the substrate, irradiating the soldered joint with the X-ray from the X-ray source at the desired oblique irradiation angle such that the X-ray is transmitted through the soldered joint and the substrate, detecting the X-ray transmitted through the soldered joint and the substrate with the detector, the detector producing an output signal indicative of the detected X-ray, and determining a condition of the soldered joint based on the output signal of the detector. The apparatus may operate in the same fashion.
摘要翻译：一种用X射线检测焊接接头的方法和装置，所述焊接接头通过将引线焊接到基板的表面而形成。该方法可以包括移动基板以使基板的表面在XY平面中移动，以将焊接接头定位在XY平面中的期望位置，旋转基板以使基板的表面在XY平面中旋转将焊接接头定位在XY平面中所需的取向上，使X射线源和检测器围绕焊接接头在与XY平面垂直的两个相互垂直的平面中旋转，同时将X射线源和检测器保持在固定位置，以建立来自X射线源的X射线与衬底表面上的铅之间的期望的倾斜照射角度，用X射线源的X射线照射焊接接头所需的倾斜照射角度，使得X射线透射通过焊接接头和基板，通过检测器检测透过焊接接头和基板的X射线，检测器产品选择表示检测到的X射线的输出信号，以及基于检测器的输出信号确定焊接接头的状态。该装置可以以相同的方式操作。

4. 发明申请

US20080063257A1 Pattern Inspection Method And Apparatus 有权
标题翻译：图案检验方法及装置
公开(公告)号：US20080063257A1
公开(公告)日：2008-03-13
申请号：US11931693
申请日：2007-10-31
申请人： Takashi HIROI , Masahiro Watanabe , Chie Shishido , Aritoshi Sugimoto , Maki Tanaka , Hiroshi Miyai , Asahiro Kuni , Yasuhiko Nara
发明人： Takashi HIROI , Masahiro Watanabe , Chie Shishido , Aritoshi Sugimoto , Maki Tanaka , Hiroshi Miyai , Asahiro Kuni , Yasuhiko Nara
IPC分类号： G06K9/00
CPC分类号： G01N21/9501 , G01N21/956 , G01N2021/8854 , G01N2021/8861 , G01N2021/8864 , G01R31/311 , G03F1/86 , G06T1/0007 , G06T7/0002 , G06T7/001 , G06T2200/24 , G06T2207/10061 , G06T2207/30148 , H01J37/222 , H01J37/265 , H01J37/28 , H01J2237/221 , H01J2237/24592 , H01J2237/28
摘要： An apparatus for processing a defect candidate image, including: an imager for taking an enlarged image of a specimen; an image processor for processing the image taken by the imager to detect defect candidates existing on the specimen and classify the detected defect candidates into one of plural defect classes; a memory for storing information of the defect candidates including the images of the defect candidates and the classified defect class data outputted from the image processor; and a display unit having a display screen for displaying information stored in the memory, wherein the display unit displays an image of the defect candidates together with the defect class data stored in the memory and the displayed defect class data is changeable on the display screen, and the memory changes the stored defect class data of the displayed defect candidate to the changed defect class data.
摘要翻译：一种用于处理缺陷候选图像的装置，包括：用于拍摄样本的放大图像的成像器; 图像处理器，用于处理由成像器拍摄的图像以检测存在于样本上的缺陷候选，并将检测到的缺陷候选分类为多个缺陷类别中的一个; 存储器，用于存储包括缺陷候选图像和从图像处理器输出的分类缺陷类别数据的缺陷候选的信息; 以及显示单元，具有用于显示存储在存储器中的信息的显示屏幕，其中所述显示单元与存储在存储器中的缺陷类别数据一起显示缺陷候选的图像，并且显示的缺陷类别数据可在显示屏幕上变化，并且存储器将存储的缺陷候选的缺陷类别数据改变为改变的缺陷类别数据。

5. 发明申请

US20070131877A9 Pattern inspection method and system therefor 审中-公开
标题翻译：图案检验方法及系统
公开(公告)号：US20070131877A9
公开(公告)日：2007-06-14
申请号：US10062666
申请日：2002-02-05
申请人： Takashi Hiroi , Masahiro Watanabe , Asahiro Kuni , Maki Tanaka , Munenori Fukunishi , Hiroshi Miyai , Yasuhiko Nara , Mitsunobu Isobe
发明人： Takashi Hiroi , Masahiro Watanabe , Asahiro Kuni , Maki Tanaka , Munenori Fukunishi , Hiroshi Miyai , Yasuhiko Nara , Mitsunobu Isobe
IPC分类号： G01N23/00
CPC分类号： G06K9/6211 , G01N23/22 , G06K9/033 , G06K2209/19 , G06T7/001 , G06T2207/30148
摘要： Conventionally, defect data outputted by an inspection system comprised only characteristic quantitative data, such as coordinate data, area, and projected length, and only the coordinate data for moving to a defect location could be utilized effectively. By contrast, the present invention, by using image data in addition to characteristic quantitative data as the defect data for an inspection system, enables the retrieval of image data via an outside results confirmation system. Further, in the case of defect data of a plurality of substrates, it is enabled to display a defect image during inspection by the fact that similar defects are retrieved via images and retrieval results are displayed as trends makes it possible to display a defect image during inspection by searching similar defects on images and displaying them as a trend, designating a substrate on the trend, thereby displaying the defect map thereof and designating a defect on the defect map.
摘要翻译：通常，由检查系统输出的缺陷数据仅包括诸如坐标数据，面积和投影长度的特征定量数据，并且仅有用于移动到缺陷位置的坐标数据可以被有效地利用。相比之下，本发明通过使用除了特征定量数据之外的图像数据作为检查系统的缺陷数据，能够经由外部结果确认系统检索图像数据。此外，在多个基板的缺陷数据的情况下，能够通过图像检索相似缺陷的事实在检查期间显示缺陷图像，并且检索结果被显示为趋势，使得可以在显示缺陷图像期间显示缺陷图像通过搜索图像上的类似缺陷并将其显示为趋势，指定趋势上的基板，从而显示其缺陷图并指定缺陷图上的缺陷来进行检查。

6. 发明授权

US06898305B2 Circuit pattern inspection method and apparatus 有权
公开(公告)号：US06898305B2
公开(公告)日：2005-05-24
申请号：US09791911
申请日：2001-02-22
申请人： Takashi Hiroi , Masahiro Watanabe , Chie Shishido , Asahiro Kuni , Maki Tanaka , Hiroshi Miyai , Yasuhiko Nara , Mari Nozoe
发明人： Takashi Hiroi , Masahiro Watanabe , Chie Shishido , Asahiro Kuni , Maki Tanaka , Hiroshi Miyai , Yasuhiko Nara , Mari Nozoe
IPC分类号： G01N23/225 , G01N21/956 , G06T1/00 , G06T7/00 , H01L21/66 , G06K9/00
CPC分类号： G06T7/001 , G01N21/95684 , G06T2207/10056 , G06T2207/30148
摘要： The present invention provides techniques, including a method and system, for inspecting for defects in a circuit pattern on a semi-conductor material. One specific embodiment provides a trial inspection threshold setup method, where the initial threshold is modified after a defect analysis of trial inspection stored data. The modified threshold is then used as the threshold in actual inspection.

7. 发明申请

US20050080647A1 Business process diagnostic method and business process diagnostic system 审中-公开
标题翻译：业务流程诊断方法和业务流程诊断系统
公开(公告)号：US20050080647A1
公开(公告)日：2005-04-14
申请号：US10929418
申请日：2004-08-31
申请人： Koji Okada , Tatsuya Suzuki , Asahiro Kuni
发明人： Koji Okada , Tatsuya Suzuki , Asahiro Kuni
IPC分类号： G06Q10/00 , G06Q10/06 , G06Q50/00 , G06F17/60
CPC分类号： G06Q10/06 , G06Q30/0203
摘要： In business process diagnosis, answers to questions is improved in their accuracy, and an accurate result of diagnosis is obtained. A computer diagnoses a business process of an organization based on answers to questions. The diagnosis includes a first answer reception step in which a first question sheet containing common questions is displayed to receive answers to said common questions and to receive questions proper to the organization, and then a second question sheet containing said common questions, said answers to the common questions, and said questions proper to the organization is generated; a second answer reception step in which said second question sheet is displayed to receive answers to said questions proper to the organization, and then a third question sheet containing said common questions, said answers to the common questions, said questions proper to the organization, and said answers to the questions proper to the organization is generated; and a diagnosis step in which the business process of said organization is diagnosed based on the answers to said common questions and the answers to said questions proper to the organization, with said answers to said common questions and said answers to said questions proper to the organization being filled in said third question sheet.
摘要翻译：在业务流程诊断中，问题的答案在准确性方面得到改进，得到了准确的诊断结果。计算机根据问题的答案诊断组织的业务流程。诊断包括第一答案接收步骤，其中显示包含常见问题的第一问题单以接收对所述常见问题的答案并且接收适合于该组织的问题，然后包含包含所述常见问题的第二个问题单，对共同的问题，并提出了适合组织的问题; 第二回答接收步骤，其中显示所述第二问题单以接收对组织适当的所述问题的答案，然后包含第三个问题单，其中包含所述常见问题，常见问题的答案，对组织适用的所述问题，以及表示对组织适用的问题的答案是产生的; 以及诊断步骤，其中基于所述常见问题的答案和对组织适当的所述问题的答案来诊断所述组织的业务流程，所述答案涉及对所述组织适合的所述常见问题和所述问题的答案填写在第三个问题单中。

8. 发明授权

US06614022B2 Pattern inspection method and apparatus using electron beam 失效
标题翻译：使用电子束的图案检查方法和装置
公开(公告)号：US06614022B2
公开(公告)日：2003-09-02
申请号：US09908713
申请日：2001-07-20
申请人： Takashi Hiroi , Asahiro Kuni , Masahiro Watanabe , Chie Shishido , Hiroyuki Shinada , Yasuhiro Gunji , Atsuko Takafuji
发明人： Takashi Hiroi , Asahiro Kuni , Masahiro Watanabe , Chie Shishido , Hiroyuki Shinada , Yasuhiro Gunji , Atsuko Takafuji
IPC分类号： H01J37244
CPC分类号： H01J37/244 , H01J37/28 , H01J2237/24465 , H01J2237/2817
摘要： In the detecting system for irradiating the electron beam and detecting the secondary electron thereof, an area of the detector is an important factor for high-speed detection. For the technique of the current electron optical system and detector, a detector of the area larger than a constant area is necessary and detection of 200 Msps or more by receiving limitation on the frequency inversely proportional to the area is substantially difficult. For example, for detection at 400 Msps under the condition that the required area is 4 mm square and the rate for 4 mm square is defined as 150 Msps, four discrete high-speed detectors of 2 mm square are arranged to amplify and then add the signals for A/D conversion. Otherwise, the secondary electron is sequentially inputted to the detector of 8 mm square with the secondary electron deflector, the secondary electron is detected at 100 Msps and arranged after the A/D conversion. In any case, the area of 4 mm square and rate of 400 Msps can be attained.
摘要翻译：在用于照射电子束并检测其二次电子的检测系统中，检测器的面积是高速检测的重要因素。对于当前电子光学系统和检测器的技术，需要一个大于恒定面积的区域的检测器，并且通过接收与该区域成反比的频率的限制来检测200 Msps以上是非常困难的。例如，对于在所需面积为4平方毫米，4平方毫米的速率定义为150 Msps的条件下，以400 Msps进行检测，放置4个离散高速2 mm的高速检测器，放大，然后将A / D转换。否则，二次电子依次输入到具有二次电子偏转器的8mm正方形的检测器，二次电子以100Msps检测并且在A / D转换之后排列。在任何情况下，可以获得4平方毫米的面积和400 Msps的面积。

9. 发明授权

US06376854B2 Method of inspecting a pattern on a substrate 有权
标题翻译：检查基板上的图案的方法
公开(公告)号：US06376854B2
公开(公告)日：2002-04-23
申请号：US09848422
申请日：2001-05-04
申请人： Chie Shishido , Takashi Hiroi , Haruo Yoda , Masahiro Watanabe , Asahiro Kuni , Maki Tanaka , Takanori Ninomiya , Hideaki Doi , Shunji Maeda , Mari Nozoe , Hiroyuki Shinoda , Atsuko Takafuji , Aritoshi Sugimoto , Yasutsugu Usami
发明人： Chie Shishido , Takashi Hiroi , Haruo Yoda , Masahiro Watanabe , Asahiro Kuni , Maki Tanaka , Takanori Ninomiya , Hideaki Doi , Shunji Maeda , Mari Nozoe , Hiroyuki Shinoda , Atsuko Takafuji , Aritoshi Sugimoto , Yasutsugu Usami
IPC分类号： G01N2188
CPC分类号： G01N21/95607
摘要： A method for inspecting a pattern formed on a substrate, includes the steps of moving a table along a first direction on which a substrate to be inspected is mounted, irradiating a converged electron beam on the substrate by scanning the converged electron beam along a second direction which is perpendicular to the first direction; detecting an electron radiated from the substrate by the irradiation of the converged electron beam in which the movement of the table and the scanning of the converged electron beam are synchronized; forming a digital image of the substrate from the detected electron; improving a quality of the digital image by filtering the digital image; and detecting a defect of a pattern formed on the substrate by using the improved quality digital image.
摘要翻译：一种用于检查形成在基板上的图案的方法，包括以下步骤：沿着安装有待检查的基板的第一方向移动工作台，通过沿第二方向扫描会聚的电子束将会聚的电子束照射在基板上其垂直于第一方向; 通过会聚电子束的照射来检测从基板辐射的电子，其中台的移动和会聚电子束的扫描同步; 从检测到的电子形成衬底的数字图像; 通过过滤数字图像来提高数字图像的质量; 以及通过使用改进的质量数字图像来检测在基板上形成的图案的缺陷。

10. 发明授权

US07894658B2 Pattern inspection method and apparatus 有权
标题翻译：图案检验方法及装置
公开(公告)号：US07894658B2
公开(公告)日：2011-02-22
申请号：US11931693
申请日：2007-10-31
申请人： Takashi Hiroi , Masahiro Watanabe , Chie Shishido , Aritoshi Sugimoto , Maki Tanaka , Hiroshi Miyai , Asahiro Kuni , Yasuhiko Nara
发明人： Takashi Hiroi , Masahiro Watanabe , Chie Shishido , Aritoshi Sugimoto , Maki Tanaka , Hiroshi Miyai , Asahiro Kuni , Yasuhiko Nara
IPC分类号： G06K9/00
CPC分类号： G01N21/9501 , G01N21/956 , G01N2021/8854 , G01N2021/8861 , G01N2021/8864 , G01R31/311 , G03F1/86 , G06T1/0007 , G06T7/0002 , G06T7/001 , G06T2200/24 , G06T2207/10061 , G06T2207/30148 , H01J37/222 , H01J37/265 , H01J37/28 , H01J2237/221 , H01J2237/24592 , H01J2237/28
摘要： An apparatus for processing a defect candidate image, including: an imager for taking an enlarged image of a specimen; an image processor for processing the image taken by the imager to detect defect candidates existing on the specimen and classify the detected defect candidates into one of plural defect classes; a memory for storing information of the defect candidates including the images of the defect candidates and the classified defect class data outputted from the image processor; and a display unit having a display screen for displaying information stored in the memory, wherein the display unit displays an image of the defect candidates together with the defect class data stored in the memory and the displayed defect class data is changeable on the display screen, and the memory changes the stored defect class data of the displayed defect candidate to the changed defect class data.
摘要翻译：一种用于处理缺陷候选图像的装置，包括：用于拍摄样本的放大图像的成像器; 图像处理器，用于处理由成像器拍摄的图像以检测存在于样本上的缺陷候选，并将检测到的缺陷候选分类为多个缺陷类别中的一个; 存储器，用于存储包括缺陷候选图像和从图像处理器输出的分类缺陷类别数据的缺陷候选的信息; 以及显示单元，具有用于显示存储在存储器中的信息的显示屏幕，其中所述显示单元与存储在所述存储器中的缺陷类别数据一起显示所述缺陷候选的图像，并且所显示的缺陷类别数据可在所述显示屏幕上变化，并且存储器将存储的缺陷候选的缺陷类别数据改变为改变的缺陷类别数据。

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